KR100977209B1 - Space transformer, probe card having space transformer, and method for manufacturing space transformer - Google Patents

Abstract

The space transducer used in a probe card including a printed circuit board includes a first layer including a connecting portion, a pattern substrate having a through hole formed therein, a first conductive pattern connected to the connecting portion, and a first connecting pattern connected to the first conductive pattern. And a third layer including a second layer including a second conductive pattern and a third conductive pattern connected to the second conductive pattern.

Space Converter, Photoresist

Description

SPACE TRANSFORMER, PROBE CARD HAVING SPACE TRANSFORMER, AND METHOD FOR MANUFACTURING SPACE TRANSFORMER

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a space transducer, and more particularly, to a space transducer used for a probe card capable of inspecting an object to be inspected, such as a semiconductor wafer, a probe card including a space transducer, and a manufacturing method of a space transducer.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

An inspection process is performed between the fabrication process and the assembly process to inspect the electrical characteristics of the wafer by applying an electrical signal to the contact pads formed on the wafer. This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

In recent years, as the demand for highly integrated semiconductor chips increases, circuit patterns formed on the wafer by the fabrication process become highly integrated, whereby the spacing between adjacent contact pads, that is, the pitch, is very narrow. .

In order to inspect such fine pitch contact pads, a space transformer is used that performs the function of pitch conversion between the probe of the probe card and the printed circuit board.

Hereinafter, a conventional probe card will be described with reference to FIG. 1.

1 is a cross-sectional view of a conventional probe card with a space conversion substrate.

As shown in FIG. 1, a conventional probe card 10 includes a printed circuit board 11, an interposer 12, a space converter 13, and a probe 14.

The printed circuit board 11 includes a circuit pattern (not shown) and a board pad 11a formed for an inspection process, and receives and transmits an electrical signal applied from a tester (not shown) to the probe 14. Do this.

The interposer 12 is connected to the substrate pad 11a of the printed circuit board 11 to electrically connect the printed circuit board 11 and the space converter 13.

The space converter 13 is formed on the bottom surface and has a distance (pitch) between the first terminals 13a facing each other, and is formed to be narrower than the distance (pitch) between the second terminals 13b facing each other. Performs the function of pitch conversion.

In addition, the space converter 13 is formed of a multi-layer ceramic substrate (MLC) including a plurality of ceramic substrates by bonding a plurality of ceramic substrates on which a conductive pattern is formed to each other by a sintering process. The electrical signal received from the printed circuit board 11 is transmitted to the probe 14 by the conductive pattern formed in the layer.

The probe 14 is directly connected to the second terminal 13b of the space transducer 13.

As described above, since the conventional space converter 13 is formed of a plurality of ceramic substrates having conductive patterns, the manufacturing cost increases, and thus, the manufacturing cost of the probe card 10 increases. .

In addition, the conventional space converter 13 forms a plurality of ceramic substrates having conductive patterns by using a photolithography process including an exposure process, a developing process, and an etching process using a mother ceramic substrate as a material. Since each ceramic substrate is bonded and manufactured using a sintering process, it takes a long manufacturing time and has a problem of low manufacturing yield.

In the conventional space converter 13, deformation of each ceramic substrate occurs due to a high temperature environment during the sintering step in the sintering step of bonding each ceramic substrate, or deformation of the conductive pattern formed on each ceramic substrate. There is a problem in that the flatness of the probe 14 connected to the space transducer 13 is generated due to a defect in the self flatness of the space transducer 13 due to the failure.

In addition, since the conventional space transducer 13 joins each ceramic substrate by a sintering process, the size of the space transducer 13 is increased and positioned in each layer to inspect a large-area to-be-tested object such as a semiconductor wafer having a large area. In the case where the ceramic substrate becomes large in area, it is difficult to join the large area ceramic substrates to each other because it is difficult to join the central regions of neighboring large-area ceramic substrates in the sintering process.

One embodiment of the present invention is to solve the above-described problems, it is an object of the present invention to provide a space transducer, a probe card including a space transducer and a method of manufacturing a space transducer that can reduce the manufacturing cost.

Another object of the present invention is to provide a space transducer, a probe card including a space transducer, and a method of manufacturing the space transducer, which can reduce manufacturing time and improve manufacturing yield.

It is also an object of the present invention to provide a space transducer, a probe card including the space transducer, and a method of manufacturing the space transducer which can improve the self flatness.

Another object of the present invention is to provide a space transducer, a probe card including a space transducer, and a manufacturing method of the space transducer, which can be formed in a large area for inspecting a large-area subject.

