KR20090121025A - In-line die cleaning apparatus and method using plasma - Google Patents

Abstract

PURPOSE: An in-line die cleaning apparatus and a method using plasma are provided to reduce a failure rate of a semiconductor molding product due to contamination of one of an upper or a lower molding by cleaning the both molding. CONSTITUTION: An in-line die cleaning apparatus is composed of a cleaning module and a conveying unit. A cleaning module(190) forms a chamber when being matched with at least one of the upper molding(1010a) and lower molding(1010b). The cleaning module is formed to generate plasma within the chamber, and the conveying unit transfers a cleaning module at a position for cleaning from the upper molding to the lower molding. The cleaning module is lifted up by the lower molding at the position for cleaning and matched with the upper mold.

Description

IN-LINE DIE CLEANING APPARATUS AND METHOD USING PLASMA}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the field of mold cleaning of semiconductor molding equipment, and more particularly, to an apparatus and method for cleaning the molds without separating the molds used in the process of molding a semiconductor into a resin from the molding equipment.

In an electronic component, in particular, a semiconductor manufacturing process, a molding process of encapsulating a plurality of semiconductor chips located on a lead frame or a substrate with a resin such as EMC (Epoxy Molding Compound) is performed using a mold. This molding process is performed using a vertical mold having a plurality of cavities that define the periphery of the semiconductor chip. After the molding process, residues of resin remain in the cavity of the mold, which causes a subsequent molding process to be inhibited.

Accordingly, a work for periodically cleaning the inside of the cavity of the mold is required. As a method for cleaning a mold, wet cleaning by manual operation of removing resin residues using a chemical after separating the mold from the molding equipment is well known. However, such a wet cleaning method causes a lot of trouble and waste of time without high cleaning efficiency. In addition, there is also a problem that it is not environmentally friendly because it uses chemicals.

Another mold cleaning method is a technique of separating a mold from a semiconductor molding equipment and cleaning the separated mold in a plasma cleaning facility provided separately. However, this technique still requires a lot of labor and time for the removal and remounting of the mold, and thus economics.

In contrast, a technique for cleaning a mold using plasma discharge has been developed by the present inventors without separating the mold from the semiconductor molding equipment, and this technique is disclosed in WO2007029949. The disclosed technique is a technique for cleaning a mold surface by plasma discharge in a plasma chamber after partitioning a plasma chamber between a box-shaped frame (i.e., a cleaning case) mounted on a semiconductor molding equipment. It is economical in that the mold can be cleaned without separating from the semiconductor molding equipment. Nevertheless, the above prior art has technical limitations in cleaning the mold surface at a desired time point or a desired period in an automated inline manner.

In particular, the prior art has a problem that the plasma chamber is formed in contact with the surface of only one mold, it is not possible to clean the two molds consisting of one set up and down in one process.

 Accordingly, a technical object of the present invention is to provide an apparatus and method for automatically cleaning a mold surface contaminated by resin on a semiconductor molding equipment at a desired time point or at a desired period using plasma in an inline manner. To provide.

According to an aspect of the present invention, an inline mold cleaning apparatus for performing plasma cleaning of at least one of an upper mold and a lower mold installed in a semiconductor molding equipment in an inline manner. The disclosed in-line mold cleaning apparatus includes a cleaning module configured to form a chamber when it is matched with at least one of the upper mold and the lower mold, and to generate a plasma in the chamber; And a transfer unit for transferring to the cleaning standby position between the lower molds, wherein the cleaning module is lifted by the lower mold and coincides with the upper mold at the cleaning standby position.

The cleaning module may be a bidirectional cleaning module having a hollow and including a wall in which a chamber is formed when both ends contact the upper mold and the lower mold, and an electrode body disposed in the wall. In addition, the cleaning module, the lower end of the wall may be first mated with the rising lower mold, the upper end of the wall may be lifted by the lower mold to be later mated with the upper mold. Alternatively, the cleaning module is a one-way cleaning module including a wall having an open top and an open bottom, and an electrode body disposed in the wall, wherein the cleaning module is lifted by the lower mold to open the wall. The upper end may be in agreement with the upper mold.

On the other hand, the transfer unit, the z-axis transfer unit for transferring the cleaning module up and down or close to the one mold set including the upper mold and the lower mold, and the cleaning module back and forth with respect to the mold set It may include a y-axis transfer for transferring far or close. The z-axis feeder includes a z-axis feed block on which the y-axis feeder is mounted, and a z-axis drive mechanism installed to lift the z-axis feed block, and the y-axis feeder is fixed to the z-axis feed block. It may include a rail member and a pulley structure that is installed to be moved back and forth along the rail member while the cleaning module is mounted. The pulley structure is provided with a pinion that rotates by motor power, and the rail member is formed with a rack tooth shape in gear engagement with the pinion, and the pulley structure is rotated while the pinion rotates in gear engagement with the rack tooth shape. May be moved back and forth. The semiconductor molding equipment may include a plurality of mold sets arranged left and right, and the transfer unit may include x for transferring the module to the left and right directions for cleaning of one of the plurality of mold sets. It may further include an axis feeder.

According to another aspect of the present invention, there is provided a method for cleaning an upper mold and a lower mold by using a cleaning module including a wall having both ends open and an electrode body disposed in the wall, wherein the method includes: Positioning the cleaning module between the lower molds; Raising the lower mold to conform a lower end of the wall to the lower mold; Raising the lower mold further to conform the top of the wall to the upper mold; Applying electric power to the electrode body to generate plasma into the chamber defined by the upper mold, the lower mold, and the wall.

Alternatively, there is provided a method of cleaning an upper mold using a cleaning module comprising an open top and closed bottom wall and an electrode body disposed within the wall, the method comprising: between the upper mold and the lower mold; Positioning the cleaning module in the; Raising the lower mold to lift the cleaning module to mate the top of the wall with the upper mold; Applying electric power to the electrode body to generate a plasma in the chamber defined by the upper mold and the wall.

According to the present invention, compared to the prior art, by automatically cleaning the molds in-line at a desired time or a desired period, eliminating a lot of trouble and the economical waste of removing and remounting the molds from the semiconductor molding equipment, It can provide more work efficiency. In particular, since the plasma cleaning process is performed once on the upper and lower molds, the process time is shortened, and the cleaning process, which is usually only the upper mold cleaning, is performed on both the upper and lower molds. It can dramatically reduce the defect rate of semiconductor molding products caused by one contamination.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention can be fully conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 shows a semiconductor molding apparatus with an in-line mold cleaning apparatus including a bidirectional cleaning module.

Referring to FIG. 1, the semiconductor molding equipment 1000 includes a plurality of molding apparatus 1002 for molding a semiconductor with a resin composition such as EMC. Each of the plurality of molding apparatus 1002 includes a plurality of sets of molds 1010 consisting of upper and lower molds facing each other.

The plurality of mold sets 1010 are arranged long on the semiconductor molding equipment 1000 in the left and right directions, that is, in the x-axis direction. More specifically, the upper molds 1010a of the mold set 1010 are arranged left and right while being installed under the upper bed 1001a of the semiconductor molding equipment 1000, and the lower mold 1010b of the mold set 1010. They are arranged left and right while being installed on the upper part of the lower bed 101b. In this case, each of the upper molds 1010a is positioned to face each of the lower molds 1010b corresponding to each other, and one upper mold 1010a and one lower mold 1010b facing each other constitute one mold set. In this embodiment, with the upper mold 1010a fixed, the lower mold 1010b is raised by, for example, hydraulic, pneumatic or other mechanism to conform to the upper mold 1010a. A semiconductor is located in the space between the matched upper mold 1010a and the lower mold 1010b and a liquid resin is filled to enable molding of the semiconductor.

A known feeder guide 1003 for guiding a feeder (not shown) for supplying a strip such as a substrate on which a semiconductor to be molded is to be molded between the upper mold 1010a and the lower mold 1010b is spaced apart from each other. Prepared. When the molding process is not performed, the feeder retracts from the feeder guide 1003 and falls outward.

According to the present invention, when the cleaning of the mold (1010a, 1010b) is required, the bidirectional cleaning module 190 to be described in detail below to the cleaning standby position between the upper mold (1010a) and the lower mold (1010a) facing each other Is moved. Next, the cleaning of the mold is performed at the cleaning position where the cleaning module 190 coincides with the upper mold 1010a and / or the lower mold 1010b. Hereinafter, the term "cleaning standby position" refers to a position where the cleaning module 190 is movable up and down between the upper mold 1010a and the lower mold 1010b, and the term "cleaning position" refers to the position of the cleaning module 190. It refers to a position where both ends of the wall coincide with or contact the molds to form a chamber in which the plasma is generated.

