KR20090130533A - Method for manufacturing contact structure - Google Patents

Abstract

PURPOSE: A method for manufacturing a contact structure is provided to improve the reliability of a test process by using a second motherboard having a first motherboard and an opening having a conductive layer. CONSTITUTION: In a device, a first motherboard is prepared(S100). A bonding layer is formed on the first substrate through a sputtering process. A conductive layer is formed on the bonding layer through an evaporation process or the sputtering process. A second motherboard is prepared(S200), and the second substrate is formed on the second motherboard. An insulating layer is formed on the second substrate. A photoresist layer is formed on the insulating layer. The second motherboard is adhered on the first motherboard(S300). A contact structure is formed(S400), and the first motherboard and the second motherboard are removed(S500).

Description

Method for manufacturing a contact structure {METHOD FOR MANUFACTURING CONTACT STRUCTURE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a contact structure, and more particularly, to a method of manufacturing a contact structure in contact with a contact pad formed on an inspected object such as a wafer.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

An inspection process is performed between the fabrication process and the assembly process to inspect the electrical characteristics of the wafer by applying an electrical signal to the contact pads formed on the wafer. This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

In recent years, as the demand for high integrated chips increases, circuit patterns formed on the wafer by the fabrication process and contact pads connected with the circuit patterns are highly integrated. That is, the spacing between neighboring contact pads is very narrow, and the size of the contact pad itself is also finely formed. As a result, a manufacturing method using photolithography technology capable of finely manufacturing the size of the contact structure of the probe card in contact with the contact pad has been developed.

Hereinafter, a method of manufacturing a conventional contact structure will be described with reference to FIGS. 1 to 3.

1 to 3 are views for explaining a conventional method for manufacturing a contact structure.

As shown in FIG. 1, the conventional method of manufacturing a contact structure sequentially forms a sacrificial layer 20, an adhesive layer 30, a conductive layer 40, and a photoresist layer 50 on a sacrificial substrate 10. After that, the opening A is formed by using a photolithography technique including an exposure and development process. As shown in FIG. 2, the opening A is formed in a shape corresponding to the shape of the contact structure.

Next, as shown in FIG. 3, the contact structure 60 is formed by filling the opening A with a conductive material different from the conductive layer 40. Then, the photoresist layer 50 is peeled off, and the sacrificial layer 20 is formed. ), The sacrificial substrate 10 is separated from the adhesive layer 30, the conductive layer 40, and the contact structure 60.

Next, the adhesive layer 30 and the conductive layer 40 are etched to form the contact structure 60.

As described above, in the conventional method of manufacturing the contact structure, an opening A in which the contact structure 60 is formed is formed in the photoresist layer 50.

However, in the conventional method for manufacturing a contact structure, since the amount of light reaching the upper side and the lower side of the photoresist layer 50 in which the opening A is formed during the exposure process is different, the opening of the opening A formed after the developing process The length of the first width d ', the upper width, and the second width d2, the lower width of the opening A, are different. Since the first width d₁ and the second width d2 of the opening A are different, the third width d₃, which is an upper width of the contact structure 60 formed in the opening A, and the lower side of the contact structure 60. The fourth width d₄, which is the width, is different. As such, since the third width d₃ and the fourth width d₄ of the contact structure 60 are different from each other, an eccentricity may act on the contact structure 60 contacting the contact pads formed on the object under test. Due to this eccentricity in the inspection process, the contact structure 60 is moved in an undesired direction such that a portion contacting the contact pad formed on the inspected object is in contact with an unwanted portion on the contact pad. That is, the reliability of the inspection process may be lowered.

In addition, in the conventional method of manufacturing a contact structure, when forming the photoresist layer 230 positioned on the conductive layer 40, when the thickness of the photoresist layer 230 is not uniformly formed as a whole, neighboring mutually The heights of the openings A are formed differently. When the heights of the openings A adjacent to each other are different from each other, the thicknesses of the contact structures 60 formed in the respective openings A are different from each other. As such, when the thicknesses of the contact structures 60 formed in the respective openings A are different from each other, the pressures applied to the contact pads formed on the inspected object during the inspection process are different from each other, resulting in mechanical damage to the contact pads or the contact structures 60. This can happen. That is, the reliability of the inspection process may be lowered.

In addition, in the conventional method for manufacturing a contact structure, when the contact structure 60 is formed, the material of the photoresist layer 50 surrounding the contact structure 60 is a polymer-based material, and the material forming the contact structure 60 is made of metal or the like. The surface crystal structure of the photoresist layer 50 is very different from the surface crystal structure of the contact structure 60 because it is a conductive material. As described above, since the crystal structures of the two materials in contact with each other are very different, there is a problem in that the surface characteristics of the contact structure 60 in contact with the photoresist layer 50 are lowered when the contact structure 60 is formed.

