KR20080111679A - The laser processing apparatus using the line beam and the processing method thereof - Google Patents

Abstract

A laser machining apparatus and method are provided to reduce the time for cutting TEG wiring or A/V pattern by using linear laser beam. A laser machining apparatus comprises a rotating stage(120) in which a panel(110) is loaded, a flexible printed circuit board(191) which is positioned on the lateral side of the panel and mounted with a drive I/C(192), an anisotropic conductive film(180) for electrical contact, a transparent pressurizer(200) pressurizing the anisotropic conductive film and the panel to form a junction, a laser generator(170) outputting and irradiating the laser beam to the junction, an optical system(160) converting the laser beam into the laser beam of line shape, a gantry(210) moving the optical system back and forth and left and right in order to change the irradiation position of the laser beam, and a monitoring apparatus for confirming alignment and bonding state of the panel.

Description

The Laser Processing Apparatus Using The Line Beam And The Processing Method Thereof}

1 is a three-dimensional perspective view of a laser processing apparatus using a line beam capable of irradiating a line-shaped laser beam to one side of the panel according to the present invention;

2 is a three-dimensional perspective view of a laser processing apparatus using a line beam capable of irradiating a laser beam of a type only to a bonding region formed in a panel according to the present invention;

3 is a three-dimensional perspective view of a laser processing apparatus using a line beam capable of irradiating a laser beam in a line shape to a plurality of side surfaces of the panel according to the present invention;

4 and 5 are three-dimensional perspective view of the laser processing apparatus using a line beam having a rotatable optical system according to the present invention.

* Description of the main parts of the drawings *

110: large area display panel 120: stage

130: support table 140: guide rail

150: support 160: optical system

170: laser oscillator 180: ACF

191: flexible circuit board 200: transparent pressurizer

210: gantry

The present invention relates to a processing apparatus and a processing method using a laser light source, and more particularly, to a laser processing apparatus and a processing method using a line beam for the ACF bonding process or a wire cutting process using a line-shaped laser beam. .

The bonding process using an anisotropic conductive film (ACF: hereinafter referred to as 'ACF') is used in the semiconductor mounting field using a film in which conductive particles such as metal coated plastic or metal particles are dispersed. Among them, LCD panels and flexible printed circuit boards (FPC) or printed circuit boards (PCBs) and flexible circuit boards are widely used in the LCD (Liquid Crystal Display) mounting field. After bonding the ACF on the ITO electrode, join the flexible printed circuit board to which the driving I / C chip is bonded, and then join the PCB to the opposite side of the flexible printed circuit board using ACF again.

In general, a hot bar is used as a heat source for bonding a flexible printed circuit board mounted with a display and driving I / C using an ACF. In the bonding process and apparatus using hot bar, it is difficult to uniformize the temperature of the entire hot bar by using a heater for ACF bonding, and the heat conversion efficiency is low because the heat consumption is high in addition to the connection area. The disadvantage is that the surface is contaminated. In particular, since the thermal expansion and shrinkage of the material are not taken into consideration, a large liquid crystal display panel requiring a narrow pitch and a narrow frame, in particular, has a variety of problems because the thermal expansion and contraction amount increase. Specifically, there is a problem that staining occurs in the joint due to the difference in shrinkage after thermal expansion of the panel and the flexible circuit board in contact with the ACF.

The panel includes a display panel including a pixel including a switching element, a display signal line, and a gate driver to turn on / off the switching element of the pixel by emitting a gate on voltage and a gate off voltage to a gate line among the display signal lines. The display signal line includes a data driver for outputting a data voltage to the data line and applying the data voltage to the pixel through the turned-on switching element. The integrated chip generates a control signal and a drive signal for controlling the gate driver and the data driver of the display unit of the panel. It is mainly mounted in the form of COF (Chip On Film). The display panel is subjected to a certain test in the manufacturing process, which is performed by applying a test signal through a wiring called a shorting bar.

In addition, the shorting bar serves to protect the display device against static electricity from the outside. At this time, for example, after the array test and the VI test, the shorting bar is separated from the signal wires in order to perform a test similar to the actual situation. For this separation, so-called laser trimming is performed by cutting using a laser. . The shorting bar is also connected to an inspection line for connecting to the end of each signal line, and the separation of the shorting bar is to actually perform laser trimming on the inspection line, but in the following, the same meaning is used unless there is a large confusion of terms. do. At this time, the laser trimming of the shorting bar is performed by evaporating while dissolving inspection lines one by one using a laser spot having a diameter of several tens of micrometers from left to right.