In the present embodiment, the in-line mold cleaning apparatus, which is installed on the lower bed 101b of the semiconductor molding equipment 1000, transfer unit for transferring the cleaning module 190 and the cleaning module 190 to the cleaning standby position. 110. In addition, the transfer unit 110 includes an x-axis transfer unit 120, a z-axis transfer unit 140, and a y-axis transfer unit 160.

The x-axis transfer unit 120 selects any one mold set 1010 among a plurality of mold sets 1010 whose main uses are arranged left and right to move the cleaning module 190 in a left-right direction, that is, in an x-axis direction. It is to move. Thus, for example, if the molding equipment may clean only one mold set, or if a plurality of cleaning modules are used for each of the plurality of mold sets, the x-axis transfer unit 120 may be omitted. However, the use of the x-axis transfer unit 120 is not necessarily limited to selecting and cleaning one of the plurality of molds, which can be used for the purpose of precise three-axis transfer of the cleaning module 190 will be.

2 is a side view of the in-line mold cleaning apparatus installed as part of the semiconductor molding equipment, Figure 3 is a front view of the in-line mold cleaning apparatus shown in FIG. 2 and 3, it is noted that elements that overlap each other and greatly detract from the simplicity of the drawing are intentionally omitted in the range that can be understood from FIGS. 2 and 3.

1 to 3, in particular, FIGS. 2 and 3, the in-line mold cleaning apparatus 100 includes a hollow wall that is open in both up and down directions, and an electrode body for plasma discharge in the hollow of the wall. One bidirectional cleaning module 190 is included. The structure of the bidirectional cleaning module 190 will be described in more detail below.

It has been mentioned above that the in-line mold cleaning apparatus 100 includes a transfer unit 110 for conveying the cleaning module 190 in the three axis direction. The transfer unit 110, from any starting position on the semiconductor molding equipment 1000 (shown in Figure 1), the cleaning module 190 is the upper and lower molds (1010a, 1010b) of the semiconductor molding equipment (1000); And the cleaning module 190 to a cleaning standby position lying between them.

The transfer unit 110, the z-axis transfer unit 140 for transferring the cleaning module 190 in the vertical direction (ie in the z-axis direction) far or close to one mold set 1010, and the mold And a y-axis feeder 160 for transferring the cleaning module 190 far or near to the set 1010 in the front-rear direction (ie, in the y-axis direction). In addition, the transfer unit 110 includes an x-axis transfer unit 120 for moving the cleaning module 190 in the left-right direction, that is, the x-axis direction. As described above, the x-axis transfer unit 120 is used for selecting any one mold set 1010 among the plurality of mold sets 1010 arranged left and right.

The z-axis transfer unit 140, the z-axis transfer block 141 and the z-axis transfer block 141 mounted on the y-axis transfer unit 160 and the cleaning module 190 thereon, and the vertical movement of the z-axis transfer block 141 And a z-axis drive mechanism configured to. The z-axis drive mechanism is provided between the levers 142 connected in the X shape by the intermediate hinge h and the levers 142 connected by the hinge h by the power of the motor 143. It includes a lever drive means for driving to widen or narrow.

The X-shaped levers 142 are connected so as to be linearly movable on the z-axis transfer block 141 and the x-axis transfer block 121, which will be described below, by the guide means, respectively. In addition, the lever driving means, the screw 144 is rotated by receiving the power of the motor 143 and the motor 143 and the rotation of the screw 144 coupled to the screw 144 in a ball screw manner Screw block 145 to be advanced or retracted by. The screw block 145 acts to narrow or widen the levers 142 by pushing one of the set of X-shaped levers 142 by the forward or retract.

When the levers 142 are narrowed about the hinge h, the z-axis feed block 141 rises, and when the levers 142 are widened about the hinge h, the z-axis feed block ( 141 descends. Therefore, by the lever driving means, the transfer block 141 of the z-axis transfer unit 140 and the y-axis transfer unit 160 and the cleaning module 190 mounted thereon can be transferred up and down. At this time, a power transmission means for changing the power and / or RPM of the motor 143 may be further employed.

In addition, the y-axis transfer unit 160 includes a pair of y-axis rail members 163 in the y-axis direction fixed to the z-axis transfer block 141. At this time, the bottom surface of the y-axis rail member 163 is formed with a rack tooth (163a) long in the y-axis direction. In addition, the y-axis rail members 163 are spaced apart from the z-axis transfer block 141 by a predetermined height by spacers 147. In addition, the y-axis transfer unit 160 includes a pulley structure configured to linearly move in the y-axis direction along the y-axis rail member 163 with the cleaning module 190 mounted thereon.

