KR20100005864A - Method for picking-up device mounted with adhesive film - Google Patents

Method for picking-up device mounted with adhesive film Download PDF

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Publication number
KR20100005864A
KR20100005864A KR1020080065943A KR20080065943A KR20100005864A KR 20100005864 A KR20100005864 A KR 20100005864A KR 1020080065943 A KR1020080065943 A KR 1020080065943A KR 20080065943 A KR20080065943 A KR 20080065943A KR 20100005864 A KR20100005864 A KR 20100005864A
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KR
South Korea
Prior art keywords
adhesive film
dicing tape
tape
annular frame
adhered
Prior art date
Application number
KR1020080065943A
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Korean (ko)
Inventor
마사루 나카무라
Original Assignee
가부시기가이샤 디스코
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Priority to KR1020080065943A priority Critical patent/KR20100005864A/en
Publication of KR20100005864A publication Critical patent/KR20100005864A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

The present invention provides a method for picking up a device in which a beard-like dust remains on the dicing tape and does not adhere to the adhesive film mounted on the back side of the device even when a beard-like dust is generated when the device is picked up from the dicing tape. do.

As a pick-up method of a device in which a plurality of devices equipped with an adhesive film on the back surface are adhered to a dicing tape attached to an annular frame, and an adhesive film for picking up a device from the dicing tape with the adhesive film attached thereto is adhered. The tape extension which expands the dicing tape by pressurizing with the expansion member the area | region between the annular frame internal diameter in a dicing tape and a wafer with an expansion member, maintaining the annular frame, and widening the space | interval between the said devices and an adhesive film. And a pick-up step of picking up the device and the adhesive film from the dicing tape, wherein in the tape expansion step, the relative movement speed of the expansion member and the frame holding means when the expansion member and the dicing tape are in contact is 100 mm / It is set to more than a second, and the space | interval which extended between devices and an adhesive film is 100 micrometers The above is set.

Description

How to pick up devices with adhesive film {METHOD FOR PICKING-UP DEVICE MOUNTED WITH ADHESIVE FILM}

The present invention is a device for picking up a device in which a plurality of streets are formed in a lattice shape on a surface thereof, and a device is formed in a plurality of areas partitioned by the plurality of streets, and a wafer adhered to a dicing tape is divided along the streets. The pickup method relates to.

For example, in the semiconductor device manufacturing process, devices such as IC and LSI are formed in a plurality of regions partitioned by a street (cutting line) formed in a lattice shape on a surface of a substantially disk-shaped semiconductor wafer, and the devices are formed. Each semiconductor chip is manufactured by dividing an area along a street. Generally as a dividing apparatus for dividing a semiconductor wafer, a cutting apparatus called a dicing apparatus is used, and this cutting apparatus cuts a semiconductor wafer along the street by the cutting blade about 20 micrometers in thickness. The semiconductor chips divided in this way are packaged and widely used in electric devices such as mobile phones and personal computers.

The semiconductor chip divided | segmented individually is equipped with the adhesive film for die bonding called the dia touch film of 20-40 micrometers in thickness formed with the epoxy resin etc. on the back surface, and the die which supports a semiconductor chip via this adhesive film Bonding is carried out by hot pressing to the bonding frame. As a method for attaching the adhesive film for die bonding to the back surface of the semiconductor chip, the adhesive film is adhered to the back surface of the semiconductor wafer, the semiconductor wafer is adhered to the dicing tape via the adhesive film, and then the surface of the semiconductor wafer By cutting together with the adhesive film by the cutting blade along the formed street, the semiconductor chip in which the adhesive film was attached to the back surface is formed (for example, refer patent document 1).

