KR20090083255A - Substrate transfer apparatus - Google Patents

Abstract

A substrate transfer apparatus is provided to facilitate a chamber for processing the plural sheets of wafer. Two or more rotation plate arms(121,122,123) for loading loads all kinds of wafer. Two or more rotation plate arms(124,125,126) for unloading unloads the processed wafer. The axis member consists of the dual tube structure of the first and second rotations. The rotation angle control member(160) connects the rotation plate arms for unloading and unloading with the first and second rotation axis in order to be rotated in different radius.

Description

Substrate transfer device {SUBSTRATE TRANSFER APPARATUS}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate transfer apparatus that can improve productivity by saving a substrate transfer time by loading / unloading a plurality of substrates into a process chamber continuously.

In recent years, a substrate processing facility for manufacturing a liquid crystal display device, a plasma display device, and semiconductor devices has generally been adopted a cluster system capable of processing a plurality of substrates consistently.

In general, a cluster system refers to a multi-chamber substrate processing system that includes a transfer robot (or handler) and a plurality of substrate processing modules disposed around the robot.

The cluster system includes a transfer chamber and a transfer robot provided with a free rotation in the transfer chamber. Each side of the transfer chamber is equipped with a process chamber for carrying out a substrate processing process. Such a cluster system increases substrate throughput by allowing a plurality of substrates to be processed simultaneously or a plurality of processes can be performed continuously. Another effort to increase the substrate throughput is to process a plurality of substrates simultaneously in one process chamber to increase the substrate throughput per hour.

However, even if the process chamber processes a plurality of substrates simultaneously (or continuously), time loss occurs when the substrates before and after the process are not efficiently exchanged in the process chamber.

In addition, in the case of a conventional cluster system, when forming a hexagonal conveying chamber (basically composed of four process chambers and two load lock chambers), not only the area of the entire plant but also the manufacturing is due to the area occupied by the conveying chamber. The equipment width, which is important in the arrangement of equipment in the line, is increased more than necessary, and the size of the vacuum equipment required to keep the conveying chamber in a vacuum state is increased, thereby increasing the equipment cost and installation cost. In addition, the area of such a conveyance chamber is further weighted as the number of process chambers installed is increased.

Therefore, there is a demand for a substrate transfer apparatus capable of simultaneously and / or continuously processing a plurality of substrates in a process chamber for processing a plurality of substrates, and for exchanging substrates before and after the treatment more efficiently.

An object of the present invention is to provide a substrate transfer device having a structure capable of transferring a substrate efficiently.

Moreover, an object of this invention is to provide the board | substrate conveying apparatus which can improve productivity by reducing the conveyance time of a board | substrate.

Moreover, an object of this invention is to provide the board | substrate conveying apparatus which has a small installation area.

It is also an object of the present invention to provide a substrate transfer apparatus having a structure in which the rotating plate arms can be sequentially unfolded or folded.

According to an aspect of the present invention, there is provided a substrate transfer apparatus for transferring multiple substrates, the driving unit providing a rotation force; A rotating shaft connected to the driving unit; Rotating plate arms rotated by the rotating shaft; And rotation angle adjustment members respectively connecting the rotation plate arms to the rotation shaft such that the rotation plate arms are rotated at different rotation radii through a predetermined angle.

According to an embodiment of the present invention, the rotation angle adjusting member is key coupled to the rotating shaft and having a fixing pin; And a guide groove provided on the rotating plate arm and having the fixing pin fitted therein and varying the rotation angle according to the rotating radius of the rotating plate arm.

According to an embodiment of the present invention, the substrate transfer apparatus further includes a support member supporting the rotating plate arms rotated by the rotation angle adjusting member.

According to an embodiment of the present invention, the rotating plate arm further includes a rotating end having an arc-shaped auxiliary guide groove supported on the support member and corresponding to the rotation angle, wherein the supporting member is fitted into the auxiliary guide groove. It further comprises a stopper for limiting the rotation angle of the rotating plate arm rotated by the rotation angle adjusting member.

According to an embodiment of the present invention, the support member further includes a guide groove in which the fixing pin of the connecting body is positioned and guides the rotation of the connecting body by the maximum rotation angle of the rotating shaft.