However, when the process is applied to a large display panel of 40 inches or more, it takes a lot of time and has a disadvantage of affecting productivity.

The present invention uses a laser beam in the form of a line corresponding to the length of one side of a large area display panel, thereby reducing the time required to bond the large area display panel and the flexible circuit board on which the driver driver I / C is mounted. An object of the present invention is to provide a laser processing apparatus and processing method using a line beam that can improve productivity and yield.

The present invention reduces the time required to cut a TEG wiring or A / V pattern by using a line-shaped laser beam corresponding to the length of one side of the large area display panel, thereby maximizing the productivity and yield of the product. Another object is to provide a laser processing apparatus and a processing method using a line beam.

According to an aspect of the present invention, there is provided a laser processing apparatus using a line beam, the apparatus for bonding a large area display panel and a flexible circuit board using a laser beam, the apparatus comprising: a stage rotatable for mounting the panel; A flexible circuit board on the side of the panel and having a drive I / C mounted thereon; An anisotropic conductive film disposed between the panel and the flexible circuit board for electrical contact; A transparent pressurizer for forming a junction by pressing the anisotropic conductive film and the panel on the flexible circuit board; A laser oscillator for outputting and irradiating a laser beam to the junction portion; An optical system for converting the laser beam into a line-shaped laser beam; A gantry for moving the optical system forward / backward, left / right to change the irradiation position of the laser beam; And a monitoring device for checking an alignment state and a bonding state of the panel.

A laser processing apparatus using another line beam of the present invention, the apparatus for cutting the wiring formed in the large-area display panel using a laser beam, comprising: a stage for seating the panel; A laser oscillator for outputting a laser beam to cut the wiring; An optical system positioned on a side of a wiring formed in the panel and configured to convert the laser beam into a laser beam in a line form and output the laser beam; A gantry for moving the optical system forward / backward, left / right to change the irradiation position of the laser beam; And a monitoring device for checking an alignment state and a cutting state of the panel.

A laser processing method using a line beam of the present invention comprises the steps of: bonding a large area display panel and a flexible circuit board using a laser beam, the method comprising: seating the panel on a stage; Forming a junction by loading an anisotropic conductive film and a flexible circuit board on an electrode formed on one side of the panel; Aligning the junction; Simultaneously pressing the junction and converting the laser beam into a line-shaped laser beam using an optical system and then irradiating the junction; And confirming the junction.

A laser processing method using another line beam of the present invention comprises the steps of: cutting a wire formed on a large area display panel using a laser beam, the method comprising: seating the panel on a stage; Aligning positions of the panel and the optical system; Converting the laser beam into a line-shaped laser beam using the optical system and irradiating the wiring; And monitoring a cutting state of the wire.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. Based on the principle that can be defined, it should be interpreted as meaning and concept corresponding to the technical idea of the present invention.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a three-dimensional perspective view of a laser processing apparatus using a line beam that can irradiate a line-shaped laser beam on one side of the panel.

The illustrated laser processing apparatus is for bonding the flexible circuit board 191 provided with the large area display panel 110 and the driving I / C chip 192 using the ACF 180.

A stage 120 and a clamp (not shown) for seating and fixing the large-area display panel 110 are formed on the support table 130 to move the stage 120 in the X, Y, and Z axes. A support 150 having a vibration damping stand (not shown) capable of absorbing vibration while supporting the guide rail 140 and the support table 130 is formed.

The stage 120 may further include a resin-based fixing member (not shown) for fixing the substrate while preventing damage to the substrate that may occur due to a collision during loading of the panel. A hole (not shown) formed in the fixing member is connected to the pipe so that air can be sucked by the operation of the vacuum pump (not shown). The panel 110 located in the fixing member is vacuumed by suction force by the operation of the vacuum pump and is fixed on the stage 120.

The support table 130 includes a driving linear motor (not shown) for moving the stage 120 on the guide rail 140 and further includes an air slide or a fine driving linear motor (not shown) for finer movement. . And the laser oscillator 170 and the optical system 160 for irradiating the laser beam (L) for processing the panel 110 is provided in the gantry 210, the front / rear, left / right can be driven to the substrate The processing can be made more stable and efficient.