As a technical means for achieving the above-described technical problem, the first aspect of the present invention is a space converter for use in a probe card including a printed circuit board, the connection portion electrically connected to the printed circuit board, part of the connection portion The first photoresist in which the above is inserted, a pattern substrate having a through hole for exposing one end of the connecting portion is formed, and a first opening positioned on the pattern substrate for exposing one end of the connecting portion. A first layer comprising a pattern and a first conductive pattern positioned in the first opening and connected to the connecting portion, the first layer being positioned on the first layer and extending in a plane direction while exposing the first conductive pattern A second photoresist pattern having a channel formed therein and a second connected to the first conductive pattern positioned in the channel A second photoresist pattern including a second layer including a conductive pattern and a second opening formed on the second layer and exposing at least a portion of the second conductive pattern; A spatial converter including a third layer including a third conductive pattern connected with a second conductive pattern is provided.

The first to third layers may be repeatedly formed to include a multilayer conductive pattern.

The first opening and the second opening are formed in plural in the first photoresist pattern and the second photoresist pattern, respectively, and the interval between the neighboring first openings and the neighboring second openings are mutually different. Can be different.

In addition, a second aspect of the present invention provides a method of manufacturing a space converter for a probe card including a printed circuit board, comprising the steps of: (a) forming a connection portion electrically connected to the printed circuit board; Forming a patterned substrate in which at least a portion of a connecting portion is inserted and a through hole is formed to expose one end of the connecting portion when the connecting portion is inserted, (c) inserting the connecting portion into the through hole, (d) Mounting a protective cover on the pattern substrate to form a protective space surrounding the connection portion, (e) inverting the pattern substrate on which the protective cover is mounted so that the pattern substrate is positioned above, (f) the A first photoresist pattern having a first opening for exposing one end of the connecting portion on a pattern substrate and an image positioned in the first opening; Forming a first layer including a first conductive pattern connected to a connecting portion, (g) exposing the first conductive pattern on the first layer and simultaneously forming a channel extending in a plane direction; Forming a second layer comprising a photoresist pattern and a second conductive pattern positioned in the channel and connected to the first conductive pattern, (h) forming at least a portion of the second conductive pattern on the second layer Forming a third layer comprising a third photoresist pattern having a second opening to be exposed and a third conductive pattern positioned in the second opening and connected to the second conductive pattern; and (i) the protection It provides a method of manufacturing a space converter comprising the step of separating the cover from the patterned substrate.

Steps (f) to (h) may be repeated to form a multilayer conductive pattern.

In each of the steps (f) and (h), a plurality of the first openings and the second openings are formed in the first photoresist pattern and the second photoresist pattern, respectively, and the adjacent first openings. The spacing of and the spacing of the neighboring second openings may be different from each other.

In the step (a), the connecting portion may be formed using MEMS (micro electro mechanical systems) technology.

The step (b) includes preparing a substrate and forming the through hole in the substrate to form the pattern substrate, wherein the through hole is formed using a mechanical processing process or a photolithography process. can do.

The step (f) may include forming a first photoresist layer on the pattern substrate, exposing and developing the first photoresist layer to form the first photoresist pattern having the first opening, and the The method may include filling the first opening with a conductive material to form the first conductive pattern.

The step (g) includes forming a second photoresist layer on the first layer, exposing and developing the second photoresist layer to form the second photoresist pattern on which the channel is formed, and the channel. The method may include filling the conductive material in the second conductive pattern to form the second conductive pattern.

(H) forming a third photoresist layer on the second layer, exposing and developing the third photoresist layer to form the third photoresist pattern having the second openings; The method may include filling the second opening with a conductive material to form the third conductive pattern.

In addition, the third aspect of the present invention is a probe card, a printed circuit board, a connecting portion electrically connected to the printed circuit board, at least a portion of the connecting portion is inserted, the through hole for exposing one end of the connecting portion A first substrate having a pattern substrate formed thereon, a first photoresist pattern formed on the pattern substrate and exposing one end of the connecting portion, and a first conductive layer disposed at the first opening and connected to the connecting portion A first layer comprising a pattern, a second photoresist pattern formed on the first layer and having a channel extending in a plane direction while exposing the first conductive pattern, and a first conductive pattern positioned in the channel; A second layer including a second conductive pattern connected to the second layer and one of the second conductive patterns positioned on the second layer; A space converter comprising a third photoresist pattern having a second opening that exposes an abnormality, and a third layer including a third conductive pattern positioned in the second opening and connected to the second conductive pattern; Provided is a probe card comprising a probe electrically connected to the third conductive pattern of the transducer.