According to an embodiment of the present invention, the rotating plate arm is supported by the support member and has a shaft hole through which the rotating shaft passes.

Substrate transport apparatus for multi-substrate transfer according to the present invention includes two or more loading rotating plate arm for loading the substrate before processing and having a different radius of rotation and unfolded and folded in a fan shape; Two or more unloading rotating plate arms which unload the substrate after processing and which are unfolded and folded in a fan shape with different turning radii; A shaft member in which the loading rotating plate arm and the loading rotating plate arm are connected in multiple stages, each of which has a first and second rotating shafts having a double tube structure; And rotation angle adjusting members connecting the first and second rotation shafts and the loading / unloading rotation plate arms to rotate the loading / unloading rotation rotation plate arms at different rotation radii through a predetermined angle. Include.

According to an embodiment of the present invention, each of the loading rotating plate arm and the unloading rotating plate arm includes a rotating end having a shaft hole into which the shaft portion is inserted, and each of the rotating angle adjusting members has the shaft portion. It includes a connector coupled to the key plate and inserted into the guide groove formed in the rotary end so that the corresponding rotating plate arm is rotated by a predetermined rotational angle.

According to an embodiment of the present invention, the substrate transfer apparatus further includes a support member for supporting the rotating end of the loading / unloading rotating plate arm.

According to an embodiment of the present invention, the support member further includes a stopper connected to the rotary end to limit the rotation angle of the loading / unloading rotating plate arm rotated by the rotation angle adjusting member.

According to an embodiment of the present invention, the rotary end further includes an auxiliary guide groove into which the stopper is fitted.

According to an embodiment of the invention, the at least two loading rotating plate arms and the at least two unloading rotating plate arms are arranged sequentially or alternately.

 The present invention can quickly perform the substrate exchange before and after the treatment in a substrate processing facility that simultaneously or sequentially processes a plurality of substrates, thereby increasing the throughput of the facility to increase the overall productivity of the substrate. In addition, since a substrate transfer apparatus for simultaneously loading and unloading substrates is provided, it is very easy to implement a process chamber for processing a plurality of substrates. In addition, the present invention can improve the productivity by reducing the transfer time of the substrate.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiment of the present invention may be modified in various forms, the scope of the invention should not be construed as limited to the embodiments described in detail below. This example is provided to those skilled in the art to more fully describe the present invention. Therefore, the shape of the elements in the drawings and the like may be exaggerated to emphasize a more clear description. It should be noted that the same members in each drawing are sometimes shown with the same reference numerals. Detailed descriptions of well-known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention are omitted.

Hereinafter, with reference to the accompanying drawings illustrating a preferred embodiment of the present invention, the substrate transfer apparatus of the present invention and the substrate processing equipment using the same will be described in detail. In addition, in the drawings, the same reference numerals are denoted together for components that perform the same function.

 The basic intention of the present invention is to increase productivity by providing a more efficient substrate exchange method in a substrate processing facility having a plurality of substrate processing capabilities.

1 is a view showing a substrate processing apparatus to which a substrate transfer apparatus according to an embodiment of the present invention is applied. FIG. 2 is a view showing the substrate transfer apparatus shown in FIG. 1. 3 is a cross-sectional view of the substrate transfer apparatus shown in FIG. 1. 4 is a view showing a sensing unit for detecting a rotation angle of the rotating plate arm.

Referring to the drawings, the transfer robot 500 may carry three substrates w in a single operation from a pull placed in a load port (not shown) and carry three arms 510 into the transfer chamber 400. It can be composed of a robot having a structure. That is, the transfer robot 500 can take over three substrates w to the first, second, and third rotation plate arms 121, 122, 123 of the substrate transfer apparatus 100 and the fourth of the substrate transfer robot 100. It has a multi-stage arm structure capable of taking over three substrates w from 5, 6 rotating plate arms 124, 125 and 126. And the transfer robot 500 can be raised and lowered.