[Patent Document 1] Japanese Unexamined Patent Publication No. 2000-182995

In recent years, electric devices such as mobile phones and personal computers are required to be lighter and smaller in size, and thinner semiconductor chips are required. As a technique for dividing a semiconductor chip into thinner, a dividing technique called so-called Dicing Before Grinding (DBG) has been put into practical use. This pre-polishing dicing method forms a dividing groove having a predetermined depth (depth corresponding to the final thickness of the semiconductor chip) along the street from the surface of the semiconductor wafer, and then grinding the back surface of the semiconductor wafer having the dividing groove formed thereon. As a technique of exposing the dividing grooves on the back surface and separating them into individual semiconductor chips, the thickness of the semiconductor chips can be processed to 50 mu m or less.

By the way, when dividing a semiconductor wafer into individual semiconductor chips by the pre-polishing dicing method, after forming a groove having a predetermined depth along the street from the surface of the semiconductor wafer, the rear surface of the semiconductor wafer is ground to divide the groove into the rear surface. In order to express, the adhesive film for die bonding cannot be attached to the back surface of the semiconductor wafer in advance. Therefore, when bonding the semiconductor chip divided by the pre-polishing dicing method to the die bonding frame, the bonding agent must be inserted between the semiconductor chip and the die bonding frame, so there is a problem that the bonding operation cannot be performed smoothly. .

In order to solve this problem, an adhesive film for die bonding is adhered to the back surface of a semiconductor wafer divided into individual semiconductor chips by a pre-polishing dicing method, and the semiconductor wafer is adhered to a dicing tape through the adhesive film. Thereafter, a portion of the adhesive film exposed to the gap between the semiconductor chips is irradiated with a laser beam through the gap from the surface side of the semiconductor chip to remove the portion of the adhesive film exposed to the gap. This has been proposed. (See, for example, Patent Document 2.)

[Patent Document 2] Japanese Unexamined Patent Publication No. 2002-118081

Thus, when the adhesive film is cut by the cutting blade or the laser beam along the device divided by the street, the outer peripheral portion of the adhesive film is entangled with the adhesive glue of the dicing tape, and the beard is picked up when picking up the device from the dicing tape. The dust of a mold generate | occur | produces and adheres to the adhesive film mounted on the back surface of a device, and becomes a cause of die-bonding defect or wiring defect.

This invention is made | formed in view of the said fact, The main technical subject is that even if a beard-like dust generate | occur | produces when picking up a device from a dicing tape, a beard-like dust will remain | survive on a dicing tape, It is to provide a method of picking up a device that does not adhere to the attached adhesive film.

In order to solve the said main technical subject, according to this invention, the back surface of the wafer in which the several street was formed in the grid | lattice form on the surface, and the device was formed in the several area | region divided by the said plurality of streets is annular through an adhesive film. Adhered to a dicing tape mounted to a frame of the wafer, wherein the wafer and the adhesive film are divided into individual devices along the plurality of streets, and pick up the device from the dicing tape with the adhesive film mounted. As a pick-up method of a device to which an adhesive film is adhered,

The dicing tape is expanded to press the region between the annular frame inner diameter and the wafer in the dicing tape by an expansion member while the annular frame is held by a frame holding means. And tape expansion process to widen the gap between the adhesive film,

A pick-up step of picking up the device and the adhesive film from the dicing tape in a state where the distance between the devices adhered to the dicing tape and the adhesive film is widened by the tape expanding process,

In the tape expansion step, the relative movement speed of the expansion member and the frame holding means when the expansion member and the dicing tape are in contact is set to 100 mm / sec or more, between the devices and the adhesive film. A method for picking up a device with an adhesive film adhered is provided, wherein the spaced interval is set to 100 µm or more.

In the said tape expansion process, it is preferable that an adhesive film is cooled to 10 degrees C or less.

According to the present invention, in the tape expansion step, the relative movement speed of the expansion member and the frame holding means when the expansion member and the dicing tape are in contact is set to 100 mm / sec or more, and the distance between the devices and the adhesive film Since it is set to 100 micrometers or more, even if a beard-like dust generate | occur | produces when picking up a device from a dicing tape, a beard-like dust remains on a dicing tape and does not adhere to an adhesive film.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of the pick-up method of the device by which the adhesive film which concerns on this invention was stuck is described in detail with reference to an accompanying drawing.

Here, the shape of the wafer in which the adhesive film was attached to the back surface is demonstrated.

1, the adhesive film 3 for die bonding is attached to the back surface of the semiconductor wafer 2, and the adhesive film 3 side is attached to the surface of the dicing tape 40 mounted to the annular frame 4; The stuck state is shown. In the semiconductor wafer 2 shown in FIG. 1, a plurality of streets 21 are formed in a lattice shape on the surface 2a, and a device 22 is formed in a plurality of regions partitioned by the plurality of streets 21. have. The adhesive film 3 consists of an epoxy resin film of 20-40 micrometers in thickness, and is pressed and mounted on the back surface of the semiconductor wafer 2, heating at a temperature of 80-200 degreeC. The annular frame 4 is formed annularly by stainless steel having a thickness of 1 mm. In the illustrated embodiment, the dicing tape 40 is coated with an acrylic resin paste on the surface of a sheet base material made of polyvinyl chloride (PVC) having a thickness of 70 μm and having a thickness of about 5 μm.

As described above, the semiconductor wafer 2 adhered to the surface of the dicing tape 40 attached to the annular frame 4 may be cut along the plurality of streets 21 by a cutting device having a cutting blade. As shown in FIG. 2, the device is divided into individual devices 22. As shown in FIG. At this time, the adhesive film 3 for die bonding attached to the back surface of the semiconductor wafer 2 is also cut | disconnected simultaneously.

In order to divide the semiconductor wafer 2 into individual devices by a so-called pre-polishing dicing method, a predetermined depth (each semiconductor) is formed along a street 21 formed on the surface 2a of the semiconductor wafer 2 using a cutting device. The dividing groove having a depth corresponding to the final thickness of the chip is formed (dividing groove forming step). Next, the protection member is attached to the surface of the semiconductor wafer 2 in which the dividing grooves are formed, and the back surface of the semiconductor wafer 2 is ground, and the dividing grooves are exposed on the back surface to divide into individual devices 22 (dividing). Home presentation process). In this way, the adhesive film 3 for die bonding is attached to the back surface of the semiconductor wafer 2 divided into the individual devices 22. And the dicing tape which mounted the adhesive film 3 of the semiconductor wafer 2 [divided into the individual devices 22] with the adhesive film 3 mounted on the back surface to the annular frame 4 mentioned above. It adhere | attaches on the surface of 40, and irradiates a laser beam with the dividing groove to the adhesive film 3, and cuts the adhesive film 3 along the dividing groove. Therefore, each device 22 in which the semiconductor wafer 2 is divided along the plurality of streets 21 and the adhesive film 3 cut along the dividing grooves have an annular frame 4 as shown in FIG. 2. It will be in the state adhered to the surface of the dicing tape 40 attached to the.

As described above, the individual devices 22 adhered to the surface of the dicing tape 40 via the adhesive film 3 are conveyed to the pickup device and picked up from the dicing tape 40. Here, an example of a pick-up apparatus is demonstrated with reference to FIGS.

3 is a perspective view of the pickup device, and FIG. 4 is a perspective view showing an exploded view of the main part of the pickup device shown in FIG. 3. The pickup device 5 includes a base 51, a first table 52 arranged to be movable on the base 51 in a direction indicated by an arrow Y, and an arrow Y on the first table 52. The 2nd table 53 arrange | positioned so that the movement to the direction shown by the arrow X orthogonal to this is provided. The base 51 is formed in a rectangle, and two guide rails 511 and 512 are arranged in parallel with each other in the direction indicated by the arrow Y on the upper surface of both sides. Further, in one of the two guide rails, a guide groove 511a having a V-shaped cross section is formed on the upper surface thereof.

