KR20090059038A - 열-보조 기입 자기 소자 - Google Patents
열-보조 기입 자기 소자 Download PDFInfo
- Publication number
- KR20090059038A KR20090059038A KR1020080118920A KR20080118920A KR20090059038A KR 20090059038 A KR20090059038 A KR 20090059038A KR 1020080118920 A KR1020080118920 A KR 1020080118920A KR 20080118920 A KR20080118920 A KR 20080118920A KR 20090059038 A KR20090059038 A KR 20090059038A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- magnetic
- amorphous
- field
- storage
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
- G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
- G11C11/165—Auxiliary circuits
- G11C11/1675—Writing or programming circuits or methods
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
- H10B61/20—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
- H10B61/22—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/80—Constructional details
- H10N50/85—Magnetic active materials
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Hall/Mr Elements (AREA)
- Mram Or Spin Memory Techniques (AREA)
- Magnetic Heads (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0759584A FR2924851B1 (fr) | 2007-12-05 | 2007-12-05 | Element magnetique a ecriture assistee thermiquement. |
FR0759584 | 2007-12-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090059038A true KR20090059038A (ko) | 2009-06-10 |
Family
ID=39370712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080118920A KR20090059038A (ko) | 2007-12-05 | 2008-11-27 | 열-보조 기입 자기 소자 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7898833B2 (ja) |
EP (1) | EP2218072B1 (ja) |
JP (1) | JP5727125B2 (ja) |
KR (1) | KR20090059038A (ja) |
CN (1) | CN101452991B (ja) |
FR (1) | FR2924851B1 (ja) |
SG (1) | SG153012A1 (ja) |
WO (1) | WO2009080939A1 (ja) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009074411A1 (en) * | 2007-12-13 | 2009-06-18 | Crocus Technology | Magnetic memory with a thermally assisted writing procedure |
WO2010021213A1 (ja) * | 2008-08-18 | 2010-02-25 | 日本電気株式会社 | 磁気抵抗記憶装置 |
US8238151B2 (en) | 2009-12-18 | 2012-08-07 | Micron Technology, Inc. | Transient heat assisted STTRAM cell for lower programming current |
KR101684915B1 (ko) | 2010-07-26 | 2016-12-12 | 삼성전자주식회사 | 자기 기억 소자 |
FR2965654B1 (fr) | 2010-10-01 | 2012-10-19 | Commissariat Energie Atomique | Dispositif magnetique a ecriture assistee thermiquement |
EP2479759A1 (en) * | 2011-01-19 | 2012-07-25 | Crocus Technology S.A. | Low power magnetic random access memory cell |
US9157879B2 (en) | 2011-04-15 | 2015-10-13 | Indiana University of Pennsylvania | Thermally activated magnetic and resistive aging |
US9041419B2 (en) | 2011-04-15 | 2015-05-26 | Indiana University of Pennsylvania | Thermally activated magnetic and resistive aging |
FR2976113B1 (fr) | 2011-06-06 | 2013-07-12 | Commissariat Energie Atomique | Dispositif magnetique a couplage d'echange |
US20130065075A1 (en) * | 2011-09-12 | 2013-03-14 | Klemens Pruegl | Magnetoresistive spin valve layer systems |
US8503135B2 (en) | 2011-09-21 | 2013-08-06 | Seagate Technology Llc | Magnetic sensor with enhanced magnetoresistance ratio |
