KR20090032962A - Rfid 태그 및 rfid 태그의 제조 방법 - Google Patents
Rfid 태그 및 rfid 태그의 제조 방법 Download PDFInfo
- Publication number
- KR20090032962A KR20090032962A KR1020080080855A KR20080080855A KR20090032962A KR 20090032962 A KR20090032962 A KR 20090032962A KR 1020080080855 A KR1020080080855 A KR 1020080080855A KR 20080080855 A KR20080080855 A KR 20080080855A KR 20090032962 A KR20090032962 A KR 20090032962A
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- KR
- South Korea
- Prior art keywords
- surface mount
- mount package
- antenna
- base
- rfid tag
- Prior art date
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10719—Land grid array [LGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims (7)
- 베이스, 상기 베이스 상에 형성된 안테나, 표면 실장 패키지에 봉입되며 상기 안테나에 납땜되어 이루어지는, 상기 안테나를 통해 무선 통신을 하는 IC 칩, 및 상기 베이스와 상기 표면 실장 패키지의 간극을 메우는 언더필(underfill)로 이루어지는 인레이(inlay)와,상기 인레이 전체를 봉입하여 이루어지는 외장 보호재를 구비한 것을 특징으로 하는 RFID 태그.
- 제1항에 있어서, 상기 표면 실장 패키지의 열팽창 계수를 α1상기 언더필의 열팽창 계수를 α2상기 베이스의 열팽창 계수를 α3상기 외장 보호재의 열팽창 계수를 α4로 했을 때,α1<α2, α4<α3를 만족하는 것을 특징으로 하는 RFID 태그.
- 제1항에 있어서, 상기 표면 실장 패키지는, 상방에서 보았을 때에 직사각형 으로서, 상기 직사각형의 변으로부터 복수의 리드가 돌출된 리드 부착 표면 실장 패키지이며, 상기 표면 실장 패키지에 봉입된 IC 칩과 상기 안테나는, 상기 표면 실장 패키지의, 상기 직사각형의 2변이 접하는 코너부에 인접한 리드를 제외한 어느 하나의 리드를 통해 접속되어 이루어지는 것을 특징으로 하는 RFID 태그.
- 제2항에 있어서, 상기 표면 실장 패키지는, 상방에서 보았을 때에 직사각형으로서, 상기 직사각형의 변으로부터 복수의 리드가 돌출된 리드 부착 표면 실장 패키지이며, 상기 표면 실장 패키지에 봉입된 IC 칩과 상기 안테나는, 상기 표면 실장 패키지의, 상기 직사각형의 2변이 접하는 코너부에 인접한 리드를 제외한 어느 하나의 리드를 통해 접속되어 이루어지는 것을 특징으로 하는 RFID 태그.
- 제1항에 있어서, 상기 표면 실장 패키지는 바닥면에 접속 단자가 배열된, 상방에서 보았을 때에 직사각형의 표면 실장 패키지이며, 상기 표면 실장 패키지에 봉입된 IC 칩과 상기 안테나는, 상기 표면 실장 패키지의, 2변이 접하는 코너부에 인접한 접속 단자를 제외한 어느 하나의 접속 단자를 통해 접속되어 이루어지는 것을 특징으로 하는 RFID 태그.
- 제2항에 있어서, 상기 표면 실장 패키지는 바닥면에 접속 단자가 배열된, 상방에서 보았을 때에 직사각형의 표면 실장 패키지이며, 상기 표면 실장 패키지에 봉입된 IC 칩과 상기 안테나는, 상기 표면 실장 패키지의, 2변이 접하는 코너부에 인접한 접속 단자를 제외한 어느 하나의 접속 단자를 통해 접속되어 이루어지는 것을 특징으로 하는 RFID 태그.
- 베이스, 상기 베이스 상에 형성된 안테나, 표면 실장 패키지에 봉입되며 상기 안테나에 납땜되어 이루어지는, 상기 안테나를 통해 무선 통신을 하는 IC 칩, 및 상기 베이스와 상기 표면 실장 패키지의 간극을 메우는 언더필로 이루어지는 인레이와, 상기 인레이 전체를 봉입하여 이루어지는 외장 보호재를 구비한 RFID 태그의 제조 방법으로서,안테나가 형성된 베이스의, 상기 표면 실장 패키지가 땜납 접속되는 부분에 땜납 페이스트를 인쇄하는 땜납 페이스트 인쇄 공정과,상기 베이스 상에 상기 표면 실장 패키지를 위치 맞춤하여 탑재하는 패키지 탑재 공정과,상기 표면 실장 패키지를 땜납 리플로우에 의해 상기 베이스 상의 안테나에 접속하는 땜납 리플로우 공정과,상기 베이스와 상기 표면 실장 패키지의 간극에 언더필을 주입하는 언더필 주입 공정과,상기 언더필을 경화시킴으로써 상기 인레이를 완성하는 언더필 경화 공정과,상기 외장 보호재의 외형에 상당하는 공극을 갖는 성형 금형 내에, 상기 인레이가 감입되는 오목부를 갖는, 상기 외장 보호재의 하부에 대응하는 수지제의 하측 부재와, 상기 하측 부재의 상기 오목부에 감입시킨 상태의 상기 인레이를 배치 하는 인레이 배치 공정과,상기 성형 금형 내의 공극에 상기 외장 보호재의 상부에 상당하는 수지를 유입함으로써 상기 상부를 성형하는 것과 함께 상기 상부와 상기 하측 부재를 융착시키는 외장 보호재 성형 공정을 포함하는 것을 특징으로 하는 RFID 태그의 제조 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007256270A JP5037286B2 (ja) | 2007-09-28 | 2007-09-28 | Rfidタグおよびrfidタグの製造方法 |
JPJP-P-2007-00256270 | 2007-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090032962A true KR20090032962A (ko) | 2009-04-01 |
KR101018763B1 KR101018763B1 (ko) | 2011-03-07 |
Family
ID=40225596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080080855A KR101018763B1 (ko) | 2007-09-28 | 2008-08-19 | Rfid 태그 및 rfid 태그의 제조 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8248240B2 (ko) |
EP (1) | EP2043028B1 (ko) |
JP (1) | JP5037286B2 (ko) |
KR (1) | KR101018763B1 (ko) |
CN (1) | CN101398912B (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080035739A1 (en) * | 2006-08-11 | 2008-02-14 | Sheng-Chang Huang | Label with a rfid to be stuck on a product to be formed in a mold |
CN101751600B (zh) * | 2009-12-31 | 2015-10-21 | 马宇尘 | 一种卵石型多层包覆电子标签器件及其制造方法 |
CN101787246B (zh) * | 2009-12-31 | 2014-08-20 | 上海杰远环保科技有限公司 | 一种复合式自膨胀型封装体及其制造方法 |
FR2963137B1 (fr) * | 2010-07-20 | 2016-02-19 | Oberthur Technologies | Insert a transpondeur et dispositif comprenant un tel insert |
JP2012033125A (ja) * | 2010-08-03 | 2012-02-16 | Kyodo Printing Co Ltd | 情報記録媒体及び情報記録媒体の製造方法 |
TWI453677B (zh) * | 2011-12-01 | 2014-09-21 | Mutual Pak Technology Co Ltd | 射頻識別標籤與具有其之衣物 |
CN102968724A (zh) * | 2011-12-21 | 2013-03-13 | 周朝成 | 射频识别追源防伪系统 |
CN104299022B (zh) * | 2014-10-10 | 2018-09-21 | 竹林伟业科技发展(天津)股份有限公司 | 一种rfid标签及其制造方法 |
CN106030618B (zh) | 2014-11-07 | 2018-11-20 | 株式会社村田制作所 | 无线通信装置及其制造方法、以及带rfic元件贴片及其制作方法 |
EP3089079B1 (en) | 2014-11-07 | 2020-08-05 | Murata Manufacturing Co., Ltd. | Carrier tape, method for manufacturing same, and method for manufacturing rfid tag |
CN106471524B (zh) | 2015-06-18 | 2019-07-30 | 株式会社村田制作所 | 载带及其制造方法以及rfid标签的制造方法 |
US10762412B2 (en) | 2018-01-30 | 2020-09-01 | Composecure, Llc | DI capacitive embedded metal card |
US10977540B2 (en) | 2016-07-27 | 2021-04-13 | Composecure, Llc | RFID device |
US11267172B2 (en) | 2016-07-27 | 2022-03-08 | Composecure, Llc | Overmolded electronic components for transaction cards and methods of making thereof |
US11618191B2 (en) | 2016-07-27 | 2023-04-04 | Composecure, Llc | DI metal transaction devices and processes for the manufacture thereof |
US11151437B2 (en) | 2017-09-07 | 2021-10-19 | Composecure, Llc | Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting |
EP3679523B1 (en) | 2017-09-07 | 2023-02-01 | Composecure LLC | Transaction card with embedded electronic components and process for manufacture |
CN118364848A (zh) | 2017-10-18 | 2024-07-19 | 安全创造有限责任公司 | 具有窗或窗图案和可选背光的金属、陶瓷或陶瓷涂层的交易卡 |
USD1032613S1 (en) * | 2020-02-02 | 2024-06-25 | Federal Card Services, LLC | Smart card |
USD948613S1 (en) | 2020-04-27 | 2022-04-12 | Composecure, Llc | Layer of a transaction card |
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JP3502557B2 (ja) | 1999-01-07 | 2004-03-02 | 松下電器産業株式会社 | 非接触icカードの製造方法 |
JP2000311176A (ja) | 1999-04-28 | 2000-11-07 | Casio Comput Co Ltd | データ検索管理装置およびそのプログラム記録媒体 |
EP1052595B1 (de) | 1999-05-14 | 2001-09-19 | Sokymat Sa | Transponder und Spritzgussteil sowie Verfahren zu ihrer Herstellung |
US6509217B1 (en) * | 1999-10-22 | 2003-01-21 | Damoder Reddy | Inexpensive, reliable, planar RFID tag structure and method for making same |
JP4620836B2 (ja) | 2000-06-08 | 2011-01-26 | 大日本印刷株式会社 | ウエハーの製造方法 |
US20040217472A1 (en) * | 2001-02-16 | 2004-11-04 | Integral Technologies, Inc. | Low cost chip carrier with integrated antenna, heat sink, or EMI shielding functions manufactured from conductive loaded resin-based materials |
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JP2007079526A (ja) * | 2004-11-26 | 2007-03-29 | Hasegawa Kagaku Kogyo Kk | Icタグ及びその製造方法 |
JP2007042087A (ja) * | 2005-07-04 | 2007-02-15 | Hitachi Ltd | Rfidタグ及びその製造方法 |
TWI339358B (en) * | 2005-07-04 | 2011-03-21 | Hitachi Ltd | Rfid tag and manufacturing method thereof |
JP2008046668A (ja) | 2006-08-10 | 2008-02-28 | Fujitsu Ltd | Rfidタグ |
-
2007
- 2007-09-28 JP JP2007256270A patent/JP5037286B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-29 US US12/181,631 patent/US8248240B2/en not_active Expired - Fee Related
- 2008-07-31 EP EP08161525A patent/EP2043028B1/en not_active Expired - Fee Related
- 2008-08-19 KR KR1020080080855A patent/KR101018763B1/ko active IP Right Grant
- 2008-08-20 CN CN2008102130095A patent/CN101398912B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2009087068A (ja) | 2009-04-23 |
JP5037286B2 (ja) | 2012-09-26 |
CN101398912B (zh) | 2011-03-16 |
US20090085747A1 (en) | 2009-04-02 |
US8248240B2 (en) | 2012-08-21 |
CN101398912A (zh) | 2009-04-01 |
KR101018763B1 (ko) | 2011-03-07 |
EP2043028A1 (en) | 2009-04-01 |
EP2043028B1 (en) | 2012-04-11 |
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