發明所屬技術領域 ^ 本發明係有關於圖樣修正裝置，尤其係有關於修正在 电漿顯示器之肋（間隔壁）之製程發生之肋缺口缺陷之 修正裝置。 间铋 I知技術 圖4係用以說明修正係電漿顯示器（pDp)之構造要素之 =之缺陷之方法之圖。在圖4(a)，在電漿顯示器，在玻璃 基板21上形成肋22。肋22製作成其高度約150 ，寬产約 〜100/ζιη，但是在發生了肋22之一部分缺少之肋缺口&缺 ^23之情況，例如在特開平8 —29442號公報記載之裝置修 即 31附著 23，藉 肋缺口 發明所 在 受到修 制’滿 而 正用黏 寬度也 因 較大之 ，利用肋缺口 修正用黏膏24 著利用修正用 部。 欲解決之課題 上述之習知之 正用黏膏24之 意之修正只能 且，至於肋缺 膏24而下垂， 變寬，在修正 而，本發明之 缺陷也可修正 缺陷23之兩側之殘留之肋，令塗抹針 如圖4(b)所示’塗抹於肋缺口缺陷 黏貧24之表面張力之形狀保持力再生 方法，可修正之肋缺口缺陷23之寬度 點度和肋缺口缺陷23之寬度之關係^ 達到約200 //in〜300 //m之缺陷為止。 口見度大之缺陷，在中央部因缺少修 無法重現本來所需之肋高度。又，^ 品質上也變成修正不良。 ,·Technical field to which the invention belongs ^ The present invention relates to a pattern correction device, and in particular to a correction device for correcting a rib gap defect occurring in a process of ribs (partition walls) of a plasma display. Metabismuth I Knowing Technology Fig. 4 is a diagram for explaining a method for correcting defects of structural elements of a plasma display (pDp). In FIG. 4 (a), a rib 22 is formed on a glass substrate 21 in a plasma display. The rib 22 is made to have a height of about 150 Å and a wide output of about 100 / ζιη. However, when a rib gap & ^ 23 lacking in a part of the rib 22 occurs, for example, the device repair described in JP-A-8294942 That is, 31 is attached to 23, and the width of the active adhesive is also larger due to the repair of the rib notch invention. The rib notch correction paste 24 is used to correct the portion. The problem to be solved The correction of the above-mentioned conventional application of the paste 24 can only and, as for the rib lacking the paste 24, sags and widens, the defects of the present invention can also correct the residues on both sides of the defect 23 As shown in Fig. 4 (b), the ribs make the painting needles "apply to the shape retention force regeneration method of the surface tension of the rib gap defect stickiness 24, which can modify the width of the rib gap defect 23, The relationship between the widths ^ reaches a defect of about 200 // in to 300 // m. Due to the lack of visibility, the lack of repair in the central part cannot reproduce the required rib height. In addition, ^ also becomes defective in quality. , ·
主要目的在於提供即使係缺口寬度比 之圖樣修正裝置。 “XThe main purpose is to provide a pattern correction device even if the gap width ratio is used. "X
第4頁 五、發明說明-——、I’域 用以解決課題之手段 部夕I凊專利範圍第1項之發明係用以修正電路 ::樣修正裝置，包括：將電路板放置於工作，缺陷 向移動之工作台、在該電路板之缺 ς上後在 iii出程度之針、驅動該針在上下方4,用.έ 構以…除去自缺陷部溢出部之雷 月之刮除針機構。 之修正用勘 項之t ί申請專利範圍第2項之發明，如申請專 射=射照射機構包括用以烘 丨】範圍第i ::及用以切除自缺陷部溢出之修正用黏;=:;;!雷 利範申:之專:匕圍第3項之圖樣修正裝置，如申&專 ^ ^ ^ ^ ^ ^ ^ ^ 在如申請專利範圍第示、邛之脈波振盪之雷射。 抹之修正用黏膏之高；J4項之發明，還包括用以將已塗 在如申請專利之播壓機構。 用到除針機構所除去之夕項之發明，還包括用以吸入利 在如申請專利範圍黏膏之抽真空機構。 請專利範圍第丨項之雷 、之圖樣修正裝置，使用如申 之過粗。 田“、、射機構和刮除機構修正缺陷部 發明之實施例 圖1係表示本發明之一每 焉％例之裝置整體之構造之 i 4/5058 五、發明說明（3) !田ί圖1，若將圖樣修正裝置大致分類，由包括黏膏烘 部之觀察光學系卜裁剪用雷射部2、由塗抹導電 溢出：ίΪΠ正用墨水之針構成之黏膏塗抹機構3、將 网平之擠壓機構4、除去多餘之修正黏膏之刮 二、構5、令修正黏膏乾燥之IR光源6、識別缺陷之影 理機構7、控制裝晉煞辦++办 、冢处 私从Γ > a 整之主電腦8以及控制裝置機構部之 M A1 /二，用電腦9構成。此外，還設置裝載工件之XY工 作台10、在XY工作/^ ] η μ仅杜 /iL 1 照射機構上下之2軸％22等 夾頭座11、驅動雷射 圖2係用以說明本於明夕 ^ ^ . 