JP2007165013A - Pattern defect correcting method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern defect correcting method and a pattern defect correcting device capable of satisfactorily correcting pattern defects, and enhancing correction efficiency. <P>SOLUTION: This pattern defect correcting method includes an application step to apply a base part 31 to the defective part 32 of a rib 83 formed on a substrate, a step to reshape the applied base part 31, a step to bake the shaped base part 31, a step to further apply correcting paste on the baked base part 31, and a step to bake the applied correcting paste. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pattern defect correction method and a pattern defect correction apparatus, and in particular, applies a correction paste to a defective portion of a fine pattern formed on a substrate, and performs drying, baking, removal and shaping of excess correction paste, and the like. The present invention relates to a pattern defect correction method and a pattern defect correction apparatus for correcting a defective portion.

FIG. 5 is a diagram showing a configuration of a plasma display panel (PDP).
Referring to the figure, a plasma display panel (PDP) includes a front glass substrate 70, a transparent electrode 71, a bus electrode 72, a dielectric layer 73, a protective layer 74, a rear glass substrate 80, and an address electrode. 81, partition walls (ribs) 83 that are fine patterns, and phosphors 84.

  In the PDP, a front glass substrate 70 and a rear glass substrate 80 are bonded together, and a large number of ribs (partition walls) 83 are formed on the bonded surface of the rear glass substrate 80 with the front glass substrate 70.

  The shape of the rib 83 shows a stripe type formed in a linear shape as an example in the figure, but various shapes such as a waffle type formed in a rectangular shape have been proposed.

  By the way, when the rib is formed on the rear glass substrate, a defect in which a part of the rib is lost may occur due to the mixing of foreign matters and a manufacturing defect. Such rib defects cause color mixing and dark spots when the PDP is turned on after production, and the quality of the PDP is remarkably lowered. Therefore, it is necessary to correct a rib defect portion (hereinafter also referred to as a rib defect portion). is there.

  As an apparatus for correcting the rib defect portion, for example, Patent Document 1 discloses the following pattern defect correcting apparatus. In other words, the paste is applied to the extent that the correction paste protrudes from the defective portion of the rib by the paste application mechanism, the upper part of the rib is shaped using the squeegee mechanism, the correction paste applied by the IR (infrared) light source is dried, and the cutting laser unit Then, the protruding portion of the correction paste is cut, the protruding portion is removed using a scratch mechanism, the correction debris is sucked and removed by the vacuum function, and then baked using a semiconductor laser.

Patent Document 2 discloses the following pattern defect correction apparatus. That is, a repair paste filling mechanism, a paste firing mechanism, a mechanical shaping mechanism that mechanically cuts and shapes a rib-defined cross-section protruding material, a vertical movement mechanism that moves in a direction perpendicular to a flat substrate, a filling mechanism, and a firing mechanism And a head portion on which the shaping mechanism is mounted and a horizontal positioning mechanism that moves relatively in a plane direction parallel to the flat substrate, and each mechanism mounted on the head portion is interlocked with the vertical direction moving mechanism.
JP 2000-299059 A JP 2004-311914 A

  However, in the pattern defect correction apparatus described in Patent Document 1, a correction paste (hereinafter also referred to as a rib correction part) applied to a rib defect part generally having a height of about 120 to 200 μm is baked at once with a laser beam. Therefore, the heat of the laser beam escapes to the normal rib side in contact with the rib correcting portion, and the amount of heat transmitted to the bottom of the rib correcting portion is reduced, and the coupling between the rib correcting portion and the dielectric layer may be weakened. In addition, if the power of the laser beam is increased in order to strengthen the bond between the rib correction part and the dielectric layer, the upper surface of the rib correction part is excessively heated and melts, and the melted correction paste shrinks at the time of hardening and causes internal stress. May occur, and cracks may occur in the rib correction portion. Moreover, after drying and shaping the rib correction portion, if the entire rib correction portion is fired, the shaped shape may be deformed during firing. Therefore, the pattern defect correction apparatus described in Patent Document 1 has a problem that pattern defect correction cannot be performed satisfactorily.

  Moreover, although the pattern defect correction apparatus of patent document 2 is the structure which shapes the upper surface and wall surface of the rib correction part which deform | transformed at the time of baking by machining after baking, the width | variety between ribs is 0.2 mm-0.2. Since it is as narrow as about 3 mm, the tool for processing between the ribs needs to have a thin outer shape of 0.2 mm or less, and since it is after firing, the object to be processed is hard and the processing efficiency is poor. Therefore, the pattern defect correction apparatus described in Patent Document 2 has a problem that the correction efficiency is lowered.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a pattern defect correction method and a pattern defect correction apparatus that can correct a pattern defect well and improve the correction efficiency.

