KR20090117218A - Method of making probe card - Google Patents

Abstract

PURPOSE: A method for manufacturing a probe card is provided to suppress the waste of a second substrate by inserting a probe into a first substrate firstly. CONSTITUTION: A first substrate with a plurality of probe holes is prepared(S100). A probe is inserted into the probe holes on the first substrate(S200). A conductive bump is formed on the surface of the probe and the first substrate(S300). The probe is connected to a conductive pattern by bonding the first substrate with the probe in the second substrate with the conductive pattern(S400).

Description

Manufacturing method of probe card {METHOD OF MAKING PROBE CARD}

The present invention relates to a method for manufacturing a probe card, and more particularly, to a method for manufacturing a probe card using batch mounting.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

An inspection process is performed between the fabrication process and the assembly process to inspect the electrical characteristics of the wafer by applying an electrical signal to the contact pads formed on the wafer. This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

In recent years, as the demand for high integrated chips increases, circuit patterns formed on the wafer by the fabrication process and contact pads connected with the circuit patterns are highly integrated. That is, the spacing between neighboring contact pads is very narrow, and the size of the contact pad itself is also finely formed. As a result, since the probe of the probe card used in the inspection process must be in contact with the contact pad, the distance between neighboring probes corresponding to the contact pad must be formed very narrowly, and the size of the probe itself must also be finely formed.

Hereinafter, a method of manufacturing a conventional probe card will be described with reference to FIGS. 1 to 3.

1 to 3 are diagrams for explaining a conventional method of manufacturing a probe card.

First, as shown in FIG. 1, an opening 11 is formed in a sacrificial substrate 10 using photolithography technology, and a probe 20 is formed by filling a conductive material in the opening 11.

Next, as shown in FIG. 2, the probe card is completed by bonding each probe 20 to the pad 31 formed on the substrate 30.

The conventional method of manufacturing a probe card as described above bonds each probe 20 to a pad 31 formed on the substrate 30, thereby increasing the time for bonding each probe 20. FIG. This increases the manufacturing time and manufacturing cost.

Hereinafter, another conventional method of manufacturing a probe card for solving the above problems will be described.

First, as shown in FIG. 1, an opening 11 is formed in a sacrificial substrate 10 using photolithography technology, and a probe 20 is formed by filling a conductive material in the opening 11.

Next, as shown in FIG. 3, the probe 20 formed on the sacrificial substrate 10 is bonded to the pad 31 formed on the substrate 30.

Next, as shown in FIG. 2, the probe card is completed by separating the sacrificial substrate 10 from the probe 20.

As described above, another conventional method of manufacturing a probe card uses a photolithography technique used to form a pattern of a semiconductor, so that the size of the probe 20 itself can be finely formed, and the interval between neighboring probes 20 can be achieved. It can also be formed in the printed circuit board 30 very narrowly.

However, according to another conventional method of manufacturing a probe card, the plurality of probes 20 are collectively bonded to the pad 31 formed on the substrate 30, so that some probes 20 or the entire probes 20 are pads. Defects that are not exactly aligned on 31 may occur. In this case, after bonding the plurality of probes 20 to the substrate 30, the alignment state of the plurality of probes 20 is inspected by an additional process to remove the probes 20 when the alignment state is poor. The problem arises in that the alignment must be correctly bonded again. This is a factor that increases the manufacturing period and manufacturing cost.

In addition, since the plurality of probes 20 formed on the sacrificial substrate 10 are collectively bonded to the substrate 30, when some of the probes 20 of the plurality of probes 20 formed on the sacrificial substrate 10 have abnormalities, In addition, since the surface state of the probe 20 cannot be confirmed, there is a problem that the abnormal probe 20 is bonded to the substrate 30 as it is. Therefore, the trouble of having to replace the abnormal probe 20 with the abnormal probe 20 by an additional process or to bond the plurality of probes 20 to the substrate 30 again.

