KR20080102089A - Test tray and handler for testing semiconductor device using the same and method for manufacturing of semiconductor device - Google Patents

Abstract

A test tray having ID discrimination groove is provided to reduce working progress of a discrimination groove by measuring a depth of a discrimination groove in a chamber consisting of an environment of a high temperature. A test tray having ID discrimination groove comprises the followings: a frame(110); a carrier module(120) in which the semiconductor device is settled, and having the regular interval on the frame; one or more ID discrimination groove(140) comprised in a side of the frame; and one or more discrimination block(150) controlling a depth of a discrimination groove, and inserted into the discrimination groove. The discrimination groove is formed in an upper surface of the frame.

Description

Test tray and handler for testing semiconductor device using the same and method for manufacturing of semiconductor device

1 is a configuration diagram schematically showing a handler for testing a general semiconductor device

2 and 3 are diagrams illustrating structures of a test tray and a carrier module respectively applied to a conventional semiconductor device test handler.

4 is a schematic view showing a test tray according to the present invention;

5 is a plan view schematically showing the overall structure of a handler for testing semiconductor devices to which a test tray according to the present invention is applied;

FIG. 6 is a side view of the handler for testing the semiconductor device of FIG. 5. FIG.

7 is a view for explaining the configuration and operation of the test tray identification device;

8 is a flowchart illustrating a method of manufacturing a semiconductor device according to the present invention.

Explanation of symbols for the main parts of the drawings

100: test tray 140: identification groove

150: identification block 200: loading unit

300: unloading unit 800: rotator

900: Test Tray Identification Device

The present invention relates to a handler for testing a semiconductor device, and more particularly, to a test tray for identifying an ID through a depth of an identification groove, a handler for testing a semiconductor device, and a method of manufacturing a semiconductor device using the same.

In general, memory ICs or non-memory semiconductor devices and module ICs having these circuits properly configured on a single substrate are shipped after various tests after production, and are automatically shipped as described above. As a handler, a device that is used to electrically test an external test device is called a handler.

In general, many of these handlers not only perform general performance tests at room temperature, but also create extreme environments of high temperature and low temperature through electrothermal heaters and liquefied nitrogen injection systems in closed chambers such as semiconductor devices and module ICs. It is also capable of performing high and low temperature tests, which test whether they can function under extreme temperature conditions.

Korean Patent Application Publication No. 10-0384622 filed and filed by the present applicant (May 22, 2003) has a large amount of semiconductors in a short time by constructing a plurality of chambers without increasing the overall size and structural complexity of the handler. A handler for testing semiconductor devices is disclosed that allows for efficient testing of devices.

1 is a block diagram schematically illustrating a handler for a test of a general semiconductor device.

As shown in FIG. 1, a handler capable of performing high and low temperature tests of a semiconductor device may include a first picker robot 51 in which the semiconductor devices to be tested, which are accommodated in a customer tray of the loading unit 10, linearly move on an XY axis. ) Is temporarily held in the buffer unit 40, and then transferred to the exchange unit 30 by the second picker robot 52 and remounted in the test tray T.

The test tray T in which the semiconductor devices to be tested are remounted is transferred to the test unit 70 located behind the handler by a separate transfer unit (not shown), and then the test tray 70 is heated or cooled at the test unit 70. Perform the test.

In the test unit 70, three closed chambers arranged to test the semiconductor devices under a predetermined temperature state while sequentially transferring the test trays by creating a high or low temperature environment therein are connected in a vertical direction. These chambers are equipped with a preheating chamber 71 for preheating the semiconductor devices to a high or low temperature, and the semiconductor devices passing through the preheating chamber 71 are mounted in a test socket (not shown) combined with a separate test equipment. And a test chamber 72 performing a test at a high temperature or a low temperature state, and a heat removing chamber which cools the tested semiconductor devices through the test chamber 72 or removes frost by heating to return to an original room temperature state. It consists of 73.

Meanwhile, the test tray T passing through the heat removal chamber 73 of the test unit 70 is transferred to the exchange unit 30 again, and then the semiconductor elements having been tested are buffered by the second picker robot 52. After temporarily mounting on the 40, the first picker robot 51 is classified and mounted on the predetermined customer tray of the unloading unit 20 according to the test result.

