KR20090097897A - 광원 - Google Patents

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Publication number
KR20090097897A
KR20090097897A KR1020097013257A KR20097013257A KR20090097897A KR 20090097897 A KR20090097897 A KR 20090097897A KR 1020097013257 A KR1020097013257 A KR 1020097013257A KR 20097013257 A KR20097013257 A KR 20097013257A KR 20090097897 A KR20090097897 A KR 20090097897A
Authority
KR
South Korea
Prior art keywords
sealing member
substrate
light emitting
phosphor
light source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020097013257A
Other languages
English (en)
Korean (ko)
Inventor
사토시 시다
히로유키 나이토
다카아리 우에모토
Original Assignee
파나소닉 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파나소닉 주식회사 filed Critical 파나소닉 주식회사
Publication of KR20090097897A publication Critical patent/KR20090097897A/ko
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
KR1020097013257A 2007-01-11 2008-01-10 광원 Withdrawn KR20090097897A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-003881 2007-01-11
JP2007003881 2007-01-11

Publications (1)

Publication Number Publication Date
KR20090097897A true KR20090097897A (ko) 2009-09-16

Family

ID=39387265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097013257A Withdrawn KR20090097897A (ko) 2007-01-11 2008-01-10 광원

Country Status (7)

Country Link
US (1) US8410501B2 (enExample)
EP (1) EP2104797B1 (enExample)
JP (1) JP5296690B2 (enExample)
KR (1) KR20090097897A (enExample)
CN (1) CN101578473B (enExample)
TW (1) TW200837925A (enExample)
WO (1) WO2008084878A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5768435B2 (ja) * 2010-04-16 2015-08-26 日亜化学工業株式会社 発光装置
DE102010033092A1 (de) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
US9373606B2 (en) * 2010-08-30 2016-06-21 Bridgelux, Inc. Light-emitting device array with individual cells
JP2013201355A (ja) * 2012-03-26 2013-10-03 Toshiba Lighting & Technology Corp 発光モジュール及び照明装置
CN103456728B (zh) 2012-05-29 2016-09-21 璨圆光电股份有限公司 发光组件及其发光装置
US10048434B2 (en) * 2012-11-08 2018-08-14 Sharp Kabushiki Kaisha Backlight device and liquid-crystal display device
US9236366B2 (en) 2012-12-20 2016-01-12 Intel Corporation High density organic bridge device and method
TWI706107B (zh) * 2014-04-07 2020-10-01 晶元光電股份有限公司 一種發光裝置之色溫調整方法
CN105655472A (zh) * 2016-02-02 2016-06-08 上海鼎晖科技股份有限公司 一种金属导热柱cob led光源

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100419611B1 (ko) 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP4045781B2 (ja) 2001-08-28 2008-02-13 松下電工株式会社 発光装置
KR100923804B1 (ko) * 2001-09-03 2009-10-27 파나소닉 주식회사 반도체발광소자, 발광장치 및 반도체발광소자의 제조방법
AU2003284756A1 (en) 2003-05-12 2004-11-26 Luxpia Co., Ltd. Tb,b-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same
JP4238693B2 (ja) * 2003-10-17 2009-03-18 豊田合成株式会社 光デバイス
JP2005267927A (ja) * 2004-03-17 2005-09-29 Nichia Chem Ind Ltd 発光装置
JP2005294185A (ja) 2004-04-05 2005-10-20 Nichia Chem Ind Ltd 発光装置
WO2005038935A1 (ja) * 2003-10-15 2005-04-28 Nichia Corporation 発光装置
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
US20050248259A1 (en) * 2004-05-10 2005-11-10 Roger Chang Bent lead light emitting diode device having a heat dispersing capability
CN100380694C (zh) * 2004-12-10 2008-04-09 北京大学 一种倒装led芯片的封装方法
US20060255352A1 (en) 2005-05-11 2006-11-16 Quasar Optoelectronics, Inc. Light emitting diode light source model
JP2009071090A (ja) * 2007-09-14 2009-04-02 Toshiba Lighting & Technology Corp 発光装置

Also Published As

Publication number Publication date
EP2104797A1 (en) 2009-09-30
CN101578473A (zh) 2009-11-11
JP2010516041A (ja) 2010-05-13
US8410501B2 (en) 2013-04-02
CN101578473B (zh) 2013-04-10
TW200837925A (en) 2008-09-16
US20090321772A1 (en) 2009-12-31
EP2104797B1 (en) 2013-07-31
WO2008084878A1 (en) 2008-07-17
JP5296690B2 (ja) 2013-09-25

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090625

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid