JP2005066949A - Cleaning device for mold and cleaning method using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning device for a mold simple in constitution capable of properly removing the resin left in the mold after the resin is molded. <P>SOLUTION: This cleaning device for the mold is constituted so as to remove the unnecessary resin left in the mold comprising a fixed mold 5, a first movable mold 6 and a second movable mold 7 successively getting into contact with and separated from one another. Runner locking pins 16 are respectively provided to the fixed mold 5 or the second movable mold 7. The side surface of the runner locking pin 16 is notched to form an escape preventing part 16b for separating the unnecessary resin left in a longitudinal runner so as to turn the same toward the same direction. A cleaning unit 201 capable of reciprocating between the inside and outside of the opened mold is provided and a resin recovering plate 60, which is provided so as to approach and separate from the unnecessary resin separated from the first movable mold 6 and holds the unnecessary resin at the time of approach, is provided to the cleaning unit 201. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a mold cleaning apparatus and method.

  Conventionally, as a mold cleaning device, for example, the following has been proposed.

  First, a configuration in which the runner is removed from the runner lock pin by holding and rotating the runner (unnecessary resin) held by the runner lock pin at the tip of the robot hand is known (for example, see Patent Document 1). .

Secondly, a configuration is known in which a foreign substance removal pin is inserted into the foreign substance remaining in the tunnel runner and the gate and the foreign substance removal pin is moved backward to be removed (see, for example, Patent Document 2).
JP-A-7-205188 JP 2001-322146 A

  However, in the first configuration, an expensive robot is required to rotate the runner that is unnecessary resin remaining in the mold.

  Further, in the second configuration, the foreign matter remaining in the gate or the like must be removed by piercing the foreign matter removal pin. However, in this method, it is actually very difficult to properly remove the foreign matter without remaining. Have difficulty.

  Accordingly, an object of the present invention is to provide a mold cleaning apparatus and method having a simple configuration capable of appropriately removing the resin remaining in the mold after resin molding.

According to the present invention, as means for solving the above-mentioned problems, the fixed-side mold, the first movable-side mold, and the second movable-side mold, which are arranged so as to be sequentially contactable and separable, are clamped, and the first In a mold cleaning apparatus for removing unnecessary resin remaining in the mold by opening the mold after filling a resin into a cavity via a plurality of vertical runners formed on one movable side mold ,
The fixed mold or the second movable mold is provided with a lock member corresponding to each vertical runner, and unnecessary resin remaining on the vertical runner of the first movable mold is opened when the mold is opened. A retaining portion for separating is formed on the side surface of each locking member by cutting out in the same direction,
A cleaning unit that can reciprocate inside and outside the mold that has been opened is provided so that the cleaning unit can be brought into and out of contact with an unnecessary resin that has been detached from the first movable side mold. Is provided with a resin recovery plate capable of holding

  With this configuration, the unnecessary resin can be removed from the lock member simply by holding the unnecessary resin on the resin recovery plate and moving the cleaning unit. And unnecessary resin can be easily collect | recovered by moving a cleaning unit to the exterior of a metal mold | die.

  The resin recovery plate is operable by driving means built in the cleaning unit, and the driving means includes an actuator and a rotating plate that rotates when the rod of the actuator advances and retreats. When the resin recovery plate is operated in conjunction with the rotational movement of the motor, the resin recovery plate can be operated so that unnecessary resin can be held without increasing the size of the cleaning unit by a driving means having a simple configuration. Is possible.

The cleaning unit further includes:
A rotationally driveable brush for cleaning the surface of the mold;
A protruding pin that protrudes the residual resin in the gate formed in the mold, and
A suction device for sucking and removing the resin remaining in the mold;
A first suction part communicating the gate and the suction device;
A second suction part for communicating the brush and the suction device;
With the flow path switching means for switching the flow path to either the first suction section or the second suction section, the resin remaining on the mold surface and the gate can be recovered efficiently and continuously. This is preferable.

The protruding pin is supported by a protruding plate,
When the projecting plate and the first movable-side mold are provided with an alignment portion that can be aligned with each other, the projecting pin can be reliably projected into the gate, and unnecessary resin remaining in the gate can be reliably ensured. This is preferable in that it can be removed through the second suction part.

  When the gate and the suction device are communicated with each other by the first suction part, if a buffer material is provided at the communicating part, it is possible to prevent air leakage during suction and to reliably remove the resin remaining in the gate. This is preferable.

The cleaning unit further includes:
A rotationally driveable brush for cleaning the surface of the mold;
When the brush is provided with driving means for rotating and positioning the brush at the horizontal retreat position and the vertical cleaning position, the brush does not require a complicated configuration for raising and lowering the cleaning unit. Is preferable in that the surface of the mold can be cleaned.