One embodiment of the present invention is to solve the above-described problems, it is an object of the present invention to provide a method for manufacturing a contact structure that can improve the reliability of the inspection process.

It is also an object of the present invention to provide a method for producing a contact structure capable of improving the surface properties of the contact structure.

As a technical means for achieving the above technical problem, the first aspect of the present invention is a method of manufacturing a contact structure, (a) providing a first mother substrate comprising a first substrate having a conductive layer formed on the upper surface (b) providing a second mother substrate comprising a second substrate having a through hole corresponding to the image of the contact structure, (c) forming a second mother substrate on the first mother substrate with the conductive layer therebetween; Bonding the mother substrate, (d) filling the through hole located on the conductive layer to form the contact structure, and (e) removing the first mother substrate and the second mother substrate. It provides a method of manufacturing a contact structure comprising the step.

The step (b) may include preparing the second substrate, forming a photoresist layer on the second substrate, and exposing and developing the photoresist layer to form an opening corresponding to the image of the contact structure. The method may include forming the through hole by etching the second substrate exposed by the opening, and removing the photoresist layer.

In the step (b), forming an insulating layer on the second substrate so as to be positioned between the second substrate and the photoresist layer, and etching the insulating layer exposed by the opening to expose the second substrate. And removing the insulating layer.

The step (a) may include preparing the first substrate and forming the conductive layer on the first substrate.

The step (a) may further include forming an adhesive layer on the first substrate to be positioned between the first substrate and the conductive layer.

The adhesive layer may include titanium (Ti) or chromium (Cr).

Step (d) may be performed using a plating process using the conductive layer.

Step (d) may include grinding the conductive material protruding onto the second mother substrate.

The conductive material comprises at least one of nickel (Ni), nickel alloy (Ni alloy), beryllium copper (BeCu) and stainless steel.

And the conductive layer comprises at least one of gold (Au), silver (Ag), and copper (Cu).

At least one of the first substrate and the second substrate may be a silicon wafer.

The silicon wafer may be a double side polishing (DSP) wafer.

In addition, the second aspect of the present invention is a method of manufacturing a contact structure, comprising the steps of (a) providing a first mother substrate comprising a first substrate, (b) a through hole of a shape corresponding to the image of the contact structure Providing a second mother substrate including a second substrate having a substrate formed thereon, (c) adhering the second mother substrate onto the first mother substrate, and (d) filling the through hole with a conductive material Forming a structure and (e) removing the first mother substrate and the second mother substrate.

The step (b) may include preparing the second substrate, forming a photoresist layer on the second substrate, and exposing and developing the photoresist layer to form an opening corresponding to the image of the contact structure. The method may include forming the through hole by etching the second substrate exposed by the opening, and removing the photoresist layer.

In the step (b), forming an insulating layer on the second substrate so as to be positioned between the second substrate and the photoresist layer, and etching the insulating layer exposed by the opening to expose the second substrate. And removing the insulating layer.

Step (d) may be performed using a sputtering process.

The conductive material may include one or more of nickel, nickel alloys, beryllium copper, and stainless steel.

At least one of the first substrate and the second substrate may be a silicon wafer.

The silicon wafer may be a double-sided polishing wafer.

According to one of the embodiments of the above-described problem solving means of the present invention, by forming a contact structure using a first mother substrate with a conductive layer and a second mother substrate with an opening, reliability of the inspection process can be improved. It has an effect.

In addition, there is an effect that can improve the surface properties of the contact structure.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is located "on" with another part, this includes not only when a layer is in contact with another layer, but also when there is another layer between the two layers. In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated.

Hereinafter, a method of manufacturing a contact structure according to a first embodiment of the present invention will be described with reference to FIGS. 4 to 16.

4 is a flowchart illustrating a method of manufacturing a contact structure according to a first embodiment of the present invention, and FIGS. 5 to 16 are views illustrating a method of manufacturing a contact structure according to a first embodiment of the present invention. 8 is a cross-sectional view taken along the line VIII-VIII of FIG. 7, and FIG. 13 is a cross section taken along the line III-XIII of FIG. 12.

First, as illustrated in FIGS. 4 and 5, the first mother substrate 100 is provided (S100).

Specifically, first, as shown in FIG. 5, the first substrate 110 is prepared. The first substrate 110 may be a double side polishing (DSP) silicon wafer (Si wafer) having a top surface and a bottom surface polished.