The reaction chamber 200 has three susceptors 220, 230, 240 located on the rotation path S of the rotation plate arms 121-126 of the substrate transfer device 100. The reaction chamber 200 has a half arc-shaped inner space 200 in which the first, second and third susceptors 220, 230, and 240 on which the target substrate w is placed are disposed. One side of the reaction chamber 200 (the side in contact with the transfer chamber) has a substrate entrance 210 provided with a slit valve (not shown) for inputting and outputting the substrates w. The first susceptor 220 is positioned closest to the substrate entrance 310 of the reaction chamber 200, and then the third susceptor 230 is located farthest from the second susceptor 230 and the substrate entrance 310. 240 is located. Although not shown, the first, second, and third susceptors 220, 230, and 240 have lift pins for taking over or taking over the substrate w from the substrate transfer device 100, and the first, second, and third susceptors 220, 230, and 240 are provided. The lift pins of are set at different heights for the takeover / takeover of the substrate w. For example, the takeover / takeover height at the first susceptor 220 closest to the substrate entrance 310 is lowest, and then the takeover of the substrate in order of the second susceptor 230 and the third susceptor 240. / Takeover height increases sequentially. The substrate takeover / takeover height set in these susceptors is set to prevent interference and collision in the substrate takeover / takeover process with the substrate transfer device 100. The reaction chamber 200 may include two susceptors 220 and 230 as shown in FIG. 10, and the number of rotating plate arms of the substrate transfer device 100 may also change according to the number of susceptors.

In addition, the reaction chamber 200 may not be disposed only in one direction of the transfer chamber 400, and may be disposed symmetrically on both sides of the transfer chamber 400b as shown in FIGS. 11 to 13. In addition, the number of susceptors can be increased when the reaction chambers having the transfer chamber 400b interposed therebetween are symmetrical with each other. 11 illustrates an example in which one susceptor 220 is provided in each of the reaction chambers 200b-1 and 200b-2, and in FIG. 12, two susceptors (respective to each of the reaction chambers 200c-1 and 200c-2). 220 and 230 are shown, and FIG. 13 shows reaction chambers 200d-1 and 200d-2 provided with three susceptors 220, 230 and 240, respectively. In particular, when three susceptors are provided in each of the reaction chambers as in 13, it is preferable to arrange and operate two substrate transfer apparatuses 100-1 and 100-2 equipped with one six rotating plate arms.

Here, the processing target substrate w is a wafer substrate for manufacturing a semiconductor circuit or a glass substrate for manufacturing a liquid crystal display. Here, the reaction chamber 200 may be configured to perform various substrate processing operations. For example, the reaction chamber may be an ashing chamber that removes the photoresist using plasma to remove the photoresist, and the reaction chamber may be a chemical vapor deposition (CVD) chamber configured to deposit an insulating film. The reaction chamber may be an etch chamber configured to etch apertures or openings in the insulating film to form interconnect structures, the reaction chamber may be a PVD chamber configured to deposit a barrier film, and the reaction chamber may be It may be a PVD chamber configured to deposit a metal film. Multiple processing systems may be required to perform all the processes required for complete fabrication of integrated circuits or chips.

1 and 3, the transfer chamber 400 is located in one side space adjacent to the half arc-shaped reaction chamber 200. The transfer chamber 400 has a substrate entrance 410 for entering and leaving the substrate with the transport robot. The transfer chamber of the present invention is provided in the transfer chamber.

The substrate transfer apparatus 100 is for simultaneously conveying three substrates w in the reaction chamber 200 for processing three substrates w. The substrate transfer apparatus 100 may load and unload three substrates w at a time into the first, second, and third susceptors 220, 230, and 240. In particular, the plurality of susceptors illustrated in the embodiment of the present invention may be used. It has a structure that is very suitable for transferring the substrate w to the reaction chamber.

As shown in FIGS. 2 to 7, the substrate transfer apparatus 100 has a double tube structure shaft member having first and second axes 130 and 140 rotated independently by a driving unit, and rotation of the first and second axes 130 and 140. Rotating plate arms (121-126) for loading / unloading step by step in a fan-shaped form, the support member 110 for supporting the rotating ends of the rotating plate arms and the rotating plate arms (121-126) It has a rotation angle adjusting member 160 for connecting the rotating plate arms (121-126) to the shaft member so as to rotate at different rotation radii through.

