KR102579528B1 - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

The main robot's hand enters the processing unit. The unprocessed substrate held by the hand is handed over to the loading position of the processing unit. After the substrate before processing is handed over to the loading position, the substrate after processing is received by a hand from the loading location of the processing unit. After the processed substrate is received from the unloading position, the hand is ejected from the processing unit. Processing is performed on the substrate before processing by the processing unit.

Description

Substrate processing apparatus and substrate processing method {SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD}

The present invention relates to a substrate processing apparatus and a substrate processing method for performing predetermined processing on a substrate.

Substrates for FPD (Flat Panel Display), semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, and ceramic substrates used in liquid crystal displays or organic EL (Electro Luminescence) display devices. Alternatively, substrate processing equipment is used to perform various treatments on various substrates such as solar cell substrates.

For example, Japanese Patent Application Laid-Open No. 2013-77639 describes a substrate processing apparatus including a plurality of processing units and a transport mechanism for transporting a substrate between the plurality of processing units using first and second hands. there is. The plurality of processing units include a heat treatment unit, a cooling unit, and an application processing unit that respectively perform heat treatment, cooling treatment, and application processing on the substrate. The transfer mechanism moves between a plurality of processing units while holding the substrate by the first hand and not holding the substrate by the second hand. Additionally, the transfer mechanism unloads the processed substrate from the processing unit at the transfer destination by the second hand, and also transports the unprocessed substrate held by the first hand into the processing unit.

In the substrate processing apparatus described in Japanese Patent Application Laid-Open No. 2013-77639, removal of the substrate after processing from the processing unit and loading of the substrate before processing into the processing unit are carried out continuously by the first and second hands of the transfer mechanism. It is carried out. Therefore, it was thought that throughput was improved. However, the transfer mechanism needs to move between a plurality of processing units without holding the substrate in any hand in order to unload the processed substrate from the processing unit at the transfer destination. In this case, there is a limit to improvement in throughput because only fewer substrates than the number of hands can be transported at a time.

An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of improving throughput.

(1) A substrate processing apparatus according to one aspect of the present invention has a loading position where a substrate before processing is loaded and a loading location where a substrate after processing is loaded, a processing unit that processes the substrate before processing, and a processing unit that processes the substrate before processing and after processing the substrate. A substrate transport unit is provided with a transport holder configured to selectively hold a substrate, wherein the transport holder holds the substrate before processing, enters the processing unit, delivers the unprocessed substrate to the loading location, and then transfers the processed substrate from the loading location. is received, and the processed substrate is discharged from the processing unit after receiving it.

In this substrate processing apparatus, the transport and holding portion of the substrate transport unit enters the processing unit. The substrate before processing held by the transfer holding unit is handed over to the loading position of the processing unit. After the substrate before processing is delivered to the loading position, the substrate after processing is received from the loading location of the processing unit by the transfer holding unit. After the processed substrate is received from the unloading position, the transport holding portion is ejected from the processing unit. Processing is performed on the substrate before processing by the processing unit.

According to this configuration, even when a substrate after processing exists in the processing unit, a substrate before processing can be brought into the processing unit. Therefore, after handing over the unprocessed substrate to the processing unit, it becomes possible to receive the processed substrate by the transport holding unit. Therefore, in order to receive the processed substrate, there is no need to form a transport holding portion that does not hold the substrate. Accordingly, the throughput of the conveyance holding section can be improved.

(2) The loading and unloading positions may be arranged so as to be aligned in the vertical direction. In this case, the installation floor area (footprint) of the processing unit can be reduced.

(3) A plurality of processing units are formed, a plurality of transport holding units are formed to correspond to the plurality of processing units, and each of the plurality of substrate transport units enters the corresponding processing unit and passes the substrate before processing to the loading position. Afterwards, the processed substrate may be received from the unloading position, and the processed substrate may be discharged from the corresponding processing unit after receiving the processed substrate. In this case, it becomes possible to continuously perform the operations of handing over the substrate before processing and receiving the substrate after processing for a plurality of processing units. Accordingly, throughput can be further improved.

(4) The processing unit includes a first substrate holding unit that holds the substrate loaded into the loading position, a first processing unit that processes the substrate held by the first substrate holding section, and a substrate loaded from the loading position. A second substrate holding unit that holds the substrate, a receiving unit that passes the substrate processed by the first processing unit from the first substrate holding unit to the second substrate holding unit, and processing is performed on the substrate held by the second substrate holding unit. It may also include a second processing unit. In this case, the substrate brought in to the loading location and processed by the first and second processing units can be unloaded from the loading location as a processed substrate.

(5) The first processing unit and the second processing unit may perform different treatments on the substrate. In this case, different treatments can be efficiently performed on the substrate.

(6) The first processing unit may perform a cleaning process on the central region of the lower surface of the substrate, and the second processing unit may perform a cleaning treatment on the outer region of the lower surface surrounding the central region of the lower surface of the substrate. In this case, the entire lower surface of the substrate can be cleaned efficiently.

(7) A substrate processing method according to another aspect of the present invention includes a step of allowing the transfer holding portion of the substrate transport unit to enter the processing unit, and a step of passing the substrate before processing held by the transport holding unit to the loading position of the processing unit. A step of receiving the processed substrate from the unloading position of the processing unit by the transport holding unit after the unprocessed substrate is delivered to the loading position, and removing the transport holding unit from the processing unit after the processed substrate is received from the unloading position. It includes a step and a step of processing a substrate before processing by a processing unit.

According to this substrate processing method, even when a substrate after processing exists in the processing unit, a substrate before processing can be brought into the processing unit. Therefore, after handing over the unprocessed substrate to the processing unit, it becomes possible to receive the processed substrate by the transport holding unit. Therefore, in order to receive the processed substrate, there is no need to form a transport holding portion that does not hold the substrate. Accordingly, the throughput of the conveyance holding section can be improved.

1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus taken along line JJ in FIG. 1;
Figure 3 is a schematic plan view of the substrate cleaning device of Figure 1;
Fig. 4 is an external perspective view showing the internal structure of the substrate cleaning device of Fig. 3;
5 is a block diagram showing the configuration of the control system of the substrate processing apparatus;
FIG. 6 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of FIG. 3;
Fig. 7 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 8 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 9 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 10 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 11 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 12 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 13 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 14 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 15 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 16 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 17 is a schematic diagram for explaining an example of the operation of the substrate cleaning device of Fig. 3;
Fig. 18 is a flow chart showing substrate processing by the control device of Fig. 5;
FIG. 19 is a flow chart showing substrate processing by the control device in FIG. 5.

Hereinafter, a substrate processing apparatus and a substrate processing method related to embodiments of the present invention will be described using drawings. In the following description, the substrate refers to a semiconductor substrate (wafer), a substrate for an FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, and a magneto-optical device. This refers to a substrate for a disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. Additionally, in this embodiment, the upper surface of the substrate is the circuit formation surface (front surface), and the lower surface of the substrate is the surface (back surface) opposite to the circuit formation surface. Additionally, in this embodiment, the substrate has a circular shape excluding the notch.

(1) Configuration of substrate processing equipment

1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of the substrate processing apparatus 100 taken along line J-J in FIG. 1. As shown in FIG. 1 , the substrate processing apparatus 100 according to the present embodiment has an indexer block 110 and a processing block 120 . The indexer block 110 and the processing block 120 are formed adjacent to each other.

The indexer block 110 includes a plurality of carrier stands 140 (four in this example) and a conveyance unit 150. A plurality of carrier platforms 140 are connected to the conveyance unit 150 and are arranged in a line with an interval between them. On each carrier mounting table 140, a carrier C accommodating a plurality of substrates W is placed.

In the conveyance unit 150, an indexer robot 200 and a control device 170 are formed. The indexer robot 200 includes a plurality of hands (four in this example) (Ia, Ib, Ic, Id), a hand support member 210, and a conveyance drive unit 220.

The plurality of hands (Ia to Id) are configured to each be capable of holding the plurality of substrates (W), and are formed on the hand support member 210 in a state in which they are arranged at regular intervals in the vertical direction. The hand support member 210 is formed to extend in one direction and supports the plurality of hands Ia to Id so as to be able to advance and retreat in that one direction. The conveyance drive unit 220 is configured to be movable in the horizontal direction (the direction in which the plurality of carrier stands 140 are aligned), and supports the hand support member 210 so that it can rotate and be raised and lowered around the vertical axis. In addition, the transport drive unit 220 includes a plurality of motors, air cylinders, etc., and moves the hand support member 210 in the horizontal direction in order to transport the plurality of substrates W by the plurality of hands Ia to Id. , the hand support member 210 is rotated around the vertical axis, and the hand support member 210 is raised and lowered. Additionally, the conveyance drive unit 220 advances and retreats the plurality of hands Ia to Id in the horizontal direction. The control device 170 consists of a computer including a CPU (central processing unit), RAM (random access memory), ROM (read only memory), and a storage device, and controls each component in the substrate processing device 100. Control.

The processing block 120 includes a washing section 161 and 162 and a conveying section 163. The washing section 161, the conveying section 163, and the washing section 162 are arranged adjacent to the conveying section 150 and arranged in this order. In the cleaning units 161 and 162, a plurality (for example, four) of substrate cleaning devices 1 are stacked vertically. Each substrate cleaning device 1 has a loading position where the substrate W before processing is loaded and a loading position where the substrate W after processing is loaded. Details of the configuration and operation of the substrate cleaning device 1 will be described later.

A main robot 300 is formed in the transfer unit 163. The main robot 300 includes a plurality (four in this example) of hands (Ma, Mb, Mc, Md), a hand support member 310, and a conveyance drive unit 320. The plurality of hands Ma to Md are configured to be capable of holding the plurality of substrates W, respectively, and are formed on the hand support member 310 in a state in which they are aligned in the vertical direction.

The hand support member 310 is installed to extend in one direction, and supports the plurality of hands Ma to Md so that they can advance and retreat independently. The conveyance drive unit 320 supports the hand support member 310 so that it can rotate and go up and down around the vertical axis. In addition, the transport drive unit 320 includes a plurality of motors, air cylinders, etc., and moves the hand support member 310 along the vertical axis in order to transport the plurality of substrates W by the plurality of hands Ma to Md. It rotates around and raises and lowers. Additionally, the conveyance drive unit 320 advances and retreats the plurality of hands Ma to Md in the horizontal direction.

Between the indexer block 110 and the processing block 120, there are a plurality of substrate placement units (four in this example) for transferring the substrate W between the indexer robot 200 and the main robot 300. PASS1) and a plurality of substrate mounting portions (PASS2) are stacked vertically. The plurality of substrate placement parts PASS1 are located above the plurality (four in this example) of substrate placement parts PASS2.

The plurality of substrate placement units PASS2 are used to transfer the substrates W from the indexer robot 200 to the main robot 300. The plurality of substrate placement units PASS1 are used to pass the substrates W from the main robot 300 to the indexer robot 200. The spacing between the plurality of substrate placement units PASS1 may be approximately the same as the spacing between the plurality of hands Ma to Md of the main robot 300. Similarly, the spacing between the plurality of substrate placement units PASS2 may be approximately the same as the spacing between the plurality of hands Ma to Md of the main robot 300.

The indexer robot 200 takes out the substrate W before processing from any one of the plurality of carriers C placed on the plurality of carrier placement tables 140 . Additionally, the indexer robot 200 places the unprocessed substrate W taken out on any one of the plurality of substrate placement units PASS2. Additionally, the indexer robot 200 receives the processed substrate W placed on any one of the plurality of substrate placement units PASS1 and accommodates it in the empty carrier C.

The main robot 300 receives the plurality of unprocessed substrates W placed in the plurality of substrate placement units PASS2 using the plurality of hands Ma to Md. At this time, the main robot 300 may sequentially receive the plurality of substrates W using the plurality of hands Ma to Md. When the interval between the plurality of substrate placement units (PASS2) is approximately equal to the interval between the plurality of hands (Ma to Md), the main robot 300 moves the plurality of substrates (W) by the plurality of hands (Ma to Md). ) can be received at the same time.

Next, the main robot 300 places the plurality of unprocessed substrates W received by the plurality of hands Ma to Md from the substrate placing unit PASS2 into the cleaning unit 161 or the cleaning unit 162. Each is handed to the loading position in the plurality of substrate cleaning devices 1. Subsequently, the main robot 300 receives the plurality of processed substrates W placed at the unloading positions in the plurality of substrate cleaning devices 1 using the plurality of hands Ma to Md.

After that, the main robot 300 places the plurality of processed substrates W received by the plurality of hands Ma to Md from the substrate cleaning device 1 on the plurality of substrate placing units PASS1, respectively. . At this time, the main robot 300 may sequentially place a plurality of processed substrates W on the plurality of substrate placement units PASS1. When the spacing between the plurality of substrate placement units (PASS1) is approximately equal to the spacing between the plurality of hands (Ma to Md), the main robot 300 moves the plurality of substrates (W) by the plurality of hands (Ma to Md). ) may be placed simultaneously on a plurality of substrate placement units (PASS1).

(2) Configuration of substrate cleaning device

FIG. 3 is a schematic plan view of the substrate cleaning device 1 in FIG. 1. FIG. 4 is an external perspective view showing the internal structure of the substrate cleaning device 1 in FIG. 3. In the substrate cleaning device 1, in order to clarify the positional relationship, the X-direction, Y-direction, and Z-direction are defined orthogonal to each other. In certain drawings after FIGS. 3 and 4, the X direction, Y direction, and Z direction are indicated by arrows as appropriate. The X direction and Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

As shown in FIG. 3, the substrate cleaning device 1 includes an upper holding device 10A, 10B, a lower holding device 20, a pedestal device 30, a receiving device 40, a lower surface cleaning device 50, It is provided with a cup device (60), a top surface cleaning device (70), an end cleaning device (80), and an opening and closing device (90). These components are installed within the unit casing (2). In Figure 3, the unit casing 2 is indicated by a dotted line.

The unit casing 2 has a rectangular bottom portion 2a and four side wall portions 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom portion 2a. The side wall portions 2b and 2c face each other, and the side wall portions 2d and 2e face each other. A rectangular opening is formed in the central portion of the side wall portion 2b. This opening is the loading/unloading port 2x of the substrate W, and is used when loading and unloading the substrate W into the unit casing 2. In Fig. 4, the loading/unloading port 2x is indicated by a thick dotted line. In the following description, the Y direction refers to the direction from the inside of the unit casing 2 through the loading/unloading port 2x to the outside of the unit casing 2 (from the side wall portion 2c to the side wall portion 2b). direction) is called the front, and the opposite direction (the direction from the side wall portion 2b to the side wall portion 2c) is called the rear.

An opening and closing device 90 is installed in the portion where the loading/unloading port 2x is formed in the side wall portion 2b and in the area near it. The opening and closing device 90 includes a shutter 91 configured to be capable of opening and closing the loading/unloading port 2x, and a shutter driving unit 92 that drives the shutter 91. In Fig. 4, the shutter 91 is indicated by a thick double-dashed line. The shutter drive unit 92 drives the shutter 91 to open the loading/unloading port 2x when loading and unloading the substrate W into and out of the substrate cleaning device 1 . Additionally, the shutter drive unit 92 drives the shutter 91 to block the loading/unloading opening 2x during the cleaning process of the substrate W in the substrate cleaning device 1.

A pedestal device 30 is formed in the central portion of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is installed to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c when viewed in plan. The movable base 32 is formed to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor and moves the movable pedestal 32 on the linear guide 31 in the Y direction.

On the movable pedestal 32, the lower holding device 20 and the lower surface cleaning device 50 are installed aligned in the Y direction. The lower holding device 20 includes a suction holding portion 21 and a suction holding driving portion 22. The adsorption holding portion 21 is a so-called spin chuck, has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis extending in the vertical direction (Z-direction axis). . In FIG. 3, the external shape of the substrate W adsorbed and held by the lower holding device 20 is indicated by a two-dashed chain line. In the following description, when the substrate W is adsorbed and held by the adsorption holding portion 21, the area on the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding portion 21 is referred to as the central region. I call. On the other hand, the area surrounding the central area of the lower surface of the substrate W is called the lower outer area.

The suction holding drive unit 22 includes a motor. The motor of the suction holding drive unit 22 is installed on the movable base 32 so that the rotation axis protrudes upward. The suction holding portion 21 is mounted on the upper end of the rotation shaft of the suction holding driving portion 22. In addition, a suction path for adsorbing and holding the substrate W in the adsorption holding unit 21 is formed on the rotation axis of the adsorption holding driving unit 22. The suction path is connected to an intake device not shown. The suction holding drive unit 22 rotates the suction holding unit 21 around the rotation axis.

On the movable pedestal 32, a receiving device 40 is additionally installed near the lower holding device 20. The transfer device 40 includes a plurality (three in this example) of support pins 41, a pin connecting member 42, and a pin lifting/lowering drive unit 43. The pin connection member 42 is formed to surround the suction holding portion 21 when viewed in plan, and connects the plurality of support pins 41. The plurality of support pins 41 are connected to each other by the pin connecting member 42 and extend upward from the pin connecting member 42 at a certain length. The pin lifting/lowering driving unit 43 raises/lowers the pin connecting member 42 on the movable pedestal 32 . Accordingly, the plurality of support pins 41 rise and fall relative to the suction holding portion 21.

The lower surface cleaning device 50 includes a lower surface brush 51, two liquid nozzles 52, a gas jet part 53, a lifting support part 54, a moving support part 55, a lower surface brush rotation drive part 55a, and a lower surface brush 50. It includes a brush lifting/lowering driving unit 55b and a lower brush moving driving unit 55c. The movable support portion 55 is installed to be movable in the Y direction with respect to the lower holding device 20 within a certain area on the movable pedestal 32 . As shown in FIG. 4, a lifting support part 54 is formed on the movable support part 55 so as to be capable of being raised and lowered. The lifting support portion 54 has an upper surface 54u that slopes obliquely downward in a direction away from the adsorption holding portion 21 (rearward in this example).

As shown in FIG. 3, the lower surface brush 51 is formed of, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge in which abrasive particles are dispersed, and has a circular cleaning surface that can be contacted with the lower surface of the substrate W. have In addition, the lower surface brush 51 is positioned on the upper surface 54u of the lifting support portion 54 so that the cleaning surface faces upward and the cleaning surface can rotate around an axis that extends in the vertical direction through the center of the cleaning surface. It is mounted on. The area of the cleaning surface of the lower surface brush 51 is larger than the area of the adsorption surface of the suction holding portion 21.

Each of the two liquid nozzles 52 is located near the lower surface brush 51 and is mounted on the upper surface 54u of the lifting support portion 54 so that the liquid discharge port faces upward. A lower surface cleaning liquid supply unit 56 (FIG. 5) is connected to the liquid nozzle 52. The lower surface cleaning liquid supply unit 56 supplies cleaning liquid to the liquid nozzle 52. The liquid nozzle 52 supplies the cleaning liquid supplied from the lower surface cleaning liquid supply unit 56 to the lower surface of the substrate W when the lower surface brush 51 cleans the substrate W. In this embodiment, pure water (deionized water) is used as the cleaning liquid supplied to the liquid nozzle 52. In addition, as the cleaning liquid supplied to the liquid nozzle 52, instead of pure water, carbonated water, ozone water, hydrogen water, electrolytic ion water, SC1 (mixed solution of ammonia and hydrogen peroxide water), or TMAH (tetramethylammonium hydroxide) can be used. there is.

The gas blowing portion 53 is a slit-shaped gas blowing nozzle having a gas blowing port extending in one direction. The gas ejection portion 53 is located between the lower brush 51 and the adsorption holding portion 21 when viewed in plan, and is mounted on the upper surface 54u of the lifting support portion 54 so that the gas ejection port faces upward. . A blowing gas supply part 57 (FIG. 5) is connected to the gas blowing part 53. The blowing gas supply unit 57 supplies gas to the gas blowing part 53. In this embodiment, nitrogen gas is used as the gas supplied to the gas blowing section 53. The gas blowing portion 53 supplies the gas supplied from the blowing gas supply portion 57 to the substrate (W) when cleaning the substrate W with the lower surface brush 51 and drying the lower surface of the substrate W to be described later. ) Spray on the bottom of the. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. As the gas supplied to the gas blowing section 53, an inert gas such as argon gas or helium gas can be used instead of nitrogen gas.

The lower surface brush rotation drive unit 55a includes a motor and rotates the lower surface brush 51 when cleaning the substrate W with the lower surface brush 51 . The lower surface brush lifting drive unit 55b includes a step motor or an air cylinder, and raises and lowers the lifting support part 54 with respect to the moving support part 55. The lower brush movement drive unit 55c includes a motor and moves the movement support unit 55 on the movable base 32 in the Y direction. Here, the position of the lower holding device 20 on the movable pedestal 32 is fixed. Therefore, when the movable support part 55 is moved in the Y direction by the lower brush movement drive unit 55c, the movable support part 55 moves relative to the lower holding device 20. In the following description, the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable pedestal 32 is called the approach position, and the position of the lower surface cleaning device 50 when it is closest to the lower holding device 20 on the movable pedestal 32 is called the approach position. The position of the bottom cleaning device 50 when it falls the most is called the separation position.

A cup device 60 is further formed in the central portion of the bottom surface portion 2a. The cup device 60 includes a processing cup 61 and a cup driving unit 62. The processing cup 61 is formed to be raised and lowered so as to surround the lower holding device 20 and the pedestal device 30 when viewed from the top. In Fig. 4, the processing cup 61 is indicated by a dotted line. The cup driving unit 62 moves the processing cup 61 between the lower cup position and the upper cup position depending on which part of the lower surface of the substrate W is cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the processing cup 61 is located below the substrate W held by the suction holding portion 21. Additionally, the upper cup position is a height position where the upper end of the processing cup 61 is located above the suction holding portion 21.