According to one of the problem solving means of the present invention described above, since each layer is made of a photoresist pattern, there is a technical effect that the manufacturing cost is reduced.

In addition, since each layer does not perform an etching process during the entire photolithography process and is bonded without a separate bonding process, there is a technical effect of reducing manufacturing time and improving manufacturing yield.

In addition, since each layer does not perform a separate bonding process, there is a technical effect of improving its flatness.

In addition, since each layer does not perform a separate bonding process, there is a technical effect that can be formed in a large area for inspecting a large-area subject.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Throughout the specification, when a member is located “on” another member, this includes not only when one member is in contact with another member but also when another member exists between the two members. In addition, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless otherwise stated.

Hereinafter, a space converter and a probe card including the same according to an embodiment of the present invention will be described with reference to FIG. 2.

2 is a cross-sectional view of a space converter and a probe card including the same according to an embodiment of the present invention.

As shown in FIG. 2, the probe card 1000 according to the exemplary embodiment includes a printed circuit board 100, a space converter 200, and a probe 300.

The printed circuit board 100 is formed in a substantially disk shape and includes a probe circuit pattern (not shown) for an inspection process. The printed circuit board 100 may be connected to a computer for an inspection process. The probe circuit pattern (not shown) is connected to the substrate pad 110 formed on the bottom surface of the printed circuit board 100. The space converter 200 is connected to the substrate pad 110.

The space converter 200 includes a connector 210, a pattern substrate 220, a first layer 230, a second layer 240, and a third layer 250.

The connection part 210 is positioned between the printed circuit board 100 and the first layer 230 and is inserted into the through hole 221 of the pattern substrate 220. The connection part 210 is inserted into the through hole 221 and is fixed to the pattern substrate 220 by an adhesive member such as an epoxy resin. The connection unit 210 is connected to a probe circuit pattern (not shown) of the printed circuit board 100 to electrically connect the printed circuit board 100 and the first layer 230. In other words, the connection unit 210 serves as an interposer. The connection unit 210 may be finely formed using micro electro mechanical systems (MEMS) technology, such as a photolithography process, and may have its own elasticity and have a substrate pad 110 of the printed circuit board 100. Can be connected elastically.

In another embodiment, the connection portion 210 may be formed by a mechanical process such as cutting.

In another embodiment, the fixing between the connecting portion 210 and the through hole 221 of the pattern substrate 220 is connected to the structural coupling according to the structural shape of the connecting portion 210 and the through hole 221 of the pattern substrate 220. Can be performed by

The pattern substrate 220 faces the printed circuit board 100 and includes a through hole 221 formed through the pattern substrate 220 to correspond to the substrate pad 110 of the printed circuit board 100. do. The connection part 210 is inserted into the through hole 221, and one end of the connection part 210 inserted into the through hole 221 is exposed by the through hole 221. The pattern substrate 220 may be an insulating substrate such as a silicon wafer having an upper surface and a lower surface facing the upper surface thereof by a mechanical or chemical polishing process. The through hole 221 of the pattern substrate 220 may be formed using a mechanical machining process or a photolithography process using a tool. The first layer 230 is positioned on the pattern substrate 220 to face the printed circuit board 100 with the pattern substrate 220 therebetween.

The first layer 230 is adhered to the pattern substrate 220 and includes a first photoresist pattern 231 and a first conductive pattern 232.

The first photoresist pattern 231 is a state in which a photoresist material is exposed and developed, and includes a first opening 231a exposing one end of the connection portion 210. The first opening 231a is formed by an exposure and development process corresponding to the connection portion 210.

The first conductive pattern 232 is made of a conductive material and is located in the first opening 231a. The first conductive pattern 232 is connected to the connection unit 210, and is connected to the probe circuit pattern (not shown) of the printed circuit board 100 to form the second conductive pattern of the connection unit 210 and the second layer 240. 242 serves to electrically connect.

The second layer 240 is adhered to the first layer 230 and includes a second photoresist pattern 241 and a second conductive pattern 242.

The second photoresist pattern 241 is a state in which the photoresist material is exposed and developed, and includes a channel 241a exposing the first conductive pattern 232 and extending in the plane direction of the second layer 240. do. One end of the channel 241a corresponds to the first conductive pattern 232 and the other end corresponds to the third conductive pattern 252 and is formed by an exposure and development process.