As shown in FIG. 3, the pulley structure includes a pair of pulley walls 165 parallel to each other, and the power of the motor 166 and the motor 166 is applied between the pulley walls 165. The power transmission unit 167 to be transmitted is fixedly installed in a state mounted on the pulley wall 165, the pinion 168 is rotated by the rotational force of the motor 166 via the power transmission unit 167 is The outer walls of the pulley walls 165 are rotatably installed. The pinion 168 is arranged to mesh with the rack teeth 163a of the y-axis rail member 163. Thus, when the pinion 168 is rotated by the motor power 166, the rail member ( The pulley structure and the cleaning module 190 mounted on the pulley structure are linearly moved in the y-axis direction (ie, the front-back direction) along the 163. At this time, the rail member 163 is spaced apart from the z-axis transfer block 141 by the spacers 147 described above for securing a path through which the pinion 168 moves. The cleaning module 190 may be moved to the cleaning standby position between the upper mold 1010a and the lower mold 1010b as shown in FIG. 1 by the y-axis transfer unit 160.

Meanwhile, the x-axis conveying unit 120 includes a pair of x-axis rail members 125 and 126 installed long in the x-axis direction on the lower bed. In addition, the rack teeth 124 are formed on the side of one of the pair of x-axis rail members x-axis rail member 125 in the x-axis direction. In addition, the x-axis transfer unit 120 includes an x-axis transfer block 121 is installed to be linearly sliding in the x-axis direction along the x-axis rail member 125. At this time, the x-axis transfer unit 120, for the automatic front and rear transfer of the x-axis transfer block 121, further comprises an x-axis drive mechanism. The x-axis drive mechanism includes a pinion gear 127 that is rotated by the power of the motor 128 and the above-described rack tooth form 124 formed on one x-axis rail member 125. The pinion gear 127 rotates while being engaged with the gear tooth 124 formed long in the x-axis direction, that is, the left and right direction by the power of the motor 128, thereby, the pinion gear 127 The x-axis transfer block 121 is installed with a motor 128, can move along the pair of x-axis rail members (125, 126) in the left-right direction (that is, the x-axis direction).

The operation of the transfer unit 110 described above is as follows.

First, the x-axis conveying unit 120, along the x-axis rail members 125 and 126 by the rack-pinion drive of the x-axis drive mechanism, the left and right directions (or the x-axis direction) of the x-axis conveying block 121 ). The action of the x-axis transfer unit 120 contributes to positioning the cleaning module 190 in front of the mold set 1010 of the plurality of mold sets arranged left and right.

Next, the z-axis feeder 140 hinge-drives the X-shaped levers 142 by the driving of the z-axis drive mechanism, thereby narrowing the levers 142, thereby uppering the levers 142. The Z-axis feed block 141 connected to is raised.

Next, the y-axis transfer unit 160, by the pulley action including the rack and pinion, serves to move forward the pulley structure and the cleaning module 190 mounted therein in the y-axis direction. By the advance of the pulley structure, the cleaning module 190 is placed in the cleaning standby position between the upper mold 1010a and the lower mold 1010b as shown in FIG. 1.

On the other hand, in the cleaning standby position, the cleaning module 190 must be moved up and down to be matched (or contact) to the upper mold (1010a) and the lower mold (1010b). 4 is a plan view illustrating a cleaning module 190 positioned between the pulley walls 165 of the pulley structure. Referring to this, the cleaning module 190 may include an LM guide installed on the inner surfaces of the pulley walls 165. 199) is slidably held up and down. At this time, immediately above and directly below the cleaning module 190, the upper mold 1010a and the lower mold 1010b as shown in FIG. In this case, the cleaning module 190 may be moved up and down by a lower mold 1010b that is moved up and down or by a separate precision transfer means.

5 is a partial cross-sectional perspective view showing a bidirectional cleaning module 190 according to an embodiment of the present invention.

Referring mainly to FIG. 5, the bidirectional cleaning module 190 is located in the middle of an inner wall 191 of the wall 191 defining an open rectangular hollow therein and toward the upper direction and the lower direction. The plate-shaped electrode body 192 is included. The wall 191 includes a body portion 191a and a pair of adapter portions 191b and 191c, wherein the pair of adapter portions 191b and 191c are bolted to an upper end of the body portion 191a. It is detachably fastened to the bottom and the adapter portion 191b, 191c is added to the bidirectional cleaning module 190 of the present embodiment to be compatible with the mold of various sizes and various specifications. In addition, the upper end of the wall, more specifically, the upper end of the adapter may be provided with a seal (1913) to improve the adhesion between the mold and the cleaning module.