As shown in Fig. 4, the first table 52 is formed in the shape of a window frame having a rectangular opening 521 in the center thereof. The guide rail 522 which is slidably fitted to the guide groove 511a formed in one guide rail 511 provided in the base 51 on one side lower surface of the first table 52. ) Is installed. In addition, two guide rails 523 and 524 are arranged in parallel with each other on an upper surface of both sides of the first table 52 in a direction orthogonal to the guide rail 522. In addition, one guide rail 523 of the two guide rails is formed with a V-shaped guide groove 523a on its upper surface. As shown in FIG. 3, the first table 52 configured as described above is fitted into the guide groove 511a formed in one guide rail 511 in which the guide rail 522 is installed in the base 51, and the other The side lower surface of the side is placed on the other guide rail 512 provided on the base 51. The pick-up apparatus 5 is equipped with the 1st moving means 54 which moves the 1st table 52 to the direction shown by the arrow Y along the guide rails 511 and 512 provided in the base 51. As shown in FIG. This first moving means 54 is a male screw rod 541 disposed in parallel to the other guide rail 512 provided on the base 51 as shown in FIG. 4 and a male screw disposed on the base 51. A bearing 542 for rotatably supporting one end of the rod 541, a pulse motor 543 connected to the other end of the male threaded rod 541 to rotate the male threaded rod 541, and the first table. It consists of the female thread block 544 provided in the lower surface of 52, and screwing to the male threaded rod 541. As shown in FIG. The 1st moving means 54 comprised in this way drives the pulse motor 543 to rotate the external threaded rod 541, and moves the 1st table 52 to the direction shown by the arrow Y. As shown in FIG.

The second table 53 is formed in a rectangular shape as shown in Fig. 4, and has a circular hole 531 in the center thereof. The guide rail which is slidably fitted to the guide groove 523a formed in one guide rail 523 provided in the first table 52 on one side lower surface of the second table 53. 532 is installed. The second table 53 configured as described above is fitted into the guide groove 523a formed in one guide rail 523 in which the guide rail 532 is installed in the first table 52, as shown in FIG. And the other side lower surface is placed on the other guide rail 524 provided on the first table 52. The pick-up apparatus 5 is equipped with the 2nd moving means 55 which moves the 2nd table 53 in the direction shown by the arrow X along the guide rails 523, 524 provided in the 1st table 52. As shown in FIG. As shown in FIG. 4, the second moving means 55 includes a male threaded rod 551 disposed in parallel to the other guide rail 524 provided on the first table 52, and the first table 52. A bearing 552 disposed on the rotatably supporting one end of the male screw rod 551, a pulse motor 553 connected to the other end of the male screw rod 551 to rotationally drive the male screw rod 551, and It consists of the female thread block 554 which is provided in the lower surface of the 2nd table 53, and is screwed to the male threaded rod 551. The 2nd moving means 55 comprised in this way drives the pulse motor 553 to rotate the external threaded rod 551, and moves the 2nd table 53 to the direction shown by the arrow X. As shown in FIG.

The pick-up device 5 comprises a frame holding means 6 for holding the annular frame 4 and a dicing tape 40 mounted to the annular frame 4 held by the frame holding means 6. A tape expanding means 7 is provided. As shown in Figs. 3 and 5, the frame holding means 6 includes an annular frame holding member 61 having an inner diameter larger than the diameter of the hole 531 provided in the second table 53, and the frame. It consists of several clamp 62 as a fixing means arrange | positioned at the outer periphery of the holding member 61. As shown in FIG. The upper surface of the frame holding member 61 forms a mounting surface 611 on which the annular frame 4 is placed, and the annular frame 4 is placed on this mounting surface 611. Then, the annular frame 4 placed on the mounting surface 611 is fixed to the frame holding member 61 by the clamp 62. The frame holding means 6 comprised in this way is arrange | positioned above the hole 531 of the 2nd table 53, and is supported by the tape expansion means 7 mentioned later so that an up-and-down movement is possible.

