KR20090108420A - Chuck and deposition apparatus using the same - Google Patents

Abstract

PURPOSE: A chuck and a deposition apparatus using the same are provided to keep flatness of a substrate to support the substrate and arrange the substrate and a mask by closely supporting the mask on the substrate, thereby realizing fine arrangement and reducing the frequency of arrangement attempts. CONSTITUTION: A chuck includes a main body(210), an electrostatic layer(250), a pattern and an electromagnet(230). The electrostatic layer is installed in one side of the main body. A substrate close to one side of the main body is supported by an electrostatic force. The patterns are inserted and installed into and in the main body. A pattern of a deposition film is formed on the substrate.

Description

Chuck and deposition apparatus using the same

The present invention relates to a chuck and a deposition apparatus using the same, and more particularly, to a chuck supporting a substrate and a mask for depositing a pattern on the substrate and a deposition apparatus using the same.

Recently, as the electronic display industry in the semiconductor industry has developed rapidly, the demand for display devices has increased in various forms. Recently, flat panel displays (FPDs) such as liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent displays (VFDs) have been studied. It is already widely used in real life.

A flat panel display (FPD) is an image display device that is thinner and lighter than a cathode ray tube (CRT), which is mainly used as a display, such as a TV or a computer monitor, and is a liquid crystal display (LCD) and a plasma display. Plasma Display Panels (PDPs) and Organic Light Emitting Displays.

Among them, the organic light emitting diode display uses self-emitting light, in which electrons and holes injected through a cathode and an anode are recombined to form an exciton, and light of a specific wavelength is generated by energy from the formed excitons. Type display device.

Such an organic light emitting diode display has advantages of being able to be driven at a low voltage, being lightweight, thin, having a wide viewing angle, and having a fast response speed. It is attracting attention as a device.

The organic light emitting diode of the organic light emitting diode display is also called an organic light emitting diode (OLED) due to its diode characteristic and includes an anode electrode, an organic layer, and a cathode electrode which are stacked on a substrate.

The organic layer includes an organic emission layer (EL), in which holes and electrons recombine to form excitons and generate light. In this case, in order to increase the light emission efficiency, holes and electrons should be more smoothly transported to the organic light emitting layer.

On the other hand, as a general method of forming an organic film on the substrate, physical vapor deposition (PVD) methods such as vacuum evaporation, ion plating, and sputtering, and chemical vapor deposition by gas reaction (CVD) method.

Among them, a chemical vapor deposition (CVD) method using a gas reaction is used to form a thin film layer including an organic film of an organic light emitting device, and a vacuum vapor deposition apparatus using an organic material is mainly used.

In the vacuum deposition apparatus using the organic material, a separate organic material supply line for supplying the organic material or the source material is formed. The organic material supply line is provided with various mechanisms for gasifying and transporting organic material, for example, a mass flow valve, a carrier gas heater, a canister, a valve, and the like, and supply organic materials to the chamber by their organic operation.

On the other hand, in order to form a pattern in the vapor deposition film deposited on a board | substrate, the method of placing the mask in which the pattern was formed on the board | substrate, and spraying a deposit is used. In this case, the quality of the deposited film may be determined according to the degree of alignment of the substrate and the mask.

When the substrate and the mask are mechanically supported when the edge and the edge of the substrate are mechanically supported, the center portion of the substrate is sag due to its own weight, thereby causing a problem that the substrate and the mask are damaged by friction between the mask and the substrate.

Therefore, when the central portion of the substrate sags by its own weight, in order to eliminate friction between the substrate and the mask, the distance between the substrate and the mask should be increased by the amount of the central portion of the substrate sag. This blurs the focus of the camera photographing the alignment state of the substrate and the mask, and has a problem of repeating unnecessary alignment processes in order to obtain a clear camera focus.

An object of the present invention is to provide a chuck for supporting a substrate by maintaining the flatness of the substrate, and closely supporting the mask on the substrate, and a deposition apparatus using the same.

The chuck according to the embodiment of the present invention includes: a main body; an electrostatic layer installed on one side of the main body and supporting a substrate close to one side of the main body by electrostatic force; And an electromagnet inserted into a plurality of interiors of the main body, and having a pattern of a deposition film to be deposited on the substrate, and supporting a mask on which the magnetic body is installed on the substrate supported by the electrostatic layer by magnetic force.

The main body may further include a heating member for heating the substrate supported by the electrostatic layer.

The main body may have a cooling tunnel formed on one side of the main body to cool the substrate and provide a circulation path of a refrigerant for curing the deposited film.

The mask is provided coupled to the mask frame to the edge portion, the plurality of the electromagnet, a plurality of first electromagnet disposed in a position corresponding to the central portion of the mask; And a plurality of second electromagnets disposed at a position corresponding to the edge portion of the mask.

