JP2001322131A - Method and apparatus for cleaning - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for cleaning wherein dirt stuck to a surface of a material to be cleaned is sufficiently removed in a short time. SOLUTION: A cleaning apparatus is equipped with a cleaning part 17 having an excimer lamp 18 for which an xenon gas is used as an electric discharge gas and a light-transmitting window 19 transmits generated eximer light. Then, the cleaning part 17 is moved between opened resin-sealing mold 8, and a surface of the mold is irradiated with the eximer light generated by the eximer lamp 18. Thereby, by the eximer light wherein a single peak wavelength is provided and an energy of the photon is much, adhesion between the mold surface and a material stuck thereto is lowered, and the material of which the adhesion is lowered is vaporized by oxidizing decomposition. Then, the material removed from the mold surface and an atmosphere containing a generated ozone are discharged outside the apparatus. Then, the material stuck to the mold surface can be removed from the mold surface in a short time.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cleaning method and a cleaning apparatus for removing a substance adhered to an object to be cleaned, in particular, a resin molding die or a wiring board.

[0002]

2. Description of the Related Art In recent years, increasingly severe quality, such as dimensional accuracy and surface appearance quality, has been required for molded products manufactured using a resin molding die. . For this reason, it is necessary to improve the releasability between the mold and the molded product and to effectively clean the mold surface. Conventionally, to clean the mold surface,
A cleaning device combining a rotating brush or a reciprocating brush and a suction mechanism is used.

[0003]

However, according to the above-described conventional cleaning apparatus, when a small and precise product is molded, a minute concave portion or a small concave portion in a cavity of a resin molding die is formed at the time of molding. There was a problem that the resin residue attached to the corners and the like could not be sufficiently removed. Also, electronic components such as semiconductor chips are used for lead frames, printed boards, etc. (hereinafter referred to as wiring boards).
In general, resin sealing is performed using a mold. In this case, in addition to the above factors, there is another factor that cannot sufficiently remove the resin residue. That is, with the progress of miniaturization and thinning of a package as a completed product, a sealing resin having high adhesion to a wiring board is used in order to secure the reliability of the package. However, since the sealing resin having high adhesion has strong adhesion to the mold surface, the resin residue easily adheres to the mold surface, and the adhered resin residue is more difficult to be removed. Furthermore, if dirt is attached to the wiring board itself, the adhesion between the sealing resin and the wiring board is reduced, and the reliability of the package may be reduced due to invasion of moisture or the like. From these facts, it is necessary to clean the resin molding die over a long period of time to maintain the quality of the molded product, and to improve the reliability of the package, It had to be thoroughly cleaned.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a cleaning method and a cleaning apparatus for removing dirt adhering to the surface of an object to be cleaned in a short time and sufficiently. Aim.

[0005]

In order to solve the above-mentioned technical problems, a cleaning method according to the present invention comprises a step of generating excimer light by a light emitting mechanism using a discharge gas; The method is characterized by comprising a step of irradiating a surface of an object to reduce the adhesion between the surface and the substance attached to the surface, and a step of removing the substance from the surface.

According to this method, the excimer light having a single peak wavelength and high photon energy cuts the chemical bond of a substance, particularly an organic substance, attached to the surface of the irradiated object to be cleaned. The adhesion between the surface and the substance attached thereto is reduced in a short time.
Then, the substance having reduced adhesion can be removed in a short time by the removing means.

Further, the cleaning method according to the present invention comprises:
In the cleaning method described above, the discharge gas is F, A
It is a gas containing at least one of r, Kr, and Xe.

According to this, a gas containing at least one of F, Ar, Kr, and Xe is used as a discharge gas to emit excimer light having a single peak wavelength unique to the discharge gas. it can.

Further, the cleaning method according to the present invention comprises:
In the above-described cleaning method, the light emitting mechanism generates excimer light even in the removing step.

[0010] According to this, the substance having reduced adhesion is
Ozone (O ₃ ) and active atomic oxygen generated by excimer light having a single peak wavelength are caused to act to oxidatively decompose and volatilize the substance. Therefore, the substance adhering to the surface of the object to be cleaned can be removed.

Further, the cleaning method according to the present invention comprises:
In the above-described cleaning method, the light emitting mechanism is turned off at least in steps other than the step of lowering and the step of removing.

According to this, since the light emitting mechanism emits excimer light for a necessary time, energy consumption can be reduced and the life of the light emitting mechanism can be extended.

Further, the cleaning method according to the present invention comprises:
In the above-described cleaning method, the light emitting mechanism is characterized in that, when excimer light is generated, the light emitting mechanism is repeatedly turned off after being turned on.

According to this, each time the lamp is turned on, the adhesion between the surface of the object to be cleaned and the substance attached thereto is reduced by the excimer light. In addition, ozone (O ₃ ) and active atomic oxygen act on the substance having reduced adhesion. Therefore, the object to be cleaned can be cleaned in a shorter time.

Further, the cleaning method according to the present invention comprises:
In the above-described cleaning method, the object to be cleaned is a wiring board on which an electronic component is to be mounted or a wiring board on which the electronic component is mounted.

According to this, before mounting the electronic component,
The substance attached to the surface of the wiring board is removed. Therefore, when mounting the electronic component, the adhesion between the electronic component and the wiring board can be improved, and the reliability of the electrical connection between the electrodes of the electronic component and the wiring board can be improved. In addition, a substance attached to the surface of the wiring board after mounting the electronic component is removed. Therefore, the adhesion between the wiring board and the sealing resin can be improved during resin sealing.

Further, the cleaning method according to the present invention comprises:
In the above-described cleaning method, the object to be cleaned is a resin molding die.

According to this method, excimer light is applied to resin residues adhering to minute recesses and corners in the mold cavity, which cannot be sufficiently removed by cleaning using a brush. Can be removed by

Further, the cleaning method according to the present invention comprises:
In the above-described cleaning method, in the step of lowering, the light emitting mechanism moves to the vicinity of the mold and irradiates the surface of the mold in a state where the mold is not molded with resin.

According to this, since the light emitting mechanism moves and irradiates the surface of the mold, the mold can be cleaned by the light emitting mechanism incorporated in the resin molding apparatus.
Therefore, the process of cleaning the mold can be automated.

Further, the cleaning method according to the present invention comprises:
In the cleaning method described above, in the removing step,
The light emitting mechanism moves from the vicinity of the mold, at least one of the blow mechanism or the brush mechanism and the suction mechanism move to the vicinity of the mold, and the surface of the mold using at least one of the blow mechanism or the brush mechanism and the suction mechanism. Removing the substance from the material.

According to this, after the light emitting mechanism that irradiates the surface of the mold moves from the vicinity of the mold, at least one of the blow mechanism or the brush mechanism and the suction mechanism move to the vicinity of the mold to cause the surface of the mold to move. Remove material from Therefore, the substance having reduced adhesion to the surface of the mold is physically removed using a blow mechanism or a brush mechanism, and the removed substance is removed from the surface of the mold using a suction mechanism. Can be discharged.

Further, the cleaning method according to the present invention comprises:
In the above-described cleaning method, the mold is heated to a resin molding temperature when being cleaned.

According to this, since the mold heated to the resin molding temperature is irradiated with the excimer light, the adhesion between the surface of the mold and the substance attached thereto is further reduced. Therefore, the substance can be more effectively removed from the surface of the mold.

In order to solve the above-mentioned technical problems, a cleaning apparatus according to the present invention comprises a light emitting means for generating excimer light by using a discharge gas, and irradiating the surface of an object to be cleaned with excimer light. And irradiation means for reducing the adhesion between the surface and the substance attached to the surface, and removing means for removing the substance from the surface.

According to this method, the excimer light having a single peak wavelength and having a large photon energy cuts off the chemical bond of a substance, particularly an organic substance, attached to the surface of the irradiated object to be cleaned. The adhesion between the surface of the substrate and the substance attached thereto is reduced in a short time.
Then, the substance having reduced adhesion is removed in a short time by the removing means.