  When the surface of the mold is cleaned with a brush, if the amount of contact of the brush can be adjusted by the moving position of the first movable side mold, the position of the brush can be easily adjusted even if the brush is worn. Therefore, it is preferable in that appropriate cleaning can be performed.

  When the guide tube portion communicating with the suction device is slidably disposed in the suction passage constituting a part of each suction portion, the suction unit is always maintained in the suction state while the cleaning unit is moved in and out of the mold. Is preferable in that it becomes possible.

In addition, as a means for solving the above-mentioned problems, the present invention clamps the fixed-side mold, the first movable-side mold, and the second movable-side mold, which are sequentially arranged so as to be able to contact and separate, Mold cleaning that fills the cavity with resin through a plurality of vertical runners formed on the first movable side mold, molds the resin, and then opens the mold to remove unnecessary resin remaining in the mold. In the method
In succession to the step of collecting the unnecessary resin, a step of rotating a brush provided in the cleaning unit to be brought into sliding contact with the surface of the mold and suctioning the unnecessary resin scraped by the brush is performed. is there.

  By this method, it is possible not only to scrape out the unnecessary resin adhered to the mold by the brush continuously after the collection of the unnecessary resin, but also to remove it by suction, so that an efficient cleaning process can be performed.

In this case, the fixed mold or the second movable mold is provided with a locking member corresponding to each vertical runner, and remains on the vertical runner of the first movable mold when the mold is opened. A retaining portion for separating unnecessary resin is formed on the side surface of each lock member by cutting out in the same direction,
When removing the unnecessary resin, the resin recovery plate provided in the cleaning unit is held close to the unnecessary resin separated from the first movable mold, and the retaining portions of the lock members are cut out. It is preferable to move in a different direction.

  According to the present invention, since the resin remaining in the mold can be recovered by the resin recovery plate provided in the horizontally moving cleaning unit, the configuration can be simplified and manufactured at low cost. Become.

  Embodiments according to the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 shows a resin sealing device 200 according to this embodiment. In this resin sealing device 200, a fixed platen 3 and a movable platen 4 are arranged on a base 1 via four columns 2, and a fixed mold 5 and a first movable side mold are arranged on the fixed platen 3. The second movable side mold 7 is attached to the mold 6 and the movable platen 4.

  The fixed platen 3 is fixed to the upper end portion of the column 2 by bolts 2a. A servo motor 9 is attached to the side surface of the fixed platen 3 via a bracket 8. A drive pulley 10 is integrated with the rotation shaft of the servo motor 9.

  As shown in FIG. 2, a fixed mold 5 is attached to the lower surface of the fixed platen 3 via spacer blocks 11 disposed on both sides. A runner 12 is formed on the lower surface of the fixed mold 5. A first ejector plate 13 and a second ejector plate 14 are disposed between the spacer blocks 11.

  The first ejector plate 13 is formed by integrating two flat plates with screws or the like. As shown in FIGS. 5 and 10, the bottom surface of the concave portion 13a formed at four locations on the center line in the longitudinal direction is provided. The first stopper member 90 is disposed so as to be vertically movable so as to penetrate therethrough. The upper end portion and the lower end side of the first stopper member 90 are respectively formed with flange portions 90 a and 90 b, and the lower end portion is fixed to the stationary mold 5. A spring 91 is disposed in the recess 13a, and the first ejector plate 13 is urged downward. The first ejector plate 13 is provided with a first return pin 15 that penetrates the stationary mold 5 and a runner lock pin 16 that is an example of a lock member is arranged to be movable up and down. The runner lock pin 16 is formed with a flange 16 a on the upper end side and is urged upward by a spring 13 c disposed in the housing recess 13 b of the first ejector plate 13. Further, the runner lock pin 16 is formed with a retaining portion 16b at a lower end portion, and can protrude from a resin passage portion that forms a runner or a cull of the fixed mold 5. The retaining portions 16 b are formed in a substantially V-shaped groove shape, and are all arranged in the same direction, that is, in a direction in which a cleaning unit 201 described later enters the resin sealing device 200. In FIG. 5, for the sake of explanation, the retaining portion 16 b is illustrated as opening in the shape of a groove toward the right side. However, the release direction and shape of the retaining portion 16b are not limited as long as unnecessary resin can be recovered by horizontal movement of the resin recovery plate 60.

  The second ejector plate 14 has a substantially frame shape, and is located around the first ejector plate 13 as shown in FIG. As shown in FIG. 7, in the recesses 14a formed at the four corners of the second ejector plate 14, as in the first stopper member 90, a second stopper member 92 having flanges 92a and 92b is movable up and down. The second ejector plate 14 is urged downward by a spring 93 disposed in the recess 14a. In the vicinity of each second stopper member 92, a second return pin 17 that penetrates the fixed mold 5 and the first movable mold 6 is provided. Ejector rods 18 are slidably disposed at four locations around each runner lock pin 16 disposed along both side surfaces of the second ejector plate 14. The ejector rod 18 penetrates the fixed mold 5 and the tip is located in the first movable mold 6.

  As shown in FIG. 1, a support base 19 and a nut plate 20 are provided on the upper surface of the fixed platen 3. A ball screw 21 is rotatably supported between the upper surface portion of the support base 19 and the fixed platen 3. A driven pulley 22 is integrated with the upper end of the ball screw 21. A timing belt 23 is stretched between the driven pulley 22 and the driving pulley 10. As a result, the power from the servo motor 9 is transmitted to the ball screw 21.

  The nut plate 20 is configured such that the ball screw 21 is screwed into a nut 24 provided at the center, and the ball plate 21 is moved up and down. The nut plate 20 passes through the fixed platen 3, the spacer block 11, and the fixed side mold 5, and is connected to the first movable side mold 6 by a connecting rod 25 guided by a sliding member (not shown) so as to be movable up and down. It is connected. Therefore, the first movable mold 6 is moved up and down together with the nut plate 20 by driving the servo motor 9.

  As shown in FIG. 2, the first movable-side mold 6 is formed with an opening 26 at the center, and the position corresponding to each runner lock pin 16 disposed along both side surfaces of the first ejector plate 13. A vertical runner 27 is formed on the top. Further, on the lower surface of the first movable mold 6, a molding recess 28 is formed which forms a cavity with one surface of the substrate 40 sandwiched between the movable molds when the mold is clamped. A lower end opening of the vertical runner 27, that is, a pinpoint gate 29 is opened in the molding recess 28. Further, as shown in FIG. 7, the ejector pin 30 can appear and disappear in the molding recess 28. The ejector pin 30 is urged upward by a spring 30a and is pushed down by the ejector rod 18.

  As shown in FIG. 1, the movable platen 4 is slidably provided on the column 2, and is moved up and down by driving of a driving device 32. In other words, when the driving device 32 is driven, the moving member 33 moves up and down via the ball screw 31. Then, the movable platen 4 is moved up and down through the plurality of links 34 by the lifting and lowering operation of the moving member 33 (see, for example, JP 2000-37746 A for a mechanism for moving the movable platen 4 up and down).

  The movable platen 4 is provided with a plunger 211 that can be moved up and down. The plunger 211 is provided with a long plate 216 at the lower end thereof and has a detachable structure. Further, a screw portion 214 is fixed to the plate 216. A nut 213 is screwed into the screw portion 214. The nut 213 is rotated via a pulley and a belt by driving of the driving device 212. Therefore, the plunger 211 moves up and down by driving the driving device 212.

  A second movable side mold 7 is disposed on the upper surface of the movable platen 4 via a second spacer block 35. As shown in FIG. 2, a material supply recess 36 for supplying the resin material M is formed at the center of the second movable mold 7. The bottom surface of the material supply recess 36 is constituted by the upper surface of the plunger tip 37 engaged with the tip of the plunger 211. In addition, a recess 7 a in which the substrate 40 is disposed is formed on the upper surface of the second movable-side mold 7. In the recess 7a, positioning pins 38 are provided so as to project through positioning holes (not shown) of the substrate 40 to position the substrate 40.

  A substrate 40 and a resin material M are supplied between the first movable side mold 6 and the second movable side mold 7 by the inloader unit 39 shown in FIG. The substrate 40 is clamped by moving the movable platen 4 and is resin-sealed with the resin material M as described later.

  The inloader unit 39 includes a plurality of substrate holding portions 41 that hold a substrate 40 on which an electronic component such as a semiconductor chip is mounted in advance, and a resin material holding portion 42 that holds a resin material M. The substrate holding part 41 is configured to open and close a pair of holding arms 45 by an actuator 44 provided in the unit main body 43. The side edge of the substrate 40 is supported by the holding piece 46 at the tip of the holding arm. The resin material holding portion 42 includes an accommodation recess 47 in which the resin material M is accommodated and a shutter 48 that closes the accommodation recess 47. When an electric motor (not shown) is driven, the inloader unit 39 moves in the horizontal direction by a guide mechanism (not shown) and is positioned inside and outside the mold.

  The fixed mold 5 and the first movable mold 6 are cleaned by the cleaning unit 201 shown in FIGS.

  The cleaning unit 201 includes an upper wall portion 50 and a lower wall portion 51 that face each other at a predetermined interval.

  As shown in FIG. 14, the upper wall portion 50 is provided with a first suction portion 52 and a second suction portion 53. As shown in FIG. 13, the first suction part 52 is vertically partitioned by a partition wall 54, and is located at a first suction passage 55 located on one side of the upper wall part 50 and a lower part of the upper wall part 50, A suction chamber 57 having a plurality of suction ports 56 formed on the lower surface is formed. Each suction port 56 is provided at a position corresponding to each vertical runner 27 of the first movable mold 6. The first suction passage 55 and the suction chamber 57 communicate with each other at the tip, and the partition wall 54 is gradually inclined upward as it approaches the communication portion. Thereby, air can flow smoothly from the suction chamber 57 to the first suction passage 55. As shown in FIG. 14, the second suction part 53 includes a second suction passage 58 located on the opposite side of the upper wall part 50 from the first suction part 52. In the suction passages 55 and 58 of the suction portions 52 and 53, guide tube portions 59 that communicate with a suction device (not shown) are respectively disposed. For this reason, even if the cleaning unit 201 reciprocates as described later, the communication state between the suction passages 55 and 58 and the suction device is maintained via the guide tube portion 59 regardless of the difference in position. . In addition, as shown in FIG. 16, each guide tube portion 59 is formed with openings 87 and 88 that are opened and closed by a damper 86 on the lower surface on one end side. Thereby, if the damper 86 is rotated to the position A, the suction can be performed from the suction port 56 via the first suction part 52, and if the damper 86 is rotated to the position B, the second suction part 53 is interposed. Then, suction can be performed from the brushing portion 67. That is, it becomes possible to share the suction device by switching the flow path.

  Further, as shown in FIGS. 12 and 14, a resin recovery plate 60 is disposed on the upper surface portion of the upper wall portion 50. The resin recovery plate 60 is supported by a linear bush 98 slidably on a shaft portion 97 protruding from the four corners of the lower surface. Then, as shown in FIG. 12, by driving the actuator 62, the rotating plate 95 rotates about the support shaft 95a via the rod 62a, and the elevating member 96 moves up and down. Thereby, the resin recovery plate 60 moves up and down. On the upper surface of the resin recovery plate 60, a conical resin recovery recess 61 capable of holding a portion corresponding to each vertical runner 27 of unnecessary resin described later is formed.

  On the other hand, as shown in FIG.12 and FIG.13, the protrusion plate 63 is provided in the lower wall part 51 so that raising / lowering drive is possible. The protruding plate 63 includes a support plate 100 and a holding plate 101. As for the support plate 100, the shaft part 102 and the stopper volt | bolt 104 protrude from the lower surface four corners. The shaft portion 102 is supported by a linear bush 103 provided on the lower wall portion 51 so as to be movable up and down. The stopper bolt 104 penetrates the lower wall portion 51 and can come into contact with a part of the second movable side mold 7 (excluding the resin molding portion). Thereby, when the movable platen 4 is moved up and down, the support plate 100 can be moved up and down via the stopper bolt 104. In the holding plate 101, like the support plate 100, a shaft portion 105 protruding from the four corners of the lower surface can be raised and lowered by a linear bush 106 provided on the holding plate 101, and is elastically supported by a spring 107. The holding plate 101 is formed with a convex portion 108 at the center of the side edge. Each convex portion 108 is engaged with the concave portion 6a of the first movable mold 6 and aligns both the members 101 and 6. The support plate 100 is provided with gate protrusion pins 64 at positions corresponding to the pinpoint gates 29. The gate protruding pin 64 penetrates the holding plate 101 and protrudes and protrudes upward as the holding plate 101 moves up and down.

  As shown in FIGS. 11 and 12, the cleaning unit 201 is provided with a brushing portion 67 at the tip of the upper wall portion 50. As shown in FIG. 15A, the brushing portion 67 includes a first roller brush 65 that is rotatably disposed in the first cover 69 and a second roller brush 66 that is rotatably disposed in the second cover 73. And. As illustrated in FIG. 15C, the first roller brush 65 rotates via the coupling 71, the bevel gear 72 a, the gears 72 b and 72 c, and the belt 121 by driving the electric motor 70. Further, the first roller brush 65 rotates to the horizontal retraction position shown in FIG. 15B and the vertical cleaning position shown in FIG. 15A by driving the rotary actuator 120 and turning the arm 68. Is positioned. The first cover 69 is formed with a suction port 69 a that opens upward and a communication port 69 b that communicates with the communication port 74 a of the third cover 74 in a vertical position. The third cover 74 is in communication with the second suction passage 58. On the other hand, as shown in FIG. 15C, the second roller brush 66, like the first roller brush 65, drives the electric motor 70 to connect the coupling 71, the bevel gear 72a, the gear 72b, and the belt 123. Rotate through. The brushing unit 67 collects residual resin scraped by the brushes 65 and 66 through the second suction passage 58 by driving a suction device (not shown).

  As shown in FIG. 14, the cleaning unit 201 has slide guides 75 fixed to both side surfaces thereof. The slide guide 75 is slidably guided by a ridge 77 provided on a side wall 76 standing from a base or the like. As shown in FIGS. 11 and 12, the cleaning unit 201 is configured such that the ball screw 78 is screwed into the nut 110, the electric motor 79 is driven, and the ball screw 78 is rotated via the pulley 80 and the belt 81. It reciprocates along the ridge 77.

  As shown in FIG. 17, the substrate 40 sealed with resin by the unloader unit 82 is taken out between the first movable mold 6 and the second movable mold 7.

  The unloader unit 82 is provided with a roller brush 83 at the tip and a holding arm 84 at the bottom. The unloader unit 82 reciprocates in the horizontal direction by driving the electric motor 85.

  Next, the operation of the resin sealing device 200 will be described.

  (Supply Processing) As shown in FIGS. 1 and 2, by driving the driving device 32, the movable platen 4 is lowered to a position where the inloader unit 39 can enter. Further, by driving the servo motor 9, the first movable mold 6 is moved to the vicinity of the fixed mold 5.

  Further, the resin material M is accommodated in the accommodating recess 47 of the inloader unit 39 from the material supply unit (not shown), and the substrate 40 is held on the holding piece 46 of the holding arm 45 from the substrate alignment unit (not shown). Then, the inloader unit 39 is moved to a predetermined position in the resin sealing device 200 and the second movable mold 7 is raised. The second movable side mold 7 stops when the positioning pin 38 of the second movable side mold 7 is inserted into the positioning hole of the substrate 40 and opens the holding arm 45. As a result, the substrate 40 is supplied to the upper surface of the second movable mold 7. At this time, since the housing recess 47 is positioned above the material supply recess 36 of the second movable-side mold 7, the shutter 48 is opened and the resin material M is supplied to the material supply recess 36.

  When the supply of the substrate 40 and the resin material M is completed, the second movable mold 7 is lowered, the inloader unit 39 is moved in the horizontal direction, and is retracted from the resin sealing device 200.

  (Resin sealing process) Then, the drive device 32 is driven and the movable platen 4 is raised. As shown in FIG. 3, the raised second movable-side mold 7 abuts on the first movable-side mold 6 and sandwiches the supplied substrate 40. A cavity is formed by the upper surface of the substrate 40 and the molding recess 28 of the first movable-side mold 6, and the electronic component mounted on the substrate 40 is located in the cavity. At this time, the servo motor 9 is set free (no load state), and the first movable side mold 6 is set so as to freely move up and down. As a result, the second movable side mold 7 continues to rise together with the first movable side mold 6, comes into contact with the fixed side mold 5, and then a predetermined pressure is applied to complete the mold clamping.

  When the mold clamping is completed, the driving device 212 is then driven and the plunger tip 37 is raised. As a result, the resin material M in the material supply recess 36 is melted and pressurized in a mold maintained at a high temperature. As shown in FIG. 4, the extruded molten resin flows through the runner 12 of the fixed mold 5 and is filled into the cavity from the vertical runner 27 of the first movable mold 6 through the pinpoint gate 29. The

  When the filled resin is thermally cured and the electronic components mounted on the substrate 40 are sealed, the driving devices 32 and 9 are driven to drive the first movable mold 6 and the first mold as shown in FIG. 2 Lower the movable mold 7 integrally. At this time, the cured resin of the runner 12 of the fixed mold 5 and the vertical runner 27 of the first movable mold 6 is prevented by the retaining portion 16 b of the runner lock pin 16. For this reason, stress concentrates on the resin located at the pinpoint gate 29, and here, the resin that seals the surface of the substrate 40 and the resin of the runner portion are separated. The substrate 40 is lowered together with the first movable side mold 6 and the second movable side mold 7, and unnecessary resin in the runner portion remains in the fixed side mold 5.

  When the first movable mold 6 is lowered by a predetermined dimension, the first movable mold 6 is stopped, and only the second movable mold 7 is lowered. When the second movable side mold 7 is further lowered by a predetermined dimension, the return pin 17 comes into contact with the second movable side mold 7 by the biasing force of the spring 93. Therefore, as shown in FIGS. 7 and 8, the second ejector plate 14 descends and causes the ejector pin 30 to protrude downward via the ejector rod 18. As a result, the substrate is pressed against the resin-sealed portion by the ejector pins 30 and is surely lowered together with the second movable side mold 7 without remaining in the first movable side mold 6. At this time, the substrate 40 is positioned by the positioning pin with the second movable mold 7.