The tape expansion means 7 is provided with the expansion drum 70 arrange | positioned inside the said annular frame holding member 61, as shown to FIG. 3 and FIG. The expansion drum 70 has an inner diameter smaller than the inner diameter of the annular frame 4 and larger than the outer diameter of the semiconductor wafer 2 adhered to the dicing tape 40 attached to the annular frame 4. And an outer diameter. In addition, the expansion drum 70 has a mounting portion 71 that is rotatably fitted to an inner circumferential surface of the hole 531 provided in the second table 53 at a lower end thereof, and has a diameter on an upper outer circumferential surface of the mounting portion 71. The support flange 72 which protrudes in the direction is provided. The tape expansion means 7 is provided with the support means 73 which can advance the said annular frame holding member 61 to an up-down direction. The support means 73 is composed of a plurality of air cylinders 730 disposed on the support flange 72, and the piston rod 731 is connected to the lower surface of the annular frame holding member 61. Thus, the support means 73 which consists of the some air cylinder 730 uses the annular frame holding member 61, and the reference position which the loading surface 611 becomes substantially the same height as the upper end of the expansion drum 70 (FIG. 5 and 6A), the stacking surface 611 is spaced apart from the upper end of the expansion drum 70 by a predetermined amount spaced upward in the drawing (shown in FIG. 6B), and the stacking surface 611 is the expansion drum. It is selectively moved from the upper end of 70 to the extended position (shown in FIG. 6C) below the predetermined amount in the figure. Therefore, the support means 73 which consists of the some air cylinder 730 functions as expansion movement means which relatively moves the expansion drum 70 and the frame holding member 61 to an up-down direction (axial direction).

As shown in FIG. 3, the pick-up apparatus 5 is equipped with the rotation means 75 which rotates the said expansion drum 70 and the frame holding member 61. As shown in FIG. The rotation means 75 includes a pulse motor 751 disposed on the second table 53, a pulley 752 mounted on a rotation shaft of the pulse motor 751, the pulley 752 and an expansion drum ( It consists of an endless belt 753 wound around the support flange 72 of 70. The rotating means 75 configured as described above rotates the expansion drum 70 via the pulley 752 and the endless belt 753 by driving the pulse motor 751.

The pick-up apparatus 5 is the device 22 divided into the semiconductor wafers 2 each supported by the dicing tape 40 by the annular frame 4 hold | maintained at the said annular frame holding member 61. Is provided with a detection means (8) for detecting. The detection means 8 is attached to the L-shaped support pillar 81 arranged in the base 51. The detecting means 8 is composed of an optical system, an imaging device (CCD), or the like, and is supported by a dicing tape 40 via an annular frame 4 held by the annular frame holding member 61. The device 22 divided into individual semiconductor wafers 10 is imaged, converted into electrical signals, and transferred to a control means (not shown).

The pickup device 5 further includes a pickup means 9 for picking up the individually divided devices 22 from the dicing tape 40. This pick-up means 9 consists of a turning arm 91 arranged on the base 51 and a pick-up collet 92 mounted on the tip, and the turning arm 91 is pivoted by driving means (not shown). . Moreover, the turning arm 91 is comprised so that up-and-down movement is possible, and the pick-up collet 92 attached to the front end can pick up the individually divided device 22 adhering to the dicing tape 40.

Referring again to FIG. 5, the pickup device 5 is provided with cooling means 10 arranged in an expansion drum 70 constituting the tape expansion means 7. In this cooling means 10, the cooling fluid injection nozzle 101 is arrange | positioned upward and communicates with the cooling fluid supply means which is not shown in figure.

The pick-up apparatus 5 is comprised as mentioned above, The individual device 22 which adhered to the surface of the dicing tape 40 mentioned above via the adhesive film 3 using this pick-up apparatus 5 was carried out. The procedure of picking up from the dicing tape 40 is mainly demonstrated with reference to FIG. 6 and FIG.

As shown in FIG. 2, the annular frame 4 which supported the individual device 22 with the adhesive film 3 mounted on the back surface through the dicing tape 40 as shown in FIG. 6A is shown in FIG. It mounts on the mounting surface 611 of the frame holding member 61 which comprises the frame holding means 6, and is fixed to the frame holding member 61 by the clamp 62 (frame holding process). At this time, the frame holding member 61 is located at the reference position shown in Fig. 6A.