At a height above the processing cup 61, a pair of upper holding devices 10A, 10B are installed to face each other across the pedestal device 30 when viewed from the top. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive unit 13A, and an upper chuck drive unit 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive unit 13B, and an upper chuck drive unit 14B.

The lower chucks 11A, 11B are arranged symmetrically with respect to a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding portion 21 when viewed from the top, and are movable in the X direction within a common horizontal plane. It is installed properly. Each of the lower chucks 11A, 11B has two support pieces capable of supporting the lower surface peripheral portion of the substrate W from below the substrate W. The lower chuck driving units 13A and 13B move the lower chucks 11A and 11B so that the lower chucks 11A and 11B approach each other or move the lower chucks 11A and 11B away from each other.

The upper chucks 12A, 12B, like the lower chucks 11A, 11B, are arranged symmetrically with respect to a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding portion 21 when viewed from the top, and have a common It is installed to be movable in the X direction within the horizontal plane. Each of the upper chucks 12A, 12B has two holding pieces configured to be capable of holding the outer peripheral ends of the substrate W by abutting against two portions of the outer peripheral ends of the substrate W. The upper chuck driving units 14A, 14B move the upper chucks 12A, 12B so that the upper chucks 12A, 12B approach each other or the upper chucks 12A, 12B move away from each other.

As shown in FIG. 3, on one side of the processing cup 61, an upper surface cleaning device 70 is installed so as to be located near the upper holding device 10B when viewed from the top. The top surface cleaning device 70 includes a rotation support shaft 71, an arm 72, a spray nozzle 73, and a top surface cleaning drive unit 74.

The rotation support shaft 71 is supported on the bottom surface portion 2a by the top surface cleaning drive unit 74 so as to extend in the vertical direction and to be able to move up and down and to be rotatable. As shown in FIG. 4 , the arm 72 is installed to extend in the horizontal direction from the upper end of the rotation support shaft 71 at a position above the upper holding device 10B. A spray nozzle 73 is attached to the distal end of the arm 72.

A top surface cleaning fluid supply unit 75 (FIG. 5) is connected to the spray nozzle 73. The top cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

Additionally, instead of pure water, carbonated water, ozone water, hydrogen water, electrolyzed ion water, SC1 (mixed solution of ammonia and hydrogen peroxide water), or TMAH (tetramethylammonium hydroxide) can be used as the cleaning liquid supplied to the spray nozzle 73. there is. Additionally, as the gas supplied to the spray nozzle 73, an inert gas such as argon gas or helium gas can be used instead of nitrogen gas.

The top surface cleaning drive unit 74 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotation support shaft 71 and rotates the rotation support shaft 71. According to the above configuration, the entire upper surface of the substrate W can be cleaned by moving the spray nozzle 73 in an arc on the upper surface of the substrate W, which is adsorbed and held and rotated by the suction holding portion 21. there is.

As shown in FIG. 3, on the other side of the processing cup 61, an end cleaning device 80 is installed so as to be located near the upper holding device 10A when viewed from the top. The end cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush drive unit 84.

The rotation support shaft 81 is supported on the bottom surface portion 2a by the bevel brush drive portion 84 so as to extend in the vertical direction and to be capable of being raised and lowered and rotatable. As shown in FIG. 4 , the arm 82 is installed to extend in the horizontal direction from the upper end of the rotation support shaft 81 at a position above the upper holding device 10A. At the distal end of the arm 82, a bevel brush 83 is provided so as to protrude downward and to be rotatable around an axis in the vertical direction.

The bevel brush 83 is formed, for example, of a PVA sponge or a PVA sponge in which abrasive particles are dispersed, and the upper half has an inverted cone-trapezoid shape and the lower half has a cone-trapezoid shape. According to this bevel brush 83, the outer peripheral edge of the substrate W can be cleaned in the central portion in the vertical direction of the outer peripheral surface.

The bevel brush drive unit 84 includes one or more pulse motors, air cylinders, etc., and raises and lowers the rotation support shaft 81 and rotates the rotation support shaft 81. According to the above configuration, the entire outer peripheral end of the substrate W is brought into contact with the central portion of the outer peripheral surface of the bevel brush 83 to the outer peripheral end of the substrate W, which is adsorbed and held and rotated by the suction holding portion 21. It can be cleaned.

Here, the bevel brush drive unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 formed at the distal end of the arm 82 around an axis in the vertical direction. Therefore, when cleaning the outer peripheral edge of the substrate W, the bevel brush 83 rotates, thereby improving the cleaning power of the bevel brush 83 at the outer peripheral edge of the substrate W.

(3) Control system of substrate processing equipment

FIG. 5 is a block diagram showing the configuration of the control system of the substrate processing apparatus 100. As above, the control device 170 in FIG. 1 includes a CPU, RAM, ROM, and a storage device. RAM is used as the CPU's work area. ROM stores system programs. The memory device stores the substrate processing program.

As shown in FIG. 5, the control device 170 includes, as functional units, a chuck control unit 171, an adsorption control unit 172, a pedestal control unit 173, a delivery control unit 174, a lower surface cleaning control unit 175, and a cup. It includes a control unit 176, a top cleaning control unit 177, a bevel cleaning control unit 178, a loading/unloading control unit 179, and a conveyance control unit 180, 181. The functional portion of the control device 170 is realized by the CPU executing the substrate processing program stored in the memory device on the RAM. Part or all of the functional portion of the control device 170 may be realized by hardware such as an electronic circuit.

Chuck control unit 171, adsorption control unit 172, pedestal control unit 173, water treatment control unit 174, lower surface cleaning control unit 175, cup control unit 176, upper cleaning control unit 177, bevel cleaning control unit 178. and the loading/unloading control unit 179 controls the operation of each substrate cleaning device 1. Specifically, the chuck control unit 171 includes lower chuck driving units 13A and 13B in order to receive the substrate W loaded into each substrate cleaning device 1 and hold it at a position above the suction holding unit 21. ) and the upper chuck driving units 14A, 14B.

The adsorption control unit 172 controls the adsorption-holding drive unit 22 in order to adsorb and hold the substrate W by the adsorption-holding unit 21 and rotate the adsorbed-held substrate W. The pedestal control unit 173 controls the pedestal drive unit 33 to move the movable pedestal 32 with respect to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 174 controls the substrate W between the height position of the substrate W held by the upper holding devices 10A, 10B and the height position of the substrate W held by the suction holding unit 21. ), the pin lifting and lowering drive unit 43 is controlled.

In order to clean the lower surface of the substrate W, the lower surface cleaning control unit 175 includes a lower surface brush rotation driving unit 55a, a lower surface brush lifting and lowering driving unit 55b, a lower surface brush moving driving unit 55c, a lower surface cleaning liquid supply unit 56, and The blowing gas supply unit 57 is controlled. The cup control unit 176 uses a cup driving unit 62 to collect the cleaning liquid sprayed from the substrate W into the processing cup 61 when cleaning the substrate W held by the suction holding unit 21. control.

The top cleaning control unit 177 controls the top cleaning drive unit 74 and the top cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the suction holding unit 21. The bevel cleaning control unit 178 controls the bevel brush drive unit 84 in order to clean the outer peripheral edge of the substrate W held by the suction holding unit 21. The loading/unloading control unit 179 operates the shutter drive unit 92 to open and close the loading/unloading port 2x of the unit casing 2 during loading and unloading of the substrate W in each substrate cleaning device 1. ) is controlled.

The transport control unit 180 controls the transport drive unit 220 to transport the substrate W between the plurality of carriers C and the plurality of substrate placement units PASS1 and PASS2. The transport control unit 181 controls the transport drive unit 320 to transport the substrate W between the plurality of substrate placement units PASS1 and PASS2 and the plurality of substrate cleaning devices 1.

In the example of FIG. 5 , the control device 170 controls the operations of the plurality of substrate cleaning devices 1 in addition to the operations of the indexer robot 200 and the main robot 300, but the embodiment does not depend on this. It is not limited. Each substrate cleaning device 1 may have a control device for controlling the operation of the substrate cleaning device 1 in question. In this case, the control device 170 includes a chuck control unit 171, a suction control unit 172, a pedestal control unit 173, a delivery control unit 174, a lower surface cleaning control unit 175, a cup control unit 176, and an upper surface cleaning control unit ( 177), the bevel cleaning control unit 178, and the loading/unloading control unit 179 do not need to be included.

(4) Operation of the substrate cleaning device

In the plurality of substrate cleaning devices 1, cleaning processes are sequentially performed on the plurality of substrates W each conveyed by the hands Ma to Md of the main robot 300 in FIG. 1. Hereinafter, the operation of the substrate cleaning device 1 for the substrate W conveyed by the hand Ma will be described, but the operation of the substrate cleaning device 1 for the substrate W conveyed by the hands Mb to Md is explained below. The operation of is also the same as the operation of the substrate cleaning device 1 with respect to the substrate W transported by the hand Ma.

6 to 17 are schematic diagrams for explaining an example of the operation of the substrate cleaning device 1 in FIG. 3. In each of FIGS. 6 to 17, a top view of the substrate cleaning device 1 is shown at the top. Additionally, a side view of the lower retaining device 20 and its peripheral portion as seen along the Y direction is shown in the middle, and a side view of the lower retaining device 20 and its peripheral portion as viewed along the X direction is shown at the lower portion. The side view in the middle corresponds to the side view along line A-A in FIG. 3, and the side view at the bottom corresponds to the side view along line B-B in FIG. 3. Additionally, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning device 1, the expansion ratios of some components are different between the top plan view and the middle and bottom side views. 6 to 17, the processing cup 61 is indicated by a two-dot chain line, and the external shape of the substrate W is indicated by a thick one-dot chain line.

In the initial state before the substrate W is loaded into the substrate cleaning device 1, the shutter 91 of the opening and closing device 90 blocks the loading/unloading opening 2x. Moreover, as shown in FIG. 3, the lower chucks 11A and 11B are maintained in a state where the distance between the lower chucks 11A and 11B is sufficiently larger than the diameter of the substrate W. In addition, the upper chucks 12A and 12B are also maintained in a state where the distance between the upper chucks 12A and 12B is sufficiently larger than the diameter of the substrate W. Additionally, the movable pedestal 32 of the pedestal device 30 is arranged so that the center of the suction holding portion 21 is located at the center of the processing cup 61 when viewed from the top. Additionally, on the movable pedestal 32, the lower surface cleaning device 50 is arranged at an accessible position. Additionally, the lifting support portion 54 of the lower surface cleaning device 50 is in a state in which the cleaning surface (upper end portion) of the lower surface brush 51 is located below the suction holding portion 21. Additionally, the water transfer device 40 is in a state in which the plurality of support pins 41 are located below the suction holding portion 21. Additionally, in the cup device 60, the processing cup 61 is at the lower cup position. In the following description, the center position of the processing cup 61 when viewed from the plane is called the plane reference position rp. In addition, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding portion 21 is at the plane reference position rp when viewed in a plan view is called the first horizontal position.

The substrate W before processing is loaded into the unit casing 2 of the substrate cleaning device 1. Specifically, immediately before loading the substrate W, the shutter 91 opens the loading/unloading port 2x. Then, as indicated by the thick solid arrow a1 in FIG. 6, the hand Ma of the main robot 300 in FIG. 1 passes through the loading/unloading port 2x and enters the unit casing 2, and enters the unit casing 2. The substrate (W) is handed over to approximately the center position in (2). At this time, the substrate W held by the hand Ma is positioned between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B, as shown in FIG. 6 .

Next, as indicated by the thick solid arrow a2 in FIG. 7, the lower chucks 11A, 11B approach each other so that the plurality of support pieces of the lower chucks 11A, 11B are located below the peripheral edge of the lower surface of the substrate W. . In this state, the hand (Ma) is lowered. Accordingly, a plurality of portions of the lower surface peripheral portion of the substrate W held by the hand Ma are supported by a plurality of support pieces of the lower chucks 11A, 11B. The position of the substrate W at this time is the loading position. At this point, there is a substrate W that was previously loaded into the unit casing 2 and whose processing has been completed at the unloading position. Therefore, after handing the substrate W to the lower chucks 11A and 11B at the loading position as described above, the hand Ma receives the processed substrate W at the loading position and removes it from the unit casing 2. do. After the hand Ma is withdrawn, the shutter 91 closes the loading/unloading port 2x.

Next, as shown by the thick solid arrow a3 in FIG. 8, the upper chucks 12A and 12B approach each other so that the plurality of holding pieces of the upper chucks 12A and 12B come into contact with the outer peripheral end of the substrate W. The plurality of holding pieces of the upper chucks 12A, 12B abut against the plurality of portions of the outer peripheral ends of the substrate W, so that the substrate W supported by the lower chucks 11A, 11B is moved by the upper chucks 12A, 12B. more maintained. In this way, the center of the substrate W held by the upper holding devices 10A, 10B overlaps or almost overlaps the planar reference position rp when viewed from the top. In addition, as indicated by the thick solid arrow a4 in FIG. 8, the movable base is positioned so that when the suction holding portion 21 deviates a predetermined distance from the plane reference position rp, the center of the brush 51 is located at the plane reference position rp. (32) moves forward from the first horizontal position. At this time, the position of the movable pedestal 32 located on the floor portion 2a is called the second horizontal position.

Next, as indicated by the thick solid arrow a5 in FIG. 9 , the lifting support portion 54 rises so that the cleaning surface of the lower surface brush 51 contacts the central region of the lower surface of the substrate W. Additionally, as shown by the thick solid arrow a6 in FIG. 9, the lower surface brush 51 rotates (rotates) around the axis in the vertical direction. Accordingly, contaminants adhering to the central area of the lower surface of the substrate W are physically peeled off by the lower surface brush 51.

At the bottom of Fig. 9, an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W is shown in a partially enlarged view. As shown in the partial enlarged view, with the lower surface brush 51 in contact with the substrate W, the liquid nozzle 52 and the gas jet portion 53 are positioned close to the lower surface of the substrate W. maintain. At this time, the liquid nozzle 52 discharges the cleaning liquid toward the lower surface of the substrate W at a position near the lower surface brush 51, as indicated by the white arrow a51. Accordingly, the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W is guided to the contact portion between the lower surface brush 51 and the substrate W, thereby removing the liquid from the lower surface of the substrate W by the lower surface brush 51. The removed contaminants are washed away by the cleaning solution. In this way, in the lower surface cleaning device 50, the liquid nozzle 52 is mounted on the lifting support portion 54 together with the lower surface brush 51. Accordingly, the cleaning liquid can be efficiently supplied to the cleaning portion of the lower surface of the substrate W by the lower surface brush 51. Accordingly, the consumption of the cleaning liquid is reduced and excessive scattering of the cleaning liquid is suppressed.

