KR20090091302A - 나노미립자 충전재를 갖는 연마 용품 및 그 제조 및 사용 방법 - Google Patents
나노미립자 충전재를 갖는 연마 용품 및 그 제조 및 사용 방법 Download PDFInfo
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- KR20090091302A KR20090091302A KR1020097012691A KR20097012691A KR20090091302A KR 20090091302 A KR20090091302 A KR 20090091302A KR 1020097012691 A KR1020097012691 A KR 1020097012691A KR 20097012691 A KR20097012691 A KR 20097012691A KR 20090091302 A KR20090091302 A KR 20090091302A
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- South Korea
- Prior art keywords
- abrasive
- particles
- abrasive article
- matrix material
- inorganic filler
- Prior art date
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- 229920003986 novolac Polymers 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical class O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000375 suspending agent Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000012224 working solution Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US87172006P | 2006-12-22 | 2006-12-22 | |
| US60/871,720 | 2006-12-22 | ||
| US11/671,037 | 2007-02-05 | ||
| US11/671,037 US7497885B2 (en) | 2006-12-22 | 2007-02-05 | Abrasive articles with nanoparticulate fillers and method for making and using them |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20090091302A true KR20090091302A (ko) | 2009-08-27 |
Family
ID=39540892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097012691A Ceased KR20090091302A (ko) | 2006-12-22 | 2007-12-14 | 나노미립자 충전재를 갖는 연마 용품 및 그 제조 및 사용 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7497885B2 (https=) |
| EP (1) | EP2118226A4 (https=) |
| JP (1) | JP2010513050A (https=) |
| KR (1) | KR20090091302A (https=) |
| TW (1) | TW200902233A (https=) |
| WO (1) | WO2008079743A1 (https=) |
Families Citing this family (33)
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| US8287611B2 (en) * | 2005-01-28 | 2012-10-16 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for making same |
| US7591865B2 (en) * | 2005-01-28 | 2009-09-22 | Saint-Gobain Abrasives, Inc. | Method of forming structured abrasive article |
| US8435098B2 (en) * | 2006-01-27 | 2013-05-07 | Saint-Gobain Abrasives, Inc. | Abrasive article with cured backsize layer |
| US8083820B2 (en) * | 2006-12-22 | 2011-12-27 | 3M Innovative Properties Company | Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same |
| JP5351967B2 (ja) * | 2008-08-28 | 2013-11-27 | スリーエム イノベイティブ プロパティズ カンパニー | 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 |
| EP2539416A4 (en) * | 2010-02-24 | 2017-11-29 | Basf Se | Abrasive articles, method for their preparation and method of their use |
| JP2013526777A (ja) | 2010-05-11 | 2013-06-24 | スリーエム イノベイティブ プロパティズ カンパニー | 化学機械平坦化用の界面活性剤を含む固定研磨パッド |
| DE102010042040A1 (de) | 2010-10-06 | 2012-04-12 | Siltronic Ag | Verfahren zum Schleifen einer Halbleiterscheibe |
| JP2012182314A (ja) * | 2011-03-01 | 2012-09-20 | Jsr Corp | 組成物および化学機械研磨パッド、ならびに化学機械研磨方法 |
| JP2013092748A (ja) | 2011-10-26 | 2013-05-16 | Cabot Corp | 複合体粒子を含むトナー添加剤 |
| US9353313B2 (en) | 2012-08-09 | 2016-05-31 | Auburn University | Microdevices and methods of manufacture |
| WO2015095154A1 (en) | 2013-12-20 | 2015-06-25 | Cabot Corporation | Metal oxide-polymer composite particles for chemical mechanical planarization |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| KR20240015167A (ko) | 2014-10-17 | 2024-02-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성 |
| US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| JP6940495B2 (ja) | 2015-10-30 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| KR102629800B1 (ko) | 2016-01-19 | 2024-01-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 화학적 기계적 연마 패드들 |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
| US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| KR102410612B1 (ko) * | 2020-08-24 | 2022-06-20 | 에스케이씨솔믹스 주식회사 | 연마패드 및 이를 이용한 반도체 소자의 제조방법 |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| US12138737B2 (en) * | 2021-03-31 | 2024-11-12 | Rohm and Haas Electronic Materials Holdings, Inc. | CMP polishing pad with enhanced rate |
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| US4623364A (en) | 1984-03-23 | 1986-11-18 | Norton Company | Abrasive material and method for preparing the same |
| CA1254238A (en) | 1985-04-30 | 1989-05-16 | Alvin P. Gerk | Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products |
| US4623384A (en) * | 1985-06-03 | 1986-11-18 | Stauffer Chemical Co. | Benzylacrylaryl amide herbicidal compounds and methods of use |
| US4770671A (en) | 1985-12-30 | 1988-09-13 | Minnesota Mining And Manufacturing Company | Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith |
| US4881951A (en) | 1987-05-27 | 1989-11-21 | Minnesota Mining And Manufacturing Co. | Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith |
| CH675250A5 (https=) * | 1988-06-17 | 1990-09-14 | Lonza Ag | |
| US5014468A (en) | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
| US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| US5736371A (en) * | 1991-06-04 | 1998-04-07 | A Et S Biovecteurs | Biodegradable particulate vector for transporting molecules having biological activity |
| US6258137B1 (en) | 1992-02-05 | 2001-07-10 | Saint-Gobain Industrial Ceramics, Inc. | CMP products |
| RU2124978C1 (ru) | 1993-09-13 | 1999-01-20 | Миннесота Майнинг Энд Мэнюфекчуринг Компани | Абразивное изделие, способ его производства, способ его использования для чистовой обработки и рабочий инструмент для его производства |
| US5391210A (en) | 1993-12-16 | 1995-02-21 | Minnesota Mining And Manufacturing Company | Abrasive article |
| KR970701118A (ko) | 1994-02-22 | 1997-03-17 | 로저 로이 템트 | 연마 물품, 이의 제조 방법 및 이를 표면 마무리용으로서 사용하는 방법(abrasive article, a method of making same, and a method of using same for finishing) |
| US5958794A (en) | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
| US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US5876268A (en) * | 1997-01-03 | 1999-03-02 | Minnesota Mining And Manufacturing Company | Method and article for the production of optical quality surfaces on glass |
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| US5942015A (en) | 1997-09-16 | 1999-08-24 | 3M Innovative Properties Company | Abrasive slurries and abrasive articles comprising multiple abrasive particle grades |
| TW512170B (en) | 1998-07-24 | 2002-12-01 | Ibm | Aqueous slurry composition and method for polishing a surface using the same |
| US6287353B1 (en) * | 1999-09-28 | 2001-09-11 | 3M Innovative Properties Company | Abrasive grain, abrasive articles, and methods of making and using the same |
| KR100793459B1 (ko) * | 2000-09-08 | 2008-01-14 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 연마 시트, 이의 제조 방법 및 섬유 광학 커넥터의 연마방법 |
| US6551366B1 (en) | 2000-11-10 | 2003-04-22 | 3M Innovative Properties Company | Spray drying methods of making agglomerate abrasive grains and abrasive articles |
| US6645624B2 (en) | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
| US6755721B2 (en) | 2002-02-22 | 2004-06-29 | Saint-Gobain Ceramics And Plastics, Inc. | Chemical mechanical polishing of nickel phosphorous alloys |
| US6802878B1 (en) * | 2003-04-17 | 2004-10-12 | 3M Innovative Properties Company | Abrasive particles, abrasive articles, and methods of making and using the same |
| CN1789365A (zh) * | 2004-12-16 | 2006-06-21 | 鸿富锦精密工业（深圳）有限公司 | 抛光磨料及其制造方法 |
| US7591865B2 (en) * | 2005-01-28 | 2009-09-22 | Saint-Gobain Abrasives, Inc. | Method of forming structured abrasive article |
| NZ562513A (en) * | 2005-04-14 | 2010-10-29 | Saint Gobain Abrasives Inc | Forming structured abrasive article by partially curing a binder through exposure to actinic radiation and forming a pattern in binder |
-
2007
- 2007-02-05 US US11/671,037 patent/US7497885B2/en not_active Expired - Fee Related
- 2007-12-14 EP EP07865705.3A patent/EP2118226A4/en not_active Withdrawn
- 2007-12-14 WO PCT/US2007/087598 patent/WO2008079743A1/en not_active Ceased
- 2007-12-14 KR KR1020097012691A patent/KR20090091302A/ko not_active Ceased
- 2007-12-14 JP JP2009543104A patent/JP2010513050A/ja active Pending
- 2007-12-21 TW TW096149593A patent/TW200902233A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US7497885B2 (en) | 2009-03-03 |
| US20080148651A1 (en) | 2008-06-26 |
| WO2008079743A1 (en) | 2008-07-03 |
| EP2118226A1 (en) | 2009-11-18 |
| TW200902233A (en) | 2009-01-16 |
| JP2010513050A (ja) | 2010-04-30 |
| EP2118226A4 (en) | 2013-07-17 |
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