On the other hand, an expensive multi-layer ceramic substrate (MLC) is used as the substrate 30 to correspond to the contact pads formed finely on the wafer. However, in this case, when bonding the plurality of probes 20 to the substrate 30 by using a conventional method of manufacturing a probe card, when a bonding failure occurs and the defective probe 20 is replaced with a new probe, In the replacement process, a failure occurs in the pad 31 of the substrate 30, and thus the substrate 30 may not be recycled and disposed of. In this case, the manufacturing cost increases because a new expensive multilayer ceramic substrate must be used.

One embodiment of the present invention is to solve the above-described problems, an object of the present invention is to provide a method of manufacturing a probe card that can correctly align the probe with respect to the substrate when bonding the probe to the substrate.

In addition, another object of the present invention is to provide a method of manufacturing a probe card, which can confirm the state of a probe when bonding the probe to a substrate.

It is also an object of the present invention to provide a method for manufacturing a probe card, which can reduce the manufacturing period and manufacturing cost.

In addition, an object of the present invention is to provide a method for manufacturing a probe card that can suppress the disposal of a substrate when bonding failure occurs.

As a technical means for achieving the above technical problem, an aspect of the present invention is a method of manufacturing a probe card, a) providing a first substrate having a plurality of probe holes, b) said first substrate Inserting a probe into each of the plurality of probe holes, c) forming conductive bumps between an end surface of the probe and a surface of the first substrate, and d) forming a conductive pattern on the first substrate into which the probe is inserted. Bonding to the formed second substrate, to provide a method of manufacturing a probe card comprising the step of connecting between the probe and the conductive pattern.

The conductive bumps may be formed in plurality for each of the probes.

The step a) may include preparing an insulating substrate and forming the plurality of probe holes in the insulating substrate using a photolithography process.

In the step c), the conductive bumps may be formed using a jetting process or a screen printing process.

Step d) may be performed by melting the conductive bumps using heat or a laser.

Step a) may include forming one or more guide holes positioned adjacent to each of the probe holes.

The step b) may be performed by mounting the guide part formed on the probe to the guide hole, and mounting the signal part formed on the probe to the probe hole.

The conductive bumps may be conductive pastes or solders.

The second substrate may be a multi-layer ceramic substrate (MLC).

According to one of the problem solving means of the present invention described above, there is an effect that the alignment state of the probe with respect to the second substrate can be corrected by bonding the first substrate having the probe inserted into the second substrate.

In addition, since the probe is inserted into the first substrate, there is an effect that the state of the probe can be confirmed when bonding the probe to the second substrate.

In addition, since a plurality of probes are inserted into the first substrate and the first substrate is bonded to the second substrate, the plurality of probes may be collectively mounted on the second substrate to reduce the manufacturing period and manufacturing cost.

In addition, since the probe is preferentially inserted into the first substrate, there is an effect of suppressing the disposal of the second substrate which may occur when bonding failure occurs.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a member is located “on” another member, this includes not only when one member is in contact with another member but also when another member exists between the two members. In addition, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless otherwise stated.

Hereinafter, a probe card manufactured by the method of manufacturing a probe card according to the first embodiment of the present invention will be described with reference to FIG. 4.

4 is a cross-sectional view of a probe card manufactured by the method of manufacturing a probe card according to the first embodiment of the present invention.

As shown in FIG. 4, the probe card 1000 may include a printed circuit board 100, an interposer 200, a second substrate 300, a conductive bump 400, a probe 500, and a first substrate 600. ).

The printed circuit board 100 is formed in a substantially disk shape, and a probe circuit pattern (not shown) is formed. The printed circuit board 100 may be connected to a tester for an inspection process, and when connected, the tester is connected to a probe circuit pattern (not shown).

The lower surface of the printed circuit board 100 is formed with a substrate pad 110 to which the interposer 200 to be described later is connected. The printed circuit board 100 performs pitch conversion through wiring from the upper surface of the printed circuit board 100 to the substrate pad 110 formed on the lower surface of the printed circuit board 100 in order to inspect a test object such as a highly integrated wafer. Can be.

Reinforcement plates may be mounted on upper and lower sides of the printed circuit board 100, respectively.