EP2608208B1 (en) * | 2011-12-22 | 2015-02-11 | Crocus Technology S.A. | Self-referenced MRAM cell and method for writing the cell using a spin transfer torque write operation |
CN103531707A (zh) * | 2012-07-03 | 2014-01-22 | 中国科学院物理研究所 | 磁性隧道结 |
FR2993387B1 (fr) | 2012-07-11 | 2014-08-08 | Commissariat Energie Atomique | Dispositif magnetique a ecriture assistee thermiquement |
US9029965B2 (en) * | 2012-12-03 | 2015-05-12 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions having a thermally stable and easy to switch magnetic free layer |
US8796796B2 (en) * | 2012-12-20 | 2014-08-05 | Samsung Electronics Co., Ltd. | Method and system for providing magnetic junctions having improved polarization enhancement and reference layers |
EP2800096B1 (en) | 2013-04-29 | 2018-08-01 | Crocus Technology S.A. | Thermally-assisted MRAM cells with improved reliability at writing |
US9257970B1 (en) | 2014-12-19 | 2016-02-09 | Honeywell International Inc. | Magnetic latch |
FR3031622B1 (fr) * | 2015-01-14 | 2018-02-16 | Centre National De La Recherche Scientifique | Point memoire magnetique |
US9923137B2 (en) * | 2015-03-05 | 2018-03-20 | Globalfoundries Singapore Pte. Ltd. | Magnetic memory with tunneling magnetoresistance enhanced spacer layer |
US10128309B2 (en) | 2015-03-27 | 2018-11-13 | Globalfoundries Singapore Pte. Ltd. | Storage layer for magnetic memory with high thermal stability |
CN105633275B (zh) * | 2015-09-22 | 2018-07-06 | 上海磁宇信息科技有限公司 | 一种垂直型stt-mram记忆单元及其读写方法 |
US10297745B2 (en) | 2015-11-02 | 2019-05-21 | Globalfoundries Singapore Pte. Ltd. | Composite spacer layer for magnetoresistive memory |
US10541014B2 (en) * | 2015-12-24 | 2020-01-21 | Intel Corporation | Memory cells with enhanced tunneling magnetoresistance ratio, memory devices and systems including the same |
CN110867511B (zh) * | 2018-08-28 | 2021-09-21 | 中电海康集团有限公司 | 垂直磁化的mtj器件 |
CN110531286A (zh) * | 2019-07-26 | 2019-12-03 | 西安交通大学 | 一种抗强磁场干扰的amr传感器及其制备方法 |
CN111725386B (zh) * | 2019-09-23 | 2022-06-10 | 中国科学院上海微系统与信息技术研究所 | 一种磁性存储器件及其制作方法、存储器和神经网络系统 |
CN112750946B (zh) * | 2019-10-31 | 2023-06-02 | 上海磁宇信息科技有限公司 | 一种磁性随机存储器势垒层和自由层结构单元及其制备方法 |
US11903218B2 (en) | 2020-06-26 | 2024-02-13 | Sandisk Technologies Llc | Bonded memory devices and methods of making the same |
CN114730764A (zh) * | 2020-06-26 | 2022-07-08 | 桑迪士克科技有限责任公司 | 键合的存储器设备及其制作方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3820475C1 (ja) | 1988-06-16 | 1989-12-21 | Kernforschungsanlage Juelich Gmbh, 5170 Juelich, De | |
US5159513A (en) | 1991-02-08 | 1992-10-27 | International Business Machines Corporation | Magnetoresistive sensor based on the spin valve effect |
US5343422A (en) | 1993-02-23 | 1994-08-30 | International Business Machines Corporation | Nonvolatile magnetoresistive storage device using spin valve effect |
US6021065A (en) | 1996-09-06 | 2000-02-01 | Nonvolatile Electronics Incorporated | Spin dependent tunneling memory |
US5583725A (en) | 1994-06-15 | 1996-12-10 | International Business Machines Corporation | Spin valve magnetoresistive sensor with self-pinned laminated layer and magnetic recording system using the sensor |