The optical system according to the present invention may include a beam intensity controller, a beam former, a beam homogenizer and a plurality of lenses, mirrors, beam splitters, and the like.

2 is a three-dimensional perspective view of a laser processing apparatus using a line beam capable of irradiating a laser beam only to a bonding region formed in a panel.

As shown in the drawing, the laser beam L is irradiated where the panel 110, the ACF 180 and the flexible circuit board 191 on which the driving I / C chip 192 is mounted correspond only to the junction where the junction is stacked. The expensive laser oscillator 170 and the optical system 160 do not need to be installed in the non-formed area, thereby saving costs.

The laser oscillator 170 may use a plurality of laser bands by outputting a wavelength band within a range of 200 nm to 1560 nm. An output end of the laser oscillator 170 is provided with an optical system 160 including a beam intensity controller (not shown), a beam former (not shown), a beam homogenizer (not shown), and the other end of the laser oscillator 170. A chiller (not shown) for cooling is provided.

According to the present invention, one chiller may be used to cool the plurality of laser oscillators 170, or each of the plurality of laser oscillators 170 may be provided with chillers.

One side of the optical system 160 according to the present invention may be provided with a monitoring unit (not shown) for viewing the alignment and laser processing state of the panel 110 in real time.

The laser oscillator 170 according to the present invention may use any one of a diode laser, a DPSS laser, a KrF excimer laser, an ArF excimer laser, a nanosecond, a femtosecond, and an atosecond laser.

DPSS lasers consist of pumped laser diodes, focusing optics, laser media, heat sinks, heat exchangers, nonlinear materials, and output couplers. The DPSS laser configured as described above focuses the light (eg 808nm) of the pumping laser diode on the laser medium by using the focusing optical system, and the light of the infrared wavelength (eg 1064nm / 914nm) is generated from the laser medium, and the light is applied to the output coupler. This causes resonance. The light of the resonant infrared wavelength passes through the nonlinear material and is converted (eg, 532 nm / 457 nm) to a wavelength of half (λ / 2) of the resonant wavelength by the action of Second Harmonic Generation (SHG) of the material. And pulse widths of nanoseconds, femtoseconds or attosecond lasers can be used.

In the case of the laser oscillator 170, a small-sized diode laser may be provided on the gantry 210, and as in the case of other KrF, ArF excimer laser, ND: YAG laser, or ultra-low frequency laser of femtosecond or less. When the volume of the laser oscillator 170 is large, it can be provided outside the equipment.

The chiller (not shown) is provided at the other side of the laser oscillator 170 to remove heat generated from the laser oscillator 170. The chiller may be provided in each of the laser oscillators 170 or only one chiller may be used to remove heat generated from the plurality of laser oscillators 170.

The beam intensity controller (not shown) is positioned at the output end of the laser oscillator 170 to adjust the output of the laser beam, and the beam former provided at the beam intensity controller output end can enlarge the size of the laser beam to suit the processing characteristics.

The beam homogenizer (not shown) may form a laser beam having a precise and excellent cross-sectional profile by uniformly adjusting the intensity of the laser beam output through the beam former.

In addition, a plurality of lenses, mirrors, beam splitters, prisms, and dichroic mirrors are located at the output end of the beam homogenizer, and are disposed at a desired portion of the junction where the panel 110, the ACF 180, and the flexible circuit board 191 are stacked. The laser beam can be focused so that the laser beam can be irradiated.

The monitoring unit (not shown) is located at one side of the optical system 160 and is irradiated to the panel 110 and then reflected to detect a laser beam whose path is changed through a beam splitter, and converts it into an image. The converted image is transmitted to an operator through an external monitor, so that the process proceeding in the large area display panel 110 can be confirmed in real time. As such, the monitoring unit for inspecting the machining or alignment of the large-area display panel 110 may include a CCD camera (not shown), a capture board for capturing an image, an image processing board (not shown), and the like. Can be.

In addition, an illumination unit (not shown) for irradiating visible light may be further provided to capture a processing state of the large area display panel 110. An image introduced into the CCD camera is processed by a capture board, an image processing board, or the like. An image processed by the capture board and the image processing board is input to a controller (not shown). The control unit compares the image input through the monitoring unit with the initial setting value input through the control unit at the beginning of the processing and constitutes a laser processing apparatus including a linear motor and a laser oscillator 170 for moving the stage 120. Control the element. The controller may control the operation of each component or the intensity, shape and area of the laser beam L output from the optical system 160, and the moving speed and distance of the stage 120. As described above, the monitoring unit may be arranged to coincide with the optical axis of the laser light to check the processing state of the panel 110 in real time, and the accuracy of laser processing may be improved.

