KR20090113361A - Apparatus and method for mounting electronic component - Google Patents

Abstract

Provided is a mounting apparatus for mounting a plurality of TCPs on a side portion of a substrate. The mounting apparatus is provided with punching apparatuses (3A, 3B) for punching out the TCPs (2) from a carrier tape (1); receiving/transferring means (4A, 4B) for receiving the TCPs punched out by the punching apparatus and transferring them to a prescribed position; index means (5A, 5B) which have a plurality of first holding heads (6) for receiving and holding the TCPs transferred by the receiving/transferring means; buffer means (31A, 31B) having a second holding head (34) for receiving and holding the TCPs held by a first holding head of the index means; and mounting heads (36A, 36B) for receiving the TCPs stored in the buffer means and mounts them on the side portion of the substrate.

Description

Mounting device and mounting method of electronic component {APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT}

TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus and a mounting method for mounting a TCP (Tape Carrier Package) as an electronic component on a liquid crystal display panel as a substrate.

For example, when manufacturing the liquid crystal display panel as a board | substrate, mounting TCP as an electronic component in the liquid crystal display panel with a mounting apparatus is performed. When the TCP is mounted on a liquid crystal display panel, the TCP is punched from a carrier tape by a punching device and received by a receiving member constituting the receiving / transferring means.

The receiving member conveys the punched TCP to a predetermined position and receives the plurality of holding heads provided in the index table that is intermittently rotated at a predetermined angle from the position. The TCP that communicates with the holding head of the index table is positioned at the mounting position by the cleaning and holding head of the terminal of the TCP in accordance with the intermittent rotation of the index table.

After reaching the mounting position, the TCP is imaged together with the side portion of the display panel by the imaging camera, and then the display panel is positioned relative to the TCP based on the imaging. Then, the holding head is driven in the downward direction, so that the TCP held by the holding head is mounted on the side portion of the substrate. In this way, a plurality of TCPs are sequentially mounted on the side edge portion of the substrate at predetermined intervals.

Such prior art is disclosed in Patent Document 1 and Patent Document 2.

Patent Document 1: Japanese Unexamined Patent Publication No. 2002-305398

Patent Document 2: Japanese Unexamined Patent Publication No. 2006-120929

By the way, the said punching apparatus punches TCP from the said carrier tape, and it receives it in the holding head of the index table by the receiving member of the receiving means, and conveys it to the mounting position and the time required before returning it to a mounting position. When comparing the time required for positioning the liquid crystal display panel by imaging the TCP and the side portion of the liquid crystal display panel, and mounting the TCP on the side portion of the liquid crystal display panel, the former working time is compared with the latter working time. It is about 2 times longer.

In other words, the former work involves punching TCP from the carrier tape, returning the punched TCP to the holding head of the index table, or positioning the cleaning or holding head of the TCP while intermittently rotating the index table. And so forth.

On the other hand, the latter operation only captures the TCP held by the holding head and the liquid crystal display panel, positions the liquid crystal display panel on the basis of the imaging, and lowers the holding head to mount TCP on the liquid crystal display panel.

Therefore, since the former has more work compared with the latter, and there are many mechanical work which takes a long time, the working time might be longer than the latter. This is also confirmed by measuring the actual working time.

In this way, when the working time of the former required to supply the TCP punched from the carrier tape to the mounting position takes longer than the latter working time required to mount the TCP supplied to the mounting position to the liquid crystal display panel, Even when the work is performed continuously, since the waiting time is generated in the latter work, there is a case that the improvement in productivity is caused by the waiting time.

The present invention provides an electronic component mounting apparatus and a mounting method for supplying a punched electronic component to a mounting position so that a waiting time does not occur in a mounting operation for mounting the electronic component supplied to the mounting position on a substrate. .

MEANS TO SOLVE THE PROBLEM In order to solve the problem mentioned above, this invention is a mounting apparatus which mounts several electronic component in the side part of a board | substrate,

A punching device for punching electronic components from the tape-shaped member,

Receiving means for receiving the electronic component punched by the punching device and conveying it to a predetermined position;

Index means having a plurality of first holding heads for receiving and holding electronic components conveyed by the receiving means;

Buffer means having a second holding head for receiving and holding electronic components held in the first holding head of the indexing means;

Mounting means for receiving the electronic component stored in the buffer means and mounting it on the side of the substrate;

It is providing the mounting apparatus of the electronic component characterized by including this.

Moreover, this invention is a mounting apparatus which mounts several electronic component in the side part part of a board | substrate,

A punching device for punching electronic components from the tape-shaped member,

A pair of receiving means for receiving the electronic component punched by the punching device and conveying it to a predetermined position;

A pair of index means having a plurality of first holding heads for receiving and holding the electronic components conveyed by the receiving means,

One or more buffer means having a second holding head for receiving and holding the electronic component held in the first holding head of each indexing means;

A pair of mounting means for receiving the electronic component stored in each buffer means and mounting on the one end side and the other end side, respectively, from the longitudinal center of the side edge portion of the substrate.

It is providing the mounting apparatus of the electronic component characterized by including this.

Moreover, this invention is a mounting method which mounts a some electronic component in the side part of a board | substrate,

Punching the electronic component from the tape-shaped member,

Passing the punched electronic component to the plurality of first holding heads of the indexing means,

Receiving and storing an electronic component exchanged with the first holding head of the indexing means by a plurality of second holding heads of the buffer means;

Receiving the electronic component held by the second holding head and mounting the electronic component on the side of the substrate;

It is to provide a method for mounting an electronic component, characterized in that it comprises a.

1 is a plan view showing a schematic configuration of a mounting apparatus of an embodiment of the present invention.

FIG. 2 is a side view of the mounting apparatus shown in FIG. 1. FIG.

3 is a front view showing a pair of indexing means.

4 is a front view showing a pair of backup units.

5A is an explanatory diagram for brushing a terminal of TCP by index means.

5B is an explanatory diagram for positioning TCP held in the second holding head of the indexing means.

FIG. 6 is a view for explaining a procedure of dividing a plurality of TCPs into a right portion and a left portion on one side of a substrate.

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

Fig. 1 is a plan view showing a schematic configuration of a mounting apparatus of the present invention, wherein the mounting apparatus comprises a first punching device 3A and a first punching device for punching TCP 2 as an electronic component from a carrier tape 1 as a tape-shaped member. It has two punching devices 3B.

The first punching device 3A and the second punching device 3B are operated alternately so that the TCP 2 punched by one of the punching devices 3A or 3B receives the first receiving means 4A. And by the second receiving means 4B.

That is, when the TCP 2 is punched by the first punching device 3A, the second punching device 3B is waiting, and from the carrier tape 1 supplied to the first punching device 3A, the TCP ( When the punching of 2) is completed, the second punching device 3B is operated, and a new carrier tape 1 is supplied to the first punching device 3A. Thereby, the TCP 2 punched from the carrier tape 1 can be alternately supplied to the said 1st receiving means 4A and the 2nd receiving means 4B.

Then, the first punching device 3A and the second punching device 3B are simultaneously operated, and the TCP 2 punched by the first punching device 3A is supplied to the first receiving device 4A, The TCP 2 punched out by the second punching device 3B may be supplied to the second receiving means 4B.

The TCP 2 received by the first receiving means 4A is conveyed to the first indexing means 5A, and received by the first holding head 6 provided in the first indexing means 5A. The TCP 2 received by the second receiving means 4B is conveyed to the second indexing means 5B and received by the first holding head 6 provided in the second indexing means 5B.

As shown in Fig. 2, the first and second indexing means 5A and 5B have an index table 9 which is intermittently rotated at 90-degree intervals in the circumferential direction by the first? Drive source 8. . The first holding head 6 is provided on the lower surface of each index table 9 at intervals of 90 degrees in the circumferential direction.

Accordingly, the TCP 2 conveyed by the first and second receiving means 4A, 4B is supported by the first holding head 6 of each of the indexing means 5A, 5B as described later. .

As shown in Fig. 2, the first and second punching devices 3A and 3B have a metal mold 13 for punching the TCP 2 from the carrier tape 1. The mold 13 has an upper mold 13a driven in the vertical direction and a lower mold 13b fixedly disposed to face the upper mold 13a. A punch 14 is provided in the upper mold 13a, and a through hole 15 through which the punch 14 is inserted is formed in the lower mold 13b when the upper mold 13a is lowered.