First, the rotating plate arms 121-126 are six in total, three are responsible for unloading the substrate (w), and the remaining three are responsible for loading the substrate (w), and the six rotating plate arms 121-126 are used. ) Are installed at different heights on the first and second shafts 130 and 140, and take over three substrates w conveyed by the transfer robot 500 to the first, second and third susceptors 220, 230, and 240. It is unfolded or folded in a fan shape for loading w) and unfolded or folded in a fan shape for unloading the substrates w from the first, second and third susceptors 220, 230 and 240.

In detail, the first, second and third rotation plate arms 121, 122, and 123 positioned at the top are the arms that are responsible for loading the substrate into the first, second, and third susceptors, and the fourth, fifth, and sixth rotations positioned below them. Plate arms 124, 125 and 126 are arms that are responsible for unloading the substrate from the first, second and third susceptors. That is, the first and fourth rotating plate arms 121 and 124 are arms that are responsible for loading / unloading the substrate w into and out of the third susceptor 240, and they have the same first rotating radius P32. . The second and fifth rotating plate arms 122 and 125 are arms that are responsible for loading / unloading the substrate w into and out of the second susceptor 230, and the second and fifth rotating plate arms 122 and 125 are second rotations shorter than the first rotation radius P32. Has a radius P31. The third and sixth rotation plate arms 123 and 126 are arms that are responsible for loading / unloading the substrate w into / from the first susceptor 230, and the third and sixth rotation plate arms 123 and 126 are shorter than the second rotation radius P31. Has a radius P30.

The first, second and third rotating plate arms 121, 122 and 123 and the fourth, fifth and sixth rotating plate arms 124, 125 and 126 are positioned above the respective susceptors 220, 230 and 240 when folded in a fan shape. When aligned, it is aligned perpendicular to one alignment line in the standby position of the transfer chamber 400 (see FIG. 1). Each of the first to sixth rotation plate arms 121-126 has a wide disc shaped circular shear 170 connected to the first and second shafts 130 and 140 at its ends. The rotary end 170 is positioned on the support table 150 of the support member 110.

The first and second shafts 130 and 140 have lower ends 132 and 142 respectively receiving rotational force of the driving unit. Lower ends 132 and 142 of the first and second shafts 130 and 140 are positioned outside the transfer chamber 400 and receive rotational force from the driving unit through power transmission members (not shown), such as belts and pulleys, respectively. . The first shaft 130 is formed to penetrate the inside of the second shaft 140 to rotate the first, second and third rotation plate arms 121, 122, 123 corresponding to the loading, and the second shaft 140 is The first shaft 130 is formed in a tubular shape so as to pass, and is formed to rotate the plate arms 124, 125, and 126 for unloading (fourth to sixth), and is shorter than the first shaft 130. The first and second shafts 130 and 140 are installed through the bottom 102 of the transfer chamber 400, and a support block for supporting the first and second shafts 130 and 140 at the bottom 102 of the bottom of the transfer chamber 400. 112 is installed. The support block 112 has an O-ring 116 for hermetic sealing of the transfer chamber 400. Reference numerals 118 and 144 in FIG. 3 denote bearings and detailed descriptions thereof will be omitted.

The support member 110 is located in the transfer chamber 400 and is composed of six support tables 150 supporting the rotating plate arms 121-126, respectively. An o-ring 114 is installed on the contact surface of the support member 110 and the transfer chamber 400 to maintain the airtightness. The six supporting tables 150 have a rear end connected to one body, and each of the supporting tables 150 has a central passage 152 through which the first and second axes 130 and 140 can pass, and an induction on the upper surface. The groove 151 and the stopper 154 are provided. The induction groove 151 is a portion in which the connecting body 160 of the rotating angle adjusting member is positioned to guide the rotation of the connecting body 160 by the maximum rotation angle P20 of the first and second shafts 1301 and 40. do. The stopper 154 is fitted into the auxiliary guide groove 172 of the rotating plate arm. The support tables 150 are spaced apart from each other, and the rotary end 170 of the rotating plate arms is inserted into the space therebetween. 4 briefly shows a sensing structure for sensing the rotation of the rotating plate arm. That is, the plurality of light receiving sensors k1 are disposed on one surface of the rotating end 170 of the rotating plate arm, and the light emitting sensors k2 reacting with the light receiving sensors are disposed on one surface of the support table 150 so that these sensors are disposed. The control unit may receive a signal to detect whether the rotating plate arm is rotated normally.

The organic coupling relationship between the rotating plate arm, the rotation angle adjusting member, and the support table will be described with reference to FIGS. 5 and 6.

5 and 6 are views for explaining in more detail the organic coupling relationship between the rotation plate arm, the rotation angle adjustment member and the support table. 5 and 6 illustrate, by way of example, a rotation angle adjusting member installed on the first rotating plate arm positioned at the top.

The rotation angle adjusting member includes a connecting body 160 and a guide groove 173 formed in the first rotating plate arm 121. The connector 160 has a key groove 163, and a key 131 is formed on the first shaft 130, so that the connector 160 is key-coupled to the first shaft 130 and the rotary end 170. It has a fixing pin 161 fitted into the guide groove 173 formed in the). The fixing pin 161 is seated in the guide groove 151 of the support table 150. The fixing pin 161 is fitted into the guide groove 173 of the first rotation plate arm 121 to rotate the rotation plate arm 121 according to a preset rotation radius. In other words, the rotational force of the first shaft 130 is transmitted to the first rotation plate arm 121 through the connecting body 160, and the time point of the transmission is changed according to the length of the guide groove 173. First, since the connector 160 is keyed to the first shaft 130, the connector 160 is rotated together with the first shaft 130 to a maximum rotation angle p20. In this embodiment, the connector 160 is shown and described as a separate component coupled to the first shaft 130, but if necessary, the connector 160 is also provided integrally with the first shaft 130. It can be natural. On the other hand, the fixing pin 161 of the connecting body 160 is rotated in the state fitted in the guide groove 173, the longer the length of the guide groove 173, the rotation time of the rotation plate arm 121 is fixed pin 161 ) Is delayed by the time that is moved in the guide groove 173, so that the rotation angle of the rotating plate arm 121 is also small. 5 and 6 have the same rotation radius P32 as the rotation angle p20 of the rotation shaft because the first rotation plate arm 121 is responsible for loading the substrate of the third susceptor 240. Therefore, the first rotation plate arm 121 is rotated in conjunction with the first shaft 130 because the guide groove 173 does not provide a moving space for the fixing pin 161 can move. Meanwhile, an auxiliary guide groove 172 into which the stopper 154 protruding from the support table 150 is inserted is formed at the rotational end 170 of the first rotating plate arm 121. The auxiliary guide groove 172 provides a stopper moving space of the same radius as the rotation radius of the first rotating plate arm 121. When the rotation of the first rotating plate arm 121 is completed, the stopper 154 is caught by the end of the auxiliary guide groove 172. Rotation of the first rotating plate arm 121 is made stable by the fixing pin 161 and the stopper 154.

7 is a view for explaining the rotation radius of the first, second, third rotation plate arms 121, 122, 123, respectively. For reference, the first rotation plate arm 121 has the same rotation radius as the fourth rotation plate arm 124, the second rotation plate arm 122 has the same rotation radius as the fifth rotation plate arm 125. Have The third rotation plate arm 123 has the same rotation radius as the sixth rotation plate arm 126. Therefore, only the first, second and third rotating plate arms will be described in the present embodiment.

The first rotating plate arm 121 illustrated in the upper part of FIG. 7 is a rotating plate arm that is responsible for transferring the substrate of the third susceptor 240, and has the same first rotation angle P20 as that of the first shaft 130. It has a rotation radius (P32), a description thereof will be omitted because it has been described immediately before. Reference numeral P32 denotes the rotation radius of the first rotating plate arm, and P20 denotes the rotation angle of the first axis.

The second rotation plate arm 122 shown in the middle of FIG. 7 is a rotation plate arm that is responsible for transferring the substrate of the second susceptor 230, and its rotation radius is smaller than that of the first rotation plate arm 121. This is because the guide groove 173 provides a free moving space of the fixing pin 161 corresponding to the first angle P21. Therefore, the second rotating plate arm 122 is not rotated while the connector 160 moves to the first angle P21, but the time when the connector 160 crosses the first angle P21 (fixed) The rotation starts from the point where the pin is caught by the end of the guide groove. That is, the rotation radius P31 of the second rotation plate arm 122 corresponds to the free movement space of the fixing pin provided by the guide groove at the first angle P21 at the rotation angle P20 of the first shaft 130. Will be the remaining angle.

Since the stopper movement angle of the auxiliary guide groove 172 of the second rotating plate arm 122 is the same as the rotation radius, the stopper 154 is moved from the auxiliary guide groove 172 of the first rotating plate arm 121. It can be seen that the angle is small. The stopper 154 inserted into the auxiliary guide groove 172 assists the rotation of the second rotating plate arm 122 as well as the stopper 154 is caught by the end of the auxiliary guide groove 172 in the stopped state. Will also have a role to support 170. Reference numeral P31 denotes a rotation radius of the second rotating plate arm, and P21 denotes a rotation range in which the fixing pin is moved in the guide groove.

The third rotating plate arm 123 illustrated below in FIG. 7 is a rotating plate arm that is responsible for transferring the substrate of the first susceptor 220, and its rotation radius is smaller than that of the second rotating plate arm 122. This is because the guide groove 173 provides a free moving space of the fixing pin 161 corresponding to the second angle P22 (corresponding to about twice the first angle). Therefore, the third rotating plate arm 123 is not rotated while the connecting body 160 moves to the second angle P22, but the time when the connecting body 160 crosses the second angle P22 (fixed) The rotation starts from the point where the pin is caught by the end of the guide groove. That is, the rotation radius P30 of the third rotating plate arm 123 is the second angle (corresponding to the free moving space of the fixing pin provided by the guide groove) at the rotation angle P20 of the first shaft 130 (P22). Will be the remaining angle.

As described above, since the stopper moving angle of the auxiliary guide groove 172 of the third rotating plate arm 123 is the same as the rotation radius P30, the stopper moving angle of the auxiliary guide groove 172 of the second rotating plate arm 122 is lower than that of the auxiliary guide groove 172 of the second rotating plate arm 122. It can be seen that the movement angle of the stopper is small. Reference numeral P30 denotes a rotation radius of the third rotating plate arm, and P22 denotes a rotation range in which the fixing pin is moved in the guide groove.

That is, according to the above structure, the first, second, and third rotation plate arms 121, 122, and 123 have a deployment structure that is unfolded or folded in a fan shape while being rotated step by step by the rotation of the first shaft 130.

8 is a diagram illustrating a process of loading / unloading a substrate by a substrate transfer apparatus step by step.

Referring to FIG. 8, the first, second and third rotating plate arms 121, 122 and 123 and the fourth, fifth and sixth rotating plate arms 124, 125 and 126 may be unfolded in a fan shape and disposed on top of respective corresponding susceptors 220, 230 and 240. Will be located. At this time, the first, second, and third rotating plate arms are placed on a substrate before processing received from the transfer robot 500. The substrates w that have been processed are placed on the fourth, fifth and sixth rotation plate arms 124, 125, and 126 by lift pins, respectively.

 After the process, the substrates w are unloaded into the transfer chamber 400 as the fourth, fifth and sixth rotation plate arms 124, 125, and 126 are folded. When the fourth, fifth and sixth rotation plate arms 124, 125 and 126 are folded, the substrates w placed on the first, second and third rotation plate arms 121, 122 and 123, respectively, are lifted by the lift pins and then the first, After the 2, 3 rotating plate arms 121, 122, 123 are folded to the standby position, the loading is completed when the substrates w are placed on each susceptor. In the drawings, the substrate is omitted for convenience.

In the substrate transfer apparatus illustrated in FIG. 9, the rotating plate arm for loading and the rotating plate arm for unloading are alternately disposed, and the loading / unloading process of the substrate goes through the same process as mentioned above.

According to the present invention, there is an advantage that the height and the area inside the transfer chamber can be reduced and the installation cost of the substrate transfer device can be reduced. That is, the substrate transfer apparatus installed in the transfer chamber can load and unload three substrates at a time.

The embodiment of the substrate transfer apparatus of the present invention described above is merely illustrative, and those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Could be. Therefore, it will be understood that the present invention is not limited only to the form mentioned in the above detailed description. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims. It is also to be understood that the present invention includes all modifications, equivalents, and substitutes within the spirit and scope of the invention as defined by the appended claims.

  The substrate transfer device of the present invention is very useful as a substrate processing system for various substrate processing processes such as manufacturing semiconductor integrated circuits, manufacturing flat panel displays, and manufacturing solar cells.

1 is a view showing a substrate processing apparatus to which a substrate transfer apparatus according to an embodiment of the present invention is applied.

FIG. 2 is a view showing the substrate transfer apparatus shown in FIG. 1.

3 is a cross-sectional view of the substrate transfer apparatus shown in FIG. 1.

4 briefly shows a sensing structure for detecting the rotation of the rotating plate arm.

5 and 6 are views for explaining the organic coupling relationship between the rotating plate arm, the rotation angle adjustment member and the support table.

7 is a view for explaining the rotation radius of the first, second, third rotation plate arms, respectively.

8 is a diagram illustrating a process of loading / unloading a substrate by a substrate transfer apparatus step by step.

FIG. 9 is a diagram illustrating a process of loading / unloading a substrate by a substrate transfer apparatus in which a loading rotating plate arm and an unloading rotating plate arm are alternately disposed.

10 shows a substrate processing facility having a reaction chamber with two susceptors.

11 is a view showing a substrate processing apparatus in which a reaction chamber having one susceptor is disposed to face each other with a transfer chamber interposed therebetween.

12 is a view showing a substrate processing apparatus in which reaction chambers having two susceptors are disposed to face each other with a transfer chamber interposed therebetween.

FIG. 13 illustrates a substrate processing facility in which reaction chambers having three susceptors are disposed to face each other with a transfer chamber interposed therebetween.

Claims (12)

In a substrate transfer apparatus for transferring multiple substrates: A driving unit providing a rotational force; A rotating shaft connected to the driving unit; Rotating plate arms rotated by the rotating shaft; And And rotation angle adjusting members respectively connecting the rotation plate arms to the rotation shaft such that the rotation plate arms are rotated at different rotation radii through a predetermined angle. The method of claim 1, The rotation angle adjusting member A connector key-coupled to the rotation shaft and having a fixing pin; And a guide groove provided on the rotating plate arm and having the fixing pin fitted therein and varying the rotation angle according to the rotation radius of the rotating plate arm. The method of claim 1, The substrate transfer device And a support member for supporting the rotating plate arms rotated by the rotation angle adjusting member. The method of claim 3, The rotating plate arm further includes a rotational end supported by the support member and having an auxiliary guide groove having an arc shape corresponding to the rotational angle, And the support member further includes a stopper inserted into the auxiliary guide groove to limit a rotation angle of the rotation plate arm rotated by the rotation angle adjustment member. The method of claim 3, The support member is a substrate transfer device is characterized in that the fixing pin of the connector is located, further comprising a guide groove for guiding the rotation of the connector by the maximum rotation angle of the rotation axis. The method of claim 3, And the rotating plate arm is supported by the support member and has a shaft hole through which the rotating shaft passes. In a substrate transfer apparatus for transferring multiple substrates: Two or more first rotating plate arms for loading the substrate before processing and being unfolded and folded in a fan shape with different rotation radii; At least two second rotating plate arms which unload the substrate after processing and are unfolded and folded in a fan shape with different rotation radii; A shaft member in which the first rotating plate arm and the second rotating plate arm are connected in multiple stages, and the first and second rotating shafts for rotating them independently are provided in a double pipe structure; And And rotation angle adjusting members connecting the first and second rotation shafts and the first and second rotation plate arms to rotate the first and second rotation plate arms at different rotation radii through a predetermined angle. Substrate transfer device. The method of claim 7, wherein Each of the first rotating plate arm and the second rotating plate arm Rotating end having a shaft hole is inserted into the shaft portion at the end, Each of the rotation angle adjusting members And a connecting body which is keyed to the shaft and fitted into the guide groove formed in the rotating end so that the corresponding rotating plate arm is rotated by a predetermined rotational angle. The method of claim 7, wherein The substrate transfer device And a support member for supporting the rotating ends of the first and second rotating plate arms. The method of claim 9, The support member And a stopper connected to the rotary end to limit a rotation angle of the first and second rotating plate arms rotated by the rotation angle adjusting member. The method of claim 10, The rotating end further comprises a sub guide groove into which the stopper is fitted. The method of claim 8, And said at least two first rotating plate arms and said at least two second rotating plate arms are arranged sequentially or alternately.

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