2 and 3 are diagrams illustrating structures of a test tray and a carrier module applied to a conventional semiconductor device test handler.

As shown in FIG. 2 and FIG. 3, the carrier modules 1 on which the semiconductor devices are mounted are arranged at regular intervals in the test tray T. In general, 64 (16 × 4) pieces are provided in one test tray T. Carrier module 1 is installed, but various numbers of carrier modules 1 may be used for the test tray T depending on the specifications of the test equipment such as 32 or 128.

The carrier module 1 is fixed in a state capable of flow to a certain degree by a spring (not shown) installed in the frame 11 of the test tray (T).

The carrier module 1 has a body portion 21 having a substantially rectangular shape, a seating portion 22 formed to mount a semiconductor element on the body portion 21, and moving at both ends of the seating portion 22. It is formed of a pair of latches 23 formed to be capable of holding the both ends of the semiconductor element fixed to the seating portion 22 fixedly.

The latch 23 is opened when the operation button 24 provided behind the body portion 21 is pressed to release the fixing of the semiconductor element, and when the force applied to the operation button 24 is removed, an elastic member (not shown) It returns to its original state by the elastic force, and the semiconductor element can be held.

However, the conventional semiconductor device test handler as described above has the following problems.

That is, the test trays in which the semiconductor elements to be tested are loaded into the preheating chamber and then heated to a predetermined temperature while being moved by one step by a predetermined transfer device.

However, an error may occur while the handler is running, and the handler may be stopped, and a worker may take out one or several test trays from the preheating chamber and then insert the test tray into the original position of the preheating chamber.

In this case, if an operator commits an error of changing the order of the test trays, a serious problem may occur in which the high-end semiconductor devices are damaged when the test trays are incorrectly distributed in the rear of the preheating chamber and the semiconductor devices are connected in the test chamber.

The present invention is to solve the above-mentioned conventional problems and to detect the ID (ID) of the test tray by measuring the depth of the identification groove before testing the semiconductor device seated on the test tray in the chamber formed in a high temperature environment The purpose of the present invention is to provide a test tray, a handler for testing semiconductor devices using the same, and a method of manufacturing a semiconductor device.

Test tray according to the present invention for achieving the above object is a frame; A carrier module arranged at regular intervals on the frame to seat a semiconductor device; At least one ID identification groove configured on the side of the frame, and characterized in that it comprises a at least one identification block inserted into the identification groove to adjust the depth of the identification groove.

In addition, the handler for testing a semiconductor device according to the present invention for achieving the above object includes a test tray on which a semiconductor device including a frame, a carrier module, an ID identification groove and an identification block is seated; A first chamber carrying the test tray and heating or cooling the semiconductor elements of the test tray to a predetermined temperature state; A test unit which performs a test by connecting the semiconductor element of the test tray to a test board; A second chamber for heating or cooling the semiconductor elements of the test tray on which the test is completed to a predetermined temperature state; And a test tray identification device for identifying an ID of the test tray by measuring an identification groove depth of the test tray heated or cooled from the first chamber.

In addition, the method for manufacturing a semiconductor device according to the present invention for achieving the above object comprises the steps of manufacturing at least one semiconductor device; Mounting each semiconductor device on a test tray including the frame, a carrier module, an ID identification groove, and an identification block; Heating or cooling the semiconductor device mounted on the test tray to a predetermined temperature; Identifying an ID of a test tray by measuring an identification groove depth of the test tray; Testing a semiconductor device mounted on the test tray; Heating or cooling the test tray on which the test is completed to a predetermined temperature; And separating the semiconductor device according to the test result.

Hereinafter, a test tray according to the present invention, a handler for testing a semiconductor device, and a method of manufacturing the semiconductor device using the same will be described in detail with reference to the accompanying drawings.

4 is a schematic view showing a test tray according to the present invention.

As shown in Figure 4, the test tray 100 according to the present invention is a semiconductor frame (not shown) is arranged with a frame 110 of a rectangular frame shape made of a metal material, and a predetermined interval on the frame 110 A pair of latches 130 installed at opposite sides of each of the carrier modules 120 and accommodating the carrier module 120 for accommodating the plurality of latches 130 to fix and release the semiconductor devices seated on the carrier module 120. And, the identification groove 140 is configured to have a predetermined depth on the side of the frame 110, and a plurality of identification blocks 150 inserted into the identification groove 140 to adjust the depth of the identification groove 140. It is made, including.