The second conductive pattern 242 is made of a conductive material and is located in the channel 241a. The second conductive pattern 242 is connected to the first conductive pattern 232 and the third conductive pattern 252, and is connected to the probe circuit pattern (not shown) of the printed circuit board 100 to form the first conductive pattern ( An electrical connection between the second conductive pattern 232 and the second conductive pattern 242 is performed, and a pitch conversion function is performed from the first conductive pattern 232 to the third conductive pattern 252.

Here, the pitch refers to the interval between the neighboring first conductive patterns 232 and the interval between the neighboring third conductive patterns 252.

The third layer 250 is adhered to the second layer 240 and includes a third photoresist pattern 251 and a third conductive pattern 252.

The third photoresist pattern 251 is in a state where the photoresist material is exposed and developed, and includes a second opening 251a exposing a portion of the second conductive pattern 242. The second opening 251a is formed by an exposure and development process to correspond to a part of the second conductive pattern 242.

The third conductive pattern 252 is made of a conductive material and is located in the second opening 251a. The third conductive pattern 252 is connected to the second conductive pattern 242, and is connected to the probe circuit pattern (not shown) of the printed circuit board 100 to between the second conductive pattern 242 and the probe 300. Performs the function of electrical connection.

As described above, the space converter 200 according to the exemplary embodiment of the present invention is connected to the probe circuit pattern (not shown) of the printed circuit board 100 to pitch from the connecting portion 210 to the third conductive pattern 252. Perform the conversion. In other words, the distance between the neighboring first openings 231a and the distance between the neighboring second openings 251a are different from each other. An interval between the first conductive pattern 232 and an adjacent third conductive pattern 252 are different from each other.

In another embodiment, the space converter 200 may include fourth to Nth layers, and may include a multilayer conductive pattern to perform a function of pitch conversion by combining the first to Nth layers. .

The probe 300 is connected to the third conductive pattern 252, and is in contact with a contact pad formed on an object to be inspected, such as a semiconductor wafer, during an inspection process. The probe 300 passes through the space converter 200 from the printed circuit board 100. It is delivered to the contact pad of the subject, or serves to receive the electrical signal passed through the subject.

Hereinafter, a method of manufacturing a space converter according to an embodiment of the present invention will be described with reference to FIGS. 3 to 10.

3 is a flowchart illustrating a method of manufacturing a space converter according to an embodiment of the present invention, and FIGS. 4 to 10 are views for explaining a method of manufacturing a space converter according to an embodiment of the present invention.

First, as shown in FIGS. 3 and 4, the connection part 210 is formed (S110).

Specifically, by using a MEMS technique such as a photolithography process to form a fine connection portion 210 while having elasticity.

Next, a pattern substrate 220 is formed (S120).

Specifically, after preparing a substrate made of an insulating material such as a silicon wafer and having a top surface and a bottom surface flattened by a polishing process, a through hole 221 is formed in the substrate using a mechanical processing process or a photolithography process using a tool. As a result, a pattern substrate 220 including a through hole 221 is formed.

Next, the connecting portion 210 is inserted into the pattern substrate 220 (S130).

Specifically, the connection part 210 is formed on the inner surface of the through hole 221 of the pattern substrate 220 so that the connection part 210 is fixed to the through hole 221 of the pattern substrate 220, and then the connection part 210 is formed. ) Is inserted into the through hole 221 to fix the connection portion 210 to the pattern substrate 220.

Next, as shown in FIG. 5, the protective cover 50 is mounted on the pattern substrate 220 (S140).

Specifically, the protective cover 50 is mounted to form a protective space S surrounding the connection portion 210 on the pattern substrate 220. The connection part 210 is wrapped by the protective cover 50.

Next, as shown in FIG. 6, the pattern substrate 220 is inverted (S150).

Specifically, the pattern substrate 220 on which the protective cover 50 is mounted is inverted so that the pattern substrate 220 is positioned above. At this time, damage to the connection portion 210 is prevented by the protective cover 50.

Next, as shown in FIGS. 7 and 8, the first layer 230 is formed (S160).

Specifically, the first photoresist layer 610 made of a photoresist material is formed on the pattern substrate 220, and the image corresponding to the first opening 231a to be formed later on the first photoresist layer 610. After aligning the mask having a, the first photoresist layer 610 is exposed by irradiating ultraviolet rays or the like to the first photoresist layer 610 through the mask. The exposed first photoresist layer 610 is developed using a developer after exposure to form a first photoresist pattern 231 having a first opening 231a corresponding to the connection portion 210. Thereafter, the first opening 231a is filled with a conductive material using a sputtering process or the like to form the first conductive pattern 232. The first layer 230 is formed on the pattern substrate 220 by the above process.