  In order to solve the above problems, a pattern defect correction method according to an aspect of the present invention includes an application step of applying a first correction paste to a defect portion of a pattern formed on a substrate, and an applied one layer A step of shaping the eye correction paste, a step of baking the shaped first layer correction paste, a step of applying a correction paste on the fired first layer correction paste, and a step of further applying Firing the modified paste.

  Preferably, the pattern defect correction method further includes a step of drying the applied first layer correction paste, and in the step of shaping, the dried first layer correction paste is shaped.

  In order to solve the above-described problems, a pattern defect correction apparatus according to an aspect of the present invention includes an application mechanism for applying a first correction paste to a pattern defect formed on a substrate, and an applied one layer. A shaping mechanism for shaping the eye correction paste and a heat radiation mechanism for firing the shaped first layer correction paste, and the coating mechanism is further provided on the fired first layer correction paste. The heat radiation mechanism bakes the further applied correction paste.

  Preferably, the heat radiation mechanism further dries the applied first layer of correction paste, and the shaping mechanism shapes the dried first layer of correction paste.

More preferably, the shaping mechanism includes a cutting tool whose tip has a substantially semicircular cross-sectional shape.
Preferably, the shaping mechanism includes a grinding tool or a grinding wheel.

  Preferably, the shaping mechanism performs shaping by irradiating a laser beam.

  According to the present invention, it is possible to correct the pattern defect well and improve the correction efficiency.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

[Configuration and basic operation]
FIG. 1 is an external view showing a configuration of a pattern defect correction apparatus according to an embodiment of the present invention.

  With reference to the figure, the pattern defect correcting apparatus includes a positioning mechanism and a personal computer (control mechanism) 22. The positioning mechanism includes a Y-axis table 1, a Z-axis table 2, and an X-axis table 3.

  The rear glass substrate 80 of the PDP panel to be corrected is placed on the Y-axis table 1 and moves in the Y-axis direction parallel to the rear glass substrate 80.

  The Z-axis table 2 moves in the Z-axis direction perpendicular to the rear glass substrate 80 placed on the Y-axis table 1.

  The X-axis table 3 carries the Z-axis table 2 and moves in the X-axis direction parallel to the rear glass substrate 80 and orthogonal to the Y-axis.

  The personal computer 22 controls the entire pattern defect correcting apparatus. For example, the personal computer 22 performs control to move the Y-axis table 1, the Z-axis table 2, and the X-axis table 3.

FIG. 2 is an external view showing an enlarged view of a portion A in FIG.
With reference to FIG. 2, the pattern defect correcting device includes a Z-axis drive motor 12 and a correction head mounted on the Z-axis table 2. The correction head includes an observation optical system 4, a coating mechanism 5, a continuous wave CO 2 laser (thermal radiation mechanism) 6, a shaping mechanism, and a laser displacement meter 11. The shaping mechanism includes a tool rotating spindle 7, a scratch mechanism 9, and a tape polishing unit 10.

The observation optical system 4 observes defects of the ribs 83 on the surface of the rear glass substrate 80.
The application mechanism 5 applies the correction paste to the rib defect using a needle.

  The continuous wave CO 2 laser 6 irradiates the rib correction portion made of the applied correction paste with laser light and dries it. Further, the continuous wave CO2 laser 6 is fired by irradiating the rib correcting portion after drying with laser light. In addition, the structure which uses a continuous wave CO2 laser as the thermal radiation mechanism 6 is not limited to the structure that radiates heat to the correction paste, and may be used instead of the continuous wave CO2 laser 6.

  The shaping mechanism shapes the rib correcting portion by cutting or the like. More specifically, the tool rotating spindle 7 cuts and removes the excess correction paste that protrudes from the normal rib width. The scratch mechanism 9 removes excess correction paste protruding from the normal rib width with a needle. The tape polishing unit 10 uses the polishing tape to remove the protrusion defect on the rib upper surface or the correction paste protruding from the upper surface of the normal rib.

  The laser displacement meter 11 detects the distance between the Z-axis table 2 and the rear glass substrate 80. The Z-axis drive motor 12 drives the Z-axis table 2.

  The configuration of the positioning mechanism is not limited to the configuration including the Y-axis table 1, the Z-axis table 2, and the X-axis table 3. The relative positions of the PDP and the correction head are the X-axis, Y-axis, and Z-axis. Anything can be used as long as it can move and adjust in the axial direction. Further, when the applied correction paste is dried, it is also possible to use an IR light source, a semiconductor laser, or the like instead of the continuous wave CO 2 laser 6. Further, the pattern defect correcting apparatus includes the YVO4 laser 8 shown in the figure instead of the tool rotating spindle 7, and the excess correction paste protruding from the normal rib width with the laser light narrowed down from the YVO4 laser 8 is provided. The structure which cuts and removes may be sufficient. Further, a YAG laser or the like may be used instead of the YVO4 laser.

