KR20090087961A - 복합 유기 봉지재 - Google Patents
복합 유기 봉지재 Download PDFInfo
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- KR20090087961A KR20090087961A KR1020097014419A KR20097014419A KR20090087961A KR 20090087961 A KR20090087961 A KR 20090087961A KR 1020097014419 A KR1020097014419 A KR 1020097014419A KR 20097014419 A KR20097014419 A KR 20097014419A KR 20090087961 A KR20090087961 A KR 20090087961A
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- South Korea
- Prior art keywords
- encapsulant
- layer
- organic
- composition
- capacitor
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Images
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Paints Or Removers (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (12)
- 하나 이상의 내장형 포일상 형성(formed-on-foil) 세라믹 커패시터를 코팅하기 위한 유기 2-층 봉지재 조성물로서, 상기 2-층 봉지재는 제1 봉지재 층 및 제2 봉지재 층을 포함하고, 상기 제1 봉지재 층은 (a) 폴리이미드를 포함하고, 상기 제2 봉지재 층은 (c) 에폭시-함유 환형 올레핀 수지, (d) 페놀계 수지, (e) 에폭시 촉매를 포함하고, 상기 내장형 포일상 형성 세라믹 커패시터는 커패시터 소자 및 프리프레그(prepreg)를 포함하고, 상기 제1 봉지재 층은 상기 커패시터 소자와 직접 접촉하고 상기 제2 봉지재 층은 상기 제1 봉지재 층과 직접 접촉하는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 제1 봉지재 층은 수분 흡수율이 2% 이하이고 유리 전이 온도가 280℃ 초과인 폴리이미드를 포함하는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 제2 봉지재 층은 수분 흡수율이 2% 이하인 에폭시-함유 환형 올레핀 수지를 포함하는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 제2 봉지재 층은 수분 흡수율이 2% 미만인 페놀계 수지; 에폭시 촉매; 선택적으로 하나 이상의 전기적으로 절연된 충전제, 소포제 및 착색제와 하나 이상의 유기 용매를 포함하는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 제1 봉지재 층은 전기적으로 절연된 충전제, 소포제, 착색제, 에폭시 수지 및 그 혼합물로 이루어진 군으로부터 선택된 하나 이상의 선택적인 성분을 추가로 포함하는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 봉지재 조성물이 경화되어 2-층 유기 봉지재를 형성하고 농도가 최대 30%인 황산 또는 수산화나트륨에 침지될 때 상기 경화된 2-층 유기 봉지재가 커패시터에 대한 보호를 제공하는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 봉지재 조성물이 경화되어 2-층 유기 봉지재를 형성하고 경화된 2-층 유기 봉지재가 상승된 온도, 습도 및 DC 바이어스의 가속 수명 시험에서 커패시터에 대한 보호를 제공하는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 내장형 커패시터의 상부 및 저부 전극을 분리하는 에칭된 트렌치를 채우는 데 사용되는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 봉지재 조성물이 경화되어 경화된 유기 봉지재를 형성하고 수분 흡수율이 1% 이하인 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 190℃ 이하의 온도에서 경화될 수 있는 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 상기 봉지재가 경화되어 경화된 유기 봉지재를 형성하고 커패시터 및 커패시터 위의 프리프레그에 대한 상기 봉지재의 접착성이 3.5 N/㎝ (2 lb의 힘/인치) 초과인 유기 2-층 봉지재 조성물.
- 제1항에 있어서, 봉지된 내장형 포일상 경화(cured-on-foil) 커패시터를 포함하는 회로 보드가 승온 열주기 동안 층분리되지 않는 유기 2-층 봉지재 조성물.