  The first movable mold 6 and the second movable mold 7 are further lowered, and the second movable mold 7 is moved to the lowest position (initial position) as shown in FIG. Further, the first movable mold 6 is moved to a substantially intermediate position between the fixed mold 5 and the second movable mold 7 that has moved to the lowest position. Unnecessary resin remaining in the stationary mold 5 is separated from the stationary mold 5 by causing the runner lock pin 16 to protrude by the biasing force of the spring 91 that contacts the first ejector plate 13.

  (Cleaning Process) When the mold is opened, the cleaning unit 201 is moved into the mold so that the first movable mold 6 is positioned between the upper wall portion 50 and the lower wall portion 51, and FIG. As shown to (a), it stops at predetermined position (alpha) (position which made the centerline of the resin collection | recovery recessed part 61 of the resin collection | recovery plate 60 correspond to the centerline C1 of the runner lock pin 16). 18B, the actuator 62 is driven to raise the resin recovery plate 60, and the resin recovery recess 61 holds the portion corresponding to the unnecessary resin vertical runner 27. In this state, as shown in FIG. 18C, the cleaning unit 201 is moved horizontally to a predetermined position β (a position where the center line C1 of the gate protruding pin 64 is aligned with the center line C1 of the runner lock pin 16). Stop. Thereby, the unnecessary resin held on the runner lock pin 16 is released and held on the resin recovery plate 60.

  Next, at the predetermined position β, the first movable mold 6 is raised, and the upper surface of the second movable mold 6 is brought into close contact with the opening edge of the suction port 56. Then, a suction device (not shown) is driven to start suction through the suction port 56. Subsequently, the movable platen 4 is raised, and the protruding plate 63 is raised via the stopper bolt 104 as shown in FIG. The holding plate 101 is positioned in contact with the lower surface of the first movable mold 6 and the gate protruding pin 64 is inserted into the pinpoint gate 29, so that the resin waste remaining on the pinpoint gate 29 is contained in the vertical runner 27. Stick out. At this time, as shown in FIG. 16, the damper 86 is rotated to the position A, and driving of a suction device (not shown) is started. Thereby, the protruding resin waste is discharged from the suction port 56 through the suction part 52. If a cushioning material such as rubber or resin is provided at the opening edge of the suction port 56, it is possible to enhance the adhesion and improve the suction performance.

  When the cleaning of the mold by the cleaning unit 201 is thus completed, the first movable mold 6 is slightly lowered and the second movable mold 7 is moved to the lowest position (initial position). Then, the first roller brush 65 is rotated to the cleaning position shown in FIG. 15A. Subsequently, the first roller brush 65 and the second roller brush 66 are driven to rotate and a suction device (not shown) is driven. Further, the cleaning unit 201 is retracted from the resin sealing device 200. As a result, the first roller brush 65 and the second roller brush 66 scrape dirt and residual resin debris attached to the surfaces of the stationary mold 5 and the first movable mold 6 from the suction ports 69a and 73a. It is removed via the second suction passage 58. Note that the contact position (contact amount) of the second roller brush 66 with the mold surface may be adjusted by the lift position of the first movable mold 6. For example, if the second roller brush 66 is worn due to continuous use, the first movable side mold 6 is raised, and the second roller brush 62 is adjusted so that it can properly slide in contact with the surface of the first movable side mold 6. do it.

  (Removal process) If unnecessary resin is removed from the mold, the servo motor 9 is driven as shown in FIG. 17, and the first movable mold 6 is moved to the vicinity of the fixed mold 5 (position in the figure). (Indicated by D.) Then, the unloader unit 82 is moved between the first movable side mold 6 and the second movable side mold 7 and stopped at a predetermined position. Subsequently, the second movable-side mold 7 is further lowered, and an ejector plate provided in the second movable-side mold 7 is pressed by an ejector rod (not shown) fixed to the base 1, and the substrate 40 is interposed via the ejector pins. Extrude In this state, the unloader part 215 is lowered and the extruded substrate 40 is held. Thereafter, the unloader unit 215 is raised to the original position, and the unloader unit 82 is retracted from the mold.

  Hereinafter, similarly, a series of molding cycles including a supply process, a resin sealing process, a cleaning process, and a removal process are repeated.

  In the resin sealing device 200, cleaning processing is performed in each molding cycle, but periodic manual cleaning is indispensable.

  In this case, the resin sealing device 200 is put into a resting state, and the positions of the first movable side mold 6 and the second movable side mold 7 are first moved manually, and the first movable side mold 6 is moved to the fixed side mold. Contact the mold 5. Then, the lower surface of the first movable mold 6 and the upper surface of the second movable mold 7 are cleaned. When this cleaning is completed, the first movable mold 6 is moved to the vicinity of the second movable mold 7 and a gap is formed between the first movable mold 6 and the fixed mold 5. . Thereby, a gap similar to the case where the first movable side mold 6 and the second movable side mold 7 are cleaned can be formed between the first movable side mold 6 and the fixed side mold 5. The upper surface of the first movable mold 6 and the lower surface of the fixed mold 5 can be cleaned with high work efficiency.