Additionally, the rotational speed of the lower surface brush 51 when cleaning the lower surface of the substrate W is such that the cleaning liquid supplied from the liquid nozzle 52 to the lower surface of the substrate W does not scatter to the side of the lower surface brush 51. It is maintained at a speed that does not occur.

Here, the upper surface 54u of the lifting support part 54 is inclined diagonally downward in the direction away from the suction holding part 21. In this case, when the cleaning liquid containing contaminants falls from the lower surface of the substrate W onto the lifting support portion 54, the cleaning liquid received by the upper surface 54u flows in a direction away from the adsorption holding portion 21. It is induced.

In addition, when cleaning the lower surface of the substrate W using the lower surface brush 51, the gas blowing portion 53 is in contact with the lower surface brush 51, as indicated by the white arrow a52 in the partially enlarged view of FIG. 9. Gas is sprayed from a position between the adsorption holding portions 21 toward the lower surface of the substrate W. In the present embodiment, the gas injection portion 53 is mounted on the lifting support portion 54 so that the gas injection port extends in the X direction. In this case, when gas is injected from the gas blowing portion 53 to the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding portion 21. Accordingly, when cleaning the lower surface of the substrate W with the lower surface brush 51, the cleaning liquid containing contaminants is prevented from scattering toward the adsorption holding portion 21. Therefore, when cleaning the lower surface of the substrate W with the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the adsorption holding part 21, and the adsorption surface of the adsorption holding part 21 is It is kept clean.

Additionally, in the example of FIG. 9 , the gas ejection unit 53 ejects gas obliquely upward from the gas ejection unit 53 toward the lower surface brush 51, as indicated by the white arrow a52. The form is not limited to this. The gas blowing portion 53 may spray gas along the Z direction from the gas blowing portion 53 toward the lower surface of the substrate W.

Next, in the state of FIG. 9, when cleaning of the central area of the lower surface of the substrate W is completed, the rotation of the lower surface brush 51 is stopped, and the cleaning surface of the lower surface brush 51 is moved to a predetermined distance from the substrate W. To separate them, the lifting support portion 54 is lowered. Additionally, discharge of the cleaning liquid from the liquid nozzle 52 to the substrate W is stopped. At this time, the injection of gas from the gas injection unit 53 to the substrate W continues.

After that, as shown by the thick solid arrow a7 in FIG. 10, the movable base 32 moves rearward so that the suction holding portion 21 is located at the plane reference position rp. That is, the movable pedestal 32 moves from the second horizontal position to the first horizontal position. At this time, as the gas is continuously sprayed from the gas blowing portion 53 to the substrate W, the central region of the lower surface of the substrate W is sequentially dried by the gas curtain.

Next, as shown by the thick solid line arrow a8 in FIG. 11, the lifting support portion 54 is lowered so that the cleaning surface of the lower brush 51 is positioned below the suction surface (upper end) of the suction holding portion 21. do. In addition, as shown by the thick solid arrow a9 in FIG. 11, the upper chucks 12A and 12B are spaced apart from each other so that the plurality of holding pieces of the upper chucks 12A and 12B are spaced apart from the outer peripheral end of the substrate W. At this time, the substrate W is supported by the lower chucks 11A and 11B.

After that, as indicated by the thick solid arrow a10 in FIG. 11, the pin connecting member 42 rises so that the upper ends of the plurality of support pins 41 are located slightly above the lower chucks 11A and 11B. Accordingly, the substrate W supported by the lower chucks 11A, 11B is received by the plurality of support pins 41.

Next, as indicated by the thick solid arrow a11 in FIG. 12, the lower chucks 11A and 11B move away from each other. At this time, the lower chucks 11A, 11B move to a position where they do not overlap the substrate W supported by the plurality of support pins 41 when viewed from the top. Accordingly, the upper holding devices 10A, 10B all return to their initial states.

Next, as shown by the thick solid line arrow a12 in FIG. 13, the pin connecting member 42 is lowered so that the upper ends of the plurality of support pins 41 are located below the suction holding portion 21. Accordingly, the substrate W supported on the plurality of support pins 41 is received by the suction holding portion 21. In this state, the adsorption holding portion 21 adsorbs and holds the central region of the lower surface of the substrate W. In this way, the center of the substrate W held by the lower holding device 20 overlaps or almost overlaps the plane reference position rp when viewed from the top. The position of the substrate W at this time is the unloading position. Therefore, in this example, the unloading position is below the loading position. Simultaneously with the lowering of the pin connecting member 42 or after the lowering of the pin connecting member 42 is completed, the processing cup 61 rises from the lower cup position to the upper cup position, as indicated by the thick solid line arrow a13 in FIG. 13. . Accordingly, the substrate W in the unloading position is located below the upper end of the processing cup 61.

Next, as shown by the thick solid line arrow a14 in FIG. 14, the suction holding portion 21 rotates around the vertical axis (the axis of the rotation axis of the suction holding driving portion 22). Accordingly, the substrate W held by the adsorption holding portion 21 rotates in the horizontal position.

Next, the rotation support shaft 71 of the top surface cleaning device 70 rotates and descends. Accordingly, as indicated by the thick solid line arrow a15 in FIG. 14, the spray nozzle 73 moves to a position above the substrate W, and the distance between the spray nozzle 73 and the substrate W is set to a predetermined distance. Descend as far as possible. In this state, the spray nozzle 73 sprays a mixed fluid of the cleaning liquid and gas onto the upper surface of the substrate W. Additionally, the rotation support shaft 71 rotates. Accordingly, as indicated by the thick solid line arrow a16 in FIG. 14, the spray nozzle 73 moves at a position above the rotating substrate W. By spraying the mixed fluid onto the entire upper surface of the substrate W, the entire upper surface of the substrate W is cleaned.

Additionally, when cleaning the upper surface of the substrate W using the spray nozzle 73, the rotation support shaft 81 of the end cleaning device 80 also rotates and moves down. Accordingly, as indicated by the thick solid line arrow a17 in FIG. 14, the bevel brush 83 moves to a position above the outer peripheral end of the substrate W. Additionally, the central portion of the outer peripheral surface of the bevel brush 83 is lowered so as to contact the outer peripheral end of the substrate W. In this state, the bevel brush 83 rotates (rotates) around the vertical axis. Accordingly, the contaminants adhering to the outer peripheral end of the substrate W are physically peeled off by the bevel brush 83. Contaminants peeled off from the outer peripheral end of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed onto the substrate W from the spray nozzle 73.

Additionally, when cleaning the upper surface of the substrate W with the spray nozzle 73, the lifting support portion 54 rises so that the cleaning surface of the lower surface brush 51 contacts the outer region of the lower surface of the substrate W. Additionally, as shown by the thick solid line arrow a18 in FIG. 14, the lower surface brush 51 rotates (rotates) around the axis in the vertical direction. Additionally, the liquid nozzle 52 discharges the cleaning liquid toward the lower surface of the substrate W, and the gas blowing portion 53 sprays gas toward the lower surface of the substrate W. In this state, as indicated again by the thick solid arrow a19 in FIG. 14, the movable support portion 55 advances and retreats between the approach position and the separation position on the movable pedestal 32. In this way, the lower surface brush 51 is moved in the horizontal direction while in contact with the lower surface of the substrate W by the movable support portion 55, so that the lower surface of the substrate W is cleaned by the lower surface brush 51. The possible range is expanded. Accordingly, the entire outer surface area of the lower surface of the substrate W, which is adsorbed and held by the adsorption holding portion 21 and rotated, is cleaned by the lower surface brush 51.