In the state where the upper and lower ends of the wall 191 are matched (or contacted) with each of the upper mold 1010a and the lower mold 1010b, the electrode body 192 is connected to the upper mold 1010a and the lower mold ( 1010b). In the present embodiment, the electrode body 192 is a stepped jaw 1901 formed on one surface of the inner wall of the wall 191 and the heat dissipating tong member 1902 formed on the other inner wall of the wall 191 so as to face the stepped 1901. Is supported by. When the molds 1010a and 1010b are grounded and a high voltage is applied to the electrode body 192, a mold cleaning plasma may be generated in the upper region and the lower region based on the electrode body 192. In addition, the electrode body 192 is made of SUS, that is, a stainless material, the wall 191 is made of aluminum, in order to prevent unwanted deformation due to the thermal deformation difference between the electrode body and aluminum material. The side edges of the electrode body 192 may be spaced apart from the inner wall surface of the wall 191 at minute intervals.

As an additional element for plasma generation, the wall 191 is provided with a vacuum port 193. The vacuum port 193 is connected to a vacuum source (not shown), for example, by a hose (not shown) or the like. In the state where the upper and lower ends of the wall 191 are aligned with the upper mold and the lower mold, the inside of the chamber defined by the wall 191 and the upper and lower molds may be vacuumed by a vacuum source connected to the vacuum port 193. Can be. In cross section, the hole of the vacuum port 193 is disposed above the electrode body 192, and is disposed above the electrode body 192 of the chamber defined by the molds 1010a and 1010b and the wall 191. The chamber region and the lower chamber region of the electrode body 192 are spread over. This contributes to a faster and easier evacuation of the chamber interior defined by the wall 191 and the molds through the vacuum port 193.

 In addition, the wall 191 is provided with gas supply ports 194 and 194 for supplying a reaction gas. The gas supply ports 194 and 194 are connected to a gas supply source (not shown) to supply a reaction gas into the chamber in a vacuum state.

In addition, the wall 191 is used to examine cleaning conditions for both the upper mold and the lower mold, and observes the upper chamber region above the electrode plate 192 and the lower chamber region below the electrode plate 192 from the outside. A pair of watch windows 195 and 195 are provided to allow for this.

6 and 7 are schematic views for explaining a plasma cleaning process for the upper and lower molds using the bidirectional cleaning module and the cleaning module according to the present embodiment.

FIG. 6 illustrates that the upper and lower ends of the wall 191 are separated from each of the molds 1010a and 1010b while the bidirectional cleaning module 190 is positioned between the upper mold 1010a and the lower mold 1010b. Show the standby position. In this case, the bidirectional cleaning module 190 is supported to be slidable up and down by the LM guides 199 installed on the inner wall surfaces of the pulley walls 165 and 165 (see FIGS. 2 to 4). The bottom of the bidirectional cleaning module 190 is limited to a certain height by a stopper not shown. Further, in the hollow interior of the wall 191, a plate-shaped electrode body 192 facing in parallel with the upper mold 1010a and the lower mold 1010b is provided at approximately the middle of the hollow. In this case, the hollow in the wall 90 is divided into an upper region UA and a lower region LA based on the electrode body 192.

 In FIG. 6, the upper mold 1010a is fixed, while the lower mold 1010b is configured to be moved up and down by hydraulic, pneumatic or other drive means. The lower mold 1010b moves upward in the direction of the arrow, coincides with the bidirectional cleaning module 190 as indicated by the imaginary line, and the upward movement is continued to lift the bidirectional cleaning module 190 upward. .

 7 illustrates a cleaning position at which the bidirectional cleaning module 190 may simultaneously clean the upper mold 1010a and the lower mold 1010b. Referring to FIG. 7, the bidirectional cleaning module 190 is matched to each of the upper mold 1010a and the lower mold 1010b at the top and bottom of the wall 191 and is based on the electrode body 192. As a result, the upper region UA and the lower region LA are merged into a part of the chamber where the upper and lower portions are blocked by the molds and the plasma is generated.