The first electromagnet and the second electromagnet, the strength of the magnetic force can be adjusted independently of each other.

On the other hand, the deposition apparatus according to an embodiment of the present invention, a chamber for providing a processing space for forming a deposition film on a substrate according to the pattern of the mask; a source supply unit for vaporizing a deposit, and spraying the vaporized deposit to the processing space A chuck positioned in the processing space and supporting the substrate by electrostatic force and laminating and supporting the mask by magnetic force on the substrate supported by electrostatic force.

The chuck may include a main body; an electrostatic layer installed on one side of the main body and supporting a substrate proximate one side of the main body by electrostatic force; And an electromagnet inserted into and installed in the main body, the electromagnet configured to closely support a mask on which the pattern of the deposition film to be deposited on the substrate is formed and the magnetic body is installed on the substrate supported by the electrostatic layer by magnetic force. .

The chuck and the deposition apparatus using the same according to the embodiment of the present invention support the substrate by maintaining the flatness of the substrate, and closely support the mask on the substrate, so that the alignment between the substrate and the mask is possible, and precise alignment is possible. This has the effect of reducing the number of attempts.

In addition, due to the precise alignment between the substrate and the mask, there is an effect to obtain a high-quality deposition film.

Hereinafter, a chuck according to an embodiment of the present invention and a deposition apparatus using the same will be described in detail with reference to the accompanying drawings.

In the following description of the present invention, the terms defined are defined in consideration of functions in the present invention, and should not be understood as a meaning of limiting the technical components of the present invention.

1 is a schematic view showing a deposition apparatus according to an embodiment of the present invention. Referring to FIG. 1, the deposition apparatus 100 includes a chamber 110, a source supply unit 130, a substrate raising unit 150, a mask raising unit 170, an alignment unit 190, and a chuck 200. .

The chamber 110 provides a processing space 111 for depositing a deposit such as an organic material on the substrate S therein. A photographing window 113 is formed on the upper portion of the chamber 110 to illuminate the processing space 111, and a camera 115 for measuring the alignment state of the substrate S and the mask M is disposed above the photographing window 113. ) Is provided.

Here, the first alignment mark Sa and the second alignment mark Ma are formed on the substrate S and the mask M, respectively, and are carried into the processing space 111. The camera 115 photographs the first alignment mark Sa and the second alignment mark Ma through the photographing window 113, thereby measuring the alignment state of the substrate S and the mask M. FIG.

The substrate lifting part receiving the substrate S and the mask M carried into the processing space 111 and guiding the substrate S and the mask M to the chuck 200 at the upper portion of the chamber 110 ( 150 and a mask lift unit 170 are provided. The substrate lifting unit 150 and the mask lifting unit 170 include a substrate clamp 151 and a mask clamp 171 that pass through the chamber 110, and the substrate clamp 151 and the mask clamp 171 may be provided. A substrate raising and lowering pump 153 and a mask raising and lowering pump 173 are provided.

The substrate clamp 151 and the mask clamp 171 are arranged such that the substrate clamp 151 supports the center of each side of the substrate S, and the mask clamp 171 supports each corner of the mask M, It is preferable that the lifting of the substrate S and the mask M does not interfere with each other.

In addition, an upper part of the chamber 110 is provided with an alignment unit 190 for performing alignment between the substrate S and the mask M according to the photographing result of the camera 115. The alignment unit 190 adjusts the planar position of the mask M with respect to the substrate S by moving the alignment plate 191 to which the mask lifting unit 170 is fixed and the alignment plate 191 in plane. 193 is provided. At this time, each mask lift pump 173 by adjusting the lifting distance of each mask clamp 171, it is possible to adjust the distance between the substrate (S) and the mask (M).

The source supply unit 130 includes a shower head 131 which vaporizes the deposit and supplies the vaporized deposit to the processing space 111 and sprays the vaporized deposit toward the upper portion of the processing space 111.

Meanwhile, the chuck 200 has a through hole 201 communicating with the imaging hole 113 and is disposed above the processing space 211.

Figure 2 is an exploded perspective view showing a coupling relationship of the chuck used in the deposition apparatus according to an embodiment of the present invention, Figure 3 is a perspective view showing a part of the chuck used in the deposition apparatus according to an embodiment of the present invention, Figure 4 2 is a cross-sectional view of the chuck used in the deposition apparatus according to the embodiment of the present invention, taken along line II ′ of FIG. 2.

2 to 4, the chuck 200 includes a main body 210, an electromagnet 230, and an electrostatic layer 250. The main body 210 has a housing shape in which a seating groove 211 into which the electromagnet 230 is inserted is formed, and after the electromagnet 230 is installed, the main body 210 includes a first cover 213 for sealing the inside.