、， 凡β不&明之一貫施例之肋缺陷修正方法 回Τ ，將形成肋22之玻璃基板21放置於χγ工作台1〇 於黏客Μϋ 移動，將肋缺口缺陷23定位 q ?二3 正下。黏膏塗抹機構3使用例如特開平 用黏客2广圖8所示之機構’令塗抹針31附著修正 用黏用24，塗抹於肋缺口缺陷23。此時，習知 後無修正之方法，原封不動的受到修正二 修正不良。可是，在本實施例，如圖2(b)所二r 自t正處塗抹修正用黏膏24溢出之程度。 勤客2 ’如圖2(c)所示，$ 了將自肋頂點溢出之修正用 黏用24整形而利用擠壓機構4擠壓。其次 =㈣光細射修正部分，令所塗抹之;】二 射舍ί ^倏如圖2(e)所示，自切割用雷射部2將YLF雷射昭 射塗抹了修正用黏膏24之溢出必要以外之部分，進行雷射、 475058 五、發明說明（4) 切割後分離。此時，也相钊σ 方法，但是在溢出部下；設/置電極而=部分^ 修正黏貧部分係困難。 k擇性除去溢出之 而’在本實施例，因切割下芦 下層電極部無不良影響。在此所‘對電極：：二部分，對 f =切割時發生對電極之熱影響或部分切割戶;== 耽不良。又，在此使用之雷射不是 引趑之電 雷射（約lpps〜20pps)，使用振湯艇变:關之巨脈波振盪 虛擬連續振盈雷射。這id頻f :1。。，〜5。。，之 、疋為了縮紐切割所需時間。 ’使用刮除機構5除去溢出部。 在刮除機構5 ,又置刮除針51除去修正 Τ。在制刮除針51之溢出部除去範、下層設、，極益出 疋利用刮除針51除去對電極無不良影響。 =一 :抽真空功能(圖上未示)，可吸入利用刮除之 用黏贫之眉、因而’在修正後也可將修正處保持潔淨 其次，如圖2(g)所示，將在肋缺口缺陷23 :用黏膏24整形後’烘烤該修正用黏膏24。修正用二二 使用加在觀察光學系1之如LD(半導體雷射）之黏膏烘/ =射烘烤1，若烘烤之方法係將修正用黏膏24加妖- 2烤之溫度(約550。〇為止之方法，可使用cw(連續以 雷射或電氣爐等。 、蛊) y< ^又，在上述之說明，使得個別設置用以烘烤修正用f 葛2 4之雷射和雷射切割所需之切割用雷射部2，但是使得Page 4 V. Description of the invention-The means of solving the problem in the I 'field. The invention in the first item of the scope of the patent of I 凊 is used to modify the circuit: a sample correction device, including: placing the circuit board at work. ， Defect moving to the workbench, after the circuit board defect, the needle is iii out, drive the needle to the upper and lower 4, use .hand structure to ... remove the thunder moon scraping from the overflow of the defective part针 机构。 Needle mechanism. For the amendment of the survey item t ί for the invention of the second scope of the patent application, such as the application of the special shot = the radiation irradiation mechanism includes the scope i :: and the correction stick used to cut off the overflow from the defective part; = : ;;! Relly Fanshen: Specialty: The pattern correction device of the 3rd item of Dagger, such as Shenshen & Specialty ^ ^ ^ ^ ^ ^ ^ ^ . The height of the paste used for correction is the same as the invention of item J4, which also includes a pressure applying mechanism that has been applied for patent application. The invention using the item removed by the needle removal mechanism also includes a vacuum mechanism for inhaling a paste such as the patent application scope. Please use the lightning correction and pattern correction device in item 丨 of the patent scope, and use as thick as it applies. Tian ", embodiment of the invention of the shooting mechanism and the scraping mechanism to correct the defective part of the invention Fig. 1 shows the overall structure of the device of each example of the invention 4/5058 5. Description of the invention (3)! 1. If the pattern correction device is roughly classified, the observation optical system including the paste baking part is used for cutting. 2. The paste application mechanism is formed by applying conductive overflow: ΪΪΠ is using a needle of ink. 3. Flatten the net. Squeezing mechanism 4. Scraping to remove excess correction paste 2. Structure 5. IR light source to dry the correction paste 6. Photographic mechanism to identify defects 7. Control equipment Jinsha Office ++ Office Γ > a complete main computer 8 and M A1 / 2 of the control device mechanism section, which are composed of computer 9. In addition, an XY table 10 for loading workpieces, and work in XY / ^] η μ only Du / iL 1 The upper and lower 2 axes of the irradiation mechanism, such as the chuck seat 11 and the driving laser diagram 2 are used to explain the original Yu Ming ^ ^., Where β is not consistent with the rib defect correction method of the consistent example back to T, The glass substrate 21 forming the ribs 22 is placed on the χγ table 10 and moved to the adhesive substrate ϋ, and the rib gap defects 23 are moved. The position q − 2 is directly below. The paste application mechanism 3 uses, for example, a mechanism shown in FIG. 8 of the kaiping flat adhesive 2 to make the application needle 31 adhere to the correction adhesive 24 and apply to the rib gap defect 23. At this time, After learning, there is no method of correction, and the correction 2 is badly corrected. However, in this embodiment, as shown in Fig. 2 (b), r applies the correction paste 24 directly from t to the extent that it overflows. Qin Ke 2 'As shown in Figure 2 (c), $ is used to shape the correction of overflow from the rib apex with 24 sticks and squeeze it with the squeeze mechanism 4. Next = the thin light fine shot correction part, so that it is smeared;] two shots As shown in FIG. 2 (e), the self-cutting laser part 2 applies YLF laser light to the part of the correction paste 24 that is not necessary for the overflow of the correction paste 24, and performs the laser. 475058 5. Description of the invention ( 4) Separation after cutting. At this time, the σ method is also used, but under the overflow part; it is difficult to set / place the electrode and modify the sticky poor part. K Selectively remove the overflow. In this embodiment, because of cutting There is no adverse effect on the lower electrode part of the lower layer. Here the 'counter electrode :: two parts, where f = counter electrode occurs during cutting Affects or partially cuts households; == bad delay. Also, the laser used here is not an induced laser (about lpps ~ 20pps). Use the Zhentang boat to change: Guan Zhi giant pulse oscillation virtual continuous vibration surplus mine The id frequency f: 1 ... ~~ 5 ..., the time required for cutting to shrink the button. 'Use the scraping mechanism 5 to remove the overflow part. In the scraping mechanism 5, a scraping needle 51 is set to remove it. Correction T. Remove the upper and lower layers in the overflow part of the scraping needle 51, and use the scraping needle 51 to remove the electrode without any adverse effects. = 1: Vacuum function (not shown in the figure), can be inhaled The shaved eyebrows are used for shaving, so 'the correction can be kept clean after the correction, as shown in Fig. 2 (g), the rib gap defect 23: after shaping with the paste 24', Correction with paste 24. For correction, use a paste such as LD (semiconductor laser) added to the observation optics 1 to bake / = bake 1, if the baking method is to use correction paste 24 plus demon-2 baking temperature ( For the method up to about 550.0, you can use cw (continuous laser or electric furnace, etc.), y < ^ Also, in the above description, individually set the laser for bake correction f Ge 2 4 And laser cutting part 2 required for laser cutting, but making
475058 五、發明說明（5) 用一個雷射而切換使用也可。 ^用上述之製程完成肋缺口缺陷2 3之修正。 此外’形成肋22時，可能發座圓、 23以外之如圖3 x ·)所示肋缺口缺陷 之情況。在此情況，如上述所示 見度過租缺陷 使用利用雷射切割之修正方法，難修=層有電極，無法 之丄在(t)實所施例，Λ於/種肋寬度過粗缺陷，如上述 製程正：陷應用溢出部切割及溢出部除去 π ^ ^ "缺陷。牡此^況，在裝置構造上，在m娇- B樣修正裝置，昤τ又兩西丸古、 工在圖1所不 肉辦八私支 、 而要黏賞塗抹機構3、觀窣弁與έ 1 内所έ黏膏烘烤用雷射部、擠壓 硯察先子乐；ι 同一構造之裝置可修正。機構4 iR光源6以外，用 雖然本發明已以較佳實施例揭露如上，鈇直 限定本發明，任何熟習 ：：亚非用以 神和範圍⑺，當可作更動丄者门在不脫離本發明之精 當視後附之申&糞刮r n = w飾因此本發明之保護範圍 交w <甲明專利靶圍所界定者為準。 發明之效果 ^上述所示，若依據本發明’因在缺陷部將修 :塗抹至溢出程度後，供烤已塗抹之修正用黏膏 分’使得除去所切割之多餘之修正用黏膏田藉 者：用“明，可使習知可修正之缺陷寬度係約2曰 m-300 /iin的變成可進行3〇〇//m以上之修正。 :且’在肋缺陷寬度方向之整形使用利用雷射切判之 方法和刮除機構，可對下層電極無不良影響的整形。。475058 V. Description of the invention (5) It is also possible to switch using a laser. ^ Complete the correction of rib gap defect 23 using the above process. In addition, when the ribs 22 are formed, there may be a case where the ribs are not round and the ribs are not as shown in Fig. 3 x ·). In this case, as shown above, the over-leaf defect is corrected using the laser cutting method. Difficult to repair = there are electrodes on the layer, which cannot be implemented in (t). The implementation example, Λ // the rib width is too thick. As described above, the process is positive: the application of the overflow portion cutting and the overflow portion to remove the π ^ ^ defects. In this case, in terms of device structure, in the Miao-B-like correction device, 昤 τ and two Nishimaruko, workers in Figure 1 do not do eight private branches, but must pay attention to the smearing mechanism 3. 1 1 The laser baking part inside the paste is used for squeezing and inspecting Xianzile; ι The device with the same structure can be modified. Mechanism 4 other than iR light source 6, although the present invention has been disclosed in the preferred embodiment as above, it is straightforward to limit the invention. Any familiarity: Asia and Africa use God and scope. When it can be changed, the door will not depart from this. The essence of the invention shall be determined by the attached application & feces scraping rn = w. Therefore, the scope of protection of the present invention shall be subject to the definition of the target range of Jiaming patent. Effect of the Invention ^ As shown above, according to the present invention, "because the repair is performed on the defective part: after applying to the overflow level, it is used to bake the already applied correction paste." By: "Ming, the conventionally correctable defect width is about 2 m-300 / iin can be changed to more than 3,000 / / m can be modified.: And 'in the rib defect width direction use and use The laser cutting method and scraping mechanism can be used to shape the electrode without adversely affecting it.