The carrier tape 1 passes between the upper mold 13a and the lower mold 13b, and when the upper mold 13a is lowered, the TCP 2 is punched out and sent at a predetermined pitch in the direction of the arrow when raised. The next TCP 2 is punched out.

The TCP 2 punched by the first and second punching devices 3A and 3B is alternately received by the receiving holes 16 of the first and second trapping means 4A and 4B. do. As shown in Figs. 2 and 3, the receiving tool 16 can be driven in the Z direction in the vertical direction and in the θ direction in the rotation direction by the Zθ driving circles 18 provided on the Y table 17, respectively. It is supposed to be.

The pair of Y tables 17 are provided so as to be driven by a linear motor (not shown) in the Y guide body 20 provided in the X table 19 along the Y direction, respectively. The pair of X tables 19 are provided in the base 22 of the mounting apparatus so as to be driven by a linear motor (not shown) in the X guide body 23 arranged along the X direction. Each X table 19 is driven independently by the linear motor. In addition, X direction and Y direction are shown by the arrow in FIGS.

When the receiving port 16 of the first trapping means 4A receives the TCP 2 from one of the first and second punching devices 3A and 3B, the position indicated by the dashed line from the position shown by the solid line in FIG. It is driven so as to be in the Y direction and positioned so as to face one lower side of the four first holding heads 6 provided at intervals of 90 degrees in the circumferential direction on the lower surface of the first indexing means 5A.

Similarly, the receiving holes 16 of the second receiving means 4B are four first holding heads 6 provided at intervals of 90 degrees in the circumferential direction on the lower surface of the second indexing means 5B when receiving the TCP 2. Is positioned to face the bottom of one).

Each of the positioned receiving holes 16 is driven in the upward direction by the Zθ driving source 18 as shown in FIG. Accordingly, since the TCP 2 held in the receiving tool 16 approaches the lower surface of the first holding head 6 provided in the index table 9 at a contact or at a minute interval, the first holding head 6 TCP (2) is supported by adsorption.

As shown in Fig. 3, the pair of first X tables 19 are provided side by side so as to be driven along the X guide member 23, which is on the same orbit over the base 22 in the X direction. Therefore, in the figure, the pair of left and right first X tables 19 receives the TCP 2 punched by either one of the first and second punching devices 3A and 3B. The driving is controlled so as not to interfere with each other when being received by the first holding head 6 of the first and second indexing means 5A, 5B, that is, when driven in the X direction, respectively.

When TCP 2 is passed to the first holding head 6 provided in the index tables 9 of the first and second index means 5A, 5B, the index table 9 is the first? Drive source 8. By intermittent rotation by 90 degrees.

When the first retaining head 6 receiving the TCP 2 from the receiving hole 16 is driven to rotate 90 degrees in the circumferential direction together with the index table 9, the first retaining head 6 is retained by the first retaining head 6 at that position. The TCP is brushed by a brush 27 whose terminal (not shown) is rotationally driven by the motor 26, as shown in Fig. 5A. This eliminates contamination attached to the terminal. Then, at the time of brushing, volatile solvents such as alcohol are supplied to prevent the generation of static electricity at the time of brushing.

After brushing the terminal, the TCP 2 adsorbed and supported by the first holding head 6 is pressurized by the gauge 29 driven by the cylinder 28, as shown in FIG. 5B. Thus, one end of the TCP 2 is positioned to coincide with the side of the first holding head 6. In other words, the TCP 2 is held in substantially the same state with respect to each first holding head 6.

The motor 26 and the cylinder 28 are alternately opposed to each other with respect to the first holding head 6 positioned at a predetermined position by a drive mechanism (not shown). As a result, the TCP 2 held by the first holding head 6 can perform the brushing with the brush and the positioning with the gauge 29 at the same position.

If the first holding head 6 holding the brushed and positioned TCP 2 is driven to rotate 90 degrees again in the circumferential direction together with the index table 9, the TCP 2 held on the first holding head 6 is maintained. Are positioned with respect to the first and second buffer means 31A, 31B, respectively. Each buffer means 31A, 31B has a rotating body 33 which is rotationally driven by the second θ drive source 32 as shown in FIG. 2.

A pair of second holding heads 34 are provided at the periphery of the rotating body 33 at intervals of 180 degrees in the circumferential direction. That is, a pair of Z guides 35 are installed in the rotating body 33, and each of the Z guides 35 is disposed in a vertical direction (Z direction) by a linear motor (not shown). It is installed to be driven along.