The identification block 150 has the same thickness, and selectively fills the identification groove 140, the identification groove 140 is the final depth, that is, the identification block 150 at the depth of the identification groove 140 ID represents the test tray 100 through the depth minus the height.

For example, when five identification blocks 150 having a thickness of 10 mm are inserted into the identification groove 140 having a depth of 100 mm, the depth of the final identification groove 140 becomes 50 mm. At this time, the test tray 100 having a depth of 50 mm of the identification groove 140 has a unique ID.

On the other hand, when the depth of the identification groove 140 is 100mm, and the identification block 150 is made of 10 pieces 10mm in thickness, the identification groove 140 is the number of the identification block 150 is inserted The depth is lowered proportionally, and each test tray 100 has a unique depth to distinguish it from other test trays.

In the embodiment of the present invention has been described that the identification block 150 has the same thickness, but is not limited to this, even if having a different thickness is selectively inserted into the identification groove 140 of the identification groove 140 You can also adjust the depth.

On the other hand, in the embodiment of the present invention by identifying the test tray 100 through the final depth of the identification groove 140 formed on the side of the test tray 100, the test tray 100 has been tested in the handler for semiconductor device testing. In addition, the semiconductor device can be separated more smoothly and the ID number can be accurately identified before being distributed to the test chamber even during the test, thereby preventing the test tray from being incorrectly coupled to the test head and broken by the identification error. Can be.

The latch 130 is pivotally installed on a latch operating member (not shown), which is formed separately from the carrier module 120, and accommodated in the carrier module 120 while being rotated in association with an operation button of the latch operating member. It is configured to fix and release the semiconductor device.

Although not shown in detail, the carrier module 120 includes a body portion having a substantially rectangular shape, a seating portion formed to mount a semiconductor element on the body portion, and a movable portion formed on both sides of the seating portion. It is composed of a pair of latch 130 for holding the both ends of the semiconductor element is fixed to the part fixedly.

The latch 130 is opened when the operation button provided behind the body is pressed to release the fixing of the semiconductor element, and when the force applied to the operation button is removed, the latch 130 returns to its original state by the elastic force of the elastic member (not shown). And the semiconductor element can be held.

Meanwhile, although the test tray 100 describes one identification groove 140 in the embodiment of the present invention, the identification tray 140 is formed after forming a plurality of identification grooves 140 having a predetermined interval without being limited thereto. It may be configured through a plurality of identification block 150 is inserted into the inside to adjust the depth of the identification groove 140.

In addition, when the plurality of identification grooves 140 are formed, the depths of the identification grooves 140 may be formed at the same depth or may be formed at different depths.

The test tray according to the present invention configured as described above moves in a horizontal or vertical direction in a handler for a semiconductor device test. In this case, the identification groove 140 is formed on the left side or the right side of the frame 110 when moving in the horizontal direction, and the identification device 140 is formed by forming the identification groove 140 on the upper side of the frame 110 when moving in the vertical direction. This makes it easy to identify the test tray.

5 is a plan view schematically showing the overall structure of a semiconductor device test handler to which the test tray according to the present invention is applied, and FIG. 6 is a side view of the handler for semiconductor device test of FIG. 5.

5 and 6, the handler for testing a semiconductor device according to the present invention includes a loading unit 200 in which customer trays (not shown) in which a plurality of semiconductor devices to be tested are stored are installed. The unloading unit 300 may be installed at one side of the loading unit 200 to classify the tested semiconductor devices according to the test result and to be stored in the customer tray.

In addition, the loading side buffer unit 410 and the unloading side buffer unit 420 in which the semiconductor elements transferred from the loading unit 200 are temporarily seated at both sides of the middle portion of the handler are buffer moving units (not shown). It is installed so that forward and backward are possible.

Between the loading side buffer unit 410 and the unloading side buffer unit 420 transfers the semiconductor device to be tested and remounts the test tray 100 and separates the tested semiconductor device of the test tray 100 from each other. The exchange unit 430 is made to work is installed.

In the test tray 100, a plurality of carrier modules C temporarily fixing semiconductor elements are arranged at predetermined intervals.

