KR20090004519A - 그라비아 인쇄법을 이용한 촉매 패턴 형성에 사용되는 촉매전구체 수지 조성물, 이를 이용한 금속패턴 형성방법 및이에 따라 형성된 금속패턴 - Google Patents
그라비아 인쇄법을 이용한 촉매 패턴 형성에 사용되는 촉매전구체 수지 조성물, 이를 이용한 금속패턴 형성방법 및이에 따라 형성된 금속패턴 Download PDFInfo
- Publication number
- KR20090004519A KR20090004519A KR1020080057232A KR20080057232A KR20090004519A KR 20090004519 A KR20090004519 A KR 20090004519A KR 1020080057232 A KR1020080057232 A KR 1020080057232A KR 20080057232 A KR20080057232 A KR 20080057232A KR 20090004519 A KR20090004519 A KR 20090004519A
- Authority
- KR
- South Korea
- Prior art keywords
- silver
- complex
- complexes
- pattern
- catalyst
- Prior art date
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- H01L21/32—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers using masks
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Abstract
Description
패턴성 | 패턴 박리 현상 | 증착 속도 | 도금 박막의 질 | |
실시예 1 | O | X | O | O |
실시예 2 | O | X | O | O |
실시예 3 | O | X | O | O |
비교예 1 | O | △ | △ | △ |
비교예 2 | X | O | X | X |
비교예 3 | O | X | △ | △ |
Claims (19)
- (a) 유기 고분자 수지, (b) 은아세테이트계, 은설폰네이트계, β-카르보닐케톤계 및 β-카르보닐에스테르계 실버(I)착화물로 구성되는 그룹으로부터 선택된 최소 일종의 은이온 유기 착화물 전구체 및 (c) 유기용매를 포함하여 구성되는 촉매 전구체 수지 조성물.
- 제 1 항에 있어서, 상기 유기 고분자 수지는 로진 수지, 부틸랄 수지, 천연 고무, 합성 고무, 폴리에스테르 수지, 폴리아미드 수지, 폴리에테르 수지, 비닐 수지, 폴리올레핀 수지, 아크릴 수지, 멜라민 수지, 에폭시 수지, 페놀 수지, 우레탄 수지 및 셀룰로오스(cellulose) 유도체 수지로 구성되는 그룹으로부터 선택됨을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 2항에 있어서, 상기 유기 고분자 수지는 크라운 에테르기, 이미다졸기, 수산기 및 카르복실기로 구성되는 그룹으로부터 선택된 최소 1종 이상의 관능기를 갖는 수지임을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 1항에 있어서, 상기 은이온 유기 착화물 전구체는 은아세테이트, 은락테이트, 은미리스트레이트, 은시트레이트, 은벤조에이트, 은페닐아세테이트, 은사이클로헥산부티레이트, 은파라톨루엔설폰네이트, 은옥살레이트, 은마론네이트, 은써신네이트, 은에디픽에이트, 은(I)플루오르설페이트, 은(I)트라이플루오르아세테이트, 은(I)트라이플루오르메탄설페이트, 은(I)펜타플루오르프로피온네이트, 은(I)헵타플루오르브틸레이트와 같은 은아세테이트계 혹은 은설폰네이트계; 및 실버(I)아세틸아세토네이트, 3-클로로-2,4-펜탄다아온네이트실버(I)착화물, 3,5-헵탄다이온네이토실버(I)착화물, 2-아세틸사이클로헥사노네이토실버(I)착화물, 3-에틸-2,4-펜타다이오네이토실버(I)착화물, 벤조일아세톤실버(I)착화물, 다이벤조일메탄실버(I)착화물, 2,2,6,6-테트라메틸헥탄다이엔, 에틸아세토아세테이트실버(I)착화물, 메틸아세토아세테이트 실버(I)착화물, 아이소프로필아세토아세테이트 실버(I)착화물, 터셔리아릴부틸아세토- 아세테이트 실버(I)착화물, 1,5-사이클로옥타다이엔-헥사플루오르아세틸아세토네이토실버(I) 착화물, 1,1,1-트라이플루오르-2,4-펜타다이온나토실버(I)착화물, 5,5-다이메틸-1,1,1-트라이플루오르-2,4-헥산다이온네이트실버(I)착화물, 1-(4-메톡시페닐)-4,4,4-트라이플루오르부탄다이온네이토실버(I)착화물, 5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-헵타데카플루오르데칸-2,4-다이온네이토실버(I)착화물 1,1,1,2,2,3,3,-헵타플루오르-7,7-다이메틸-4,6-옥탄다이온네이토실버(I)착화물, 1,1,1,3,5,5,5-헵타플루오르펜탄-2,4-다이온네이토실버(I)착화물, 1,1,1,5,5,5-헥사플루오르펜탄-2,4-다이온네이토실버(I)착화물, 5,5,6,6,7,7,8,8,8-노나플루오르옥탄-2,4-다이온네이토실버(I)착화물, 5H,5H-퍼플 루오르노난-4,6-다이온네이토실버(I)착화물, 6H,6H-퍼플루오루-운데칸-5,7-다이온네이토실버(I)착화물, 8H,8H-퍼플루오르펜타데칸-7,8-다이온네이토실버(I)착화물, 6H,6H-퍼플루오르운데칸-5,7-다이온네이토실버(I)착화물, 1-페닐-2H,2H-퍼플루오르헥산-1,3-다이온네이토실버(I)착화물, 1-페닐-2H,2H-퍼플루오르운데칸-1,3-다이온네이토실버(I)착화물, 5,6,6,6-테트라플루오르-5-(헵타플루오르프로폭시)헥산-2,4-다이온네이토실버(I)착화물, 1,1,5,5-테트라플루오르펜탄-2,4 다이온네이토실버(I)착화물, 5,5,6,6,7,7,8,8,9,9,9-운데칸플루오르-노난-2,4-다이온네이토실버(I)착화물, 에틸 3-클로로-4,4,4-트라이플루오르아세토아세테이토실버(I)착화물, 에틸-4,4-다이플루오르아세토아세테이토실버(I)착화물, 에틸-4,4,4-트라이플루오르아세토아세테이토실버(I)착화물, 아이소프로필-4,4,4-트라이플루오르아세토아세테이토실버(I)착화물, 메틸-4,4,5,5,5-펜타플루오르-3-옥소펜타노네이토실버(I)착화물, 에틸-4,4,5,5,5-펜타플루오르-3-옥소-펜타노네이토실버(I)착화물, 1,1,1,5,5,6,6,6-옥타플루오르-2,4-헥산다이오네이토실버(I)착화물과 같은 β-카르보닐케톤계 혹은 β-카르보닐에스테르계와의 실버(I)착화물로 구성되는 그룹으로부터 선택된 최소 1종 이상임을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 1항에 있어서, 상기 은이온 유기 착화물 전구체는 플루오르화된 은이온 유기 착화물 전구체임을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 5항에 있어서, 상기 플루오르화된 은이온 유기 착화물 전구체는 은(I)플루오르설페이트, 은(I)트라이플루오르아세테이트, 은(I)트라이플루오르메탄설페이트, 은(I)펜타플루오르프로피온네이트, 은(I)헵타플루오르브틸레이트와 같은 은아세테이트계 혹은 은설폰네이트계로; 및 1,5-사이클로옥타다이엔-헥사플루오르아세틸아세토네이토실버(I) 착화물, 1,1,1-트라이플루오르-2,4-펜탄다이온나토실버(I)착화물, 5,5-다이메틸-1,1,1-트라이플루오르-2,4-헥산다이온네이트실버(I)착화물, 1-(4-메토시페닐)-4,4,4-트라이플루오르부탄다이온네이토실버(I)착화물, 5,5,6,6,7,7,8,8,9,9,10,10,11,11,12,12,12-헵타데카플루오르데칸-2,4-다이온네이토실버(I)착화물 1,1,1,2,2,3,3-헵타플루오르-7,7-다이메틸-4,6-옥탄다이온네이토실버(I)착화물, 1,1,1,3,5,5,5-헵타플루오르펜탄-2,4-다이온네이토실버(I)착화물, 1,1,1,5,5,5-헥사플루오르펜탄-2,4-다이온네이토실버(I)착화물, 5,5,6,6,7,7,8,8,8-노나플루오르옥탄-2,4-다이온네이토실버(I)착화물, 5H,5H-퍼플루오르노난-4,6-다이온네이토실버(I)착화물, 6H,6H-퍼플루오루-운데칸-5,7-다이온네이토실버(I)착화물, 8H,8H-퍼플루오르펜타데칸-7,8-다이온네이토실버(I)착화물, 6H,6H-퍼플루오르운데칸-5,7-다이온네이토실버(I)착화물, 1-페닐-2H,2H-퍼플루오르헥산-1,3-다이온네이토실버(I)착화물, 1-페닐-2H,2H-퍼플루오르운데칸-1,3-다이온네이토실버(I)착화물, 5,6,6,6-테트라플루오르-5-(헵타플루오르프로폭시)헥산-2,4-다이온네이토실버(I)착화물, 1,1,5,5-테트라플루오르펜탄-2,4 다이온네이토실버(I)착화물, 5,5,6,6,7,7,8,8,9,9,9-운데칸플루오르-노난-2,4-다이온네이토실버(I)착화 물, 에틸 3-클로로-4,4,4-트라이플루오르아세토아세테이토실버(I)착화물, 에틸-4,4-다이플루오르아세토아세테이토실버(I)착화물, 에틸-4,4,4-트라이플루오르아세토아세테이토실버(I)착화물, 아이소프로필-4,4,4-트라이플루오르아세토아세테이토실버(I)착화물, 메틸-4,4,5,5,5-펜타플루오르-3-옥소펜타노네이토실버(I)착화물, 에틸-4,4,5,5,5-펜타플루오르-3-옥소-펜타노네이토실버(I)착화물, 1,1,1,5,5,6,6,6-옥타플루오르-2,4-헥산다이오네이토실버(I)착화물과 같은 β-카르보닐케톤계 혹은 β-카르보닐에스테르계와의 실버(I)착화물로 구성되는 그룹으로부터 선택된 최소 1종이상임을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 1항에 있어서, 촉매전구체 수지 조성물중 은이온 유기 촉매 전구체의 양은 촉매 전구제 수지 조성물중 총 유기고형분 100중량부당 20~50 중량부임을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 1항에 있어서, 유기 고분자 수지 100중량부당 안료를 최고 15중량부로 추가로 포함함을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 8항에 있어서, 상기 안료는 아조(azo) 안료, 프탈로시아 닌(phthalocyanine) 안료, 안트라키논(anthraquinone) 안료, 인디고(indigo) 안료와 같은 유기 안료, 금속, 세라믹스(ceramics), 카본 블랙(carbon black)과 같은 무기 안료 및 금속 착제 안료(무기/유기 복합체 안료)로 구성되는 그룹으로부터 선택된 최소 일종 이상임을 특징으로 하는 촉매 전구체 수지 조성물.
- 제 1항에 있어서, 상기 촉매 전구체 수지 조성물은 그라비아 인쇄법으로 기재에 적용됨을 특징으로 하는 촉매 전구체 수지 조성물.
- (a) 그라비아 인쇄법으로 기재에 청구항 1 내지 10중 어느 한항의 촉매 전구체 수지 조성물로 촉매 전구체 패턴을 형성하는 단계;(b) 상기 형성된 촉매 전구체 패턴을 환원시켜 촉매 패턴층을 형성하는 단계; 및(c) 상기 촉매패턴위에 무전해 도금하는 단계를 포함하여 이루어지는 금속 패턴 형성방법.
- 제 11항에 있어서, 상기 기재는 폴리에틸렌 테레프탈레이트(polyethylene terephthalate)와 같은 폴리에스테르 수지; 폴리에틸렌, 폴리프로필렌, 폴리스틸렌 과 같은 폴리 올레핀 수지; 폴리 염화 비닐, 폴리 염화 비닐리덴과 같은 비닐 수지; 나일론 66과 같은 나일론 수지; 또는 아세틸 셀룰로오스와 같은 셀룰로오스 수지로된 기재가 사용됨을 특징으로 하는 금속 패턴 형성방법.
- 제 11항에 있어서, 상기 기재는 두께가 0.01~0.8 mm임을 특징으로 하는 금속 패턴 형성방법.
- 제11항에 있어서, 상기 환원단계는 소듐보레인하이드라이드 또는 아스코르브산과 같은 환원제로 수행되는 것을 특징으로 하는 금속패턴 형성방법.
- 제 11항에 있어서, 상기 환원단계는 UV 노광 및/또는 열을 적용하여 수행되는 것을 특징으로 하는 금속패턴 형성방법.
- 제 11항에 있어서, 상기 무전해 도금은 구리도금 또는 니켈도금으로 수행되는 것을 특징으로 하는 금속패턴 형성방법.
- (a) 그라비아 인쇄법으로 기재에 청구항 1 내지 10중 어느 한항의 촉매 전구체 수지 조성물로 촉매 전구체 패턴을 형성하는 단계;(b) 상기 형성된 촉매 전구체 패턴을 환원시켜 촉매 패턴층을 형성하는 단계; 및(c) 상기 촉매패턴위에 무전해 도금하는 단계를 포함하여 이루어지는 금속 패턴 형성방법으로 형성된 금속패턴.
- 제 17항에 있어서, 상기 금속패턴은 평균 선폭이 50㎛이하임을 특징으로 하는 금속패턴.
- 청구항 17의 금속패턴을 포함하는 전자파 차폐재.
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KR20200095921A (ko) * | 2019-02-01 | 2020-08-11 | 배수근 | 도금용 도전성 페이스트 조성물 |
KR20200095922A (ko) * | 2019-02-01 | 2020-08-11 | 배수근 | 연성 인쇄회로기판 |
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JP3526291B2 (ja) * | 2001-04-25 | 2004-05-10 | 三菱電機株式会社 | コンデンサモジュールおよびそれを用いた半導体装置 |
JP2004134511A (ja) | 2002-10-09 | 2004-04-30 | Shin Etsu Polymer Co Ltd | 透光性電磁波シールド部材 |
JP4807934B2 (ja) * | 2002-12-27 | 2011-11-02 | 富士フイルム株式会社 | 透光性電磁波シールド膜およびその製造方法 |
KR100823718B1 (ko) * | 2006-04-13 | 2008-04-21 | 주식회사 엘지화학 | 전자파 차폐층 제조시 무전해도금에 대한 촉매 전구체수지조성물, 이를 이용한 금속패턴 형성방법 및 이에 따라제조된 금속패턴 |
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CN111342204A (zh) * | 2018-12-19 | 2020-06-26 | 讯创(天津)电子有限公司 | 一种陶瓷材料表面5g三维镭雕天线的制作方法 |
KR20200095921A (ko) * | 2019-02-01 | 2020-08-11 | 배수근 | 도금용 도전성 페이스트 조성물 |
KR20200095922A (ko) * | 2019-02-01 | 2020-08-11 | 배수근 | 연성 인쇄회로기판 |
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