KR20090070664A - Injection unit and apparatus for treating substrate with the same - Google Patents

Abstract

An injection unit and a substrate processing device having the same are provided to reduce a time of a substrate process by reducing a replacing time of a nozzle in a cleaning process. An injection unit(200) sprays the process liquid. The injection unit includes an injection module and a driving module. An injection module includes a shaft which is horizontally placed and a nozzle(210) which is coupled to the shaft and is rotated to the direction vertical to the shaft. A driving module drives the injection module. The nozzle includes a rotating unit and a discharging unit. The rotating unit is coupled to the shaft. The discharging unit is extended from the rotating unit and sprays the process fluid.

Description

Injection unit and substrate processing apparatus having the same {INJECTION UNIT AND APPARATUS FOR TREATING SUBSTRATE WITH THE SAME}

The present invention relates to an injection unit for injecting a processing fluid and an apparatus for treating a substrate having the same.

Among apparatuses for processing substrates such as wafers for semiconductor integrated circuit chip manufacturing and glass substrates for flat panel display manufacturing, a cleaning apparatus sprays a processing fluid onto the substrate to remove foreign substances remaining on the surface of the substrate.

This cleaning device has a vessel, a chuck and an injection unit. The container has a cup shape with an open top, and the chuck supports and rotates the substrate inside the container during processing. And, the injection unit injects the processing fluid to the processing surface of the wafer placed on the chuck through the open top of the container during the process. A plurality of nozzles are used as the injection unit. When the process is initiated, the wafer is placed on the chuck and the respective nozzles spray the processing fluid onto the wafer rotated by the chuck to clean the wafer. At this time, each nozzle is waiting at one side of the apparatus before injecting the processing fluid, any one of the nozzles is selectively moved to the injection position for injecting the processing fluid during the injection of the processing fluid to spray the processing liquid. Then, the nozzle having completed the injection of the processing fluid is moved to the standby position again, and another nozzle is moved to the injection position to inject the next processing fluid onto the substrate.

However, such a substrate cleaning apparatus has a long time for replacing the nozzle, thereby increasing the processing time. For example, during the cleaning process, the discharge end portion of the nozzle discharges the processing fluid in a state located in the interior space of the container through the open top of the container. Therefore, in this case, when the nozzle moves between the injection position and the standby position, the container may be positioned on the movement path of the nozzle, and the nozzle and the container may collide. In order to prevent the nozzle from colliding with the container, the position of the container must be changed from the nozzle moving path before the nozzle is moved, or the nozzle must be moved between the spraying position and the standby position to avoid the container. This increases. Since the supply of the processing fluid to the substrate is stopped during the nozzle replacement, the surface of the wafer is exposed to the outside air during the nozzle replacement, thereby reducing the cleaning efficiency of the wafer.

The present invention provides a spray unit and a substrate processing apparatus having the same, which prevents the substrate processing process efficiency from being lowered due to the replacement of the nozzle.

The present invention provides a spray unit and a substrate processing apparatus having the same, which shortens the replacement time of the nozzle and shortens the substrate processing time.

The injection unit according to the present invention includes an injection module having a shaft placed horizontally and a nozzle coupled to the shaft and rotated in a direction perpendicular to the shaft, and a driving module for driving the injection module.

According to an embodiment of the present invention, the nozzle has a rotating part axially coupled with the shaft and a discharge part extending from the rotating part and injecting a processing fluid.

According to an embodiment of the present invention, the discharge portion is a first line extending in a straight line from the end of the rotating portion, a second line perpendicular to the first line, and connects the first line and the second line, round It includes a connecting line having a losing shape.

According to an embodiment of the present invention, the discharge part includes a first line extending in a straight line from an end of the rotating part and a second line extending downwardly perpendicular to the first line from an end of the first line.

The substrate processing apparatus according to the present invention includes a container having a space in which a substrate processing process is performed, a chuck for supporting a substrate in the container, and a spraying unit for injecting a processing fluid into a substrate placed on the chuck. The injection unit includes an injection module having a shaft placed horizontally and a nozzle coupled to the shaft and rotating in a direction perpendicular to the shaft, and a driving module for driving the injection module.

According to an embodiment of the present invention, the nozzle has a rotating part axially coupled with the shaft and a discharge part extending from the rotating part and injecting a processing fluid, wherein the discharge part has a first line extending straight from the end of the rotating part; And a second line perpendicular to the first line, and a connection line connecting the first line and the second line and having a rounded shape.

According to an embodiment of the present invention, the discharge part includes a first line extending straight from the end of the rotating part and a second line extending vertically downward from the end of the first line.

According to an embodiment of the present invention, the driving module includes a nozzle driver for rotating the nozzle so that the nozzle is positioned between the injection position for injecting the processing fluid and the standby position where the nozzle waits before moving to the injection position. Including, the injection position is a position where the rotating part is placed horizontally, the standby position is a position where the rotating part is placed vertically.

According to an embodiment of the present invention, a plurality of nozzles are arranged in a row, and the driving module independently positions each nozzle between the injection position and the standby position.

According to an embodiment of the present invention, the driving module further includes a second driver for swinging the injection module horizontally at a predetermined angle and a third driver for linearly reciprocating the second driver.

The injection unit and the substrate processing apparatus having the same according to the present invention shorten the replacement time of the nozzle during the cleaning process, thereby improving the efficiency of the substrate processing process and shortening the substrate processing time.

Hereinafter, with reference to the accompanying drawings will be described in detail a substrate processing apparatus and method according to an embodiment of the present invention. Embodiment of the present invention may be modified in various forms, the scope of the present invention is not limited to the embodiments described below. This embodiment is provided to more fully explain the present invention to those skilled in the art, that is, to those skilled in the art. Accordingly, the shape of elements in the figures is exaggerated to emphasize clear explanation.

In addition, the embodiment of the present invention has been described with an apparatus for performing a process of removing the foreign matter on the substrate by injecting the processing fluid on the semiconductor substrate as an example, the present invention is applied to all devices having an injection unit for injecting the processing fluid Application may be possible.

1 is a view showing a substrate processing apparatus according to the present invention, Figure 2 is a view showing the configuration of the injection unit shown in FIG. 3 is a perspective view illustrating the first to third nozzles shown in FIG. 1.

1 to 3, an apparatus for treating substrate 10 according to the present invention performs a process of cleaning a semiconductor substrate (hereinafter, referred to as a wafer) W. FIG. The substrate processing apparatus 10 has a cleaning unit 100 and an injection unit 200. The cleaning unit 100 performs a cleaning process for removing foreign matter remaining on the wafer W, and the injection unit 200 injects a processing fluid onto the wafer W during the cleaning process.

The cleaning unit 100 has a container 110 and a spin chuck 120.

The container 110 has a space for performing a cleaning process therein. The container 110 has a cup shape with an open top. The open top 112 of the vessel 110 serves as a passage for the wafer W to enter and exit the space in the vessel 110.

The spin chuck 120 supports and rotates the wafer W in the container 110 during the cleaning process. The spin chuck 120 has a spin head 122, a rotation axis 124, and a chuck driver 126. Spinhead 122 has a generally cylindrical shape. The spin head 122 has an upper surface 122a on which the wafer W is placed. A plurality of chucking pins 122b are installed at the edge of the upper surface 122a. The chucking pin 122b chucks and unchucks the edge of the wafer W placed on the upper surface 122a to fix the wafer W on the spin head 122.

The rotating shaft 124 is installed to vertically penetrate the center of the lower wall 112 of the container 110. The upper end of the rotation shaft 124 is coupled to the lower center of the spin head 122, and the lower end of the rotation shaft 124 is coupled to the chuck driver 126. The chuck driver 126 rotates the rotating shaft 124 during the cleaning process to rotate the wafer W placed on the spin head 122 at a predetermined rotation speed. In addition, the chuck driver 126 raises the rotation shaft 124 when loading and unloading the wafer W so that the upper surface 122a of the spin head 122 opens the open upper 112 of the container 110. Through the container 110 to be exposed to the external space.

In the present embodiment, a case in which the loading of the wafer W is performed by elevating the spin head 122 is performed, but the height of the container 110 is adjusted to move the spin head 122 to an open upper portion of the container 110. The wafer W may be loaded and unloaded by being exposed to the outside of the container 110 through 112.

The injection unit 200 has an injection module 202 and a driving module 250. The injection module 202 has a shaft 210, a first nozzle 220, a second nozzle 230, and a third nozzle 240.

The shaft 210 is provided for rotation of the first to third nozzles 220, 230, and 240. The shaft 210 is axially coupled with each of the first to third nozzles 220, 230, and 240, such that the first to third nozzles 220, 230, and 240 are rotated at an angle. The first to third nozzles 220, 230, and 240 are arranged side by side along the longitudinal direction of the shaft 210. In this case, the shaft 210 is generally horizontally positioned, and the first to third nozzles 220, 230, and 240 are rotated about the shaft 210. In the present embodiment, a structure in which one shaft 210 is axially coupled to the first to third nozzles 220, 230, and 240 is described as an example, but the shaft is the first to third nozzles 220, 230, and 240. One may be provided in each.

The first nozzle 220 injects the first fluid during the cleaning process. The first fluid may be a cleaning liquid for removing foreign matter remaining on the wafer (W). The first nozzle 220 has a first rotating part 222 and a first discharge part 224. One side of the first rotating part 222 is axially coupled with the shaft 210. Thus, the first rotating part 222 is rotated by an angle based on the shaft 210. The first discharge part 224 discharges the first fluid onto the wafer W during the cleaning process. The first discharge part 224 extends from the other end of the first rotating part 222 and has a shape that is rounded. For example, the first discharge part 224 has a first line L1, a second line L2, and a connection line L3. The first line L1 extends in a straight line from the other end of the first rotating part 222. The second line L10 is a line perpendicular to the second line L1. A discharge hole h1 through which the first fluid is discharged is formed at a lower end of the second line L2. In addition, the connection line L3 is a line connecting the first line L1 and the second line L2. At this time, the connection line (L3) has a shape that is bent toward the upper end of the second line (L2) from the end of the first line (L1).

The second nozzle 230 and the third nozzle 240 inject the second fluid and the third fluid, respectively, during the cleaning process. The second fluid may be a rinse liquid for removing the first fluid and other foreign matter remaining on the wafer W, and the third fluid may be a dry gas for drying the wafer W. The second nozzle 230 has a second rotating part 232 and a second discharge part 234, and the third nozzle 240 has a third rotating part 242 and a third discharge part 244. The second and third rotating parts 232 and 242 have the same shape and structure as the first rotating part 222 described above, and the second and third discharge parts 234 are the same as the first discharge part 234 described above. It has a shape and a structure.

The drive module 240 drives the injection module 202. The driving module 240 has a first driver 242, a second driver 244, and a third driver 246.

The first driver 242 independently drives each of the first to third nozzles 220, 230, and 240. For example, as shown in FIG. 3, the first driver 242 selectively drives each of the first to third nozzles 220, 230, and 240 between the injection position (a) and the standby position (b). (242a, 242b, 242c). The injection position (a) is a position for each of the first to third nozzles 220, 230, and 240 to inject the processing fluid during the process, and the standby position (b) is for each of the first to third nozzles 220, 230 and 240 are positions waiting before moving to the injection position (a). When each of the first to third nozzles 220, 230, and 240 is positioned at the injection position a, the rotating parts 222, 232, and 242 are generally horizontally positioned, and the first to third nozzles 220, 230 are positioned horizontally. 240, each of which is located in the injection position (a), each of the rotary parts 222, 232, 242 is generally placed vertically vertically. In addition, when the first to third nozzles 220, 230, and 240 are positioned at the injection position a, the ends of the discharge parts 224, 234, and 244 in which the discharge holes h1, h2, and h3 are formed are disposed in the container 210. ) Is located in the inner space.

Here, a driving cylinder may be used as each of the drivers 242a, 242b, and 242c. That is, each of the drivers 242a, 242b, and 242c is rotated by pushing or pulling a portion of the first to third rotating parts 222, 232, and 242 so that the first to third nozzles 220, 230, and 240 are sprayed. (a) and the standby position (b) can be located mutually. Alternatively, a rotating motor may be used as the drivers 242a, 242b, and 242c. That is, each of the drivers 242a, 242b, and 242c rotates the first to third rotating parts 242a, 242b, and 242c, respectively, so that the first to third nozzles 220, 230, and 240 are spray positions (a) and Standby positions (b) can be located mutually. In this case, the first driver 242 includes components for receiving the rotational force of the drivers 242a, 242b, and 242c from the first to third rotating parts 242a, 242b, and 242c, such as a gear and a belt. It may be provided. Various driving techniques may be applied to a method of driving the first to third nozzles 220, 230, and 240.

The second driver 244 rotates the rotation shaft 244a in the rotation direction R so that the first to third nozzles 220, 230, and 240 may spray the processing fluid while swinging during the cleaning process. do. In addition, the second driver 244 may adjust the height of the first to third nozzles 220, 230, and 240 by raising and lowering the injection module 202 up and down.

The third driver 246 linearly moves the injection module 202 in the first direction X1 and the second direction X2. The third driver 246 has a guide rail 246a for guiding movement of the second driver 244 in the first and second directions X1 and X2. The third driver 246 linearly moves the second driver 244 along the guide rail 242a to position the injection module 202 between the process position c and the standby position d. The process position (c) is a position of the injection module 202 for injecting a processing fluid onto the wafer W on which the first to third nozzles 220, 230, and 240 are placed on the spin chuck 126 during the cleaning process. , Waiting position (d) is a position where the injection module 202 waits on one side of the device 10 before moving to the process position (c).

In the present exemplary embodiment, the injection module 202 having a discharge part rounded to a certain curvature has been described as an example, but the shape of the discharge part may be variously changed and modified. For example, as shown in FIG. 4, the injection module 202a according to another embodiment of the present invention has discharge portions 224 ′, 234 ′, and 244 ′ in which a portion is bent at a right angle. That is, the discharge parts 224 ′, 234 ′, and 244 ′ are respectively formed of the first lines 224 a, 234 a, 244 a and the first lines 224 a, which extend in a straight line from the ends of the rotating parts 222, 232, 242, respectively. And second lines 224b, 234b and 244b extending downwardly perpendicular to the first lines 224a, 234 and 244a from the ends of 234a and 244a.

Or, as shown in Figure 5, the injection unit 200b according to another embodiment of the present invention is the discharge portion (224 ″, 234 ″, 244 ″), a portion of which is bent at a certain angle (θ) Has That is, the discharge parts 224 ″, 234 ″, and 244 ″ have first lines 224a ', 234a' and 244a 'and second lines 224b', 234b 'and 244b'. The first discharge lines 224a ', 234a', and 244a 'extend to be inclined at a first angle from the ends of the rotating parts 222, 232, and 242, respectively. The second discharge lines 224b ', 234b', and 244b 'extend inclined downward at a second angle greater than the first angle from the ends of the first discharge lines 224a', 234a ', and 244a'.

Hereinafter, a process of the substrate processing apparatus according to the present invention will be described in detail with reference to FIGS. 6 and 7A to 7E. 6 is a flowchart illustrating a substrate processing method according to the present invention, and FIGS. 7A to 7E are diagrams for describing a process of the substrate processing apparatus according to the present invention.

When the substrate treating process is started, the wafer W is loaded into the cleaning unit 100 (S110). That is, referring to FIG. 7A, a robot arm (not shown) seats the wafer W on the spin head 122 of the spin chuck 120. At this time, the upper surface of the spin head 122 is exposed to the outside of the container 110 through the open top 112 of the container 110. When the wafer W is placed on the spin head 122, the driver 126 positions the spin head 122 into the container 110.

When the wafer W is loaded, the third driver 246 of the driving module 240 moves the injection module 202 from the standby position d to the process position c (S120). That is, the third driver 246 moves the second driver 244 along the guide rail 246a in the first direction X1 to position the injection module 202 at the process position c.

When the injection module 202 is located at the process position c, the wafer W is cleaned by the first nozzle 220 (S130). That is, referring to FIG. 7B, the chuck driver 126 rotates the rotation shaft 124 to rotate the wafer W placed on the spin head 122 at a predetermined rotation speed. In addition, the first driver 242 rotates the first nozzle 220 positioned at the standby position b to position the injection position a. When the first nozzle 220 is located at the injection position a, the discharge hole h1 of the first nozzle 220 is located in the space in the container 210. The first nozzle 220 positioned at the injection position a injects a first fluid to the processing surface of the wafer W to be rotated. The injected first fluid removes foreign matter remaining on the wafer W surface. In this case, the second driver 244 may rotate the injection module 202 in the rotation direction R to inject the first fluid while the first nozzle 220 swings.

When the cleaning of the wafer W by the first nozzle 220 is completed, the cleaning of the wafer W by the second nozzle 230 is performed (S140). That is, referring to FIG. 7C, the first driver 242 moves the first nozzle 220 from the injection position a to the standby position b, and moves the second nozzle 230 from the standby position b. Move to the injection position (a). In this case, the movement of the first nozzle 220 to the standby position b and the movement of the second nozzle 230 to the injection position a may be simultaneously performed. When the second nozzle 230 is located at the injection position a, the discharge hole h2 of the second nozzle 230 is located in the space in the container 210. The second nozzle 230 located at the injection position (a) injects a second fluid to the processing surface of the wafer W to be rotated. The injected second fluid removes the first fluid and other foreign matter remaining on the wafer (W). In this case, the second driver 244 may reciprocate the injection module 202 in the rotation direction R1 to inject the second fluid while the second nozzle 230 swings.

When the cleaning of the wafer W by the second nozzle 230 is completed, drying of the wafer W by the third nozzle 240 is performed (S150). That is, referring to FIG. 7D, the first driver 242 moves the second nozzle 240 located at the injection position a to the standby position b, and at the same time, the third driver located at the standby position b. The nozzle 240 is moved to the injection position (a). When the third nozzle 240 is located at the injection position a, the discharge hole h3 of the third nozzle 240 is located in the space in the container 110. The third nozzle 240 positioned at the injection position a injects a third fluid to the processing surface of the wafer W to be rotated. The injected third fluid dries the wafer (W).

When the drying of the wafer W by the third nozzle 240 is completed, as shown in FIG. 7E, the third driver 246 moves the injection module 202 located at the process position c to the standby position d. In step S160, the wafer W is unloaded from the spin chuck 120 and then transported to a facility in which a subsequent process is performed (S170).

As described above, the substrate processing apparatus and method according to the present invention improves the efficiency of the substrate processing process by minimizing the replacement time of each nozzle 220, 230, 240 during the cleaning of the wafer W.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

1 is a view showing a substrate processing apparatus according to the present invention.

2 is a view showing the configuration of the injection unit shown in FIG.

3 is a perspective view illustrating first to third nozzles illustrated in FIG. 1.

4 is a view showing an injection unit according to another embodiment of the present invention.

5 is a view showing a spray unit according to another embodiment of the present invention.

6 is a flowchart showing a substrate processing method according to the present invention.

7A to 7E are diagrams for describing a process of a substrate processing apparatus according to the present invention.

* Description of symbols on the main parts of the drawings *

10: substrate processing apparatus

100: cleaning unit

110: container

120: spin chuck

200: injection unit

210: nozzle

220: driver

Claims (10)

In the unit for spraying the processing fluid, An injection module having a shaft placed horizontally and a nozzle coupled to the shaft and rotating in a direction perpendicular to the shaft; Injection unit comprising a drive module for driving the injection module. The method of claim 1, The nozzle, A rotating part axially coupled with the shaft; And a discharge unit extending from the rotating unit and injecting a processing fluid. The method of claim 2, The discharge portion, A first line extending in a straight line from an end of the rotating part, A second line perpendicular to the first line, and The injection unit connecting the first line and the second line, characterized in that it comprises a connection line having a rounded shape. The method of claim 2, The discharge portion, A first line extending in a straight line from an end of the rotating part, And a second line extending downwardly from the end of the first line and perpendicular to the first line. A container having a space in which a substrate treatment process is performed; A chuck for supporting a substrate inside the container, and Including a spray unit for injecting a processing fluid to the substrate placed on the chuck, The injection unit, An injection module having a shaft placed horizontally and a nozzle coupled to the shaft and rotating in a direction perpendicular to the shaft; Substrate processing apparatus comprising a drive module for driving the injection module. The method of claim 5, wherein The nozzle, A rotating part axially coupled with the shaft; Extends from the rotating part and has a discharge part for injecting a processing fluid, The discharge portion, A first line extending in a straight line from an end of the rotating part, A second line perpendicular to the first line, and And a connection line connecting the first line and the second line, the connecting line having a rounded shape. The method of claim 6, The discharge portion, A first line extending in a straight line from an end of the rotating part, And a second line extending vertically downwardly from an end of the first line. The method according to any one of claims 5 to 7, The drive module, A nozzle driver for rotating the nozzle such that the nozzle is positioned between an injection position for injecting a processing fluid and a standby position where the nozzle waits before being moved to the injection position, The injection position is, The rotary part is positioned horizontally, The standby position is, Substrate processing apparatus, characterized in that the position where the rotating portion is placed vertically. The method of claim 8, The nozzle, The plural are placed in a row, The drive module, And each nozzle is independently positioned between the injection position and the standby position. The method of claim 9, The drive module, A second driver for swinging the injection module horizontally at a predetermined angle; And a third driver for linearly reciprocating the second driver.

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