When the index table 9 is driven to rotate so that the TCP 2 held on the lower end surface of the first holding head 6 is positioned at a position opposite to the upper end surface of one of the pair of second holding heads 34. The second holding head 34 is driven in the ascending direction, and an upper end surface of the second holding head 34 contacts or approaches the TCP 2 held by the first holding head 6.

Then, after the suction force is generated in the second holding head 34, the suction force of the first holding head 6 is released, whereby the TCP 2 is released from the first holding head 6 by the second holding head 34. I accept it. When the second holding head 34 receives the TCP 2, the rotor 33 is driven to rotate at an angle of 90 degrees in the circumferential direction by the second θ drive source 32.

When the rotating body 33 is rotated 90 degrees in the circumferential direction by the second θ drive source 32, the TCP 2 held by the second holding head 34 of the first buffer means 31A is in an initial position. It is located under the 1st mounting head 36A which waits. Similarly, the TCP 2 held in the second holding head 34 of the second buffer means 31B is positioned below the second mounting head 36B waiting in the initial position.

Although not shown in detail, the 1st mounting head 36A and the 2nd mounting head 36B are each independently provided so that driving is possible in the X, Y, Z, and (theta) directions. The first mounting head 36A receives the TCP (2) from the second holding head 34 of the first buffer means 31A, and has a line in the center of the width direction of the substrate W such as a liquid crystal display panel shown in FIG. In this embodiment, seven TCPs (2) are mounted in the order shown by a to g in one side of the area L on the left side bordering O.

The second mounting head 36B receives the TCP (2) from the second holding head 34 of the second buffer means 31B, and on one side of the right side region R bordering the center in the width direction of the substrate W. Seven TCP (2) s are mounted in the order indicated by a to g.

When the pair of mounting heads 36A and 36B mounts TCP (2) on the upper surface of one side of the substrate W, the lower surface of the substrate W is in the Z direction (in the pair of backup units 38A and 38B shown in Fig. 4). It is supported by a pair of backup tools 39 which are installed to be adjustable in height).

Each backup unit 38A, 38B has an X driver 40. The pair of X driving bodies 40 are installed to be movable along the X guide body 40a provided on the base 22, and are each independently driven by a linear motor (not shown).

Each of the X driving bodies 40 is provided with the backup tool 39 driven in the Z direction by the Z driving source 39a, which is backed by the X driving body 40 in the X direction. By positioning with respect to, the lower surface of the portion on which the TCP 2 of the substrate W is mounted can be supported in the above a to g order.

A pair of alignment marks provided on the portion where the TCP 2 of the substrate W is mounted on both sides of the X driving body 40 in the width direction, and a pair of alignment marks provided on the TCP 2 (both not shown) ), A pair of imaging cameras 41 are provided.

That is, each imaging camera 41 simultaneously picks up one alignment mark provided in the board | substrate W and one alignment mark provided in TCP2, respectively, and image-processes the imaging signal to the mounting position of the board | substrate W. FIG. The position deviation amount of the TCP (2) with respect to the calculation is calculated, and based on the calculation, the first and second mounting heads (36A, 36B) holding the TCP (2) are driven in the X, Y and? 2) is positioned at the mounting position of the substrate W.

When the mounting heads 36A and 36B are positioned, the mounting heads 36A and 36B are driven in the downward direction, and the TCP 2 held at the lower end of the mounting heads 36A and 36B is located at one side of the substrate W. It is implemented in order.

When the TCP 2 is picked up by the imaging camera 41 and the image is processed by the pick-up mark of the TCP 2 by the pick-up signal, the pick-up mark is displayed when the TCP 2 is defective. It may not be possible to recognize the position. In such a case, the TCP 2 is regarded as a defective product and is disposed outside both longitudinal ends of one side portion of the substrate W as shown in FIG. 1 before being mounted on the substrate W by the mounting heads 36A and 36B. The waste box 42 is disposed of.

As shown in FIG. 2, the substrate W is formed on an upper surface of the holding table 44 driven in the X, Y, Z and θ directions, and at least one side of the peripheral portion on which the TCP 2 is mounted is held on the holding table 44. It protrudes outward from the side edge of and is hold | maintained.

When the substrate W is positioned at a predetermined position by the holding table 44, the mounting heads 36A and 36B and the backup tool 39 are in the longitudinal direction of one side of the substrate W without moving the substrate W. It drives along, and several TCP (2) is mounted in the one side.

When the plurality of TCPs 2 are mounted on one side of the substrate W without moving the substrate W, the substrates W are moved and the TCPs 2 are mounted without moving the mounting heads 36A and 36B and the backup tool 39. As in the related art, one side portion protruding from the holding table 44 of the substrate W is not vibrated in the vertical direction.

When the substrate W is vibrated, the next TCP 2 cannot be mounted until the vibration is stopped. In particular, when the substrate W is enlarged, the vibration becomes large, so that the time until stopping becomes long, resulting in a decrease in productivity.

However, if the substrate W is positioned by the holding table 44, the plurality of TCPs 2 are mounted without moving the substrate W as described above, so that the substrate W does not vibrate. Thereby, since the waiting time until the vibration of a board | substrate stops becomes unnecessary, productivity can be improved by that much.

Next, a procedure of mounting the plurality of TCPs 2 on one side of the substrate W by the mounting apparatus having the above configuration will be described.

On one side portion of the substrate W held by the holding table 44 and positioned at the mounting position, the left portion indicated by L bordering the centerline O in the width direction of the substrate W and the right portion indicated by R are shown in FIG. TCP (2) is implemented in the order indicated by ~ g.

The lower surface of one side of the substrate W is supported in the order in which the TCP 2 is mounted by the backup tool 39 by driving the backup units 38A and 38B in the X direction. Therefore, in this embodiment, when the substrate W is positioned by the holding table 44, one end of a certain length direction and the lower surface of the other end is first applied to the pair of backup tools 39 at the position of the pair of a of the substrate W. Is supported by.

When both ends in the longitudinal direction of one side of the substrate W are supported by the pair of backup tools 39, even if vibration occurs in the substrate W immediately after the positioning by the holding table 44, the vibrations of the pair of backup tools 39 Stopped in a short time). Thereby, since positioning of the board | substrate W can be started immediately after positioning the board | substrate W, productivity can be improved.

The supply of TCP2 to the 1st, 2nd mounting head 36A, 36B is a 1st, 2nd receiving after punching from one side of a pair of punching apparatus 3A, 3B from the carrier tape 1. It passes to the 1st holding head 6 provided in the index table 5A, 5B of the means 4A, 4B.

Subsequently, the TCP 2 is exchanged from the first holding head 6 to the second holding head 34 of the first and second buffer means 31A, 31B, and from the second holding head 34. The first and second mounting heads 36A and 36B are mounted on one side of the substrate W.

Time to receive TCP 2 from one of the pair of punching devices 3A and 3B, and to supply the TCP 2 to the position where it can be received by the first and second mounting heads 36A and 36B. As described above, the time required for mounting the TCP 2 supplied at the position to be passed by the mounting heads 36A and 36B to the side portion of the substrate W is longer. In particular, in the former case, it takes a long time for the TCP 2 to be received and conveyed by the receiving port 16 at the time of punching the TCP 2 and passed to the first holding head 6.

However, the first and second buffer means 31A before the start of the mounting of the TCP 2 on the substrate W, that is, the waiting time for replacing the mounted substrate W of the TCP 2 with the new substrate W. And the punched TCP 2 to the pair of second holding heads 34 of 31B can be supplied and stored in advance.

In addition, the punched TCP 2 is also supplied in advance and stored in the four first holding heads 6 and the first and second mounting heads 36A and 36B of the first and second index tables 5A and 5B, respectively. You can do it.

That is, seven TCPs 2 can be stored in combination with the first index table 5A, the first buffer means 31A and the first mounting head 36A, and the second index table 5B and the second Seven TCPs 2 can be stored in combination with the buffer means 31B and the second mounting head 36B.

The time required for mounting one TCP 2 and the time required to supply the stored TCP 2 to one mounting head are approximately the same.

Thereby, seven TCP (s) 2 stored in advance can be mounted at the positions indicated by a to g between the longitudinal one end side indicated by L of one side of the substrate W and the other end side indicated by R, respectively. That is, the mounting of TCP 2 with respect to the new board | substrate W supplied to the holding table 44 is punched by the 1st or 2nd punching apparatus 3A, 3B, and does not use the TCP 2, The board | substrate W This can be done only by the TCP 2 punched in advance and stored at the time of exchange.