In addition, a first loading / unloading picker 510 which transfers the semiconductor devices while horizontally moving between the loading part 200, the unloading part 300, and the buffer parts 410 and 420 above the front part of the handler; Second loading / unloading pickers 520 are respectively installed. The first and second loading / unloading pickers 510 and 520 are vacuum-adsorbed and conveyed the semiconductor elements while moving in the front, rear and left and right directions above the front part of the handler.

A plurality of single-axis pickers 610 and 620 which transfer semiconductor elements between the exchanger 430 and both buffer units 410 and 420 and the exchanger 430 are horizontally moved in the X-axis direction.

In the rear part of the handler, a test unit configured to test the semiconductor element under a predetermined temperature condition by sequentially transferring the test trays 100 in which the semiconductor element is mounted after creating a high or low temperature environment in a plurality of sealed chambers. 700 is disposed.

In the test unit 700, the test tray 100 is moved in a vertical state, and in the exchange unit 430, the operation of attaching and detaching a semiconductor device to the test tray 100 is performed in a horizontal state of the test tray 100. .

Here, although the test tray 100 is described as moving in a vertical state, the test tray 100 may be moved in a horizontal state.

Therefore, between the front end of the test unit 700 and the exchange unit 430, the rotator 800 for conveying while transferring the test tray 100 from the horizontal state to the vertical state, from the vertical state to the horizontal state is 90 degrees It is installed to reciprocate.

On the other hand, the exchange unit 430 is configured to be carried out to carry out a separate operation for conveying the test tray 100 in two positions. That is, in the upper working place (working place) while the test tray 100 is horizontally moved by a moving unit (not shown) by one step while the mounting and removal of the semiconductor device is performed.

In the stand-by position immediately below the work position, the test tray 100 is transported between the test unit 700 and the exchange unit 430 through the rotator 800.

The exchange unit 430 is provided with a lifting unit 350 for elevating the test tray 100 between the standby position and the working position.

On the other hand, the test unit 700 has a rear portion composed of two layers up and down so that two test trays 100 can be tested at the same time. In the exemplary embodiment of the present invention, the two test trays 100 are described to be tested, but the present invention is not limited thereto and may be configured to test one test tray or a plurality of test trays.

Referring to the configuration of the test unit 700 in more detail as follows. That is, the test unit 700 transfers the test tray 100 transferred from the exchange unit 430 step by step from front to back, and heats or cools the semiconductor devices to a predetermined temperature. The preheating chamber 710 and the semiconductor elements of the test tray 100 transferred through the preheating chamber 710 may be mounted on a test socket (not shown) coupled with an external test equipment (not shown). Performing the test chamber 720 and the test tray 100 transferred through the test chamber 720 step by step from the rear to the front step by step (step) while transferring the tested semiconductor device to the initial room temperature state And a heat removal chamber 730 for returning.

Here, the preheating chamber 710, the test chamber 720, and the heat removing chamber 730 are sequentially disposed in the axial direction. At the rear of the test chamber 720, a test board 740 having a plurality of test sockets (not shown) is formed in two layers. Meanwhile, the test board 740 may be configured as one layer.

In addition, when the test tray 100 is aligned with the upper and lower test boards 740U and 740L in the test chamber 720, the carrier module C of the test tray 100 is pressed by the test board 740. As a result, the contact unit 750 for connecting the semiconductor element to the test socket is provided so as to be movable forward and backward.

The rear end of the preheating chamber 710 and the heat removal chamber 730 is provided with an elevator (not shown) for transporting while moving the test tray 100 moved to the rear of each chamber up and down.

In front of the test unit 700, the test tray 100 and the test tray 100 of the heat removal chamber 730 transferred from the exchange unit 430 to the preheating chamber 710 and the exchange unit 430 on the side, respectively. A front side transfer unit 760 for transferring is installed.

The rear transfer unit 770 transfers the preheating chamber 710 and the test tray 100 of the test chamber 720 to the test chamber 720 and the heat removal chamber 730, respectively, at the rear of the test unit 700. This is installed.

And a test tray identification device for measuring the depth of the identification groove 140 of the test tray 100 when the test tray 100 is moved to the rear of the preheat chamber 710 on the outer surface of the preheat chamber 710 900 is installed.

Here, the identification groove 140 is the ID of the test tray 100 through the test tray identification device 900 by measuring the final depth remaining after the identification block 150 is selectively inserted therein as described above. Will be detected.

The configuration and operation of the test tray identification device 900 will be described in detail with reference to FIG. 7 as follows.

That is, FIG. 7 is a configuration diagram schematically showing a test tray identification device.

First, as shown in Figure 7, the test tray 100 is formed with an identification groove 140 having a predetermined depth on the side, and inserted into the identification groove 140, the depth of the identification groove 140 A plurality of identification block 150 is formed to control the. In this case, the test tray identification apparatus 900 measures the remaining depth of the identification groove 140 while the identification block 150 is inserted into the identification groove 140 to identify the ID of the test tray 100. do.

That is, the test tray identification apparatus 900 for identifying the ID number of the test tray 100 is mounted to the mount unit 910 and the mount unit 910 which are installed on the outer wall of the preheating chamber 710. The probe 920 is inserted into the identification groove 140 of the test tray 100 and is movable up and down, and a detection sensor 930 for detecting the movement of the probe 920.

The mount portion 910 is a fixed block 911 fixed to the wall surface of the preheating chamber 710, and the cylinder rod 912 is installed to the fixed block 911 to be slidable in the inner and outer direction of the preheating chamber 710. And a connection block 913 connecting the outer end of the cylinder rod 912 and the probe 920. Reference numeral 916 is a bushing for slidably supporting the cylinder rod 912 with respect to the fixed block 911.

In addition, a pneumatic cylinder 940 is formed on an outer surface of the preheating chamber 710 to move the cylinder rod 912 up and down by reciprocating the connecting block 913.

The probe unit 920 is preferably made of a material having excellent heat resistance.

On the other hand, the ruler 950 is formed on the inside of the pneumatic cylinder 940 and the side of the cylinder rod 910 connected to the connection block 913, the ruler 950 using the detection sensor 930 The probe unit 920 reads the depth of the identification groove 140 of the test tray 100.

In the exemplary embodiment of the present invention, the ruler 950 is described, but the present invention is not limited thereto, and an external display unit (not shown) is provided through the detection sensor 930 so that an operator can know the position of the probe unit 920 in real time. Not displayed).

That is, the probe unit 920 may be configured of a sensor having a light receiving unit and a light emitting unit to measure the depth of the identification groove and display the side of the cylinder rod 912.

The handler for testing a semiconductor device according to the present invention configured as described above operates as follows.

First, when the operator loads the customer tray containing the semiconductor devices to be tested in the loading unit 200 and operates the handler, the first loading / unloading picker 510 may vacuum-adsorb the semiconductor elements of the loading unit 200. It transfers to the loading side buffer part 410.

Subsequently, while the loading side short pickers 610 move independently along the second and third X-axis frames 630 and 640, the semiconductor element on the loading side buffer unit 410 is vacuum-adsorbed to form the test tray 100. It is attached to the carrier (C).

When all of the semiconductor devices are mounted on the test tray 100 of the exchange unit 430, the test tray 100 is conveyed to the front part of the test unit 700 while the rotator 800 is rotated by 90 degrees. Subsequently, the front transfer unit 760 of the test unit 700 is operated to slide the test tray 100 into the preheating chamber 710.

Here, in the embodiment of the present invention, while the rotator 800 is rotated 90 degrees, it is described that the conveyance of the test tray 100 to the front of the test unit 700, but the test above the loading unit 200 The test tray 100 configured as the unit 700 and rotated 90 degrees through the rotator 800 may be slid upward.

That is, in the exemplary embodiment of the present invention, the test tray 100 may be moved up, down, left, or right, in an upright position.

The test tray 100 conveyed into the preheating chamber 710 is heated or cooled to a predetermined temperature while moving backward by one step by a test tray feeder (not shown) provided in the preheating chamber 710.

On the other hand, although the movement by one step by the test tray feeder has been described, it may be moved backwards by a predetermined interval through a ball screw type or a linear motor.

When the test tray 100 is located at the rear of the preheating chamber 710, the pneumatic cylinder 940 of the test tray identification device 900 is operated so that the connection block 913 and the cylinder rod 912 are preheating chamber. 710, the inside of the probe unit 920 is inserted into the identification groove 140 to identify the ID number of the test tray 100.

At this time, when the probe unit 920 is inserted into the identification groove 140, the ruler 950 formed on the side of the cylinder rod 912 is also automatically lowered downward and the detection sensor 930 is the ruler 950. The ID of the test tray 100 is detected by reading.

On the other hand, after the test tray identification device 900 identifies the ID number of the test tray 100 moved to the rearmost of the preheating chamber 710, the pneumatic cylinder 940 is operated again to connect the connection block 913 and The cylinder rod 912 moves in an outward direction so that the end of the probe 920 exits from the identification groove 140, and the test tray 100 can be lifted by the operation of an elevator (not shown). do.

In addition, when the test tray identification device 900 reads the ID number of the test tray, the test tray identification device 900 moves upwards by the elevator (not shown) and then moves to an upper rear transfer unit 770. Is conveyed to the test chamber 720.

In the test chamber 720, when the test tray 100 is aligned in front of each of the test boards 740 on the upper and lower sides, the contact unit 750 may move a carrier (not shown) of the test tray 100 to the test board ( Pressing toward the 740 to connect the semiconductor device to a test socket (not shown) of the test board 740 to perform an electrical performance test.

When the test is completed, the rear transfer unit 770 again conveys the test trays 100 to the heat removal chamber 730, and in the heat removal chamber 730, a separate test tray transfer device (not shown) is connected to the test tray. The semiconductor device of the test tray 100 is returned to the normal temperature state by advancing the 100 by one step.

The test tray 100 moved to the rearmost portion of the heat removal chamber 730 is conveyed to the intermediate portion of the test unit 700 by the front transfer unit 760, and then the exchange unit 430 by the rotator 800. The carriers C are aligned on the movement paths of the short pickers 610 and 620 while the test tray 100 is moved to a predetermined pitch by the moving unit 350.

Thereafter, the two short pickers 620 move along the second and third X-axis frames 630 and 640, and vacuum suck the tested semiconductor device from the test tray T to the unloading side buffer unit 420. At the same time as the conveyance, two short pickers 610 on the opposite side are vacuum-adsorbed new semiconductor elements of the loading-side buffer unit 410 to be mounted on the empty carrier C of the test tray 100.

As described above, when the tested semiconductor device is placed in the unloading side buffer unit 420 by the unloading side short picker 620, the second loading / unloading picker 520 is the semiconductor of the unloading side buffer unit 420. The devices are sorted for each test result in the customer tray of the unloading unit 300 and re-stored.

8 is a flowchart illustrating a method of manufacturing a semiconductor device according to the present invention.

As shown in FIG. 8, a plurality of semiconductor devices are manufactured through a conventional manufacturing method (S101). The semiconductor device may be a liquid crystal display, a DRAM, a FRAM, a MOS transistor, an organic light emitting device, a diode, or the like.

Subsequently, it is seated on a carrier module configured in a test tray to test the semiconductor device (S102). Here, the carrier module has a body portion having a substantially rectangular shape, a seating portion formed so that the semiconductor element is seated on the body portion, and both sides of the semiconductor element formed to be movable at both ends of the seating portion and seated on the seating portion. It consists of a pair of latches holding the stage fixedly.

Here, an identification groove having a predetermined depth is formed at a side of the test tray, and at least one identification block inserted into the identification groove to control the depth of the identification groove may be embedded.

Subsequently, the test tray on which the semiconductor device is mounted is rotated by 90 degrees in the horizontal direction using the rotator, inserted into the first chamber in the vertical direction, and heated or cooled to a predetermined temperature while moving step by step (S103).

Meanwhile, although the test tray is rotated in the vertical direction using the rotator, the test tray may be heated or cooled by moving the test tray in the horizontal direction.

Subsequently, the ID of the test tray is identified by checking the depth of the identification groove formed on the side surface of the test tray by using the test tray identification device installed on the wall of the end of the first chamber. Here, since the identification groove is erected in the vertical direction of the test tray, the depth is adjusted by the identification block inserted therein while having a predetermined depth on the upper side of the test tray.