Next, the adhesive layer 120 is formed on the first substrate 110 using a sputtering process or the like. The adhesive layer 120 includes titanium (Ti), chromium (Cr), or the like, and serves to help adhesion between the first substrate 110 and the conductive layer 130 to be described later.

Next, the conductive layer 130 is formed on the adhesive layer 120 using an evaporation process or a sputtering process. The conductive layer 130 includes at least one of gold (Au), silver (Ag), and copper (Cu), and serves as a seed in a plating process used when forming the contact structure 1000 to be described later. .

By the above process, the 1st mother board | substrate 100 is provided.

Next, as shown in FIGS. 6 to 11, a second mother substrate 200 is prepared (S200).

Specifically, first, as shown in FIG. 6, the second substrate 210 is prepared. Preferably, the second substrate 210 is a double-sided polished silicon wafer having a top surface and a bottom surface polished.

Next, an insulating layer 220 is formed on the second substrate 210. Specifically, the upper surface of the second substrate 210 is oxidized by a wet thermal oxidation method in a water (H 2 O) environment to form an insulating layer 220 formed of silicon oxide (SiO 2) on the second substrate 210. .

Next, the photoresist layer 230 is formed on the insulating layer 220 using a spin coating process or the like. The photoresist layer 230 may be of a positive type in which the connection ring between particles is broken when irradiated with UV light, or may be in a negative type in which the connection ring between particles is hardened when irradiated with UV light.

Next, as shown in FIGS. 7 and 8, the photoresist layer 230 is exposed and developed to form an opening 231 corresponding to the image of the contact structure 1000 to be described later. The mask used for exposing the photoresist layer 230 depends on the case where the photoresist layer 230 is a positive type and the case of a negative type. Specifically, when the photoresist layer 230 is a positive type, the exposure is performed. The mask to be used has a light transmitting portion corresponding to the image of the contact structure 1000. On the other hand, when the photoresist layer 230 is a negative type, the mask used for exposure has a light blocking portion corresponding to the image of the contact structure 1000. Meanwhile, the insulating layer 220 is exposed to the outside by the opening 231.

Next, as shown in FIG. 9, the insulating layer 220 exposed to the outside by the opening 231 is etched using a dry etching process such as a reactive ion etching (RIE) process. Meanwhile, the second substrate 210 is exposed to the outside by etching the insulating layer 220.

In another embodiment, the insulating layer 220 may be etched using a wet etching process.

Next, as shown in FIG. 10, the through hole 211 is formed by etching the second substrate 210 exposed to the outside by etching the opening 231 and the insulating layer 220. Specifically, from the upper surface of the second substrate 210 exposed to the outside by the etching of the opening 231 and the insulating layer 220 using a dry etching process such as an ion reaction etching process from the lower surface of the second substrate 210. The second substrate 210 is etched to penetrate to form the through hole 211. When the through hole 211 is formed, the through hole 211 is formed by etching the second substrate 210 such that the etching surface of the through hole 211 is substantially perpendicular to the top and bottom surfaces of the second substrate 210. It is desirable to.

Next, as shown in FIG. 11, the photoresist layer 230 and the insulating layer 220 are removed. Specifically, the photoresist layer 230 is separated from the insulating layer 220 by using an ashing process or a lift off process, and the insulating layer 220 is formed by using a wet process using an etchant. It is separated from the second substrate 210.

In another embodiment, the contact structure 1000 may be manufactured without separating the insulating layer 220 from the second substrate 210.

By the above process, the 2nd mother board | substrate 200 is provided.

next. 12 and 13, the second mother substrate 200 is adhered to the first mother substrate 100 (S300).

Specifically, the second mother substrate 200 is adhered to the conductive layer 130 of the first mother substrate 100 using an adhesive process such as a thermocompression bonding process. At this time, since the etching surface of the through hole 211 formed in the second mother substrate 200 located on the first mother substrate 100 is substantially perpendicular to the upper and lower surfaces of the second substrate 210, the through hole. The length of the first width L ', which is the upper width of 211, and the second width L2, which is the lower width of the through hole 211, are substantially the same.

Next, as shown in FIGS. 14 and 15, the contact structure 1000 is formed (S400).

Specifically, as shown in FIG. 14, nickel (Ni) is formed in the through hole 211 of the second mother substrate 200 using a plating process such as an electrolytic plating process using the conductive layer 130 as a seed layer. ), A nickel alloy, a beryllium copper (BeCu), and a conductive material 1100 including a conductive material such as stainless steel.

Next, as shown in FIG. 15, after the conductive material 1100 is filled, the conductive material 1100 protruding onto the second mother substrate 200 may be polished and contacted using a chemical or physical polishing process due to the plating process. Form structure 1000.

Next, as shown in FIG. 16, the first mother substrate 100 and the second mother substrate 200 are removed (S500).

Specifically, the contact structure 1000 is manufactured by removing the first mother substrate 100 and the second mother substrate 200 surrounding the contact structure 1000 from the contact structure 1000 by using a wet etching process or the like. do. In this case, the manufactured contact structure 1000 may have a length of a first width L₁, which is an upper width of the through hole 211 on which the contact structure 1000 is formed, and a second width L2, which is a lower width of the through hole 211. Since it is substantially the same, the third width L 3, which is the upper layer width of the contact structure 1000, and the fourth width L, which is the lower width of the contact structure 1000, are substantially the same.

As described above, the contact structure 1000 is manufactured by the method of manufacturing the contact structure according to the first embodiment of the present invention.

Meanwhile, the second mother substrate 200 may include a plurality of through holes 211, and in this case, the contact structure 1000 may include a plurality of through holes 211 formed in one second mother substrate 200. A plurality can be produced simultaneously by one manufacturing method. As such, the plurality of contact structures 1000 may be manufactured in a short time, thereby reducing the manufacturing time of the contact structures 1000.

As such, the contact structure 1000 manufactured by the method of manufacturing the contact structure according to the first embodiment of the present invention has a third width L₃ which is an upper width of the contact structure 1000 and a fourth width L₄ which is a lower width. Since this is substantially the same, a force such as an eccentric force does not act on the contact structure 1000 that comes into contact with the contact pad formed on the inspected object during the inspection process. As a result, the contact structure 1000 is prevented from moving in an undesired direction due to a force such as an eccentricity during the inspection process, so that a portion contacting the contact pad formed on the inspected object is not in contact with the unwanted portion on the contact pad. In other words, the contact structure 1000 contacts the exact location on the contact pad that is to be contacted. Therefore, contact reliability for the subject is improved.

In addition, since the contact structure 1000 can contact the exact position to be contacted on the contact pad, a scrub, which is a mark formed on the contact pad by the contact structure 1000 during the inspection process, is formed to be constant and small. . Thereby, the defect of the to-be-tested object by the test process is suppressed.

That is, the reliability of the inspection process is improved by the above.

In addition, the contact structure 1000 manufactured by the method for manufacturing the contact structure according to the first embodiment of the present invention may be prepared by using a double-sided polishing silicon wafer as the second substrate 210 included in the second mother substrate 200. The thickness of the second substrate 210 on which the through hole 211 is formed is uniform throughout. As a result, since the thickness of the through hole 211 is uniform, the thickness of the contact structure 1000 is also uniformly manufactured. As described above, since the thickness of the through hole 211 is uniform, when the second mother substrate 200 includes the plurality of through holes 211, the plurality of contact structures 1000 formed in the respective through holes 211 are provided. ) Will have substantially the same thickness as each other. As a result, the pressures applied to the contact pads formed on the inspected object during the inspection process are equal to each other to prevent mechanical damage that may occur in the contact pad or the contact structure 1000. That is, the reliability of the inspection process is improved.

In addition, the contact structure 1000 manufactured by the method of manufacturing the contact structure according to the first embodiment of the present invention may include a through hole 211 in which the contact structure 1000 is formed when the contact structure 1000 is formed. Since the surrounding material is silicon, the occurrence of defects on the interface between the contact structure 1000 and the material surrounding the contact structure 1000 is suppressed compared to a resin such as the polymer-based photoresist layer 230. As a result, the surface characteristics of the contact structure 1000 are improved.

Hereinafter, a method of manufacturing a contact structure according to a second embodiment of the present invention will be described with reference to FIGS. 17 to 19.

17 to 19 are views for explaining a method of manufacturing a contact structure according to a second embodiment of the present invention, Figure 18 is a cross-sectional view taken along the line VII-VII of FIG.

Hereinafter, only the characteristic parts distinguished from the first embodiment will be described and described, and the description thereof will be omitted according to the first embodiment. In addition, in the second embodiment of the present invention, for the convenience of description, the same components will be described using the same reference numerals as in the first embodiment.

First, as shown in FIGS. 17 and 18, the first mother substrate 100 and the second mother substrate 200 are prepared, and the second mother substrate 200 is adhered to the first mother substrate 100. do. The first mother substrate 100 includes only the first substrate 110 which is a double-sided polishing silicon wafer.

Next, as shown in FIG. 19, a contact structure 1000 is formed.