  An image observed by the observation optical system 4 is displayed on the screen of the personal computer 22. The operator looks at this screen and instructs each mechanism of the pattern defect correction device via the personal computer 22 to specify the application position, laser irradiation position, tool movement position, measurement position, etc., and corrects application, drying, shaping, firing, etc. Do the work. Note that the configuration is not limited to the configuration in which the operator instructs each mechanism to perform the correction work, but the personal computer 22 may automatically control each mechanism to perform the correction work.

[Operation]
Next, an operation when the pattern defect correcting device according to the embodiment of the present invention corrects a defective portion of the rib will be described.

  FIG. 3 is a diagram showing how the pattern defect correcting device according to the embodiment of the present invention corrects a missing portion of a rib.

  With reference to the figure, the coating mechanism 5 applies an appropriate amount of correction paste to the bottom of the rib defect portion 32 in a line. Hereinafter, the first layer of correction paste applied to the bottom of the rib defect portion 32 is referred to as a base portion 31.

The continuous wave CO 2 laser 6 is dried by irradiating the base portion 31 with laser light.
After drying by the continuous wave CO2 laser 6, for example, the tool rotating spindle 7 is inserted between the ribs, and the paste 33 which is an extra correction paste protruding from the normal rib width is removed from the base portion 31 and the base portion 33 is removed. The wall surface of the part 31 is shaped. At this time, the tool rotating spindle 7 may be configured to shape the upper surface of the base portion 31 into a flat shape.

  Here, since the base part 31 is dry but not baked, it is soft and the correction paste to be shaped is only for one layer, so the thickness of the shaping object is thin. Therefore, in the pattern defect correction apparatus according to the embodiment of the present invention, the load on the tool during shaping is small, and even a thin tool can be shaped sufficiently. Moreover, even if YVO4 laser, YAG laser, or the like is used as described above, the base portion 31 can be accurately shaped along the wall surface.

  After shaping by the shaping mechanism, the continuous wave CO 2 laser 6 performs firing by irradiating the base portion 31 with laser light with an output stronger than the laser light during drying.

  Through the above steps, the formation of the base portion 31 at the bottom of the rib defect portion 32 is completed. The pattern defect correcting device is not limited to the configuration in which only one layer of the base portion 31 is formed on the bottom of the rib deficient portion 32, and the base portion 31 is repeatedly formed to stack a plurality of base portions. A configuration is also possible.

  Here, since the baking target is only one layer of the correction paste, the thickness of the baking target is thin, and therefore, in the pattern defect correction apparatus according to the embodiment of the present invention, the baking state changes at the upper part and the lower part of the base part 31. Further, it is possible to prevent the shaped shape from being greatly collapsed by firing, and the base portion 31 can be formed satisfactorily.

  Next, the application mechanism 5 further applies an appropriate amount of correction paste on the base portion 31 in a line.

  The continuous wave CO 2 laser 6 performs firing by irradiating the correction paste applied on the base portion 31 with laser light with a stronger output than the laser light during drying.

  The pattern defect correcting device repeats the process of applying the correction paste in a line on the base portion 31 as described above, and repeating the baking process, and stacking the correction paste until the rib defect portion 32 is filled with the correction paste. To do.

  Here, in the pattern defect correction apparatus according to the embodiment of the present invention, even in the step of applying the correction paste on the base portion 31 and baking, the baking target is only one layer of the correction paste, so the thickness of the baking target is small. Because it is thin, it is possible to prevent the firing state from changing at the top and bottom of the applied correction paste, and it is possible to prevent the shape of the shaped correction paste from being greatly destroyed by baking, It is possible to prevent the correction paste applied on the base part 31 from greatly protruding from the base part 31 during firing. Furthermore, the firing state of the correction paste to be laminated can be made uniform.

  The tape polishing unit 10 uses the polishing tape to remove and shape the portion of the correction paste filled in the rib defect portion 32 that protrudes from the upper surface of the normal rib.

  FIG. 4A is an external view showing the configuration of the tool rotating spindle 7. FIG. 2B is a cross-sectional view showing the tip shape of the tool rotating spindle 7.

  The tool rotating spindle 7 may be a regular end mill-shaped tool having a thin shape, but may also be a cutting tool having a substantially semicircular cross-sectional shape at the tip as shown in FIG. With such a configuration, the tool rotating spindle 7 can be easily manufactured, and the manufacturing cost of the pattern defect correcting device can be reduced.