Next, as shown in FIGS. 8 and 9, the second layer 240 is formed (S170).

Specifically, a second photoresist layer 620 made of a photoresist material is formed on the first layer 230, and an image corresponding to the channel 241a to be formed later is formed on the second photoresist layer 620. After the excitation mask is aligned, the second photoresist layer 620 is exposed by irradiating the second photoresist layer 620 with ultraviolet rays through the mask. The second photoresist pattern 241 is formed by developing the second photoresist layer 620 exposed using a post-exposure developing solution to form a channel 241a that extends in a plane direction at the same time as the first conductive pattern 232. To form. Thereafter, the channel 241a is filled with a conductive material using a sputtering process or the like to form the second conductive pattern 242. By the above process, the second layer 240 is formed on the first layer 230.

Next, as shown in FIGS. 9 and 10, the third layer 250 is formed (S180).

Specifically, a third photoresist layer 630 made of a photoresist material is formed on the second layer 240, and an image corresponding to the channel 241a to be formed later is formed on the third photoresist layer 630. After the excitation mask is aligned, the third photoresist layer 630 is exposed by irradiating ultraviolet rays or the like to the third photoresist layer 630 through the mask. The exposed third photoresist layer 630 is developed using a developer after exposure to form a third photoresist pattern 251 having a second opening 251a corresponding to the second conductive pattern 242. Thereafter, a third conductive pattern 252 is formed by filling the second opening 251a with a conductive material using a sputtering process or the like. The 3rd layer 250 is formed on the 2nd layer 240 by the above process.

In another embodiment, the process of forming the first layer 230 to the third layer 250 may be repeated so that the space converter 200 includes the multilayer conductive pattern.

Next, the protective cover 50 is removed (S190).

Specifically, when the protective cover 50 is separated from the pattern substrate 220, the space converter 200 according to the exemplary embodiment of the present invention shown in FIG. 2 is manufactured.

As such, in the method of manufacturing the space transducer, the probe card, and the space transducer according to the embodiment of the present invention, the first layer 230, the second layer 240, and the third layer 250 of the space transducer 200 may be formed. Since it consists of a conductive pattern and a photoresist pattern, manufacturing cost is reduced compared with the space converter in which each layer is formed with a ceramic substrate.

In addition, the first layer 230, the second layer 240, and the third layer 250 of the space converter 200 do not perform an etching process during the entire photolithography process, and a bonding process is not performed without a separate bonding process. As a result, manufacturing time is reduced and manufacturing yield is improved, compared to a space converter in which each layer is formed of a ceramic substrate.

In addition, the first layer 230, the second layer 240, and the third layer 250 of the space transducer 200 are bonded without performing a separate bonding process, and the upper and lower surfaces of the pattern substrate 220 are flat. Since the flatness of the space transducer 200 is improved, the flatness of the probe 300 connected to the third layer 250 is improved.

In addition, since the first layer 230, the second layer 240, and the third layer 250 of the space transducer 200 are bonded without performing a separate bonding process, to inspect a large-area subject. The large space converter 200 may be formed.

In addition, since the space converter 200 includes a connection portion 210 which serves as an interposer itself, a separate interposer for connecting the printed circuit board 100 and the space converter 200 is not necessary. Accordingly, the manufacturing cost of the probe card 1000 is reduced.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 is a cross-sectional view of a conventional probe card with a space conversion substrate,

2 is a cross-sectional view of a space converter and a probe card including the same according to an embodiment of the present invention;

3 is a flowchart illustrating a method of manufacturing a space converter according to an embodiment of the present invention.

4 to 10 are views for explaining a method of manufacturing a space converter according to an embodiment of the present invention.