Specifically, after aligning the mask so that the through hole 211 is exposed on the second mother substrate 200 on which the through hole 211 is formed, the contact structure is filled with a conductive material in the through hole 211 using a sputtering process. Form.

Next, the first mother substrate 100 and the second mother substrate 200 are removed.

As described above, the contact structure 1000 is manufactured by the method of manufacturing the contact structure according to the second embodiment of the present invention.

As such, the contact structure 1000 manufactured by the method for manufacturing the contact structure according to the second embodiment of the present invention has improved reliability and surface characteristics of the inspection process.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 to 3 are views for explaining a conventional method for manufacturing a contact structure,

4 is a flowchart illustrating a method of manufacturing a contact structure according to a first embodiment of the present invention;

5 to 16 are views for explaining a manufacturing method of the contact structure according to the first embodiment of the present invention,

8 is a cross-sectional view taken along the line VIII-VIII of FIG. 7,

FIG. 13 is a cross-sectional view taken along the line III-III of FIG. 12,

17 to 19 are views for explaining the manufacturing method of the contact structure according to the second embodiment of the present invention,

18 is a cross-sectional view taken along the line VIII-VIII in FIG. 17.

Claims (19)

In the manufacturing method of the contact structure, (a) providing a first mother substrate comprising a first substrate having a conductive layer formed on an upper surface thereof, (b) providing a second mother substrate comprising a second substrate having a through hole corresponding to the image of the contact structure; (c) adhering the second mother substrate onto the first mother substrate with the conductive layer interposed therebetween, (d) filling the through hole located on the conductive layer to form the contact structure; and (e) removing the first mother substrate and the second mother substrate Method for producing a contact structure comprising a. The method of claim 1, In step (b), Preparing the second substrate; Forming a photoresist layer on the second substrate, Exposing and developing the photoresist layer to form openings corresponding to the image of the contact structure; Etching the second substrate exposed by the opening to form the through hole; and Removing the photoresist layer Method for producing a contact structure comprising a. The method of claim 2, In step (b), Forming an insulating layer on the second substrate so as to be positioned between the second substrate and the photoresist layer; Etching the insulating layer exposed by the opening to expose the second substrate; and Removing the insulating layer Method of producing a contact structure further comprising. The method of claim 1, In step (a), Providing the first substrate; and Forming the conductive layer on the first substrate Method for producing a contact structure comprising a. The method of claim 4, wherein In step (a), And forming an adhesive layer on the first substrate to be positioned between the first substrate and the conductive layer. The method of claim 5, wherein The adhesive layer is a method of manufacturing a contact structure containing titanium (Ti) or chromium (Cr). The method of claim 1, In step (d), Method for producing a contact structure to perform using a plating process using the conductive layer. The method of claim 1, In step (d), Polishing the conductive material protruding onto the second mother substrate. The method of claim 1, The conductive material comprises at least one of nickel (Ni), nickel alloy (Ni alloy), beryllium copper (BeCu) and stainless steel. The method of claim 1, And the conductive layer comprises at least one of gold (Au), silver (Ag), and copper (Cu). The method of claim 1, At least one of the first substrate and the second substrate is a silicon wafer (Si Wafer). The method of claim 11, And the silicon wafer is a double side polishing (DSP) wafer. In the manufacturing method of the contact structure, (a) providing a first mother substrate comprising a first substrate, (b) providing a second mother substrate comprising a second substrate having a through hole of a shape corresponding to the image of the contact structure; (c) adhering the second mother substrate to the first mother substrate, (d) filling the through hole with a conductive material to form the contact structure; and (e) removing the first mother substrate and the second mother substrate Method for producing a contact structure comprising a. The method of claim 13, In step (b), Preparing the second substrate; Forming a photoresist layer on the second substrate, Exposing and developing the photoresist layer to form openings corresponding to the image of the contact structure; Etching the second substrate exposed by the opening to form the through hole; and Removing the photoresist layer Method for producing a contact structure comprising a. The method of claim 14, In step (b), Forming an insulating layer on the second substrate so as to be positioned between the second substrate and the photoresist layer; Etching the insulating layer exposed by the opening to expose the second substrate; and Removing the insulating layer Method of producing a contact structure further comprising. The method of claim 13, In step (d), A method of making a contact structure, which is carried out using a sputtering process. The method of claim 13, And the conductive material comprises at least one of nickel, nickel alloys, beryllium copper and stainless steel. The method of claim 13, At least one of the first substrate and the second substrate is a silicon wafer. The method of claim 18, Wherein said silicon wafer is a double-sided polishing wafer.

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