The number of the laser oscillator 170 and the optical system 160 may be provided in plural in order to irradiate the entire area in one side length direction of the panel 110. And the number of the optical system 160 is preferably provided to correspond to the number of the panel (110). As an example, when the 9th generation mother glass having a size of 2400mm × 2800mm is cut into 8 " 42 " to 52 " size, the 9th generation mother glass is divided into 8 panels, so the number of optical systems 160 is preferably 8. . And 55 "to 60" are divided into six panels, and 80 "to 100" are divided into two panels, and thus each includes an optical system 160 according to the number of panels. The size of the laser beam L in the form of a line irradiated from each optical system 160 may be in the form of a line having a width of several mm to several tens of mm and a length of several hundred mm to several thousand mm.

According to the present invention, a plurality of laser oscillators 170 may be used to form the laser beam L in the form of a line. In the case of using one laser oscillator 170, the output laser is divided into a plurality of paths by using a plurality of optical fibers, and then, by using an optical system at one end of each optical fiber, a line-shaped laser beam L ) Can be formed.

Hereinafter, a bonding process of the large area display panel by the laser processing apparatus will be described with reference to the accompanying drawings.

The stage 120 is mounted with a large-area display panel 110 that is transferred using a robot arm (not shown) from a transfer belt (conveyor) or a loading cassette (not shown). The panel 110 seated on the stage 120 has an alignment mark formed on the panel by a primary alignment device including a clamp provided on at least one outer periphery of the stage 120. To complete the primary alignment.

The panel 110 aligned by the clamp is absorbed by the stage 120, and the one end of the flexible circuit board 191 in which the ACF 180 and the driving I / C 192 are mounted is laminated on one side of the panel to join the joint. To form. Before irradiating a laser to the junction, heat and predetermined pressure is applied or a welding process is performed to fix the panel and the flexible circuit board 191 by an adhesive formed on the surface of the ACF 180 using a laser.

The other end of the flexible circuit board 191 also forms a junction for bonding with the PCB 193 using the ACF 180, and then performs a temporary welding process. After the temporary welding process is completed, the flexible circuit board 191 is pressed using the transparent pressurizer 200, and then bonded by irradiating a laser beam.

The large area display panel 110 and the flexible printed circuit board 191 are each provided with conductive bumps for electrical connection. The transparent presser 200 is formed of a transparent material so that the laser beam L can be irradiated to the ACF 180 while pressing the ACF 180 positioned between the conductive bumps formed on the panel 110 and the flexible circuit board 191. It is. When the formation of the bonding portion is completed, all of the transparent pressurizer 200 including the panel 110 is fixed using a jig portion (not shown). The bumps formed on the large-area display panel 110 and the flexible circuit board 191 need a precise position alignment so as to make a connection, and thus use a monitoring unit including a CCD camera installed at one side of the optical system 160.

According to an exemplary embodiment of the present invention, the mask jig part may further include a mask and a mask to fix the mask so that the laser beam may be irradiated only at the junction where the large area display panel 110 and the flexible circuit board 191 are bonded. have.

The laser beam output from the laser oscillator 170 passes through the optical system and then irradiates the loaded large-area display panel 110 to perform a bonding operation. When the bonding is completed, the laser beam is frozen by a conveyor (not shown). The large-area display panel 110 fixed to the jig part is moved to the bonding module while being transferred to the loading part. While irradiating the laser beam for bonding, the large area display panel 110 in which the bonding operation is completed is unloaded by a robot arm (not shown) and loads the other large area display panel 110 into the bonding module. The control unit operates the linear motor to transfer the gantry 210 to the junction of the loaded panel 110. Next, the ACF 180 and the flexible circuit board 191 are stacked on the large area display panel 110. When the alignment of the stacked panel 110, the ACF 180, and the flexible circuit board 191 is confirmed using a monitoring unit including a CCD camera, the transparent presser 200 is pressed to form a junction. The monitoring unit reads the alignment marks formed in the junction area for bonding while moving along the junction of the panel. At this time, if the position of the panel 110 is misaligned, the controller controls the position of the panel so that the laser beam L can be accurately irradiated to the junction of the panel 110 by moving the stage 120 finely. When the proper position for bonding the panel 110 and the optical system 160 is determined by the driving of the stage 120 and the gantry 210, the laser beam output from the laser oscillator 170 passes through the optical system 160. By irradiating with the ACF 180 located at the junction, the bonding process proceeds.