  In the embodiment, the servo motor 9 is free (no load state) when the movable platen 4 is raised, but before the second movable side mold 7 comes into contact with the first movable side mold 6, the servo motor 9 may be driven to raise the first movable mold 6 in advance. As a result, the movable molds 6 and 7 can be operated at a higher speed, and the cycle time can be shortened to increase the molding efficiency.

  Moreover, in the said embodiment, although the 1st movable side metal mold | die 6 was raised / lowered by the drive of the servomotor 9, it is good also as raising / lowering operation | movement by other mechanisms, such as a cylinder.

It is a front view showing the outline of the resin sealing device concerning this embodiment. It is a fragmentary sectional view which shows the state which supplies a board | substrate and a resin material to the resin sealing apparatus of FIG. It is a fragmentary sectional view which shows the state which started mold clamping after supplying a board | substrate and the resin material to the resin sealing apparatus of FIG. It is a fragmentary sectional view which shows the state which completed the mold clamping and resin filling of the resin sealing apparatus of FIG. It is sectional drawing which shows the state which cut | disconnected resin of the pinpoint gate part immediately after the mold opening of the resin sealing apparatus of FIG. It is the elements on larger scale of FIG. FIG. 6 is a partial cross-sectional view illustrating a state in which the mold is further opened from the state illustrated in FIG. 5 and a molded product is protruded with an ejector pin. It is the elements on larger scale of FIG. It is front sectional drawing which shows the state which open | released the metal mold | die completely after shaping | molding of the resin sealing apparatus of FIG. It is a top view of the 1st and 2nd ejector plate. It is a side view which shows the outline of a resin sealing device and a cleaning unit. It is a fragmentary sectional view which shows the state which removed the residual resin of the vertical runner part in the resin sealing device. It is a fragmentary sectional view showing the state where the resin waste which remains in the vertical runner is removed by the cleaning unit. It is a perspective view in the state where the brushing part of the cleaning unit was removed. It is a fragmentary sectional view which shows the state at the time of retracting the cleaning unit from the resin sealing device. It is a fragmentary sectional view which shows the state at the time of making a cleaning unit approach into a resin sealing device. It is a top sectional view showing the drive mechanism of the cleaning unit. It is a schematic sectional drawing which shows the switching mechanism to the suction device of each guide cylinder part. It is a schematic front view which shows a resin sealing device and an unloader unit. It is a schematic explanatory drawing which shows the order which removes the residual resin of the vertical runner part of a resin sealing device by a cleaning unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Support | pillar 2a ... Bolt 3 ... Fixed platen 4 ... Movable platen 5 ... Fixed side metal mold 6 ... 1st movable side metal mold 7 ... 2nd movable side metal mold 6a ... Recessed part 8 ... Bracket 9 ... Servo motor DESCRIPTION OF SYMBOLS 10 ... Drive pulley 11 ... Spacer block 12 ... Runner 13 ... 1st ejector plate 13a ... Recess 13b ... Housing recessed part 13c ... Spring 14 ... 2nd ejector plate 14a ... Recess 15 ... 1st return pin 16 ... Runner lock pin 16a ... 鍔Part 16b ... Detaching part 17 ... Second return pin 18 ... Ejector rod 19 ... Supporting base 20 ... Nut plate 21 ... Ball screw 22 ... Driven pulley 23 ... Timing belt 24 ... Nut 25 ... Connecting rod 26 ... Opening 27 ... Vertical runner 28 ... Molding recess 29 ... Pin point gate 30 ... Ejector pin 30a ... Spring 31 ... Ranger 32 ... Drive device 33 ... Moving member 34 ... Link 35 ... Spacer block 36 ... Material supply recess 37 ... Plunger chip 38 ... Positioner pin 39 ... Inloader unit 40 ... Substrate 41 ... Substrate holder 42 ... Resin material holder 43 ... unit body 44 ... actuator 45 ... holding arm 46 ... holding piece 47 ... receiving recess 48 ... shutter 50 ... upper wall 51 ... lower wall 52,53 ... each suction part 54 ... partition walls 55, 58 ... suction passage 56 ... Suction port 57 ... Suction chamber 59 ... Guide cylinder 60 ... Resin collection plate 61 ... Resin collection recess 62 ... Actuator 62a ... Rod 63 ... Projection plate 64 ... Gate projection pin 65 ... First roller brush 66 ... Second roller brush 67 ... Brushing part 68 ... Arm 69 ... Cover 69a ... Suction port 69b ... Communication port 70 ... Electric motor 71 ... Pull ring 72a ... Bevel gears 72b, 72c ... Gear 73 ... Cover 73a ... Suction port 75 ... Slide guide 76 ... Side wall 77 ... Projection 78 ... Ball screw 79 ... Electric motor 80 ... Pulley 81 ... Belt 82 ... Unloader unit 83 ... Roller brush 84 ... holding arm 85 ... electric motor 86 ... dampers 87 and 88 ... opening 90 ... first stopper members 90a and 90b ... flange 91 ... spring 92 ... second stopper member 92a ... flange 93 ... spring 95 ... rotating plate 95a ... support shaft 96 ... elevating member 97 ... shaft portion 98 ... linear bush 100 ... support plate 101 ... holding plate 102 ... shaft portion 103 ... linear bush 104 ... stopper bolt 105 ... shaft portion 106 ... linear bush 107 ... spring 108 ... convex 110 ... nut 120 ... rotary Actuator 121 ... Belt 123 ... Belt 200 ... Resin sealing device 201 ... Cleaning unit 211 ... Plunger 212 ... Drive device 213 ... Nut 214 ... Screw part 215 ... Unloader part 216 ... Plate M ... Resin material

Claims (10)

The fixed-side mold, the first movable-side mold, and the second movable-side mold, which are arranged so as to be sequentially contactable and separable, are clamped, and through a plurality of vertical runners formed on the first movable-side mold. In the mold cleaning apparatus for removing unnecessary resin remaining in the mold by opening the mold after filling the cavity with resin and molding the resin,
The fixed mold or the second movable mold is provided with a lock member corresponding to each vertical runner, and unnecessary resin remaining on the vertical runner of the first movable mold is opened when the mold is opened. A retaining portion for separating is formed on the side surface of each locking member by cutting out in the same direction,
A cleaning unit that can reciprocate inside and outside the mold that has been opened is provided so that the cleaning unit can be brought into and out of contact with an unnecessary resin that has been detached from the first movable side mold. A mold cleaning device provided with a resin recovery plate capable of holding   The resin recovery plate is operable by driving means built in the cleaning unit, and the driving means includes an actuator and a rotating plate that rotates when the rod of the actuator advances and retreats. The mold cleaning apparatus according to claim 1, wherein the resin recovery plate is operated in conjunction with the rotation of the mold. The cleaning unit further includes:
A rotationally driveable brush for cleaning the surface of the mold;
3. The mold cleaning apparatus according to claim 1, further comprising driving means for rotating and positioning the brush at a horizontal retreat position and a vertical cleaning position. The cleaning unit further includes:
A rotationally driveable brush for cleaning the surface of the mold;
A protruding pin that protrudes the residual resin in the gate formed in the mold, and
A suction device for sucking and removing the resin remaining in the mold;
A first suction part communicating the gate and the suction device;
A second suction part for communicating the brush and the suction device;
The mold cleaning apparatus according to claim 1, further comprising a flow path switching unit that switches a flow path to either the first suction section or the second suction section. The protruding pin is supported by a protruding plate,
The mold cleaning apparatus according to claim 4, wherein the projecting plate and the first movable-side mold include an alignment portion that can be aligned with each other.   6. The mold cleaning apparatus according to claim 4, wherein when the gate and the suction device are communicated with each other by the first suction part, a buffer material is provided at the communicating portion.   7. When the surface of the mold is cleaned with a brush, the amount of contact of the brush can be adjusted by the moving position of the first movable mold. Mold cleaning equipment.   The mold according to any one of claims 4 to 7, wherein a guide tube portion communicating with a suction device is slidably disposed in a suction passage constituting a part of each suction portion. Cleaning device. The fixed-side mold, the first movable-side mold, and the second movable-side mold, which are arranged so as to be sequentially contactable and separable, are clamped, and through a plurality of vertical runners formed on the first movable-side mold. In the mold cleaning method of filling the resin in the cavity and molding the resin, then opening the mold and removing unnecessary resin remaining in the mold,
In succession to the step of collecting the unnecessary resin, the step of rotating the brush provided in the cleaning unit to be brought into sliding contact with the surface of the mold and sucking the unnecessary resin scraped by the brush is performed. A cleaning method for a mold. The fixed mold or the second movable mold is provided with a lock member corresponding to each vertical runner, and unnecessary resin remaining on the vertical runner of the first movable mold is opened when the mold is opened. A retaining portion for separating is formed on the side surface of each locking member by cutting out in the same direction,
When removing the unnecessary resin, the resin recovery plate provided in the cleaning unit is held close to the unnecessary resin separated from the first movable mold, and the retaining portions of the lock members are cut out. The mold cleaning method according to claim 9, wherein the mold cleaning method is performed in a different direction.

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