US5640343A (en) | 1996-03-18 | 1997-06-17 | International Business Machines Corporation | Magnetic memory array using magnetic tunnel junction devices in the memory cells |
EP1288665A4 (en) * | 2000-05-26 | 2007-04-25 | Med & Biological Lab Co Ltd | METHOD FOR DETERMINING ENA-TESTED ANTIBODIES AND EXPERIMENTAL KIT |
US6385082B1 (en) | 2000-11-08 | 2002-05-07 | International Business Machines Corp. | Thermally-assisted magnetic random access memory (MRAM) |
JP4387955B2 (ja) * | 2001-04-24 | 2009-12-24 | パナソニック株式会社 | 磁気抵抗効果素子 |
FR2832542B1 (fr) * | 2001-11-16 | 2005-05-06 | Commissariat Energie Atomique | Dispositif magnetique a jonction tunnel magnetique, memoire et procedes d'ecriture et de lecture utilisant ce dispositif |
JP2004200245A (ja) * | 2002-12-16 | 2004-07-15 | Nec Corp | 磁気抵抗素子及び磁気抵抗素子の製造方法 |
US7161875B2 (en) * | 2003-06-12 | 2007-01-09 | Hewlett-Packard Development Company, L.P. | Thermal-assisted magnetic memory storage device |
US7110287B2 (en) * | 2004-02-13 | 2006-09-19 | Grandis, Inc. | Method and system for providing heat assisted switching of a magnetic element utilizing spin transfer |
US7149106B2 (en) * | 2004-10-22 | 2006-12-12 | Freescale Semiconductor, Inc. | Spin-transfer based MRAM using angular-dependent selectivity |
US7241631B2 (en) * | 2004-12-29 | 2007-07-10 | Grandis, Inc. | MTJ elements with high spin polarization layers configured for spin-transfer switching and spintronics devices using the magnetic elements |
US7196955B2 (en) * | 2005-01-12 | 2007-03-27 | Hewlett-Packard Development Company, L.P. | Hardmasks for providing thermally assisted switching of magnetic memory elements |
JP5077802B2 (ja) * | 2005-02-16 | 2012-11-21 | 日本電気株式会社 | 積層強磁性構造体、及び、mtj素子 |
JP2006319259A (ja) * | 2005-05-16 | 2006-11-24 | Fujitsu Ltd | 強磁性トンネル接合素子、これを用いた磁気ヘッド、磁気記録装置、および磁気メモリ装置 |
JP4768488B2 (ja) * | 2006-03-27 | 2011-09-07 | 株式会社東芝 | 磁気抵抗効果素子,磁気ヘッド,および磁気ディスク装置 |
JP4277870B2 (ja) * | 2006-04-17 | 2009-06-10 | ソニー株式会社 | 記憶素子及びメモリ |
-
2007
- 2007-12-05 FR FR0759584A patent/FR2924851B1/fr not_active Expired - Fee Related
-
2008
- 2008-11-13 US US12/269,918 patent/US7898833B2/en active Active
- 2008-11-18 SG SG200808540-9A patent/SG153012A1/en unknown
- 2008-11-27 CN CN200810178903.3A patent/CN101452991B/zh not_active Expired - Fee Related
- 2008-11-27 KR KR1020080118920A patent/KR20090059038A/ko not_active Application Discontinuation
- 2008-12-04 EP EP08864600.5A patent/EP2218072B1/fr active Active
- 2008-12-04 JP JP2008309882A patent/JP5727125B2/ja active Active
- 2008-12-04 WO PCT/FR2008/052204 patent/WO2009080939A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US7898833B2 (en) | 2011-03-01 |
WO2009080939A1 (fr) | 2009-07-02 |
EP2218072B1 (fr) | 2015-05-13 |
CN101452991B (zh) | 2014-05-07 |
SG153012A1 (en) | 2009-06-29 |
JP5727125B2 (ja) | 2015-06-03 |
JP2009147330A (ja) | 2009-07-02 |
US20090147392A1 (en) | 2009-06-11 |
FR2924851A1 (fr) | 2009-06-12 |
EP2218072A1 (fr) | 2010-08-18 |
CN101452991A (zh) | 2009-06-10 |
FR2924851B1 (fr) | 2009-11-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |