JP3781580B2 - Pattern correction device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pattern correcting apparatus, and more particularly to a pattern correcting apparatus that corrects a rib chip defect that occurs in a manufacturing process of ribs (partitions) of a plasma display.
[0002]
[Prior art]
FIG. 4 is a view for explaining a method of correcting a defect of a rib which is a structural element of a plasma display (PDP). In FIG. 4A, in the plasma display, ribs 22 are formed on a glass substrate 21. The rib 22 is manufactured with a height of about 150 μm and a width of about 60 to 100 μm. If a rib chip defect 23 such that a part of the rib 22 is missing occurs, for example, Japanese Patent Application Laid-Open No. 8-29 2 442. Corrections are made with the device described in the publication.
[0003]
That is, using the remaining ribs on both sides of the rib chip defect 23, the correction paste 24 is attached to the application needle 31 and applied to the rib chip defect 23 as shown in FIG. The rib missing portion is regenerated by the shape retention force due to the surface tension.
[0004]
[Problems to be solved by the invention]
In the conventional method described above, the width of the rib chip defect 23 that can be corrected is limited by the relationship between the viscosity of the correction paste 24 and the width of the rib chip defect 23, and a satisfactory correction can be made only up to a defect of about 200 μm to 300 μm. I couldn't. In addition, for defects having a large rib chip width, the correction paste 24 hangs down at the center of the chip, so that the originally required rib height cannot be reproduced. In addition, the rib width was widened, and the correction was poor in terms of correction quality.
[0005]
Therefore, a main object of the present invention is to provide a pattern correcting apparatus capable of correcting even a relatively large defect.
[0006]
[Means for Solving the Problems]
A pattern correction apparatus according to the present invention is a pattern correction apparatus for correcting a defective portion of a rib formed on a substrate , and a table on which the substrate is placed and moved in a horizontal direction ; The needle that applies the correction paste to the defective part of the missing rib, the drive mechanism that can move the needle up and down, and the extra correction that protrudes in the rib width direction of the applied correction paste A laser irradiation mechanism for excising the paste and a scratch needle mechanism for removing excess correction paste protruding in the width direction of the rib are configured.
[0007]
Preferably, the laser irradiation mechanism further bakes the correction paste applied and shaped to the defect portion having the rib. This laser irradiation mechanism includes a continuous wave laser for firing the correction paste and a pulsed laser for cutting off the excess correction paste.
[0008]
Preferably, the laser irradiation mechanism further bakes the correction paste applied and shaped to the defective portion of the rib. This laser irradiation mechanism includes a laser capable of switching between continuous oscillation for firing the correction paste and pulse oscillation for cutting off the excess correction paste .
[0009]
Also preferably , a squeezing mechanism for shaping the height of the applied correction paste is further included.
[0010]
Also preferably, further includes a vacuum mechanism for sucking the excess modifications paste removed by scratching needle mechanism.
[0011]
Preferably, the laser irradiation mechanism further cuts off an excess portion protruding in the width direction of the rib among the rib width-thickening defect portions in which a part of the rib swells in the width direction. The scratch needle mechanism further removes an excessive portion protruding in the width direction of the rib .
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a diagram showing the overall configuration of a pattern correction apparatus according to an embodiment of the present invention. In FIG. 1, the pattern correction apparatus is roughly classified into an observation optical system 1 including a paste firing laser part, a cutting laser part 2, and a paste application mechanism 3 including a needle for applying a conductive paste or defect correction ink. And a squeegee mechanism 4 for smoothing the protruding paste, a scratch mechanism 5 for removing excess correction paste, an IR light source 6 for drying the correction paste, an image processing mechanism 7 for recognizing defects, and a host for controlling the entire apparatus. It comprises a computer 8 and a control computer 9 that controls the operation of the device mechanism. In addition, an XY table 10 on which a workpiece is mounted, a chuck base 11 that holds the workpiece on the XY table 10, a Z-axis table 12 that drives the laser irradiation mechanism up and down, and the like are provided.
[0013]
FIG. 2 is a view for explaining a rib defect correcting method according to an embodiment of the present invention. First, the glass substrate 21 on which the ribs 22 are formed is placed on the XY table 10, the XY table 10 is moved in the horizontal direction, and the rib chip defect 23 is positioned so as to be directly below the paste application mechanism 3. For example, a mechanism as shown in FIG. 8 of Japanese Patent Laid-Open No. 9-265007 is used as the paste application mechanism 3, and the correction paste 4 is attached to the application needle 31 and applied to the rib notch 23. At this time, conventionally, when the correction paste 24 protrudes, there is no method for correcting it later, so that the correction quality is affected as it is, and the correction becomes defective. However, in this embodiment, as shown in FIG. 2B, the correction paste 24 is applied to the extent that the correction paste 24 protrudes from the correction portion.
[0014]
Next, as shown in FIG. 2C, squeegeeing is performed by the squeegee mechanism 4 in order to shape the correction paste 24 protruding from the rib apex. Next, as shown in FIG. 2D, the correction paste 24 applied by irradiating the correction portion with the IR light source 6 is dried.
[0015]
Next, as shown in FIG. 2 (e), the portion of the correction paste 24 to which the YLF laser is applied from the cutting laser unit 2 is irradiated to a portion other than the necessary portion, and laser cutting is performed for separation. At this time, a method of removing the protruding portion by laser cutting alone is also conceivable, but an electrode is provided in the lower layer of the protruding portion, and it is difficult to selectively remove only the protruding corrected paste portion.
[0016]
On the other hand, in this embodiment, since portions other than the lower electrode portion are cut, the lower electrode portion is not adversely affected. Here, the adverse effect on the electrode means the thermal influence on the electrode at the time of laser cutting or the occurrence of an electrical failure due to partial cutting. The laser used here is not a giant pulse oscillation laser with a Q switch (about 1 pps to 20 pps) but a pseudo continuous oscillation laser having an oscillation frequency of about 1000 Hz to 5000 Hz. This is to shorten the time required for cutting.
[0017]
Next, as shown in FIG. 2F, the protruding portion is removed using the scratch mechanism 5. The scratch mechanism 51 is provided with a scratch needle 51, and the protruding portion of the correction paste 24 is removed by the scratch needle 51. Although an electrode is provided in the lower layer of the protruding portion removal range by the scratch needle 51, the removal by the scratch needle 51 does not adversely affect the electrode. The scratch mechanism unit 5 is provided with a vacuum function (not shown), and can absorb the residue of the correction paste removed by the scratch needle 51. For this reason, it becomes possible to keep a correction location in a clean state even after correction.
[0018]
Next, as shown in FIG. 2G, after the correction paste 24 applied to the rib chip defect 23 is shaped, the correction paste 24 is baked. The correction paste 24 is fired by using a paste firing laser such as an LD (semiconductor laser) added to the observation optical system unit 1. However, as long as the baking method is a method of raising the correction paste 24 to a temperature at which baking can be performed (about 550 ° C.), a CW (continuous oscillation) laser or an electric furnace can be used.
[0019]
In the above description, the laser for firing the correction paste 24 and the cutting laser unit 2 for laser cutting are separately provided, but this may be switched by one laser.
[0020]
The correction of the rib chip defect 23 is completed by the above-described process.
When the rib 22 is formed, there may be a rib width thickening defect that swells in the rib width direction as shown in FIG. 3 other than the rib chip defect 23 as shown in FIG. In this case, as described above, since there is an electrode in the lower layer, the correction method using laser cutting cannot be used, and correction is difficult.
[0021]
On the other hand, in this embodiment, even for such a rib width widening defect, the defect correction is performed by applying the protruding portion cutting and protruding portion removing processes as shown in FIGS. 2 (e) and 2 (f). Is possible. In this case, the apparatus configuration does not require the paste application mechanism 3, the paste firing laser part included in the observation optical system part 1, the squeegee mechanism 4, and the IR light source 6 in the pattern correction apparatus shown in FIG. Except for the above, correction can be made with an apparatus having the same configuration.
[0022]
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
[0023]
【The invention's effect】
As described above, according to the present invention, the correction paste is applied to the defective portion so that it protrudes, the applied correction paste is baked, the protruding portion is cut with a laser, and the cut excess correction paste is removed. Since the defect width that can be corrected in the past is about 200 to 300 μm, it is possible to correct defects of 300 μm or more by applying the present invention.
[0024]
Moreover, by using a laser cutting method and a scratch mechanism for shaping in the rib defect width direction, shaping can be performed without adversely affecting the lower layer electrode.
[0025]
Further, by providing the scratch mechanism with a vacuum function, it is possible to suction and remove the correction debris generated at the time of defect correction, and it is possible to keep the corrected portion in a clean state even after correction.
[0026]
Further, it is possible to correct a defect having a large rib width, which has been difficult to be corrected conventionally.
[Brief description of the drawings]
FIG. 1 is a diagram showing an overall configuration of an apparatus according to an embodiment of the present invention.
FIG. 2 is a view showing a rib defect correcting method according to an embodiment of the present invention.
FIG. 3 is a diagram showing a rib width thickening defect that swells in the rib width direction;
FIG. 4 is a view showing a conventional rib chip defect correcting method.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Observation optical system part 2 Cutting laser part 3 Paste application mechanism 4 Squeegee mechanism 5 Scratch mechanism 6 IR light source 7 Image processing mechanism 8 Host computer 9 Control computer 10 XY table 11 Chuck base 12 Z-axis table 13 Monitor 21 Glass substrate 22 Rib 23 Rib chip defect 24 Correction paste 31 Application needle 51 Scratch needle

Claims (6)

A pattern correcting device for correcting a defective portion of a rib formed on a substrate,
A table on which the substrate is placed and moved in the horizontal direction;
A needle that is applied to the extent that the correction paste protrudes into the defective portion of the rib lacking part of the rib ; and
A drive mechanism capable of moving the needle vertically;
A laser irradiation mechanism for excising excess correction paste protruding in the width direction of the rib of the applied correction paste;
A pattern correction device, comprising: a scratch needle mechanism for removing excess correction paste protruding in the width direction of the rib . The laser irradiation mechanism further baked a correction paste applied and shaped to the rib chip defect portion,
The laser irradiation mechanism is
A continuous wave laser for firing the correction paste;
The pattern correction apparatus according to claim 1, further comprising a pulsed laser for cutting off the excess correction paste. The laser irradiation mechanism further baked a correction paste applied and shaped to the rib chip defect portion,
The pattern correction apparatus according to claim 1, wherein the laser irradiation mechanism includes a laser capable of switching between continuous oscillation for firing the correction paste and pulse oscillation for cutting off the excess correction paste . The pattern correction apparatus according to claim 1, further comprising a squeezing mechanism for shaping the height of the applied correction paste. The pattern correction device according to claim 1, further comprising a vacuum mechanism for sucking the excess correction paste removed by the scratch needle mechanism. The laser irradiation mechanism further cuts off an excess portion protruding in the width direction of the rib of the rib width-thick defect portion in which a part of the rib swells in the width direction,
6. The pattern correcting apparatus according to claim 1, wherein the scratch needle mechanism further removes an excess portion protruding in the width direction of the rib .

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