Further, the cleaning device according to the present invention comprises:
In the cleaning device described above, the discharge gas is F, A
It is a gas containing at least one of r, Kr, and Xe.

According to this, a gas containing at least one of F, Ar, Kr, and Xe is used as a discharge gas to emit excimer light having a single peak wavelength unique to the discharge gas. it can.

Further, the cleaning device according to the present invention comprises:
In the above-described cleaning apparatus, the object to be cleaned is a resin molding die.

According to this, the resin residue which has not been sufficiently removed by the cleaning using the brush and adheres to the minute concave portion or the corner portion in the cavity of the mold is removed by excimer light irradiation.

Further, the cleaning device according to the present invention comprises:
The above-described cleaning device is characterized in that the cleaning device is further provided with a moving unit that moves the irradiation unit near a mold attached to the resin molding device.

According to this, the light emitting mechanism moves to irradiate the surface of the mold during the period when the mold is not molded with the resin, so that the mold is cleaned by the irradiating means incorporated in the resin molding apparatus. be able to. Therefore, automation of the mold cleaning device can be achieved.

Further, the cleaning device according to the present invention comprises:
In the above-described cleaning apparatus, the removing unit removes the substance from the surface of the mold using at least one of a blow mechanism or a brush mechanism and a suction mechanism.

According to this, after the light emitting mechanism moves and irradiates the surface of the mold during a period in which the mold is not molded with the resin, at least one of the blow mechanism or the brush mechanism and the suction mechanism are connected to the mold. Remove material from surface. Therefore, the material having reduced adhesion to the surface of the mold is physically removed by at least one of the blow mechanism and the brush mechanism, and the material is removed from the vicinity of the surface of the mold by the suction mechanism. The substance is reliably sucked and discharged.

[0035]

(First Embodiment) A first embodiment of the present invention.
Embodiment 1 will be described with reference to FIGS. 1 and 2 by taking as an example the case of cleaning a mold used in a resin sealing device. FIG. 1 is a schematic front view showing a resin sealing device to which a cleaning device according to the present embodiment is attached.

In FIG. 1, reference numeral 1 designates a supply / carry-out unit for supplying a wiring board on which electronic components are mounted to a resin sealing device and carrying out a package after resin sealing. Reference numeral 2 denotes a molding unit for resin-sealing a wiring board on which electronic components are mounted. The supply / carry-out unit 1 and the molding unit 2 constitute a basic unit 3 which is a minimum constituent unit of the resin sealing device. Reference numeral 4 denotes a cleaning unit having a cleaning device for cleaning a mold (described later) used in the resin sealing device.

Reference numerals 5A and 5B denote fixed plates for respectively fixing a movable lower die 6 and a fixed upper die 7, which will be described later. Reference numeral 6 denotes a movable lower die which is fixed to a fixed plate 5A provided on the lower side so as to be movable up and down, and which moves up and down according to the fixed plate 5A. Reference numeral 7 denotes a fixed upper die attached to a fixed platen 5B provided on the upper side. The movable lower mold 6 and the fixed upper mold 7 together form a resin sealing mold 8. Reference numeral 9 denotes a tie bar connected to the main body via fixed plates 5A and 5B, respectively. Reference numeral 10 denotes a bottom base constituting the lowermost part of the molding unit 2 main body. Reference numeral 11 denotes a mold opening / closing mechanism that opens and closes the mold 8 by driving the fixed platen 5A up and down, that is, by moving the movable lower mold 6 up and down.

Reference numeral 12 denotes a pot, which is a columnar space provided in the movable lower mold 6, and reference numeral 13 denotes a plunger provided in the pot 12 so as to be able to move up and down. 14A and 14B are cavities provided in the movable lower mold 6 and the fixed upper mold 7, respectively, and formed of spaces into which the molten resin is injected. Reference numeral 15 denotes a cull including a space provided in the fixed upper die 7 at a position corresponding to the pot 12 of the movable lower die 6.

Reference numeral 16 denotes a guide rail fixed to the supply / carry-out unit 1 and the cleaning unit 4 and provided so as to pass through each molding unit 2. Reference numeral 17 denotes a cleaning unit which is attached to the guide rail 16 so as to be able to advance and retreat, and irradiates excimer light to the mold surfaces of the movable lower mold 6 and the fixed upper mold 7 to clean the mold surfaces. 18 is the cleaning unit 1
An excimer lamp that is provided inside or inside the apparatus 7 and that generates one or more (three in this embodiment) according to the size of the object to be cleaned and generates excimer light. In the tube of the excimer lamp 18, F, Ar, Kr,
A gas containing at least one element of Xe, for example, a xenon (Xe) gas is sealed. Reference numeral 19 denotes a light-transmitting window which is fitted into openings provided on both upper and lower surfaces of the cleaning unit 17 and is made of a material through which excimer light can pass, for example, quartz glass. Reference numeral 20 denotes an exhaust pipe provided on the upper surface of each molding unit 2 and connected to an exhaust mechanism (not shown).

The operation of the cleaning device according to this embodiment will be described with reference to FIGS. FIG. 2 is a schematic side view showing a state in which the cleaning device according to the present embodiment cleans the mold surface of the mold with excimer light in the resin sealing device shown in FIG.

First, in a state where the mold 8 is not resin-molded, that is, in a state where the movable lower mold 6 and the fixed upper mold 7 are opened, the cleaning unit 17 is moved along the guide rail 16. Move toward the molding unit 2. Then, the cleaning unit 17 is connected to the light transmitting window 1.
The excimer light passing through 9 is stopped at a predetermined position where it can uniformly irradiate a desired area on the mold surface of movable lower mold 6 and fixed upper mold 7. Here, from the viewpoint of preventing the intensity of the excimer light from decreasing, it is preferable that the gap between the light transmitting window 19 and each mold surface is as small as possible.

Next, a predetermined high-frequency voltage is applied to each of the three excimer lamps 18 provided. Accordingly, each excimer lamp 18 using xenon (Xe) gas as a discharge gas generates excimer light having a center wavelength (peak) of 172 nm. Then, the excimer light is applied to the mold surfaces of the movable lower mold 6 and the fixed upper mold 7 through the respective light transmitting windows 19. As a result, the chemical bond of a substance attached to the irradiated mold surface, for example, an organic substance such as resin residue is cut by the energy of an excimer light having a wavelength in a very narrow range around the center wavelength, that is, a single peak wavelength. Therefore, the adhesiveness between the mold surface and the substance attached thereto can be reduced.

Then, the material is irradiated with excimer light to cause ozone (O ₃ ) and active atomic oxygen generated by the energy of the excimer light to act on the substance having reduced adhesion, thereby oxidizing and decomposing the substance. Evaporate. This makes it possible to remove the substance adhered to the mold surface from the mold surface. Then, the substance removed from the mold surface is discharged to the outside of the apparatus using the exhaust pipe 20. Since the generated ozone is harmful to the human body, an atmosphere containing ozone is exhausted to the outside of the apparatus using the exhaust pipe 20. Then, the excimer lamp 18 is turned off after excimer light is irradiated for a predetermined time necessary for cleaning.

By the above operation, using the excimer light having a single peak wavelength and a large energy of photons, the mold surface, that is, the upper part of the pot 12 (not shown in FIG. 2), the cavities 14A, 14B, 15 (not shown in FIG. 2) and the surface of the resin passage connecting the cavity 14B and the cull 15 are irradiated. Thereby, the resin residue attached to the mold surface can be removed in a short time. In addition, since the cleaning unit 17 having the excimer lamp 18 is moved to irradiate the surface of the resin sealing mold 8, the cleaning unit 17 incorporated in the resin sealing device cleans the mold 8. Can be. Therefore, the process of cleaning the mold 8 can be automated. In addition, the excimer lamp 1 only for a predetermined time.
Since the lamp 8 is turned on, it is possible to reduce energy consumption and extend the life of the excimer lamp 18. Further, since the mold is cleaned by the non-contact operation, the cleaning can be performed without damaging the mold surface.

(Second Embodiment) By the way, there is a case where the resin residue adhering to the mold surface cannot be sufficiently removed only by the excimer light. For example, this is the case where the sealing resin has high adhesion or the shape of the mold surface is complicated. The second embodiment of the present invention is applied to such a case. A second embodiment of the present invention will be described with reference to FIG. 3 by taking, as an example, a case of cleaning a mold used in a resin sealing device. FIG. 3 is a schematic front view illustrating a main part of the resin sealing device to which the cleaning device according to the present embodiment is attached.

In FIG. 3, reference numeral 21 denotes a cleaning unit which uses a brush and a suction pipe, which will be described later, respectively.
Adjacent to a cleaning section 17 using an excimer lamp 18, it is attached to a guide rail 16 so as to be able to move forward and backward. Wire nets are attached to the upper and lower surfaces of the cleaning unit 21. Reference numeral 22 denotes a brush provided on both upper and lower surfaces of the cleaning unit 21 such that tips thereof contact the mold surfaces of the movable lower mold 6 and the fixed upper mold 7. Reference numeral 23 denotes a suction pipe provided on any surface of the cleaning unit 21 and connected to a suction mechanism (not shown). With this configuration,
The atmosphere near the upper and lower surfaces of the cleaning unit 21 is sucked into the cleaning unit 21 by the suction pipe 23.

The cleaning device according to this embodiment has a cleaning unit 17 and a cleaning unit 21 and operates as follows. First, in a state where the movable lower die 6 and the fixed upper die 7 are opened, the cleaning unit 1 is opened.
7 and the cleaning unit 21 are moved toward the molding unit 2 along the guide rail 16.
Then, the cleaning unit 17 is stopped at a predetermined position where the excimer light having passed through the light transmitting window 19 can uniformly irradiate a desired area on the mold surface of the movable lower mold 6 and the fixed upper mold 7. .

Next, similarly to the first embodiment, the excimer lamp 18 irradiates the excimer light to the mold surfaces of the movable lower mold 6 and the fixed upper mold 7 through the respective translucent windows 19. Thereby, the adhesiveness between the mold surface and the substance attached to the mold surface can be reduced by the energy of the excimer light.

Next, similarly to the first embodiment, excimer light is continuously irradiated to oxidize, decompose and volatilize the substance having reduced adhesion. As a result, the substance adhering to the mold surface can be removed from the mold surface in a short time. Then, the substance removed from the mold surface and the atmosphere containing the generated ozone are exhausted to the outside of the apparatus using the exhaust pipe 20.

Next, after the cleaning unit 17 is moved from between the movable lower die 6 and the fixed upper die 7, the cleaning unit 21 is moved between the movable lower die 6 and the fixed upper die 7. After that, the brush 22 is rotated to physically remove, from the mold surface, substances that have not been completely evaporated by excimer light irradiation but remain on the mold surface and have reduced adhesion to the mold surface. Then, the cleaning unit 21 is moved by the suction pipe 23.
The removed material is sucked from the vicinity of the mold surface and discharged to the outside of the resin sealing device via wire meshes attached to the upper and lower surfaces of the resin sealing device.

With the above operation, after using the excimer light, the mold surface, ie, the upper portion of the pot 12, the cavities 14A, 14
B, the cull 15 and the resin residue adhering to the surface of the resin passage communicating the cavity 14B and the cull 15 can be sufficiently removed.

As the brush 22 described in the present embodiment, a reciprocating brush or a brush whose bristle tip vibrates at a high speed may be used in addition to the rotating brush.

In place of the brush 22, a blow mechanism for injecting a high-pressure gas to the mold surface may be used. By injecting high-pressure gas onto the mold surface, it remains on the mold surface without being completely volatilized by irradiating excimer light.
Substances having reduced adhesion to the mold surface can be physically removed from the mold surface.

As described above, in the present embodiment, the brush 22 and the suction pipe 23 are used to remove the resin residue having reduced adhesion between the mold 8 and the mold surface by the irradiation of excimer light. Thus, it can be sufficiently removed from the surface of the mold surface.

In each of the embodiments described above, the excimer lamp 18 is used for the resin molding die 8.
The excimer light is irradiated by moving the cleaning unit 17 having the above. However, it is also possible to irradiate the removed mold 8 with the excimer light independently of the cleaning unit 17. In this case, the cleaning unit 17 is designed to sufficiently irradiate excimer light to the minute recesses and corners of the cavities 14A and 14B where the resin residue easily adheres to the mold 8.
It is preferable to determine the positional relationship between the mold and the mold 8. Thereby, the effect of removing the resin residue from the mold surface of the mold 8 can be further enhanced.

The operation of moving the cleaning units 17 and 21 may be performed manually by an operator as needed, or may be performed by a manual operation of operating a motor or the like by a switch. Further, a so-called automatic operation of cleaning by moving the cleaning units 17 and 21 may be performed each time molding is performed once or after molding is performed a predetermined number of times.

The resin molding die 8 is usually heated to about 175 ° C. to 180 ° C. by a heater during resin molding. Excimer light may be irradiated in this state. In this case, since the mold 8 is heated, the adhesion of the resin residue to the mold surface is more likely to be further reduced. Therefore, the effect of removing the resin residue from the mold surface of the mold 8 is further enhanced, so that the cleaning time can be reduced.

Further, as an object to be cleaned, not only the resin molding die 8 but also the wiring board before the electronic component is mounted or the wiring substrate after the electronic component is mounted is irradiated with excimer light. Is also good. As a result, the substance on the wiring board is removed. Therefore, the adhesion between the electronic component and the wiring board can be improved, and the reliability of the electrical connection between the electrodes included in the electronic component and the wiring board, for example, the connection by a wire or a bump can be improved. Further, at the time of resin sealing, the adhesiveness between the wiring board and the sealing resin is improved. Therefore, the intrusion of moisture into the package is prevented, so that the reliability of the package can be improved. In particular, an object to be cleaned, such as a printed circuit board, which is easily damaged is cleaned in a non-contact manner using excimer light, so that damage to the object to be cleaned can be prevented. Further, the heat generated by the excimer lamp 18 itself is extremely small, and the temperature of the light transmitting window 19 is about 40 ° C. even during lighting.
Therefore, even a wiring board made of a material weak to heat can be cleaned without being damaged by heat.

The excimer lamp 18 can be turned on / off instantaneously by applying / cutting off a high-frequency voltage. By utilizing this, the high frequency voltage may be intermittently applied to the excimer lamp 18 to irradiate the excimer light in a pulsed manner. In this case, each time the lamp is turned on, the energy of the excimer light reduces the adhesion between the surface of the object to be cleaned and the substance attached thereto, and the substance having the reduced adhesion has an ozone (O
₃ ) and active atomic oxygen. Therefore, the object to be cleaned can be cleaned in a shorter time.

The cleaning unit 17 for irradiating both sides
Is used, but a cleaning unit that irradiates one surface may be used according to an object to be cleaned. Further, the cleaning unit that irradiates one side may be inverted to irradiate both sides.

It is preferable that the number of excimer lamps 18 is appropriately increased or decreased according to the size of the object to be cleaned. For example, when excimer light is applied to a lead frame having an elongated shape in the above-described wiring board, one excimer lamp may be used.

As a discharge gas, xenon (X
e) Another gas may be used instead of the gas. For example,
The center wavelength is 153 nm when fluorine (F) gas is used, the center wavelength is 146 nm when krypton (Cr) gas is used, and the center wavelength is 126 nm when argon (Ar) gas is used. Generates some excimer light. Also, krypton / chlorine (Kr / Cl)
When a gas is used, excimer light having a center wavelength of 222 nm is generated. Using these excimer lights,
The object to be cleaned can also be cleaned.

[0063]

According to the present invention, the excimer light having a single peak wavelength and high photon energy reduces the adhesion between the surface of the object to be cleaned and the substance adhered to the surface. Oxidatively decomposes and volatilizes the reduced substance. As a result, the substances attached to the surface of the object to be cleaned can be removed in a short time. In addition, a substance having reduced adhesion to the surface of the mold is physically removed using a blow mechanism or a brush mechanism, and the removed substance is removed from the vicinity of the surface using a suction mechanism. Can be discharged. Therefore, the present invention has an excellent practical effect of providing a cleaning method and a cleaning apparatus capable of quickly and sufficiently removing dirt adhering to the surface of an object to be cleaned.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing a resin sealing device to which a cleaning device according to a first embodiment of the present invention is attached.

FIG. 2 is a schematic side view showing a state in which the cleaning device according to the present embodiment is cleaning the mold surface of the mold with excimer light in the resin sealing device shown in FIG.

FIG. 3 is a schematic front view showing a main part of a resin sealing device to which a cleaning device according to a second embodiment of the present invention is attached.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 supply / unload unit 2 molding unit 3 basic unit 4 cleaning unit 5A, 5B fixed platen 6 movable lower mold (object to be cleaned) 7 fixed upper mold (object to be cleaned) 8 mold 9 tie bar 10 bottom base 11 mold opening and closing mechanism 12 Pot 13 Plunger 14A, 14B Cavity 15 Cul 16 Guide rail 17 Cleaning section 18 Excimer lamp (light emitting mechanism) 19 Light transmitting window 20 Exhaust pipe 21 Cleaning section (removal means) 22 Brush (brush mechanism) 23 Suction pipe (suction mechanism)

Claims (15)

[Claims] 1. A step of generating excimer light by a light emitting mechanism using a discharge gas, and irradiating the surface of the object to be cleaned with the excimer light to obtain an adhesion between the surface and a substance attached to the surface. And a step of removing the substance from the surface. 2. The cleaning method according to claim 1, wherein the discharge gas is a gas containing at least one of F, Ar, Kr, and Xe. 3. The cleaning method according to claim 1, wherein the light emitting mechanism generates excimer light also in the removing step. 4. The cleaning method according to claim 1, wherein the light emitting mechanism is turned off except at least the lowering step and the removing step. Method. 5. The cleaning method according to claim 1, wherein the light emitting mechanism repeatedly turns on and off after generating the excimer light when the excimer light is generated. . 6. The cleaning method according to claim 1, wherein the object to be cleaned is a wiring board on which an electronic component is to be mounted or a wiring board on which an electronic component is mounted. Characteristic cleaning method. 7. The cleaning method according to claim 1, wherein the object to be cleaned is a resin molding die. 8. The cleaning method according to claim 7, wherein, in the lowering step, the light emitting mechanism moves near the mold and the surface of the mold when the mold is not resin-molded. A cleaning method characterized by irradiating the toner. 9. The cleaning method according to claim 8, wherein, in the removing step, the light emitting mechanism moves from near the mold, and at least one of a blow mechanism or a brush mechanism and a suction mechanism are positioned near the mold. A cleaning method, comprising: moving and using at least one of the blow mechanism or the brush mechanism and the suction mechanism to remove the substance from the surface of the mold. 10. The cleaning method according to claim 7, wherein the mold is heated to a resin molding temperature when the mold is cleaned. 11. A light emitting means for generating excimer light by using a discharge gas, and an adhesive property between the surface and a substance attached to the surface by irradiating the surface of the object to be cleaned with the excimer light. A cleaning unit, comprising: an irradiation unit that reduces the surface pressure; and a removal unit that removes the substance from the surface. 12. The cleaning apparatus according to claim 11, wherein the discharge gas is a gas containing at least one of F, Ar, Kr, and Xe. 13. The cleaning device according to claim 11, wherein the object to be cleaned is a resin molding die. 14. The cleaning device according to claim 13, further comprising a moving unit that moves the irradiation unit near the die attached to the resin molding device. 15. The cleaning device according to claim 14, wherein the removing unit removes the substance from the surface of the mold using at least one of a blow mechanism and a brush mechanism and a suction mechanism. And a cleaning device.