As shown in FIG. 6A, the annular structure of the frame holding member 61 positioned at the reference position with the dicing tape 40 supporting the individual devices 22 having the adhesive film 3 mounted on the rear surface thereof. When the frame 4 is fixed, the plurality of air cylinders 730 serving as the support means 73 constituting the tape expansion means 7 are operated to separate the annular frame holding member 61 in FIG. 6B. Raise to position (determining separation position).

Next, the plurality of air cylinders 730 as the support means 73 constituting the tape expansion means 7 are operated to lower the annular frame holding member 61 to the extended position shown in FIG. 6C at once. Therefore, since the annular frame 4 fixed on the mounting surface 611 of the frame holding member 61 also descends, as shown in FIG. 6C, a dicing tape mounted on the annular frame 4 ( 40 extends in contact with the top edge of expansion drum 70 (tape expansion process). At this time, since the dicing tape 40 attached to the annular frame holding member 61, that is, the annular frame 4 descends from the spaced position shown in Fig. 6B, it contacts the upper edge of the expansion drum 70. The predetermined movement speed is reached. In addition, it is important that the predetermined moving speed when the dicing tape 40 contacts the upper edge of the expansion drum 70 is 100 mm / sec or more. As a result, a tensile force acts rapidly radially on the adhesive film 3 adhered to the back surface of each device 22 adhered to the dicing tape 40, and between the devices 22 divided individually. The space | interval between the adhesive films 3 spreads rapidly. It is important that the space | interval which spreads between the individual devices 22 divided | segmented in this way, and the adhesive film 3 becomes 100 micrometers or more. Therefore, when the semiconductor wafer 2 is cut | disconnected with the cutting blade of width 20micrometer along the street 21, the space | interval between the devices 22 and the adhesive film 3 is 120 micrometers or more in a tape expansion process. Widens In addition, when performing the said tape expansion process, when it is located in a reference | standard position as shown in FIG. 6A, the cooling means 10 are operated, and a cooling fluid is injected from the cooling fluid injection nozzle 101, and the adhesive film ( It is preferable to cool 3) to 10 degrees C or less.

After the tape expansion step has been performed as described above, the first moving means 54 and the second moving means 55 are operated to move the first table 52 in the direction indicated by the arrow Y (see FIG. 3), The second table 53 is moved in the direction indicated by the arrow X (refer to FIG. 3), and each piece is attached to the dicing tape 40 attached to the annular frame 4 held by the frame holding member 61. Device 22 is placed directly below the detection means 8. Then, the detection means 8 is operated to confirm whether the gap between the individual devices 22 coincides with the direction indicated by the arrow Y or the direction indicated by the arrow X. If the gap between the individual devices 22 is out of the direction indicated by the arrow Y or the direction indicated by the arrow X, the rotating means 75 is operated to rotate the frame holding means 6 to coincide. Next, while moving the 1st table 52 to the direction shown by the arrow Y (refer FIG. 3), and moving the 2nd table 53 to the direction shown by the arrow X (refer FIG. 3), it shows in FIG. As described above, the pickup means 9 is operated to pick up (pick up process) the device 22 positioned at the predetermined position by the pickup collet 92, and to convey it to a tray or die bonding step (not shown).

In the pick-up step, the device 22 is peeled off from the dicing tape 40 and picked up with the adhesive film 3 mounted on the back surface. At this time, the outer periphery of the adhesive film 3 is entangled with the adhesive paste of the dicing tape 40, and a beard-like dust occurs when the device 22 is picked up from the dicing tape 40. When the space between the devices 22 and the adhesive film 3 which are divided in the expansion process is widened, the space between the devices 22 and the adhesive film 3 is increased with a moving speed of 100 mm / sec or more. Since it is 100 micrometers or more, the said beard-shaped dust remains on the dicing tape 40 side, and does not adhere to the adhesive film 3. According to the experiments of the present inventors, the slower the movement speed is, the higher the probability that the beard-like dust adheres to the adhesive film 3 is, the more the device 22 and the adhesive film 3 are connected. It was found that the wider the gap was smaller than 100 µm, the higher the probability that the beard-like dust was attached to the adhesive film 3. In addition, in the tape expansion step, it was found that by cooling the adhesive film 3 to 10 ° C. or lower, the probability that the beard-like dust adheres to the adhesive film 3 at the time of the pickup becomes smaller. .

