CN101578473B - 光源 - Google Patents

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Publication number
CN101578473B
CN101578473B CN2008800020900A CN200880002090A CN101578473B CN 101578473 B CN101578473 B CN 101578473B CN 2008800020900 A CN2008800020900 A CN 2008800020900A CN 200880002090 A CN200880002090 A CN 200880002090A CN 101578473 B CN101578473 B CN 101578473B
Authority
CN
China
Prior art keywords
substrate
light source
seal
semiconductor light
heat carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008800020900A
Other languages
English (en)
Chinese (zh)
Other versions
CN101578473A (zh
Inventor
仕田智
内藤浩幸
植本隆在
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN101578473A publication Critical patent/CN101578473A/zh
Application granted granted Critical
Publication of CN101578473B publication Critical patent/CN101578473B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
CN2008800020900A 2007-01-11 2008-01-10 光源 Expired - Fee Related CN101578473B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP003881/2007 2007-01-11
JP2007003881 2007-01-11
PCT/JP2008/050559 WO2008084878A1 (en) 2007-01-11 2008-01-10 Light source

Publications (2)

Publication Number Publication Date
CN101578473A CN101578473A (zh) 2009-11-11
CN101578473B true CN101578473B (zh) 2013-04-10

Family

ID=39387265

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800020900A Expired - Fee Related CN101578473B (zh) 2007-01-11 2008-01-10 光源

Country Status (7)

Country Link
US (1) US8410501B2 (enExample)
EP (1) EP2104797B1 (enExample)
JP (1) JP5296690B2 (enExample)
KR (1) KR20090097897A (enExample)
CN (1) CN101578473B (enExample)
TW (1) TW200837925A (enExample)
WO (1) WO2008084878A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5768435B2 (ja) * 2010-04-16 2015-08-26 日亜化学工業株式会社 発光装置
DE102010033092A1 (de) 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
US9373606B2 (en) * 2010-08-30 2016-06-21 Bridgelux, Inc. Light-emitting device array with individual cells
JP2013201355A (ja) * 2012-03-26 2013-10-03 Toshiba Lighting & Technology Corp 発光モジュール及び照明装置
CN203277485U (zh) 2012-05-29 2013-11-06 璨圆光电股份有限公司 发光装置、用于形成多方向出光的发光二极管芯片及其蓝宝石基板
US10048434B2 (en) * 2012-11-08 2018-08-14 Sharp Kabushiki Kaisha Backlight device and liquid-crystal display device
US9236366B2 (en) * 2012-12-20 2016-01-12 Intel Corporation High density organic bridge device and method
TWI706107B (zh) * 2014-04-07 2020-10-01 晶元光電股份有限公司 一種發光裝置之色溫調整方法
CN105655472A (zh) * 2016-02-02 2016-06-08 上海鼎晖科技股份有限公司 一种金属导热柱cob led光源
CN116632151A (zh) * 2023-06-12 2023-08-22 中科芯耀照明(广东省)有限公司 光源结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1787242A (zh) * 2004-12-10 2006-06-14 北京大学 一种倒装led芯片的封装方法
EP1681728A1 (en) * 2003-10-15 2006-07-19 Nichia Corporation Light-emitting device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100419611B1 (ko) 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP4045781B2 (ja) 2001-08-28 2008-02-13 松下電工株式会社 発光装置
KR20080087049A (ko) * 2001-09-03 2008-09-29 마츠시타 덴끼 산교 가부시키가이샤 형광체 층, 반도체발광장치, 반도체발광소자의 제조방법
WO2004099342A1 (en) * 2003-05-12 2004-11-18 Luxpia Co., Ltd. Tb,b-based yellow phosphor, its preparation method, and white semiconductor light emitting device incorporating the same
JP4238693B2 (ja) * 2003-10-17 2009-03-18 豊田合成株式会社 光デバイス
JP2005267927A (ja) * 2004-03-17 2005-09-29 Nichia Chem Ind Ltd 発光装置
JP2005294185A (ja) 2004-04-05 2005-10-20 Nichia Chem Ind Ltd 発光装置
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
US20050248259A1 (en) 2004-05-10 2005-11-10 Roger Chang Bent lead light emitting diode device having a heat dispersing capability
US20060255352A1 (en) * 2005-05-11 2006-11-16 Quasar Optoelectronics, Inc. Light emitting diode light source model
JP2009071090A (ja) * 2007-09-14 2009-04-02 Toshiba Lighting & Technology Corp 発光装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1681728A1 (en) * 2003-10-15 2006-07-19 Nichia Corporation Light-emitting device
CN1787242A (zh) * 2004-12-10 2006-06-14 北京大学 一种倒装led芯片的封装方法

Also Published As

Publication number Publication date
JP2010516041A (ja) 2010-05-13
EP2104797B1 (en) 2013-07-31
US8410501B2 (en) 2013-04-02
WO2008084878A1 (en) 2008-07-17
CN101578473A (zh) 2009-11-11
US20090321772A1 (en) 2009-12-31
JP5296690B2 (ja) 2013-09-25
TW200837925A (en) 2008-09-16
EP2104797A1 (en) 2009-09-30
KR20090097897A (ko) 2009-09-16

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C06 Publication
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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130410

Termination date: 20170110

CF01 Termination of patent right due to non-payment of annual fee