The irradiation unit and the jig unit including the laser oscillator 170 and the optical system 160 according to the present invention may be connected to an operation panel unit (not shown) through a control unit to control each component of the laser bonding apparatus using a keypad. . For example, each variable (laser strength, irradiation method, irradiation time, pressure, etc.) of a work process may be set using a value input through a keypad. And the display panel is provided with a display, it is possible to proceed more precisely the process using the laser beam while checking the image input through the CCD camera.

3 is a three-dimensional perspective view of a laser processing apparatus using a line beam capable of irradiating a line-shaped laser beam to a plurality of side surfaces of the panel.

The stage 120 is mounted with a large-area display panel 110 that is transferred using a robot arm (not shown) from a transfer belt, a roller (conveyor) or a loading cassette (not shown).

The large-area display panel 110 seated on the stage 120 is firstly aligned to the center by a clamp (not shown) provided in at least one outer periphery of the stage 120, and then the panel is placed on the stage 120. It is fixed by vacuum adsorption. Next, the ACF 180 and the flexible circuit board 191 are stacked to form a junction. And the gantry 210 moves to the junction of the panel 110. When the gantry 210 is positioned at the junction of the panel, the micro-drive linear motor is operated based on the image displayed through the monitoring unit to move the stage 120 more finely, thereby precisely positioning the panel 110. 2nd alignment.

In general, the flexible printed circuit board 191 may be connected to either one of the front and rear surfaces of the large-area display panel 110 or any one of the left and right surfaces, or may be connected to both sides. Therefore, when one side of the large area display panel 110 is bonded with the flexible circuit board 191, the flexible circuit board 191 should be bonded to the other side.

According to an embodiment of the present invention, the optical system 160 is provided on two sides of the area where the large area display panel 110 and the flexible circuit board 191 are bonded, that is, the large area display panel 110. The bonding process may be completed through irradiation of a laser beam.

4 is a three-dimensional perspective view of a laser processing apparatus using a line beam having a rotatable optical system.

The large-area display panel 110 seated on the stage 120 by the robot arm is first aligned to the center by a clamp (not shown) provided at least one on the outer periphery of the stage 120, and then the panel is staged. It is vacuum-adsorbed and fixed on the 120. Next, the ACF 180 and the flexible circuit board 191 are stacked to form a junction. And the gantry 210 moves to the junction of the panel. When the gantry 210 is positioned at the junction of the panel, the gantry 210 operates the microdrive linear motor based on the image displayed through the monitoring unit. As the stage moves finer with the operation of the microdrive linear motor, the secondary alignment is completed by aligning the position of the panel more precisely.

According to an embodiment of the present invention, the optical system 160 includes a rotation driver (not shown) using a motor or an actuator, so that the irradiation area of the laser beam can be changed according to the rotation of the optical system 160, Both joints formed on both sides can be machined. That is, when the bonding process is terminated on one surface of the large area display panel 110, the rotational driver (not shown) is operated to rotate the optical system 160 to generate a laser beam L in another area of the large area display panel in which the junction is formed. ) To complete the bonding process.

According to another embodiment of the present invention, the optical system 160 is positioned on one side of the panel on which the junction is formed using the gantry, and then the fine driving linear motor is driven to more precisely control the movement of the stage 120. And a bonding process is performed by irradiating a laser beam. When the bonding process is completed, the stage 120 is rotated, and then a first alignment is performed by moving the alignment mark formed on the panel into a field of view (FOV) using a first alignment device including a clamp. Next, the gantry is moved so that the optical system is positioned above the junction. The stage is precisely controlled to align the position of the optical system and the junction. Finally, the laser beam is irradiated to perform the bonding process.

FIG. 5 is a three-dimensional perspective view of a laser processing apparatus having a rotatable optical system, which may be used to cut a TEG wiring or an A / V (Auto Visual) pattern formed to test a large area display panel 110.

The plurality of pixels formed in the display panel 110 are connected to the electrode wires and connected to the pad electrodes on the side surfaces of the panel 110. The pad electrode is connected to a short bar and a TEG wire for testing a defect of the panel 110. Before the display panel and the flexible circuit board 191 are connected, the panel 110 is inspected by checking whether each pixel formed in the panel 110 is operated by using a short bar connected with the TEG wiring to inspect the panel 110 for failure. ) Will be judged as defective. When the inspection of the panel 110 is completed, the laser beam L is irradiated to cut the wiring or the pattern.

To this end, first, the large area display panel 110 to cut the wiring is mounted on the stage 120. The panel 110 seated on the stage 120 is first aligned to the center by a clamp, and then the panel is vacuum-adsorbed and fixed on the stage 120. Then, the optical system is positioned on the pattern to be cut by moving the gantry. Then, the micro-drive linear motor is operated based on the image displayed through the monitoring unit. As the stage moves finer with the operation of the microdrive linear motor, the secondary alignment is completed by aligning the position of the panel more precisely. When the secondary alignment is completed, the TEG wiring is cut by controlling the optical system to focus the laser beam on the area to be processed and then irradiating the laser beam. When the cutting process is complete, check the cutting status of the TEG wiring and complete the process.

According to an embodiment of the present invention, the optical system 160 is positioned on one side of the panel 110 to irradiate a laser beam. First, the laser beam output from the laser oscillator 170 is irradiated to one side surface of the panel by passing through the optical system, and then the wire is cut and then the wire cutting state is checked. When the cutting is completed, the operation of the laser oscillator 170 is stopped. Next, by operating the rotary drive unit connected to the optical system 160, rotate the optical system 160 to move to the other side of the panel 110 is formed another TEG wiring, and then restart the laser oscillator 170 to operate the laser beam By re-examined (L), after cutting the TEG wiring of the panel 110 in which the wirings are formed on the plurality of side surfaces, the cutting state of the wiring is confirmed and the process is completed.

According to another embodiment of the present invention, the optical system 160 is positioned on one side of the panel 110 on which the wiring is formed by using the gantry 210, and then the wiring is cut by irradiating a laser beam L. When the cutting is completed, after checking the cutting state, the stage 120 is rotated. The optical system 160 is positioned at the junction formed on the other side of the panel using the gantry 210, and the wiring is cut by irradiating a laser beam. When the cutting is completed, check the cutting status.

The width of the laser beam used to cut the TEG wiring according to the present invention may be 50 μm or less, and in the case of A / V (Auto Visual) pattern, 200 μm to 1000 μm or less.

Although the present invention has been shown and described with reference to the preferred embodiments as described above, it is not limited to the above embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

The present invention converts and irradiates beams output from a plurality of laser oscillators in a line shape corresponding to the length of one side of a large area display panel, thereby providing a flexible circuit having a large area display panel and a driver driver I / C mounted thereon. There is a remarkable and advantageous effect of reducing the time required for bonding the substrate and cutting the TEG wiring or A / V pattern, and maximizing the productivity and yield of the product.

Claims (24)

An apparatus for bonding a large area display panel and a flexible circuit board using a laser beam, A rotatable stage for seating the panel; A flexible circuit board on the side of the panel and having a drive I / C mounted thereon; An anisotropic conductive film disposed between the panel and the flexible circuit board for electrical contact; A transparent pressurizer for forming a junction by pressing the anisotropic conductive film and the panel on the flexible circuit board; A laser oscillator for outputting and irradiating a laser beam to the junction portion; An optical system for converting the laser beam into a line-shaped laser beam; A gantry for moving the optical system forward / backward, left / right to change the irradiation position of the laser beam; And Monitoring device for checking the alignment and bonding of the panel Laser processing apparatus using a line beam comprising a. An apparatus for cutting wiring formed in a large area display panel using a laser beam, A rotatable stage for seating the panel; A laser oscillator for outputting a laser beam to cut the wiring; An optical system positioned on a side of the wiring formed in the panel and outputting the laser beam by converting the laser beam into a line-shaped laser beam and moving up and down to adjust focus; A gantry for moving the optical system forward / backward, left / right to change the irradiation position of the laser beam; And Monitoring device for checking the alignment and cutting of the panel Laser processing apparatus using a line beam comprising a. The method according to claim 1 or 2, The optical system is a laser processing apparatus using a line beam capable of irradiating a laser beam on one side of the panel and a side perpendicular to the one side by rotating by a rotation drive unit. The method according to claim 1 or 2, The optical system is a laser processing apparatus using a line beam provided on a plurality of side surfaces of the panel. The method according to claim 1 or 2, The laser oscillator and the laser processing apparatus using a line beam provided in plurality. The method according to claim 1 or 2, The output terminal of the laser oscillator is a laser processing apparatus using a line beam connected to a plurality of optical fibers and optical system. The method according to claim 1 or 2, The laser oscillator is a laser processing apparatus using a line beam having a chiller to remove heat generated when the laser beam output. The method according to claim 1 or 2, A support table for supporting the stage; A guide rail formed on the support table for moving the stage in the X, Y, and Z axes; And Damping table for reducing vibration of the support table Laser processing apparatus using a line beam containing. The method of claim 2, The wiring is a laser processing apparatus using a line beam which is any one of a TEG wiring and an A / V pattern. The method of claim 9, Laser processing apparatus using a line beam of 50um or less width of the laser beam used to cut the TEG wiring. The method of claim 9, Laser processing apparatus using a line beam having a width of the laser beam used to cut the A / V pattern is 200um to 1000um or less. The method according to claim 1 or 2, The laser oscillator laser processing apparatus using a line beam using any one of a diode laser, DPSS laser, KrF excimer laser, ArF excimer laser, nanosecond, femtosecond and attosecond laser. The method of claim 12, The wavelength of the laser oscillator is a laser processing apparatus using a line beam using a 200nm to 1560nm band. The method of claim 8, A primary alignment device installed at an outer portion of the stage to insert an alignment mark formed in the panel into a field of view (FOV) area; A resin-based fixing member for preventing damage to the panel that may occur when loading on the stage and fixing the panel; And Vacuum adsorption means for fixing the panel when the substrate is seated on the stage Laser processing apparatus using a line beam comprising a. The optical system of claim 1 or 2, A beam intensity adjuster for adjusting the intensity of the laser beam; A beam former for modifying the shape of the laser beam; A beam homogenizer for equalizing the intensity of the beam; And Mirrors and lenses for controlling the path and focus of the laser beam Laser processing apparatus using a line beam comprising a. The method of claim 15, The beam former is a laser processing apparatus using a line beam for converting the laser beam to a width of several mm to several tens of mm. The method of claim 16, The optical system is provided with each of the laser oscillator laser processing apparatus using a line beam for controlling the shape or focus of each laser beam. The method according to claim 1 or 2, The monitoring device is located on one side of the optical system CCD camera for inspecting the processing state or alignment state; And Capture board and image processing board to capture images Laser processing apparatus using a line beam comprising a. The method of claim 18, The monitoring device laser processing apparatus using a line beam further comprises an illumination unit for irradiating visible light to capture the processing state. The method according to claim 1 or 2, Laser processing apparatus using a line beam including a control device for controlling the operation of each configuration, the driving of the laser oscillator, optical system and stage. In the method of bonding a large area display panel and a flexible circuit board using a laser beam, Mounting the panel on a stage; Forming a junction by loading an anisotropic conductive film and a flexible circuit board on an electrode formed on one side of the panel; Aligning the junction; Simultaneously pressing the junction and converting the laser beam into a line-shaped laser beam using an optical system and then irradiating the junction; And Checking the joint Laser processing method using a line beam comprising a. In the method for cutting the wiring formed in the large area display panel using a laser beam Mounting the panel on a stage; Aligning positions of the panel and the optical system; Converting the laser beam into a line-shaped laser beam using the optical system and irradiating the wiring; Monitoring a cutting state of the wires; And Checking the cut state of the wiring Laser processing method using a line beam comprising a. The method of claim 21 or 22, After confirming the cut state of the junction part or the wiring, rotating the optical system to change the irradiation position of the laser beam. The method of claim 21, wherein after the step of identifying the junction, Stacking an anisotropic conductive film and a printed circuit board on the lower end of the flexible circuit board to form a junction; Aligning the junction; And Pressing the upper portion of the flexible circuit board using a transparent pressurizer; Converting the laser beam into a line-shaped laser beam using the optical system and irradiating the junction; And Checking the bonding state of the joint Laser processing method using a line beam comprising a.

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