The electromagnet 230 is provided in plurality, and is inserted into the seating groove 211 and installed. At this time, the electromagnet 230 is coupled to the fixed plate 231 to which the electromagnet 230 is fixed according to the placement of the seating groove 211, and is installed on the main body 210 by coupling the fixed plate 231 to the main body 210. . The fixing plate 231 eliminates the hassle of individually inserting the electromagnet 230 into the seating groove 211, thereby providing convenience of assembly of the chuck 200.

Here, although not shown, the mask M may be provided with a metal piece or a magnet embedded therein so that the mask M may be attached to the mask M by a magnetic force generated by the electromagnet 230. In addition, before the mask M is attached to the chuck 200, the mask M is coupled to a metal mask frame Mb that supports the edge of the mask M, and the mask clamp 171 supports the mask frame Mb. This supports the mask M. (See FIG. 1).

Therefore, it is preferable that the plurality of electromagnets 230 are provided to differentially apply magnetic force to the center portion and the edge portion of the mask M. As shown in FIG. That is, the electromagnet 230 is divided into a first electromagnet 230a disposed at a position corresponding to the center portion of the mask M, and a second electromagnet 230b disposed at a position corresponding to the edge portion of the mask M. FIG. Can be.

The first electromagnet 230a is formed in a bar shape and disposed at the center of the main body 210, and the second electromagnet 230b is formed in a coin shape and disposed at the edge of the main body 210. In this case, since the second electromagnet 230b provides the magnetic force to the mask frame Mb, and the first electromagnet 230a provides the magnetic force to the mask M, the magnetic force of the second electromagnet 230b is the first electromagnet ( It is preferable to form larger than the magnetic force of 230a).

At this time, by adjusting the amount of current provided to the first electromagnet 230a and the amount of current provided to the second electromagnet 230b, the strengths of the magnetic forces of the first electromagnet 230a and the second electromagnet 230b may be independently adjusted. Can be.

The electrostatic layer 250 has a flat surface with respect to the substrate S, and is installed on the outer wall of the main body 210 facing the shower head 131. The electrostatic layer 250 attaches the substrate S by using static electricity. That is, as the electrostatic layer 250 applies '+' and '-' to the electrostatic layer 250, the '-' and '+' potentials are charged to the substrate S, thereby charging the substrate S. The board | substrate S is attached using what generate | occur | produces a pulling force.

As such, the chuck 200 attaches the substrate S from the substrate clamp 151 and attaches the mask M from the mask clamp 171 so that the mask M faces the showerhead 131. The substrate S and the mask M are supported together.

On the other hand, if the mobility of the deposit on the substrate (S) is not free to move, a porous pillar including an empty space between the deposition film may be formed. Due to the influence of the porous column, the density of the deposited film is lower than that of the mass material. In addition, the adhesion force is reduced by moisture, heat, etc., and cause cracking, which results in a decrease in durability to the external environment, resulting in a shortened lifespan.

Accordingly, a heating member 270 is provided inside the main body 210 toward the shower head 131 to heat the substrate S in order to free the movement of the deposit on the substrate S. The heating member 270 may be configured as a hot wire coil.

In addition, a cooling tunnel 290 is provided inside the main body 210 toward the shower head 131 to provide a circulation path of a refrigerant for cooling the substrate S to cure the deposit. The cooling tunnel 290 forms a groove on the surface of the main body 210 facing the shower head 131, and seals the second cover 215 provided in the main body 210.

At this time, the cooling method of the deposit may be used by any one of air-cooled and water-cooled. If a water-cooled cooling method is used as the method of cooling the deposit, a separate tube (not shown) is preferably installed in the cooling tunnel to provide a circulation path of the refrigerant.

Hereinafter, with reference to the accompanying drawings for the operation of the deposition apparatus according to an embodiment of the present invention will be described in detail. Each element mentioned below should be understood with reference to the above description and drawings.

5a to 5c is an operation diagram showing an operating state of the deposition apparatus according to an embodiment of the present invention.

First, referring to FIG. 5A, the substrate S and the mask M are carried into the processing space 111, the substrate S is received by the substrate clamp 151, and the mask M is the mask clamp 171. Are received). In this case, the mask M is coupled to the mask frame Mb and brought into the processing space 111.

Referring to FIG. 5B, the substrate lifting unit 150 raises the substrate clamp 151 to the chuck 200 to bring the substrate S closer to the chuck 200. When the substrate S is close to the chuck, '+' and '-' are applied to the electrostatic layer 250, and '-' and '+' potentials are charged to the substrate S. Accordingly, the substrate S is attached to the electrostatic layer 250. Since the electrostatic layer 250 has a flat surface with respect to the substrate S, the substrate S is attached to the electrostatic layer 250 while maintaining flatness.

Referring to FIG. 5C, when the substrate S is attached to the electrostatic layer 250, the mask lifting unit 170 raises the mask clamp 171 to the chuck 200, thereby raising the mask M to the substrate S. Close to At this time, the camera 115 measures the alignment state of the substrate S and the mask M. That is, the camera 115 photographs the first alignment mark Sa and the second alignment mark Ma through the photographing hole 113 and the through hole 201.

According to the photographing result of the camera 115, the alignment unit 190 moves the alignment plate 191 to adjust the plane position of the mask M relative to the substrate S, and the mask lift pump 173 The distance between the substrate S and the mask M is adjusted by individually adjusting the rising distance of each mask clamp 171.

When the alignment of the substrate S and the mask M is performed, a current is supplied to the electromagnet 230. As the current is supplied, a magnetic force is generated from the electromagnet 230, and the mask M is stacked on the substrate S.

In this case, since the second electromagnet 230b is disposed at a position corresponding to the mask frame Mb, a larger magnetic force than the first electromagnet 230a is used to attach the mask frame Mb coupled to the mask M together. in need. Therefore, the amount of current supplied to the second electromagnet 230b is greater than the amount of current supplied to the first electromagnet 230a.

As such, by supplying the amount of current supplied to the second electromagnet 230b to be greater than the amount of current supplied to the first electromagnet 230a, the flatness of the mask M is maintained and the mask M on the substrate S is maintained. Can be laminated.

When the substrate S is attached to the electrostatic layer 250 and the mask M is stacked on the substrate S, the source supply unit 130 vaporizes the deposit, and deposits the deposit through the showerhead 131. S) to the side. At this time, the substrate S is preferably heated so that the vaporized deposit can be moved freely on the substrate (S).

When the deposit is deposited on the substrate S according to the pattern of the mask M, the coolant is supplied to the cooling tunnel 290. When the refrigerant circulates along the cooling tunnel 290, the deposit deposited on the substrate S is cured to complete the deposited film.

Although described in detail with respect to preferred embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims Various modifications may be made to the invention. Therefore, changes in the future embodiments of the present invention will not be able to escape the technology of the present invention.

1 is a simplified view showing a deposition apparatus according to an embodiment of the present invention.

Figure 2 is an exploded perspective view showing a coupling relationship of the chuck used in the deposition apparatus according to the embodiment of the present invention.

3 is a perspective view showing a part of the chuck used in the deposition apparatus according to the embodiment of the present invention.

FIG. 4 is a cross-sectional view of the chuck used in the deposition apparatus according to the embodiment of the present invention based on the line II ′ of FIG. 2.

5a to 5c is an operation diagram showing an operating state of the deposition apparatus according to an embodiment of the present invention.

<Description of Signs of Major Parts of Drawings>

100: deposition apparatus 200: chuck

210: body 230: electromagnet

250: electrostatic layer

Claims (7)

main body; An electrostatic layer installed on one side of the main body and supporting the substrate close to one side of the main body by electrostatic force; and A plurality of electromagnets inserted into and installed in the main body, and having a pattern of a deposition film to be deposited on the substrate, and supporting a mask on which the magnetic body is installed on the substrate supported by the electrostatic layer by magnetic force; Pretend to be. The method of claim 1, wherein the main body, And a heating member for heating the substrate supported by the electrostatic layer. The method of claim 2, wherein the main body, And a cooling tunnel formed on one side of the main body to cool the substrate and provide a circulation path of a refrigerant for curing the deposited film. According to claim 1, The mask is provided coupled to the mask frame on the edge portion, A plurality of the electromagnets, A plurality of first electromagnets disposed at positions corresponding to central portions of the mask; and And a plurality of second electromagnets disposed at a position corresponding to the edge portion of the mask. The method of claim 4, wherein the first electromagnet and the second electromagnet, Chuck, characterized in that the strength of the magnetic force is independently controlled. A chamber providing a processing space for forming a deposition film on a substrate according to a pattern of a mask; A source supply unit for vaporizing a deposit and spraying the vaporized deposit into the processing space; And a chuck positioned in the processing space and supporting the substrate by electrostatic force and laminating and supporting the mask by magnetic force on the substrate supported by electrostatic force. The method of claim 6, wherein the chuck, main body; An electrostatic layer installed on one side of the main body and supporting the substrate close to one side of the main body by electrostatic force; and A plurality of electromagnets inserted into and installed in the main body, and having a pattern of a deposition film to be deposited on the substrate, and supporting a mask on which the magnetic body is installed on the substrate supported by the electrostatic layer by magnetic force; Vapor deposition apparatus.

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