  The configuration is not limited to using the tool rotating spindle 7 which is a rotary cutting tool, but may be configured to remove the paste protruding portion 33 using a small-diameter grinding wheel instead of the tool rotating spindle 7.

  Incidentally, the pattern defect correction apparatus described in Patent Document 1 has a problem that defect correction cannot be performed satisfactorily, and the pattern defect correction apparatus described in Patent Document 2 has a problem that the correction efficiency is low. was there. However, in the pattern defect correction apparatus according to the embodiment of the present invention, the coating mechanism, the heat radiation mechanism, and the shaping mechanism perform coating, drying, firing, and shaping to form the base portion 31 at the bottom of the rib defect portion 32. Then, the correction paste is further applied onto the formed base portion 31 and baked to fill the rib defect portion 32 with the correction paste.

  Here, usually, if there is a portion where the rib 83 is not formed and the surface of the dielectric layer 73 is exposed at the bottom of the rib defect portion 32, the correction paste is likely to spread when the correction paste is applied to the portion. There is. On the other hand, in the state where the rib 83 has a normal wall surface and the surface of the dielectric layer 73 does not come out at the bottom of the defect portion 32, the correction paste applied to the rib defect portion 32 remains. There is a property of being laminated in a state of conforming to the shape of the rib 83. For this reason, if the amount of the correction paste applied at one time is stabilized at an appropriate amount, the applied correction paste does not spread from the base portion 31, and the correction paste applied on the base portion 31 is dried. The step of shaping can be omitted.

  As described above, in the pattern defect correction apparatus according to the embodiment of the present invention, it is possible to correct the pattern defect satisfactorily and improve the correction efficiency.

  In the pattern defect correction apparatus according to the embodiment of the present invention, the continuous wave CO2 laser 6 irradiates the base portion 31 with laser light to dry it, and the tool rotating spindle 7 included in the shaping mechanism has the base portion 31 after drying. However, the present invention is not limited to this. Even when the heat radiation mechanism for drying the base portion 31 is not provided, when the correction paste is a substance that is easy to dry, such as when the correction paste can be properly shaped without being dried after application of the correction paste. The object of the present invention can be achieved.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is an external view which shows the structure of the pattern defect correction apparatus which concerns on embodiment of this invention. It is an external view which shows the A section enlarged view of FIG. It is a figure which shows a mode that the pattern defect correction apparatus which concerns on embodiment of this invention corrects the defect | deletion location of a rib. (A) is an external view showing the configuration of the tool rotating spindle 7. FIG. 2B is a cross-sectional view showing the tip shape of the tool rotating spindle 7. It is a figure which shows the structure of a plasma display panel.

Explanation of symbols

  1 Y-axis table, 2 Z-axis table, 3 X-axis table, 4 observation optical system, 5 coating mechanism, 6 continuous oscillation CO2 laser (thermal radiation mechanism), 7 tool rotating spindle, 9 scratch mechanism, 10 tape polishing unit, 11 Laser displacement meter, 12 Z-axis drive motor, 22 Personal computer (control mechanism), 31 Base part, 32 Rib defect part, 33 Paste protruding part, 70 Front glass substrate, 71 Transparent electrode, 72 Bus electrode, 73 Dielectric layer, 74 protective layer, 80 back glass substrate, 81 address electrode, 83 barrier rib (rib), 84 phosphor.

Claims (7)

An application step of applying a first layer of correction paste to a defective portion of a pattern formed on the substrate;
Shaping the applied first layer of correction paste;
Firing the shaped first layer correction paste;
Applying a correction paste on the fired first layer correction paste; and
And baking the further applied correction paste. The pattern defect correction method further includes:
Drying the applied first layer of correction paste;
The pattern defect correction method according to claim 1, wherein in the shaping step, the dried first layer correction paste is shaped. An application mechanism for applying a first layer of correction paste to a defective portion of a pattern formed on a substrate;
A shaping mechanism for shaping the applied first layer correction paste;
A heat radiation mechanism for firing the shaped first layer correction paste,
The coating mechanism further applies a correction paste on the baked first layer correction paste,
The thermal radiation mechanism is a pattern defect correction device for firing the further applied correction paste. The thermal radiation mechanism further dries the applied correction paste of the first layer,
The pattern defect correction device according to claim 3, wherein the shaping mechanism shapes the dried first layer correction paste.   The pattern defect correction device according to claim 4, wherein the shaping mechanism includes a cutting tool having a substantially semicircular cross-sectional shape at a tip end.   The pattern defect correcting device according to claim 3, wherein the shaping mechanism includes a grinding tool or a grinding wheel.   The pattern defect correction device according to claim 3, wherein the shaping mechanism performs the shaping by irradiating a laser beam.

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