In this cleaning position, the chamber is vacuumed, and after the reaction gas is filled, high voltage power is applied to the electrode body 192. In this case, since the upper mold and the lower mold 1010a and 1010b facing the upper and lower surfaces of the electrode body 192 form a ground, between the electrode body 192 and the upper mold 1010a, and The plasma is generated between the electrode body 192 and the lower mold 1010b. By the plasma, foreign matters of the resin residues present on the surfaces of the upper mold 1010a and the lower mold 1010b may be cleaned.

8A and 8B are views for explaining an inline mold cleaning apparatus and a cleaning method according to another embodiment of the present invention.

Referring to FIGS. 8A and 8B, the cleaning module 190 includes a wall 191 having a closed lower end and an open upper end, and a plate-shaped electrode body 192 disposed in the wall 191. It includes.

As shown in FIG. 8A, the cleaning module 190 is at a cleaning standby position between the upper mold 1010a and the lower mold 1010b. In this case, the cleaning module 190 is transferred to the cleaning standby position by the transfer unit 110 described above. Next, as in the previous embodiment, the lower mold 1010b is raised to lift the cleaning module 190, whereby the upper end of the wall 191 of the cleaning module 190 is the upper mold 1010a. )

Since the lower end of the wall 191 of the cleaning module 190 is blocked, the chamber is defined by the wall 191 and the upper mold 1010a. Next, when high voltage power is applied to the electrode body 192 disposed inside the wall 191, plasma is generated in the chamber. At this time, the upper mold 1010a serves as a ground electrode while forming a ground.

1 is a view showing a semiconductor molding equipment using an in-line mold cleaning device equipped with a cleaning module.

Figure 2 is a side view for explaining the transfer unit of the in-line mold cleaning device.

3 is a front view for explaining a transfer unit of the in-line mold cleaning device.

4 is a plan view for explaining a cleaning module according to an embodiment of the present invention.

5 is a partial cross-sectional perspective view for explaining a cleaning module according to an embodiment of the present invention.

6 and 7 are views for explaining a bidirectional mold cleaning method according to an embodiment of the present invention.

8 is a view for explaining a one-way mold cleaning method according to another embodiment of the present invention.

Claims (8)

An inline mold cleaning apparatus for plasma cleaning at least one of the upper mold and the lower mold installed in the semiconductor molding equipment in an inline manner, A cleaning module configured to form a chamber when it is matched with at least one of the upper mold and the lower mold, and to generate a plasma in the chamber; It includes a transfer unit for transferring the cleaning module from the starting position to the cleaning standby position between the upper mold and the lower mold, And the cleaning module is lifted by the lower mold and coincides with the upper mold at the cleaning standby position. The method of claim 1, wherein the cleaning module, characterized in that the bidirectional cleaning module including a hollow wall and the wall is formed when both ends contact the upper mold and the lower mold, and the electrode body disposed in the wall. In-line mold cleaning system. The inline of claim 2, wherein the cleaning module has a lower end of the wall first mated with the raised lower mold, and an upper end of the wall is lifted by the lower mold and later mated with the upper mold. Mold cleaning device. The cleaning module of claim 1, wherein the cleaning module is a one-way cleaning module including a wall having an open top and an open bottom, and an electrode body disposed in the wall, wherein the cleaning module is lifted by the lower mold. In-line mold cleaning apparatus, characterized in that the open top is matched with the upper mold. The method according to claim 1, wherein the transfer unit, A z-axis feeder for transferring the cleaning module up or down far or close to one mold set including the upper mold and the lower mold; And a y-axis feeder for transporting the cleaning module back and forth far or close to the mold set. The method according to claim 5, wherein the z-axis feeder, the z-axis feed block on which the y-axis feeder is mounted, and the z-axis drive mechanism provided to lift the z-axis feed block, And the y-axis feeder comprises a rail member fixed to the z-axis feed block, and a pulley structure installed to be moved back and forth along the rail member while the cleaning module is mounted thereon. 7. The pulley structure of claim 6, wherein the pulley structure is provided with a pinion that rotates by motor power, and the rail member is provided with a rack tooth type that meshes with the pinion, and the pinion rotates while being engaged with the rack tooth type. In-line mold cleaning apparatus, characterized in that the pulley structure is moved back and forth. The method of claim 5, wherein the semiconductor molding equipment, comprising a plurality of mold sets arranged in a left and right, the transfer unit, to clean the mold set of one of the plurality of mold sets, the module in the left and right directions In-line mold cleaning apparatus, characterized in that it further comprises an x-axis transfer unit for transferring to.

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