For example, when the total depth of the identification groove is 100 mm and the thickness of one of the identification blocks is 10 mm, if one identification block is inserted into the identification groove, the first test tray and two identification blocks When inserted, it is divided into 2 test trays and 3 identification blocks are inserted into 3 test trays.

Meanwhile, when the test tray moves in the horizontal direction, an identification groove is formed on the left side or the right side of the test tray, and the ID of the test tray is detected by measuring the depth of the identification groove.

Subsequently, the semiconductor device mounted on the test tray is tested using the test unit to determine whether there is a defect (S105).

Subsequently, the test tray on which the semiconductor element on which the test is completed is mounted is heated or cooled to a predetermined temperature while moving to the second chamber by one step (S106).

Here, when heated in the first chamber, cooling is performed in the second chamber, and when cooled in the first chamber, the second chamber is heated.

In operation S107, the semiconductor device is separated from the test tray passing through the second chamber according to the test result.

On the other hand, the present invention described above is not limited to the above-described embodiment and the accompanying drawings, it is possible that various substitutions, modifications and changes within the scope without departing from the technical spirit of the present invention. It will be apparent to those of ordinary skill in Esau.

As described above, the test tray according to the present invention, a handler for testing a semiconductor device, and a method of manufacturing a semiconductor device using the same have the following effects.

First, by identifying the ID of the test tray by measuring the depth of the identification groove can be separated more efficiently when separating the semiconductor device is completed the test. In other words, the semiconductor device may be separated by accurately identifying the ID of the test tray in which the semiconductor device for the defect is mounted through the test.

Second, by forming an identification groove and an identification block having a predetermined depth on the side of the test tray for identification, the identification number can be accurately identified before being distributed to the test chamber at the rear of the preheating chamber. It can be prevented from being incorrectly bonded to the test head and broken.

Third, by reducing the number of identification grooves and defects of identification blocks of various sizes in proportion to the increase in the number of identification grooves, more identification numbers can be assigned, thereby reducing the identification groove processing process and improving the working capacity of the handler. have.

Claims (11)

frame; A carrier module arranged at regular intervals on the frame to seat a semiconductor device; At least one ID identification groove formed at a side of the frame; And And at least one identification block inserted into the identification groove to adjust the depth of the identification groove. The test tray of claim 1, wherein the identification groove is formed on an upper surface of the frame. The test tray of claim 1, wherein the identification groove is formed on a left side or a right side of the frame. The test tray of claim 1, wherein each of the identification blocks has the same thickness. The test tray of claim 1, wherein each of the identification blocks has a different thickness. A test tray according to any one of claims 1 to 5, on which a semiconductor element is mounted; A first chamber carrying the test tray and heating or cooling the semiconductor elements of the test tray to a predetermined temperature state; A test unit which performs a test by connecting the semiconductor element of the test tray to a test board; A second chamber for heating or cooling the semiconductor elements of the test tray on which the test is completed to a predetermined temperature state; And And a test tray identification device for identifying an ID of the test tray by measuring an identification groove depth of the test tray heated or cooled from the first chamber. The handler for testing a semiconductor device according to claim 6, wherein the test tray identification device is provided on an outer surface of the first chamber. The apparatus of claim 6, wherein the test tray identification device comprises: a mount installed on a wall of the first chamber, a probe installed on the mount, inserted into an identification groove of the test tray, and moving up and down; Handler for semiconductor device testing, comprising a detection sensor for detecting the movement of the negative. The method of claim 8, wherein the mount portion is a fixed block fixed to the wall surface of the first chamber, a cylinder rod slidably installed in the inner and outer direction of the first chamber on the fixed block, the outer end and the probe portion of the cylinder rod And a bushing for slidably supporting the cylinder rod with respect to the connecting block for connecting and the fixed block. Manufacturing at least one semiconductor device; Placing each semiconductor device in a test tray according to any one of claims 1 to 5; Heating or cooling the semiconductor device mounted on the test tray to a predetermined temperature; Identifying an ID of a test tray by measuring an identification groove depth of the test tray; Testing a semiconductor device mounted on the test tray; Heating or cooling the test tray on which the test is completed to a predetermined temperature; And And separating the semiconductor device according to the test result. The method of claim 10, wherein the test tray is tested by modifying or leveling the test tray when the semiconductor device is tested.

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