Therefore, the time for punching TCP 2 from the carrier tape 1 by the first or second punching devices 3A, 3B, and the first and second receiving means 4A, 4B for punching TCP 2. Since the time passed to the first and second index tables 5A and 5B can be omitted, the TCP (2) is supplied to the first and second mounting heads 36A and 36B without waiting time. It can be mounted on one side of W.

The timing at which the TCP 2 is stored in the pair of second holding heads 34 of the first and second buffer means 31A and 31B changes the mounted substrate W of the TCP 2 to the new substrate W. As shown in FIG. It is not limited only to the waiting time at the time of exchange, and it may be any time as long as there is no TCP2 in the 2nd holding head 34 of each buffer means 31A, 31B.

In addition, although the 1st, 2nd buffer means 31A and 31B provided and comprised the pair of 2nd holding head 34 in the rotating body 33, each buffer means 31A and 31B has the rotating body 33 Although not shown in the figure, a linear movable body driven linearly in the Y direction may be used. In this case, the number of the 2nd holding heads 34 which are provided in a linear movable body may be any one, or more than one, and the point should just provide the one or more 2nd holding heads 34. As shown in FIG.

When mounting TCP (2) on one side of the board | substrate W by a pair of mounting head 36A, 36B, it was made to carry out from the longitudinal direction both ends of the one side part. Therefore, since the board | substrate W supplied and hold | maintained to the holding table 44 is first supported by the pair of backup tools 39 at both ends of the longitudinal direction of one side part, the one side part at the time of supply to the holding table 44 is carried out. The vibration generated in the stops in a short time. That is, even when the substrate W is enlarged and the vibration is large, the stopping time can be shortened.

The mounting of TCP (2) on the L side portion and the R side portion of one side of the substrate W is performed only from one end of the L side portion and the R side portion (both ends in the longitudinal direction of the substrate W). When three TCP (2) s of c were mounted from one end to the middle part, as shown in d-g, it returned to the middle part from the longitudinal center part of one side part of the board | substrate W.

Therefore, the timing with which the 1st mounting head 36A mounts TCP2 of "D" of the other end of the L side part of one side of the board | substrate W, and the 2nd mounting head 36B of the other end of the R side part Since the timing for mounting the TCP 2 of "g" is shifted, the first mounting head 36A and the second mounting head 36B are positioned in the longitudinal direction of the substrate W at the central portion in the longitudinal direction of one side of the substrate W. As shown in FIG. Interference at the center can be prevented.

The mounting on the board | substrate W of the TCP2 by the 1st, 2nd mounting head 36A, 36B is not mounted from the both ends of the longitudinal direction of the board | substrate W, but mounts with one mounting head in the longitudinal center part of the board | substrate W May be performed from the end portion in the longitudinal direction, or may be performed from the central portion in the longitudinal direction by a pair of heads, and the point is that TCP (to the substrate W by the pair of mounting heads 36A and 36B) is used. The mounting order of 2) is not limited to any.

In the above embodiment, it is possible to store four TCPs in the index table, two in the buffer means, one in the mounting head, and seven in total. It may not be the number (7).

In this case, the number of the first holding heads provided in the index table or the second holding heads provided in the rotating body of the buffer means is changed in accordance with the number of TCPs mounted on the L side portion and the R side portion of the substrate. As a result, the number of TCPs mounted on one side of the board can be procured only by the TCP stored in advance, so that the productivity can be reliably improved even when the number of TCPs mounted on one side of the board is not seven. .

The number of TCPs stored in advance is not necessarily the same as the number of TCPs mounted on the L and R sides of the substrate, and the point is to provide a buffer means, and at least a plurality of second holdings of the buffer means. Keeping TCP in the head can improve productivity compared to the case where it is not.

In addition, although two sets of the receiving means, the index table, the buffer means, and the mounting head are provided, respectively, one set of the receiving means, the index table, the buffer means, and the mounting head may be used depending on the size of the substrate on which the TCP is mounted.

According to the present invention, the electronic components punched out of the tape-like member and exchanged with the plurality of first holding heads of the index means are mounted on these substrates while being delivered to the plurality of second holding heads, so that a plurality of the first The electronic component held by the holding head can be mounted on the substrate in turn.

Therefore, the mounting efficiency of the plurality of electronic components on the substrate can be improved by the buffering action of the electronic components held in the plurality of second holding heads.

According to the present invention, the electronic components punched out of the tape-like member and exchanged with the plurality of first holding heads of the index means are mounted on these substrates while being delivered to the plurality of second holding heads, so that a plurality of the first The electronic component held by the holding head can be mounted on the substrate in turn.

Therefore, the mounting efficiency of the plurality of electronic components on the substrate can be improved by the buffering action of the electronic components held in the plurality of second holding heads.

Claims (10)

As a mounting apparatus for mounting a plurality of electronic components on the side portion of the substrate, A punching device for punching electronic components from the tape-shaped member, Receiving means for receiving the electronic component punched by the punching device and conveying it to a predetermined position; Index means having a plurality of first holding heads for receiving and holding electronic components conveyed by said receiving means; Buffer means having a second holding head for receiving and holding electronic components held in the first holding head of the indexing means; Mounting means for receiving the electronic component stored in the buffer means and mounted on the side portion of the substrate Mounting device of the electronic component, including. The method of claim 1, A mounting apparatus for mounting a plurality of electronic components on the side portion of the substrate, A punching device for punching electronic components from the tape-shaped member, A pair of receiving means for receiving the electronic component punched by the punching device and conveying it to a predetermined position; A pair of index means having a plurality of first holding heads for holding and holding the electronic components conveyed by the receiving means; One or more buffer means having a second holding head for receiving and holding the electronic component held in the first holding head of each of the index means; A pair of mounting means for receiving the electronic component stored in each of the buffer means and mounted on one end side and the other end side, respectively, from the longitudinal center of the side edge portion of the substrate. Mounting device of the electronic component, including. The method according to claim 1 or 2, Electronic component mounting which has a 1st punching apparatus and a 2nd punching apparatus, and moves another punching apparatus when an electronic component is punched and replaced with a new tape-shaped member from the tape-shaped member supplied to one punching apparatus. Device. The method according to claim 1 or 2, The electronic component mounting apparatus which stores the electronic component punched by the said punching apparatus in the 2nd holding head of the said buffer means, when an electronic component is mounted in the said board | substrate and is replaced with a new board | substrate. The method of claim 2, Having a pair of backup units supporting a lower surface of a portion on which the electronic component of the substrate is mounted when mounting the electronic component on the substrate by the pair of mounting means, The pair of backup units are driven along the longitudinal direction of the side portion on which the electronic component of the substrate is mounted, The mounting of the electronic component with respect to the side part of the said board | substrate is performed from the both ends of the longitudinal direction of the side part of the said board | substrate initially supported by the said pair of backup unit. The method of claim 5, The backup unit is provided with an imaging camera for imaging and positioning the electronic component and the substrate when mounting the electronic component held in the mounting means on the substrate, And the electronic component is discarded before being mounted on the substrate when the position recognition of the electronic component is impossible by the imaging camera. As a mounting method for mounting a plurality of electronic components on the side of the substrate, Punching the electronic component from the tape-shaped member, Passing the punched electronic component to the plurality of first holding heads of the indexing means, Receiving and storing an electronic component exchanged with the first holding head of the indexing means by a plurality of second holding heads of the buffer means; Receiving the electronic component held by the second holding head and mounting the electronic component on the side of the substrate; Including, the mounting method of the electronic component. The method of claim 7, wherein The electronic component mounting method of storing an electronic component in the said 2nd holding head, when mounting of an electronic component is complete in the said board | substrate and replacing with a new board | substrate. The method of claim 7, wherein The electronic component mounting method of storing an electronic component in the said 1st holding head after storing an electronic component in the said 2nd holding head, when mounting of an electronic component is completed in the said board | substrate and replacing with a new board | substrate. The method of claim 7, wherein The mounting of the plurality of electronic components on the side portions of the substrate is performed from both ends in the longitudinal direction of the side portions of the substrate, and the mounting of the electronic components from one end in the longitudinal direction of the substrate is sequentially performed from one end in the longitudinal direction to the center portion. The mounting method from the other end is carried out from the other end in the longitudinal direction to the middle part before reaching the center part, and is then carried out from the center part toward the middle part in the longitudinal direction.

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