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows the state which the semiconductor wafer with the adhesive film for die bonding attached to the back surface adhered to the dicing tape attached to the annular frame.

FIG. 2 is a perspective view showing a state in which the semiconductor wafer and the adhesive film shown in FIG. 1 are divided into individual devices. FIG.

3 is a perspective view of a pickup device for carrying out the pickup method of a device equipped with an adhesive film according to the present invention;

4 is an exploded perspective view illustrating main parts of the pickup apparatus shown in FIG. 3.

FIG. 5 is a cross-sectional view showing a second table, a frame holding means and a tape expanding means constituting the pickup device shown in FIG. 3; FIG.

Fig. 6 is an explanatory diagram showing a tape expanding step in the pickup method of a device equipped with an adhesive film according to the present invention.

7 is an explanatory diagram showing a pick-up step in the pick-up method of a device with an adhesive film according to the present invention.

<Explanation of symbols for the main parts of the drawings>

2: semiconductor wafer

21: Street

22: device

3: adhesive film

4: fantasy frame

40: dicing tape

5: pickup device

6: frame holding means

61: frame holding member

7: tape expansion means

70: expansion drum

73: support means

730: air cylinder

731: piston rod

8: detection means

9: pickup means

92: pickup collet

10: cooling means

101: cooling fluid injection nozzle

Claims (2)

On the surface, a plurality of streets are formed in a lattice shape, and the back surface of the wafer, in which a device is formed in a plurality of regions partitioned by the plurality of streets, is adhered to a dicing tape mounted on an annular frame via an adhesive film, and the wafer And the adhesive film is divided into individual devices along the plurality of streets, and wherein the device is picked up from the dicing tape with the adhesive film mounted thereon, wherein the adhesive film-adhered device is a pickup method. The dicing tape is expanded to press the region between the annular frame inner diameter and the wafer in the dicing tape with an expansion member while the annular frame is held by a frame holding means, thereby extending between the devices and Tape expansion process to widen the gap between the adhesive film, A pick-up step of picking up the device and the adhesive film from the dicing tape in a state where the distance between the devices adhered to the dicing tape and the adhesive film is widened by the tape expanding process, In the tape expansion step, the relative movement speed of the expansion member and the frame holding means when the expansion member and the dicing tape are in contact is set to 100 mm / sec or more, between the devices and the adhesive film. The space | interval which widened is set to 100 micrometers or more, The pick-up method of the device by which the adhesive film adhered. The method of claim 1, wherein in the tape expanding step, the adhesive film is cooled to 10 ° C or less.
KR1020080065943A 2008-07-08 2008-07-08 Method for picking-up device mounted with adhesive film KR20100005864A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101435247B1 (en) * 2011-10-20 2014-08-28 세메스 주식회사 Die bonding apparatus
CN109065494A (en) * 2018-07-27 2018-12-21 广东阿达智能装备有限公司 The tensioning and regulating device of sealed in unit and its wafer indigo plant film
CN116631905A (en) * 2023-05-06 2023-08-22 深圳市博辉特科技有限公司 Crystal expanding equipment and crystal expanding method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101435247B1 (en) * 2011-10-20 2014-08-28 세메스 주식회사 Die bonding apparatus
CN109065494A (en) * 2018-07-27 2018-12-21 广东阿达智能装备有限公司 The tensioning and regulating device of sealed in unit and its wafer indigo plant film
CN109065494B (en) * 2018-07-27 2020-10-20 广东阿达智能装备有限公司 Packaging equipment and tensioning and adjusting device of blue membrane of wafer thereof
CN116631905A (en) * 2023-05-06 2023-08-22 深圳市博辉特科技有限公司 Crystal expanding equipment and crystal expanding method

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