KR20160033952A - Heat-radiating substrate and illumination apparatus having the same - Google Patents

Heat-radiating substrate and illumination apparatus having the same Download PDF

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Publication number
KR20160033952A
KR20160033952A KR1020140124835A KR20140124835A KR20160033952A KR 20160033952 A KR20160033952 A KR 20160033952A KR 1020140124835 A KR1020140124835 A KR 1020140124835A KR 20140124835 A KR20140124835 A KR 20140124835A KR 20160033952 A KR20160033952 A KR 20160033952A
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KR
South Korea
Prior art keywords
plate
heat
substrate
heat dissipating
mounting
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Application number
KR1020140124835A
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Korean (ko)
Inventor
오길수
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오길수
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Priority to KR1020140124835A priority Critical patent/KR20160033952A/en
Publication of KR20160033952A publication Critical patent/KR20160033952A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/745—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend

Abstract

According to an embodiment of the present invention, a heat dissipating substrate comprises: a substrate which mounts a light emitting diode on a lower side; a heat dissipating plate which is connected to the upper side of the substrate, receives heat received from the substrate, emits the heat to the outside, and includes a plurality of mounting protrusions projected toward an upper part by being connected to the upper side; and a heat dissipating piece which includes a shape projected toward the upper part of the heat dissipating plate, and is supported to the heat dissipating plate because a lower unit is inserted into a mounting protrusion. The present invention is provided to directly emit the heat received from the substrate to the outside through the heat dissipating piece, thereby maximizing heat dissipating characteristic.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a heat radiating plate,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a radiator plate and a lighting apparatus having the radiator plate, and more particularly, to a radiator plate having radiator pieces capable of effectively dissipating heat conducted from a light emitting device and a lighting apparatus having the same.

Generally, bulbs or fluorescent lamps are widely used as indoor or outdoor lighting lamps, but these bulbs and fluorescent lamps have a short life span and should be frequently replaced. In addition, the conventional fluorescent lamp has a problem that the illuminance gradually decreases due to deterioration over time of its use.

In order to solve such a problem, a lighting apparatus using an LED having a fast response speed, a high electro-optical conversion efficiency, a long lifetime, a low power consumption, a high luminance and an easy controllability has been developed.

Recently, a lighting apparatus using a high output LED is being developed. Such a lighting apparatus using a high output LED can satisfy the illuminance in an illumination space, but since a high temperature is generated from the LED, a complicated heat radiation apparatus The cost of the product has increased and the electric efficiency has been lowered.

Korean Patent Publication No. 10-2012-0122176. Nov 07, 2012.

An object of the present invention is to provide a lighting device which is excellent in heat radiation efficiency and is easy to manufacture.

Another object of the present invention is to provide a heat dissipating plate capable of effectively dissipating heat conducted from a light emitting element by using a heat dissipating piece having a laminated structure.

Other objects of the present invention will become more apparent from the following detailed description and drawings.

According to an embodiment of the present invention, a radiator plate includes: a substrate on which a light emitting device is mounted; A heat sink coupled to an upper surface of the substrate to receive heat transferred from the substrate and discharge the heat to the outside, and a plurality of mounting protrusions connected to the upper surface and protruding upward; And a heat radiating piece having a shape protruding toward an upper portion of the heat sink and having a lower end inserted into the mounting protrusion and supported by the heat sink.

Wherein the mounting protrusion is formed in parallel with a virtual line passing through the center of the heat sink,

The heat dissipation piece may include a plurality of plate members laminated and a lower end portion of the plate member disposed at the lowermost side may be inserted between the mounting protrusions.

The heat dissipation piece includes: a support portion having a shape corresponding to a width between the mounting protrusions; A connection part vertically connected to the support part and protruding upward; And a wing portion connected to an upper end of the connection portion and protruding toward the outside.

Wherein the support portion comprises: a bottom surface having a predetermined width at a central portion of the plate member; Side surfaces vertically connected to both ends of the bottom surface; And an upper surface having one end connected to the upper end of the side surface and the other end disposed in parallel with the bottom surface toward the inside.

The plate members are disposed concentrically and have shapes and sizes corresponding to each other, and the heat radiating pieces may be symmetrical.

The wing portion may have a downwardly curved shape toward the heat sink.

The plate member includes a first plate disposed at the lowermost portion and a second plate member disposed at an upper portion of the first plate member. The wing portion of the first plate member may be spaced apart from the wing portion of the second plate member in the vertical direction have.

The wings of the first plate may have a larger cross-sectional area than the wings of the second plate.

According to an embodiment of the present invention, there is provided a lighting apparatus including the structure of the radiator plate according to any one of claims 1 to 8, wherein the radiator plate has an internal installation space in which the radiator plate is installed, A body having lower through-holes; A hood provided on the upper portion of the body and having upper through holes formed through the side surface; And a fan installed on the opening formed on the upper surface of the body and supplying the air introduced through the upper through hole to the internal installation space.

According to an embodiment of the present invention, the heat dissipating plate indirectly externally discharges heat conducted from the substrate through the heat dissipating plate, and simultaneously dissipates the heat conducted to the substrate through the heat dissipating piece, thereby maximizing heat dissipation have. Further, by stacking a plurality of plate materials and machining a single heat dissipating piece, it is possible to maximize the cross-sectional area to improve the heat dissipation property, and the heat dissipating property to the same space can be achieved, thereby miniaturizing the lighting device. In addition, when the heat dissipating member needs to be replaced due to breakage of the heat dissipating member, the cost and the work process can be shortened, thereby greatly reducing the production cost.

1 is a schematic view of a lighting apparatus according to an embodiment of the present invention.
2 is an exploded perspective view of the illumination device shown in Fig.
Fig. 3 is a view showing a mounting structure of the heat radiating piece and the heat sink shown in Fig. 2;
4 is a cross-sectional view of the heat dissipating member shown in Fig.
5 is a view showing a manufacturing process of the heat sink.

In order to facilitate understanding of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments described below will be described on the basis of the embodiments best suited to understand the technical characteristics of the present invention and the technical features of the present invention are not limited by the embodiments described, Illustrate that the present invention may be implemented as embodiments.

Therefore, it is intended that the present invention covers the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. In order to facilitate the understanding of the embodiments described below, in the reference numerals shown in the accompanying drawings, among the constituent elements that perform the same function in the respective embodiments, the related constituent elements are indicated by the same or an extension line number.

Generally, a heat sink is formed by forming a heat dissipating fin or the like in order to facilitate heat dissipation from a predetermined component installed on an internal printed circuit board of an electronic product, . Most electronics are sensitive to temperature changes and use heat sinks as needed to remove heat generated during product use.

In particular, recently, the application fields of LEDs are expanding not only in LCD TV backlight but also in lighting gradually. In the case of outdoor lighting, unlike indoor lighting, the applied voltage or current value is large, and the LED package itself is applied by arraying a high power package of 1W or more.

Unlike ordinary lamps, LEDs emit light and heat when they are driven, with about 20 ~ 30% light and 70 ~ 80% heat. Particularly, heat generated during driving is rapidly dissipated to increase the light efficiency. In order to effectively transmit such heat radiation, a light emitting device such as an LED is packaged by using a heat sink.

Conventional heat dissipating boards generally include a printed circuit board on which a light emitting device such as an LED is mounted on a lower surface of a metal material such as aluminum (Al), and a heat conduction plate provided on a top surface of the printed circuit board, And a heat dissipating plate for dissipating heat. Here, a circuit wiring for electrically connecting the light emitting element to the lower surface of the printed circuit board may be formed, and the light emitting element may be electrically connected to the circuit wiring in the same manner as wire bonding.

However, a conventional radiator plate mainly uses a printed circuit board made of a metal material, particularly, an aluminum material. In this case, aluminum usually has excellent thermal conductivity, but has a poor heat radiation rate. That is, it is difficult to emit heat directly through the printed circuit board. Accordingly, the conventional radiator plate has a structure that substantially radiates the heat conducted from the light emitting element to the printed circuit board through the heat radiating plate provided on the upper surface of the printed circuit board.

Since the conventional heat radiation substrate has a heat radiation structure depending on the heat radiation plate, there is a limit to increase the heat radiation property and the size of the heat radiation plate is inevitably inefficient in order to improve the heat radiation property. Accordingly, a lighting apparatus having a heat radiating plate capable of efficiently radiating heat by improving the structure of the heat radiating plate will be described below.

1 is a schematic view of a lighting apparatus according to an embodiment of the present invention, and Fig. 2 is an exploded perspective view of the lighting apparatus shown in Fig. Fig. 3 is a view showing the mounting structure of the heat radiating piece and the heat sink shown in Fig. 2, and Fig. 4 is a sectional view of the heat radiating piece shown in Fig. 1 to 4, the lighting apparatus 100 includes a housing 20 having an internal installation space 29, a radiator plate 50 provided inside the housing 20, And a cooling fan (60) installed to supply outside air toward the radiator plate (50).

The housing 20 has a hood 15 having a lower open shape and a body 25 disposed at an open lower portion of the hood 15 and engageable with the lower portion of the hood 15. [ The housing 20 may be made of a synthetic resin and a thin metal plate to reduce the weight of the lighting apparatus 100. The lighting apparatus 100 includes a bracket 92 connected to the housing 20 so as to be fixed to the structure or frame, Member 94 as shown in Fig.

The hood 15 may have air inflow holes 17 formed through the side surface and a power supply unit SMPS (not shown) is fixedly installed inside the hood 15, 10). ≪ / RTI > An opening 21 is formed in the upper surface of the body 25 so that the body 25 can communicate with the inside of the hood 15. The lower through holes 27 are formed in a manner do.

A cooling fan 60 may be installed on the upper surface opening 21 of the body 25. When the cooling fan 60 is operated, air introduced through the air inlet holes 17 flows into the body 25 And draws heat generated from the substrate 10 and the light emitting device (not shown) and can be discharged to the outside through the lower through hole 27.

The radiator plate (50) is fixedly installed in the internal space (29) of the body (25). The heat dissipation plate 50 includes a substrate 10 on which a plurality of light emitting elements are arranged and a dedicated drive circuit for driving the light emitting elements is mounted and a heat conduction plate connected to the upper surface of the substrate 10, A heat radiating plate 30 for receiving and discharging the heat radiating plate 30 and a heat radiating plate 40 for mounting to the upper surface of the heat radiating plate 30.

Circuit wirings may be formed on the bottom surface of the substrate (! 0), and the light emitting elements may be electrically connected to the circuit wirings. Here, the light emitting device may be an LED, and may include a laser diode, a light emitting polymer, an organic light emitting diode (OLED), an electroluminescent strip, and the like. The substrate 10 is made of a metal material, and may be a conductive plate made of a conductive material having a high thermal conductivity. For example, the substrate 10 may be formed of an aluminum material.

The heat sink 30 is connected to the upper surface of the substrate 10 and the mounting protrusions 35 can be vertically installed on the heat sink 30. A mounting space 38 into which the radiating piece 40 is inserted is formed between the mounting projection 35 and the mounting projection 35. The radiating piece 40 is inserted and supported in the mounting space 38, And the bottom surface of the heat dissipating piece 40 can be abutted and connected. The heat dissipating piece 40 can also be easily supported in the mounting space 38 by abutting the side surfaces of the heat dissipating piece with the facing surfaces of the mounting protrusions 35 forming the respective mounting spaces 38. [

Mounting projections 35 protruding upward are formed on the upper surface of the heat dissipating plate 30 and the mounting protrusions 35 are disposed in parallel to the imaginary line? C passing the center C of the heat dissipating plate. For example, the mounting protrusions 35 may be arranged in pairs so that the respective heat radiating pieces 40 are inserted, and the mounting space 38 is formed such that the respective heat radiating pieces 40 are spaced apart from each other by a predetermined distance d. To maintain a predetermined distance d between them.

Therefore, the protrusion protrusion 35 of the heat sink 30 has a height h at which the heat sink 40 is inserted and supported, so that the thickness of the heat sink 30 can be minimized. For example, in order to fasten the heat dissipating plate 30 and the heat dissipating piece 40, the thickness of the heat dissipating plate 30 for inserting the bolt is required. However, in the present invention, the heat dissipating piece 40 is provided on the protruding protrusion 35 So that the thickness of the heat sink 30 for separately joining is not required. Therefore, the thickness of the heat sink 30 can be greatly reduced, and the overall weight of the heat sink 30 can be reduced.

The heat radiating piece 40 has a supporting portion 44 having a shape corresponding to the width between the mounting projections 35, a connecting portion 45 vertically connected to the supporting portion 44 and projecting upward, And may have a wing portion 47 connected to the outside and projecting toward the outside. The heat radiating piece 40 is processed so as to be integrally formed by stacking a plurality of plate members 49 so that the bottom surface 41a of the first plate member 49a disposed at the lowermost end is processed to correspond to the width of the mounting space 38.

The support portion 44 folds the central portion of the plate material 49 and is vertically connected to both end portions of the bottom surface 41 and the bottom surface 41 having a width corresponding to the width of the mounting space 38, (Not shown). The support portion 44 may further include an upper surface 43 having one end connected to the upper end of the side surface 42 and the other end disposed in parallel with the bottom surface 41 inward. The connection portion 45 may be connected to the upper surface of the support portion 44 and vertically connected to the upper portion.

For example, as shown in Fig. 4, when the heat dissipating piece 40 is processed by the six plate materials 49, the plate material 49 includes the first plate material 49a disposed at the lowermost end, A sixth sheet material 49f disposed on the top in the order of the second sheet materials 49b stacked on the first sheet material 49a may be stacked in order. Hereinafter, for convenience of explanation, the first plate 49a and the second plate 49b stacked on the first plate 49a will be described as an example, and the third to sixth plates 49c, 49d, 49e, 49f Sectional areas of the wings 47c, 47d, 47e, and 47f of the wings 47a and 47b are also reduced to a predetermined ratio.

The greater than one plate member (49a) the length (D a1) of the supporting portion of the supporting length (D b1) of the second plate member (49b) deposited on top of the first plate member (49a) (D a1 > D b1 ), the length (D a2 ) of the thermal coupling of the first plate is smaller than the length (D b2 ) of the connecting portion of the second plate 49b (D a2 <D b2 ). On the other hand, the first plate member (49a) and the second plate member (49b), the length differences of the support (44) includes a first plate member (49a) and a length greater than a length difference between the connection portion 45 of the second plate member (49b), (D a1 - D b1 <D a2 -D b2 so that the wing portion 47a of the first plate 49a is longer than the wing portion 47b of the second plate 49b. Therefore, the wing portion 47b of the first plate 49a has a larger cross-sectional area than the wing portion 47b of the second plate 49b.

As described above, the plate material 49 stacked on the upper side has the wing portion 47 having a smaller cross-sectional area. The air introduced into the upper portion of the heat dissipating piece 40 through the cooling fan 60 is separated from each of the wing portions 47 by the predetermined distance along the vertical direction through the connecting portion 45, An air circulation passage is secured between the heat exchanger and the heat exchanger so that heat can be quickly released by optimizing the heat conduction area.

The heat generated by the use of the LEDs is transferred to the heat sink 30, which is in contact with the substrate 10. That is, heat exchange with air in the atmosphere is performed through the heat sink 30 which is in contact with the substrate 10 and the heat sink 40 which is inserted and supported at predetermined intervals on the top of the heat sink 30, Heat is radiated into the atmosphere.

Accordingly, the present invention can provide a radiator plate having excellent heat dissipation and miniaturization by discharging the heat conducted from the LED to the substrate 10 through the heat dissipation plate 30 and the heat dissipation piece 40 to the outside. In addition, since the heat dissipating piece 40 can be mounted on the heat dissipating plate 30, the heat dissipating piece 40, which needs to be partially replaced, can be separated from the heat dissipating plate 30 and can be individually repaired. have.

The heat dissipation plate 30 and the heat dissipation plate 40 may be made of magnesium, an aluminum plate, silicon carbide (SiC), or an alloy material based on the material. The heat dissipation plate 30 and the heat dissipation plate 40 may be manufactured through a surface treatment process such as copper plating, galvanizing, or anodizing so as to be usable for a long time.

The lighting apparatus 100 may further include a transparent cover 70 and a flange 75. The transparent cover 70 may be installed in the internal installation space 29 and disposed under the radiator plate 50 . The transparent cover 70 can block the opened lower portion of the body 25 from the outside and a flange 75 is provided below the transparent cover 70 to fasten the body 25 and the transparent cover 70. The illumination apparatus 100 further includes a mesh network (not shown) for preventing the inflow of insects or dust or the like into the housing 20 through the air inlet hole 17 and the lower through hole 27 .

5 is a view showing a manufacturing process of the heat sink. As shown in Fig. 5, the heat radiating pieces 40 are integrally formed by laminating a plurality of plate materials 49 having the same size and shape. Each of the plate members 49 may be formed by laminating materials of the same size and folding the support members 44a of the first plate member 49a located at the lowermost end thereof into the mounting space 38 so as to be supported.

As described above, in order to effectively dissipate heat, it is desirable to increase the heat dissipation area to maximize the contact area with air. However, there is a limit in increasing the size of the heat sink to increase the heat dissipation area, and it is possible to satisfy the required heat dissipation area in a limited space.

On the other hand, in the heat dissipating piece 40 of the present invention, a plurality of plate materials 49 are stacked and integrally processed so that the wing portions 47a of the first plate material 49a and the wing portions 47b of the second plate material 49b are vertically So that the air circulation passage can be secured to optimize the heat conduction area, and the heat can be released quickly.

Accordingly, the radiator plate 50 indirectly radiates the heat conducted from the substrate 10 through the radiating plate 30, and simultaneously conveys the heat conducted to the substrate 10 through the radiating piece 40 to the outside By direct discharge, heat dissipation can be maximized. In addition, the heat dissipation property can be improved by maximizing the cross-sectional area by laminating the plurality of plate materials 49 and processing the single heat dissipation piece 40, and the heat dissipation property of the same space can be improved, . In addition, when replacement of the heat dissipating piece 40 is required due to breakage of the heat dissipating piece 40, it is possible to shorten the cost and the work process accordingly, thereby greatly reducing the production cost.

In addition, since the heat dissipating piece 40 having the above-described structure is simple in structure, it can be produced by a simple extrusion process because of the reduction of raw materials, the economical efficiency is high, and the wing parts 47 arranged in plural in the up- So that the area of contact with the outside air is maximized to increase the heat radiation efficiency and allow the air to flow through the wings 47 protruding from both sides of the heat dissipating piece 40 to allow the heat radiation efficiency to be improved.

The heat dissipating piece 40 having such a laminated structure can be freely deformed in size and shape according to the type and shape of the product to which the heat dissipating piece 40 is installed. It is obvious that such radiator plate 50 can be applied to various aspects requiring heat dissipation such as a heat exchanger, an integrated circuit, a heat pipe, a motor, a transformer, a heat sink, and a fuel cell as well as a computer main board.

The above-described illuminating device and radiator plate are not limited to the above-described embodiments, but all or a part of the embodiments may be selectively combined so that various modifications may be made to the embodiments have.

10: substrate 20: housing
30: Heat sink 35: Mounting projection
38: mounting space 40:
44: support part 45:
47: wing portion 49: plate material
50: radiator plate 60: cooling fan
70: transparent cover 100: lighting device

Claims (9)

A substrate on which a light emitting device is mounted;
A heat sink coupled to an upper surface of the substrate to receive heat transferred from the substrate and discharge the heat to the outside, and a plurality of mounting protrusions connected to the upper surface and protruding upward; And
And a radiator plate having a shape protruding toward an upper portion of the radiating plate and having a lower end inserted into the mounting protrusion and supported by the radiating plate. The method according to claim 1,
Wherein the mounting protrusion is formed in parallel with a virtual line passing through the center of the heat sink,
Wherein the heat dissipation piece has a plurality of plate members laminated, and a lower end portion of the plate member disposed at the lowermost side is inserted and supported between the mounting projections. 3. The method of claim 2,
The heat dissipation piece
A supporting portion having a shape corresponding to a width between the mounting projections;
A connection part vertically connected to the support part and protruding upward; And
And a wing portion connected to an upper end of the connection portion and protruding outward. The method of claim 3,
The support portion
A bottom surface having a predetermined width at a central portion of the plate material;
Side surfaces vertically connected to both ends of the bottom surface; And
And an upper surface having one end connected to the upper end of the side surface and the other end disposed in parallel with the bottom surface toward the inside. 5. The method of claim 4,
Wherein each of the plate members is concentrically disposed and has a shape and a size corresponding to each other,
Wherein the radiating element is symmetrical in the left and right direction. The method of claim 3,
Wherein the wing portion has a downwardly curved shape toward the heat sink. The method of claim 3,
Wherein the plate member comprises a first plate member disposed at the lowermost portion and a second plate member disposed at an upper portion of the first plate member,
Wherein a wing portion of the first plate is spaced apart from a wing portion of the second plate along a vertical direction. 8. The method of claim 7,
Wherein a wing portion of the first plate has a larger cross-sectional area than a wing portion of the second plate. 9. A lighting device comprising a radiator plate according to any one of claims 1 to 8,
A body having lower through holes having an inner installation space in which the radiator plate is installed, the through holes being formed through the side surfaces;
A hood provided on the upper portion of the body and having upper through holes formed through the side surface; And
And a fan installed on the opening formed on the upper surface of the body and supplying the air introduced through the upper through hole to the internal installation space.
KR1020140124835A 2014-09-19 2014-09-19 Heat-radiating substrate and illumination apparatus having the same KR20160033952A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180025341A (en) * 2016-08-29 2018-03-09 이영주 The led lamp plate structure
KR102538923B1 (en) * 2022-02-18 2023-06-08 주식회사 비와이티이씨 LED lighting fixtures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180025341A (en) * 2016-08-29 2018-03-09 이영주 The led lamp plate structure
KR102538923B1 (en) * 2022-02-18 2023-06-08 주식회사 비와이티이씨 LED lighting fixtures

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