Claims (14)

A spatial transducer used for a probe card comprising a printed circuit board, A connection part electrically connected to the printed circuit board; A pattern substrate in which at least a portion of the connection part is inserted and a through hole exposing one end of the connection part is formed; A first photoresist pattern disposed on the pattern substrate, the first photoresist pattern having a first opening exposing one end of the connection portion, and a first conductive pattern positioned in the first opening and connected to the connection portion; layer, A second photoresist pattern disposed on the first layer and exposing the first conductive pattern and simultaneously extending in a surface direction, and a second photoresist pattern positioned on the channel and connected to the first conductive pattern; A second layer comprising a conductive pattern and A third photoresist pattern on the second layer and having a second opening to expose at least a portion of the second conductive pattern; and a third photoresist disposed on the second opening and connected to the second conductive pattern. Third layer containing conductive pattern Space converter comprising a. The method of claim 1, The first to third layers are repeatedly formed to include a multilayer conductive pattern. The method of claim 1, The first opening and the second opening are formed in plural in the first photoresist pattern and the second photoresist pattern, respectively. Wherein the spacing of the neighboring first openings and the spacing of the neighboring second openings are different from each other. In the manufacturing method of the space converter used for the probe card including a printed circuit board, (a) forming a connection portion electrically connected to the printed circuit board, (b) forming a pattern substrate in which at least a portion of the connecting portion is inserted and a through hole is formed to expose one end of the connecting portion when the connecting portion is inserted; (c) inserting the connection part into the through hole; (d) mounting a protective cover on the pattern substrate to form a protective space surrounding the connecting portion, (e) inverting the pattern substrate on which the protective cover is mounted so that the pattern substrate is located on the upper side; (f) a first photoresist pattern having a first opening to expose one end of the connection portion formed on the pattern substrate and a first conductive pattern positioned at the first opening and connected to the connection portion; Forming a layer, (g) a second photoresist pattern having a channel extending in a plane direction at the same time exposing the first conductive pattern on the first layer, and a second photoresist positioned in the channel and connected to the first conductive pattern Forming a second layer comprising a conductive pattern, (h) a third photoresist pattern having a second opening formed on the second layer to expose at least a portion of the second conductive pattern, and a third located in the second opening and connected to the second conductive pattern. Forming a third layer comprising a conductive pattern and (i) separating the protective cover from the pattern substrate Method of manufacturing a space converter comprising a. The method of claim 4, wherein And repeating steps (f) to (h) to form a multilayer conductive pattern. The method of claim 4, wherein In each of (f) and (h), The first opening and the second opening are formed in plural in the first photoresist pattern and the second photoresist pattern, respectively. The spacing of the neighboring first openings and the neighboring second openings are different from each other. The method of claim 4, wherein In step (a), The connecting portion is formed by using a micro electro mechanical systems (MEMS) method of manufacturing a space converter. The method of claim 4, wherein In step (b), Preparing a substrate, and Forming the pattern substrate by forming the through hole in the substrate Including, The through-hole is a manufacturing method of the space converter is formed by using a mechanical machining process or photolithography (photolithography) process. The method of claim 4, wherein Step (f), Forming a first photoresist layer on the pattern substrate, Exposing and developing the first photoresist layer to form the first photoresist pattern having the first openings; and Filling the first opening with a conductive material to form the first conductive pattern Method of manufacturing a space converter comprising a. The method of claim 4, wherein In step (g), Forming a second photoresist layer on the first layer, Exposing and developing the second photoresist layer to form the second photoresist pattern having the channel formed thereon; and Filling the channel with a conductive material to form the second conductive pattern Method of manufacturing a space converter comprising a. The method of claim 4, wherein In step (h), Forming a third photoresist layer on the second layer, Exposing and developing the third photoresist layer to form the third photoresist pattern having the second openings; and Filling the second opening with a conductive material to form the third conductive pattern Method of manufacturing a space converter comprising a. In the probe card, Printed circuit board, A connecting portion electrically connected to the printed circuit board, a pattern substrate having at least a portion of the connecting portion inserted therein and having a through hole for exposing one end of the connecting portion, a pattern substrate positioned on the pattern substrate and having one end of the connecting portion A first layer comprising a first photoresist pattern having a first opening exposing the first opening and a first conductive pattern positioned in the first opening and connected to the connection portion, the first layer being positioned on the first layer A second layer and a second layer including a second photoresist pattern having a channel extending in a plane direction while exposing the first conductive pattern and a second conductive pattern positioned in the channel and connected to the first conductive pattern; A third photoresist pattern having a second opening formed on the layer and exposing at least a portion of the second conductive pattern And a third layer including a third conductive pattern positioned in the second opening and connected to the second conductive pattern. A probe electrically connected to the third conductive pattern of the spatial transducer Probe card comprising a. 13. The method of claim 12, The space converter, The probe card of claim 1, wherein the first to third layers are repeatedly formed to include a multilayer conductive pattern. 13. The method of claim 12, The first opening and the second opening are formed in plural in the first photoresist pattern and the second photoresist pattern, respectively. And a gap between the neighboring first openings and a neighboring second opening is different from each other.

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