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US87459806P | 2006-12-12 | 2006-12-12 | |
US60/874,598 | 2006-12-12 | ||
PCT/US2007/025296 WO2008073409A2 (en) | 2006-12-12 | 2007-12-11 | Composite organic encapsulants |
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KR20090087961A true KR20090087961A (ko) | 2009-08-18 |
KR101321198B1 KR101321198B1 (ko) | 2013-10-23 |
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US (1) | US8233261B2 (ko) |
EP (1) | EP2092807B1 (ko) |
JP (1) | JP2010512663A (ko) |
KR (1) | KR101321198B1 (ko) |
CN (1) | CN101617573A (ko) |
TW (1) | TWI418266B (ko) |
WO (1) | WO2008073409A2 (ko) |
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US10304630B2 (en) | 2014-07-28 | 2019-05-28 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method therefor |
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TW200839811A (en) * | 2006-12-12 | 2008-10-01 | Du Pont | Crystalline encapsulants |
DE102007028238A1 (de) | 2007-06-20 | 2008-12-24 | Osram Opto Semiconductors Gmbh | Verwendung eines Metallkomplexes als p-Dotand für ein organisches halbleitendes Matrixmaterial, organisches Halbleitermaterial und organische Leuchtdiode |
US8728568B2 (en) | 2012-01-16 | 2014-05-20 | Itron, Inc. | Method for encapsulation of electronics received in water meter pits with an improved wax-based encapsulant/moisture barrier |
US8481626B1 (en) | 2012-01-16 | 2013-07-09 | Itron, Inc. | Wax-based encapsulant/moisture barrier for use with electronics received in water meter pits |
US9076724B1 (en) * | 2013-09-26 | 2015-07-07 | Stats Chippac Ltd. | Integrated circuit system with debonding adhesive and method of manufacture thereof |
US10446414B2 (en) | 2017-12-22 | 2019-10-15 | Texas Instruments Incorporated | Semiconductor package with filler particles in a mold compound |
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US4323948A (en) * | 1977-12-05 | 1982-04-06 | Westinghouse Electric Corp. | Capacitor structures with improved electrical stress capability |
KR20000052823A (ko) * | 1996-10-29 | 2000-08-25 | 나카노 카쯔히코 | 변성 열가소성 노르보르넨계 중합체 및 그 제조방법 |
US6317023B1 (en) * | 1999-10-15 | 2001-11-13 | E. I. Du Pont De Nemours And Company | Method to embed passive components |
US6860000B2 (en) * | 2002-02-15 | 2005-03-01 | E.I. Du Pont De Nemours And Company | Method to embed thick film components |
US7029971B2 (en) * | 2003-07-17 | 2006-04-18 | E. I. Du Pont De Nemours And Company | Thin film dielectrics for capacitors and methods of making thereof |
US20050154105A1 (en) * | 2004-01-09 | 2005-07-14 | Summers John D. | Compositions with polymers for advanced materials |
US7348373B2 (en) | 2004-01-09 | 2008-03-25 | E.I. Du Pont De Nemours And Company | Polyimide compositions having resistance to water sorption, and methods relating thereto |
US7100277B2 (en) | 2004-07-01 | 2006-09-05 | E. I. Du Pont De Nemours And Company | Methods of forming printed circuit boards having embedded thick film capacitors |
US20070291440A1 (en) * | 2006-06-15 | 2007-12-20 | Dueber Thomas E | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components |
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2007
- 2007-12-11 US US12/514,822 patent/US8233261B2/en active Active
- 2007-12-11 JP JP2009541342A patent/JP2010512663A/ja active Pending
- 2007-12-11 CN CN200780043719A patent/CN101617573A/zh active Pending
- 2007-12-11 KR KR1020097014419A patent/KR101321198B1/ko active IP Right Grant
- 2007-12-11 EP EP07862748.6A patent/EP2092807B1/en active Active
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US10304630B2 (en) | 2014-07-28 | 2019-05-28 | Murata Manufacturing Co., Ltd. | Ceramic electronic component and manufacturing method therefor |
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JP2010512663A (ja) | 2010-04-22 |
WO2008073409A2 (en) | 2008-06-19 |
US8233261B2 (en) | 2012-07-31 |
TW200850088A (en) | 2008-12-16 |
WO2008073409A3 (en) | 2008-09-12 |
EP2092807A2 (en) | 2009-08-26 |
EP2092807B1 (en) | 2013-04-17 |
US20100067168A1 (en) | 2010-03-18 |
TWI418266B (zh) | 2013-12-01 |
KR101321198B1 (ko) | 2013-10-23 |
CN101617573A (zh) | 2009-12-30 |
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