Next, when cleaning of the upper surface, outer peripheral end, and lower surface outer region of the substrate W is completed, spraying of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. Additionally, as indicated by the thick solid line arrow a20 in FIG. 15, the spray nozzle 73 moves to a position on one side of the processing cup 61 (position in the initial state). Additionally, as shown by the thick solid line arrow a21 in FIG. 15, the bevel brush 83 moves to a position on the other side of the processing cup 61 (position in the initial state). Additionally, the rotation of the lower surface brush 51 is stopped, and the lifting support portion 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance away from the substrate W. Additionally, the discharge of the cleaning liquid from the liquid nozzle 52 to the substrate W and the injection of gas from the gas blowing portion 53 to the substrate W are stopped. In this state, the adsorption holding portion 21 rotates at high speed, so that the cleaning liquid adhering to the substrate W is shaken off, and the entire substrate W is dried.

Next, as indicated by the thick solid line arrow a22 in FIG. 16, the processing cup 61 is lowered from the upper cup position to the lower cup position. Accordingly, the substrate W in the unloading position is located above the upper end of the processing cup 61. In addition, in preparation for the new board W being loaded into the unit casing 2, the lower chucks 11A, 11B are moved to a position where the new board W can be supported, as indicated by the thick solid arrow a23 in FIG. 16. close to each other

Finally, the substrate W is carried out from within the unit casing 2 of the substrate cleaning device 1. Specifically, just before the substrate W is unloaded, the shutter 91 opens the loading/unloading port 2x. At this point, the substrate W does not exist at the loading position. Therefore, the hand Ma of the main robot 300 in FIG. 1 passes through the loading/unloading port 2x and enters the unit casing 2 while holding the substrate W before the next processing, thereby processing it. Pass the previous board (W) to the loading location. Thereafter, as indicated by the thick solid line arrow a24 in FIG. 17, the hand Ma receives the processed substrate W at the unloading position and ejects it from the unit casing 2. After the hand Ma is withdrawn, the shutter 91 closes the loading/unloading port 2x.

(5) Substrate processing

18 and 19 are flow charts showing substrate processing by the control device 170 in FIG. 5. The substrate processing in FIGS. 18 and 19 is performed by the CPU of the control device 170 executing the substrate processing program stored in the memory device on the RAM. Hereinafter, substrate processing will be explained using the flow charts of FIGS. 18 and 19.

In addition, in the flow charts of Figs. 18 and 19, the operation of the hand Ma of the main robot 300 is mainly described, but the operation of the hands Mb to Md is also the same as the operation of the hand Ma. In addition, in the flow charts of FIGS. 18 and 19, description of the operation of the indexer robot 200 is omitted.

First, the main robot 300 carries out the substrate W before processing from the substrate placing unit PASS2 using each hand Ma to Md (step S1). Next, the main robot 300 causes the hand Ma to enter the unit casing 2 of the corresponding substrate cleaning device 1 (step S2).

Subsequently, the main robot 300 passes the unprocessed substrate W unloaded from the substrate placing unit PASS2 in step S1 to the loading position using the hand Ma (step S3). At this time, the substrate W does not exist at the unloading position. Therefore, the main robot 300 ejects the hand Ma from the unit casing 2 of the corresponding substrate cleaning device 1 (step S4). Additionally, the main robot 300 sequentially performs the same processing as steps S2 to S4 with respect to the corresponding substrate cleaning device 1 using the hands Mb to Mc.

Next, each substrate cleaning device 1 performs the cleaning process shown in FIGS. 6 to 17 (step S5). Additionally, the main robot 300 carries out the substrate W before processing from the substrate placing unit PASS2 using each hand Ma to Md (step S6). Step S5 and step S6 may be executed in parallel.

After completion of the cleaning process, the main robot 300 causes the hand Ma to enter the unit casing 2 of the corresponding substrate cleaning device 1 (step S7). Thereafter, the main robot 300 passes the unprocessed substrate W unloaded from the substrate placing unit PASS2 in step S6 to the loading position using the hand Ma (step S8). At this time, the substrate W that has been cleaned in step S5 or step S11 described later exists at the unloading position.

Therefore, the main robot 300 receives the processed substrate W from the unloading position using the hand Ma (step S9). Thereafter, the main robot 300 ejects the hand Ma from the unit casing 2 of the corresponding substrate cleaning device 1 (step S10). Additionally, the main robot 300 sequentially performs the same processing as steps S7 to S10 with respect to the corresponding substrate cleaning device 1 using the hands Mb to Mc.

Next, each substrate cleaning device 1 performs the cleaning process shown in FIGS. 6 to 17 (step S11). Additionally, the main robot 300 loads each processed substrate W received from the unloading position in step S9 into the substrate placing unit PASS1 using the hands Ma to Md (step S12). Step S11 and step S12 may be executed in parallel.

Subsequently, the control device 170 determines whether to end substrate processing (step S13). The control device 170 may determine that substrate processing is terminated when a termination command is given by the user. Alternatively, the control device 170 may determine that the substrate processing is terminated when the cleaning processing for a predetermined number of substrates W has been performed. When it is determined that the substrate processing is finished, the control device 170 returns to step S6. In this case, steps S6 to S13 are repeated until it is determined that the substrate processing is finished.

When it is determined that the substrate processing is finished, the main robot 300 causes the hand Ma to enter the unit casing 2 of the corresponding substrate cleaning device 1 (step S14). At this time, the substrate W that has been cleaned in step S11 is present at the unloading position. Therefore, the main robot 300 receives the processed substrate W from the unloading position using the hand Ma (step S15). Thereafter, the main robot 300 ejects the hand Ma from the unit casing 2 of the corresponding substrate cleaning device 1 (step S16). Additionally, the main robot 300 sequentially performs the same processing as steps S14 to S16 with respect to the corresponding substrate cleaning device 1 using the hands Mb to Mc.

Finally, the main robot 300 loads each processed substrate W received from the unloading position in step S15 into the substrate placing unit PASS1 using the hands Ma to Md (step S17). Accordingly, the substrate processing ends.

(6) Effect

In the substrate processing apparatus 100 according to the present embodiment, the hands Ma to Md of the main robot 300 enter the corresponding substrate cleaning apparatus 1. The substrate W before processing held by each hand Ma to Md is passed to the loading position of the corresponding substrate cleaning device 1. After the unprocessed substrate W is delivered to the loading position, the processed substrate W is received from the corresponding unloading position of the substrate cleaning device 1 by each hand Ma to Md. After the processed substrate W is received from the unloading position, each hand Ma to Md is discharged from the corresponding substrate cleaning device 1. Each substrate cleaning device 1 performs processing on the substrate W before processing.

According to this configuration, even when the substrate W after processing exists in each substrate cleaning device 1, the substrate W before processing can be brought into the substrate cleaning device 1. Therefore, after passing the unprocessed substrate W to the corresponding substrate cleaning device 1 by the hands Ma to Md, the processed substrate W is received by the same hands Ma to Md. It becomes possible. Therefore, in order to receive the processed substrate W, there is no need to form a hand that does not hold the substrate W. In addition, the operation of handing over the substrate W before processing and receiving the substrate W after processing is continuously performed to the plurality of substrate cleaning devices 1 by the plurality of hands Ma to Md. It becomes possible. Accordingly, throughput can be further improved.

In addition, in each substrate cleaning device 1, the substrate W brought into the loading position is held by the upper holding devices 10A, 10B, and the central region of the lower surface is cleaned by the lower surface cleaning device 50. Processing is carried out. Next, the substrate W is handed over to the lower holding device 20 by the transfer device 40 . Subsequently, with the substrate W held by the lower holding device 20, the lower surface cleaning device 50 performs a cleaning process on the outer region of the lower surface. Accordingly, the cleaned substrate W can be unloaded from the unloading position while efficiently cleaning the entire lower surface of the substrate W. Since the loading and unloading positions are arranged to be aligned in the vertical direction, the installation floor area (footprint) of the substrate cleaning device 1 can be reduced.

In addition, as above, since the substrate is handed over and received by one hand for one substrate cleaning device 1, if a conveyance defect such as a crack in the substrate W occurs due to a defect in the hand, Therefore, the hand in which the problem is occurring can be easily identified. Additionally, since throughput is improved, there is no need to increase the transfer speed of the main robot 300. Accordingly, the stability of conveyance can be improved.

(7) Other embodiments

(a) In the above embodiment, the unloading position is formed below the loading position, but the embodiment is not limited to this. The unloading position may be formed above the loading position. For example, the loading position may be formed at the center of the suction holding portion 21 of the lower holding device 20, and the unloading position may be formed between the upper holding devices 10A and 10B.

In this configuration, the substrate W is delivered to the loading position, and while initially adsorbed and held by the lower holding device 20, its lower central region, outer peripheral edge, and upper surface are cleaned. After that, the substrate W held by the lower holding device 20 is received by the upper holding devices 10A, 10B and held at the unloading position. In this state, the central area of the lower surface of the substrate W is cleaned. The substrate W after cleaning is carried out of the unit casing 2 from the upper holding devices 10A, 10B.

Alternatively, the loading and unloading locations do not need to be arranged in a vertical direction. The loading and unloading positions may be arranged, for example, to line up in the horizontal direction.

(b) In the above embodiment, the receiving device 40 is a receiving unit, and the substrate W is exchanged between the upper holding devices 10A, 10B and the lower holding device 20, but the embodiment is limited to this. It doesn't work. When at least one of the upper holding devices 10A, 10B and the lower holding device 20 is configured to be capable of being raised and lowered, the receiving device 40 does not need to be installed. In this case, at least one of the upper holding devices 10A, 10B and the lower holding devices 20 is a receiving portion, and the receiving portion is raised and lowered to move the substrate between the upper holding devices 10A, 10B and the lower holding devices 20. (W) This is given and received.

(c) In the above embodiment, the main robot 300 has four hands (Ma to Md), but the embodiment is not limited to this. The main robot 300 may have 2, 3, or 5 or more hands. In addition, it is preferable that the substrate cleaning device 1 is provided in the substrate processing apparatus 100 to correspond to the hand of the main robot 300. Alternatively, the main robot 300 may have one hand. Even in this case, the throughput per hand can be improved.

(d) In the above embodiment, a substrate cleaning device 1 that performs cleaning processing is installed as a processing unit, but the embodiment is not limited to this. As a processing unit, a heat treatment device that performs heat treatment, a developing device that performs development, or a coating device that performs application may be installed. Additionally, the heat treatment apparatus may be configured to be able to perform heat treatment and cooling treatment as different treatments on the substrate. The developing device may be configured to perform positive development and negative development as different processes on the substrate.

(e) In the above embodiment, different processes are performed on the substrate W held by the upper holding devices 10A, 10B and the substrate W held by the lower holding device 20. The form is not limited to this. The same process may be performed on the substrate W held by the upper holding devices 10A, 10B and the substrate W held by the lower holding device 20. Alternatively, no processing needs to be performed on the substrate W held by the upper holding devices 10A, 10B or the substrate W held by the lower holding device 20.

(f) In the above embodiment, the substrate processing device 100 includes a control device 170 that controls the substrate cleaning device 1 and the main robot 300, etc., but the embodiment is not limited to this. When the substrate cleaning device 1 and the main robot 300 are configured to be controllable by an information processing device external to the substrate processing device 100, the substrate processing device 100 includes a control device 170. You do not have to do.

(8) Correspondence between each component of the claims and each part of the embodiment

Hereinafter, corresponding examples of each element of the claims and each element of the embodiment will be described, but the present invention is not limited to the examples below. As each element of a claim, various other elements having the structure or function described in the claim may be used.

In the above embodiment, the substrate W is an example of a substrate, the substrate cleaning device 1 is an example of a processing unit, the hands Ma to Md are examples of a transport holding unit, and the main robot 300 is an example of a substrate transport. This is an example of a unit, and the substrate processing apparatus 100 is an example of a substrate processing apparatus. The upper holding devices 10A, 10B are examples of the first substrate holding portions, the lower surface cleaning device 50 is an example of the first and second processing portions, and the lower holding device 20 is an example of the second substrate holding portions. Device 40 is an example of a receiver.

Claims (7)

A processing unit having an loading position where a substrate before processing is loaded and a loading location where a substrate after processing is loaded, and processing the substrate before processing,
A substrate transport unit having a transport holding unit configured to selectively hold the substrate before and after the processing,
The transfer holding section holds the substrate before processing, enters the processing unit, delivers the substrate before processing to the loading position, receives the substrate after processing from the loading position, and receives the substrate after processing. A substrate processing device being removed from the processing unit. According to claim 1,
The substrate processing apparatus wherein the loading position and the unloading position are arranged to be aligned in a vertical direction. The method of claim 1 or 2,
The processing unit is formed in plural,
A plurality of the transport holding units are formed to respectively correspond to a plurality of processing units,
Each of the plurality of substrate transport units enters the corresponding processing unit, delivers the unprocessed substrate to the loading position, then receives the processed substrate from the unloading position, and receives the processed substrate from the unprocessed substrate, and then receives the processed substrate from the unprocessed substrate to the loading position. A substrate processing device being removed from a processing unit. The method of claim 1 or 2,
The processing unit is,
a first substrate holding portion that holds the loaded substrate at the loading position;
a first processing unit that processes the substrate held by the first substrate holding unit;
a second substrate holding portion that holds the substrate loaded from the unloading position;
a receiving unit that passes the substrate processed by the first processing unit from the first substrate holding unit to the second substrate holding unit;
A substrate processing apparatus comprising a second processing unit that processes a substrate held by the second substrate holding unit. According to claim 4,
A substrate processing apparatus wherein the first processing unit and the second processing unit perform different processes on a substrate. According to claim 5,
The first processing unit performs a cleaning process on the central area of the lower surface of the substrate,
A substrate processing apparatus, wherein the second processing unit performs a cleaning process on an area outside the lower surface surrounding the central area of the lower surface of the substrate. A step of allowing the transfer holding part of the substrate transfer unit to enter the processing unit;
a step of handing the unprocessed substrate held by the transfer holding unit to the loading position of the processing unit;
a step of receiving the processed substrate from the unloading position of the processing unit by the transfer holding unit after the unprocessed substrate is delivered to the loading position;
a step of discharging the transport holding unit from the processing unit after the processed substrate is received from the unloading position;
A substrate processing method comprising a step of processing the substrate before the processing by the processing unit.

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