The reinforcing plate, which may be located above the printed circuit board 100, serves to protect the printed circuit board 100 from pressure applied to the printed circuit board 100 during an external impact or inspection process. In addition, the reinforcing plate which can be positioned below the printed circuit board 100 suppresses external shock or its own flow of the second substrate 300, which will be described later, to be described later mounted on the second substrate 300. The first substrate 600 and the plurality of probes 500 are to make uniform contact with the contact pads formed on the inspection object such as a wafer.

The interposer 200 is connected to a probe circuit pattern (not shown) formed at the printed circuit board 100 by contacting the substrate pad 110 formed at one end thereof with the printed circuit board 100. Is in contact with the first pad 310 formed on the second substrate 300. The interposer 200 serves to transfer an electrical signal from the tester through the printed circuit board 100 to the second substrate 300 for the inspection process.

The second substrate 300 is made of a multi-layer ceramic (MLC) in which an insulating layer made of ceramic, glass, silicon, etc., and a conductive layer made of gold, silver, copper, etc. are alternately overlapped, and a printed circuit. Spatial transformation is performed between the substrate 100 and the probe 500. The second substrate 300 includes a first pad 310 formed on an upper surface facing the printed circuit board 100 and a second pad 320 formed on a lower surface facing the upper surface. The first pad 310 of the second substrate 300 is in contact with the interposer 200, and the probe 500 is attached to the second pad 320 by a conductive bump 400 to be described later.

In another embodiment, the second substrate 300 forms a through hole in an insulating substrate made entirely of ceramic, glass, silicon, and the like, and fills the through hole with a conductive material to fill the printed circuit board 100 and the probe. The spatial transformation between 500 may be performed.

In another embodiment, the second substrate 300 may be a flexible substrate in which the conductive layer and the insulating layer alternately overlap.

The conductive bumps 400 are conductive pastes or solders, and are positioned between the second pads 320 and the probes 500 of the second substrate 300. The conductive bump 400 facilitates the attachment of the probe 500 to the second pad 320 and serves to transfer the test signal from the second substrate 300 to the probe 500.

The probe 500 is attached to the second pad 320 of the second substrate 300 and inserted into the probe hole 610 of the first substrate 600 which will be described later. The probe 500 is in contact with a contact pad formed on an inspected object such as a wafer during the inspection process. The probe 500 may be manufactured using MEMS (Micro Electro Mechanical System) technology.

For example, MEMS technology forms an opening in the form of a probe 500 on a sacrificial substrate using photolithography, fills the opening with a conductive material such as nickel by using a plating method, and removes the sacrificial substrate. The technique of manufacturing the probe 500, which is a conductive material filled in, is referred to.

In other embodiments, the probe 500 may be directly connected to the printed circuit board 100. In detail, the probe 500 may be attached to the substrate pad 110 of the printed circuit board 100 by the conductive bump 400.

The plurality of probes 500 are inserted into the probe holes 610 of the first substrate 600, respectively.

The first substrate 600 is positioned below the second substrate 300, and a plurality of probe holes 610 are formed. The first substrate 600 is an insulating substrate made of silicon or ceramics. The probe hole 610 may be formed in the first substrate 600 using a photolithography process.

Hereinafter, a method of manufacturing a probe card according to the first embodiment of the present invention will be described with reference to FIGS. 5 to 11.

5 is a flowchart illustrating a method of manufacturing a probe card according to a first embodiment of the present invention, and FIGS. 6 to 11 are views illustrating a method of manufacturing a probe card according to a first embodiment of the present invention. 9 is a cross-sectional view taken along the line VIII-VIII in FIG. 8.

First, as shown in FIGS. 5 and 6, the first substrate 600 is prepared (S100).

Specifically, after preparing an insulating substrate made of silicon or ceramic, a photoresist layer having a photoresist material is formed on the insulating substrate, and the photoresist layer is exposed and developed to correspond to the plurality of probe holes 610. After opening the region, the opened first substrate 600 is etched using a wet etching process or a dry etching process to form a probe hole 610. When the insulating substrate is made of silicon, the probe hole 610 may be formed using a bosch process using a silicon oxide layer formed by oxidizing a surface of silicon. By the above process, the first substrate 600 having the plurality of probe holes 610 is provided.

In another embodiment, the probe hole 610 may be formed using mechanical processing using a drilling process or the like.

Next, as shown in FIG. 7, the probe 500 is inserted into the first substrate 600 (S200).

Specifically, the probe 500 is supported in the probe hole 610 by inserting the probe 500 into each probe hole 610 formed in the first substrate 600. The diameter of the probe 500 located in the probe hole 610 is preferably smaller than the diameter of the probe hole 610. That is, the probe 500 is preferably loosely supported in the probe hole 610. Therefore, the process of inserting the probe 500 into the probe hole 610 can be easily performed.

On the other hand, the production of the probe 500 is formed using a MEMS technique using photolithography. As described above, the MEMS technique forms an opening in the form of a probe 500 on a sacrificial substrate using photolithography, and then fills the opening with a conductive material such as nickel by using a plating method and removes the sacrificial substrate. The technique of manufacturing the probe 500 which is a conductive material, and the like.

Next, as shown in FIGS. 8 and 9, the conductive bumps 400 are formed (S300).

In detail, the conductive bumps 400 may be formed using a jetting process using a jetting apparatus 2000 on the back surface of the first substrate 600 in which the probes 500 are inserted into the probe holes 610. As such, by forming the conductive bumps 400 on the first substrate 600 using the jetting process, not only the positional accuracy of the conductive bumps 400 can be improved, but also the manufacturing time can be shortened.

In another embodiment, the conductive bumps 400 may be formed using a screen printing process using a stencil mask.

The conductive bump 400 is, for example, solder, or alternatively, may be a conductive paste. In addition, the conductive bumps 400 may be positioned over the end surface of the probe 500 exposed to the outside of the probe hole 610 and the surface of the first substrate 600. With this configuration, when the conductive bump 400 bonds the first substrate 600 to the second substrate 300 to be described later, the probe not only functions as a bonding medium but also is loosely supported by the first substrate 600. A function of fixing the 500 to the first substrate 600 is performed.

In addition, one or more conductive bumps 400 may be formed, and among the conductive bumps 400, a plurality of conductive bumps 400 may be formed. Since the conductive bumps 400 are formed in plural across the probe 500 and the first substrate 600, the probe 500 is more firmly fixed to the first substrate 600.

Next, as shown in FIGS. 10 and 11, the first substrate 600 is bonded to the second substrate 300 (S400).

Specifically, as shown in FIG. 10, the probe 500 is inserted into and fixed to the conductive bumps 400 on the second pads 320, which are conductive patterns of the second substrate 300 made of a multilayer ceramic substrate. After aligning the first substrate 600, the first substrate 600 is lowered in the first direction to bond the first substrate 600 to the second substrate 300. The bonding of the first substrate 600 to the second substrate 300 increases the temperature of the surrounding environment of the conductive bump 400 to a temperature at which the conductive bump 400 may melt or flow to use the conductive bump 400. After bonding between the end of the probe 500 and the second pad 320 of the first substrate 600, the temperature of the surrounding environment of the conductive bump 400 is lowered to a temperature at which the conductive bump 400 can harden. Can be done.

As shown in FIG. 11, when the first substrate 600 is bonded to the second substrate 300, the conductive bumps 400 are broadly layered on the surface of the second pad 320 of the second substrate 300. The conductive bumps 400 adjacent to the one probe 500 are coupled to each other. As a result, the probe 500 and the second pad 320 of the second substrate 300 are brought into surface contact by the conductive bumps 400 that are widely spread in a layer shape.

In another embodiment, bonding of the first substrate 600 to the second substrate 300 may be performed by irradiating a laser to the conductive bumps 400.

The probe card 1000 is manufactured by the above method.

As described above, the probe hole 610 is formed in the first substrate 600, and after the probe 500 is inserted into the probe hole 610, a plurality of probes are provided over the probe 500 and the first substrate 600. Since the conductive bumps 400 are formed, the alignment state of the probe 500 with respect to the first substrate 600 can be corrected. That is, since the probe 500 bonds the first substrate 600 aligned correctly to the second substrate 300, the probe 500 with respect to the second substrate 300 when the probe 500 is bonded to the second substrate. ) Can be aligned correctly.

In addition, since each of the plurality of probes 500 is inserted into the probe hole 610 of the first substrate 600, the state of the probe 500 may be checked before bonding the probe 500 to the second substrate 300. Can be.

In addition, since the plurality of probes 500 are collectively mounted on the second substrate 300 using the first substrate 600 to which the plurality of probes 500 are inserted and fixed, the plurality of probes may be collectively using one process. The 500 may be bonded onto the second substrate 300. That is, the manufacturing period and manufacturing cost are reduced.

In addition, since the probe 500 is inserted into and fixed to the first substrate 600 by the conductive bumps 400, when a defect occurs in the step of inserting and fixing the probe 500 to the first substrate 600, the defect may occur. The generated probe 500 or the first substrate 600 may be replaced. That is, bonding the probe 500 to the first substrate 600 before bonding the probe 500 to the second substrate 300 made of an expensive multilayer ceramic substrate using the first substrate 600. Therefore, the burden on the expensive second substrate 300 can be reduced, and the disposal of the second substrate 300, which may occur due to poor bonding, can be suppressed. That is, the manufacturing cost can be reduced.

Thereby, the manufacturing reliability is improved, and the manufacturing method of the probe card which reduced the manufacturing period and manufacturing cost is provided.

Hereinafter, a method of manufacturing a probe card according to a second exemplary embodiment of the present invention will be described with reference to FIG. 12.

12 is a view for explaining a method of manufacturing a probe card according to a second embodiment of the present invention.

Hereinafter, only the characteristic parts distinguished from the first embodiment will be described and described, and the description thereof will be omitted according to the first embodiment. In addition, in the second embodiment of the present invention, for the convenience of description, the same components will be described using the same reference numerals as in the first embodiment.

As shown in FIG. 12, first, a first substrate 600 including a probe hole 610 and a guide hole 650 is prepared.

In detail, the guide hole 650 may be formed adjacent to the probe hole 610, and the probe hole 610 and the guide hole 650 may be formed using a photolithography process.

In another embodiment, the probe hole 610 and the guide hole 650 may be formed by mechanical machining using a drilling process or the like.

Next, the probe 500 is inserted into the first substrate 600.

Specifically, the signal unit 510 of the probe 500 is inserted into each of the probe holes 610 formed in the first substrate 600, and the probe 500 is disposed in the guide hole 650 adjacent to each probe hole 610. Insert the guide portion 550 of the support 500 to support the probe hole 610 and the guide hole 650. The diameter of the probe 500 located in the probe hole 610 and the guide hole 650 is preferably smaller than the diameter of the probe hole 610 and the guide hole 650. That is, the probe 500 may be loosely supported in the probe hole 610 and the guide hole 650.

Next, a plurality of conductive bumps 400 are formed corresponding to the signal unit 510 of the probe 500.

Next, the first substrate 600 is bonded to the second substrate 300.

A probe card is manufactured by the above method.

As described above, the method of manufacturing the probe card according to the second exemplary embodiment of the present invention includes a signal unit 510 of the probe 500 and a probe hole 610 and a guide hole 650 formed in the first substrate 600. Since the guide part 550 is inserted, the probe 500 may be more firmly supported on the first substrate 600.

In addition, since each probe 500 is supported by the probe hole 610 and the guide hole 650 formed in the first substrate 600, the pressure applied to the probe 500 during the inspection process is dispersed in two or more directions. Thus, the contact reliability is improved during the inspection process. That is, inspection reliability is improved.

Thereby, manufacturing reliability and inspection reliability are improved, and the manufacturing method of the probe card which reduced the manufacturing period and manufacturing cost is provided.

Hereinafter, a method of manufacturing a probe card according to a third embodiment of the present invention will be described with reference to FIG. 13.

13 is a view for explaining a method of manufacturing a probe card according to a third embodiment of the present invention.

Hereinafter, only the characteristic parts distinguished from the first embodiment will be described and described, and the description thereof will be omitted according to the first embodiment. In the third embodiment of the present invention, for the convenience of description, the same components will be described with the same reference numerals as in the first embodiment.

As shown in FIG. 13, first, a first substrate 600 including a probe hole 610, a first guide hole 660, and a second guide hole 670 is prepared.

Specifically, the first guide hole 660 and the second guide hole 670 are formed to be adjacent to the probe hole 610, and the probe hole 610, the first guide hole 660 and the second The guide hole 670 is formed using a photolithography process.

Next, the probe 500 is inserted into the first substrate 600.

Specifically, the signal unit 510 of the probe 500 is inserted into each of the probe holes 610 formed in the first substrate 600, and the first guide holes 660 and the first neighboring holes of the probe holes 610 are formed. The first guide part 560 and the second guide part 570 of the probe 500 are inserted into each of the two guide holes 670 so that the probe 500 is connected to the probe hole 610, the first guide hole 660, The second guide hole 670 is supported. The diameter of the probe 500 located in the probe hole 610, the first guide hole 660, and the second guide hole 670 may be the probe hole 610, the first guide hole 660, and the second guide hole ( 670 is preferably smaller than the diameter. That is, the probe 500 may be loosely supported in the probe hole 610, the first guide hole 660, and the second guide hole 670.

Next, a plurality of conductive bumps 400 are formed corresponding to the signal unit 510 of the probe 500.

Next, the first substrate 600 is bonded to the second substrate 300.

A probe card is manufactured by the above method.

As described above, in the method of manufacturing the probe card according to the second embodiment of the present invention, a probe is formed in each of the probe hole 610, the first guide hole 660, and the second guide hole 670 formed in the first substrate 600. Since the signal part 510, the first guide part 560, and the second guide part 570 of the 500 are inserted, the probe 500 may be more firmly supported on the first substrate 600.

In addition, since each probe 500 is supported by the probe hole 610, the first guide hole 660, and the second guide hole 670 formed in the first substrate 600, the probe 500 during the inspection process. The pressure applied to is dispersed in three or more directions, thereby improving contact reliability during the inspection process. That is, inspection reliability is improved.

Thereby, manufacturing reliability and inspection reliability are improved, and the manufacturing method of the probe card which reduced the manufacturing period and manufacturing cost is provided.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 to 3 are views for explaining a conventional method of manufacturing a probe card,

4 is a cross-sectional view of a probe card manufactured by the method of manufacturing a probe card according to the first embodiment of the present invention;

5 is a flowchart illustrating a method of manufacturing a probe card according to a first embodiment of the present invention.

6 to 11 are views for explaining a method of manufacturing a probe card according to a first embodiment of the present invention,

9 is a cross-sectional view taken along the line VIII-VIII of FIG. 8;

12 is a view for explaining a method of manufacturing a probe card according to a second embodiment of the present invention;

13 is a view for explaining a method of manufacturing a probe card according to a third embodiment of the present invention.

Claims (9)

In the manufacturing method of the probe card, a) preparing a first substrate on which a plurality of probe holes are formed; b) inserting a probe into each of the plurality of probe holes of the first substrate, c) forming a conductive bump across the end surface of the probe and the surface of the first substrate, and d) bonding the first substrate into which the probe is inserted to a second substrate on which a conductive pattern is formed, and connecting the probe to the conductive pattern Method of manufacturing a probe card comprising a. The method of claim 1, And a plurality of conductive bumps are formed for each of the probes. The method of claim 1, Step a) is Preparing an insulating substrate, and Forming the plurality of probe holes in the insulating substrate using a photolithography process Method of manufacturing a probe card comprising a. The method of claim 1, Step c) is A method of manufacturing a probe card, wherein the conductive bumps are formed using a jetting process or a screen printing process. The method of claim 1, In step d), Method of manufacturing a probe card that is carried out by melting the conductive bumps using heat or laser. The method of claim 1, Step a) is And forming one or more guide holes positioned adjacent to each of the probe holes. The method of claim 6, Step b), The guide portion formed in the probe is mounted in the guide hole, And mounting the signal part formed on the probe to the probe hole. The method of claim 1, The conductive bump is a conductive paste (paste) or solder (solder) manufacturing method of the probe card. The method of claim 1, And the second substrate is a multi-layer ceramic substrate (MLC).

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