KR20080071869A - Oven apparatus for manufacturing a semiconductor - Google Patents

Abstract

An oven apparatus for manufacturing a semiconductor device is provided to improve a manufacturing yield of the semiconductor device by automatically selecting one of plural substrates and ejecting the selected substrate. A door is installed on a front portion of a frame body. Intensive heat is supplied to a heating chamber from a blower. An inlet unit supplies a substrate after a bonding or molding process to the heating chamber by using a substrate transfer unit. An outlet unit ejects the substrate after a heating process from the heating chamber by using the substrate transfer unit. A motor(6) is fixed on the frame body and generates forward and backward driving forces. A driving pulley is rotated by the motor. A driven pulley(9) receives a rotational force from the driving pulley through a belt. A fixing mount(20) is fixed in the heating chamber in a vertical direction. An upper sprocket is rotatably coupled with an axis of the driven pulley. A lower sprocket is connected to the upper sprocket through a connection chain. An elevator(13) is elevated according to a rotation direction of the connection chain. An evacuation hole prevents an interference between the elevator and a fixing portion of the connection chain. Substrates are loaded on a magazine(17) inside the heating chamber.

Description

Oven apparatus for manufacturing a semiconductor

1 is a perspective view of an external appearance of an oven apparatus for manufacturing a semiconductor of the present invention from one side

Figure 2 is a perspective view of the appearance of the oven apparatus for producing a semiconductor of the present invention from the other side

Figure 3 is a perspective view showing a part of the inside of the oven apparatus for producing a semiconductor of the present invention

Figure 4 is a perspective view showing the rear side to enlarge the main configuration of the oven apparatus for producing a semiconductor of the present invention

Figure 5 is a rear perspective view showing the main portion cut to show the coupling configuration of the guide bending piece and the guide roller which are components of the oven apparatus for manufacturing a semiconductor of the present invention.

Figure 6 is a cross-sectional view showing an oven apparatus for producing a semiconductor of the present invention.

FIG. 7A is a cross-sectional view taken along the line I-I of FIG. 6, showing a state in which the magazine is lowered

FIG. 7B is a cross-sectional view taken along the line I-I of FIG. 6, showing a state in which the mega is raised

Explanation of symbols for the main parts of the drawings

1. Main frame 2. Door

3. Heating chamber 4. Inlet

5. Outlet 6. Motor

7. Drive pulley 8. Belt

9. Follower pulley 10. Upper sprocket

11.Connection Chain 12. Lower Sprocket

13. Lift member 14. Evacuation hole

15. Upper Bracket 16. Lower Bracket

17. Mega 17a. Mounting groove

18. Guide bending piece 19. Guide roller

20. Support

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an oven for semiconductor manufacturing in which bonding and molding portions are cured by high temperature immediately after various bonding and molding in semiconductor manufacturing fixing. More specifically, the present invention relates to a semiconductor lead frame or a PCB substrate (hereinafter, referred to as a bonding and molding process). The present invention relates to an oven apparatus for manufacturing a semiconductor, which is capable of being heated at a time for a long time in a state where a "substrate" is mounted on a magazine.

In general, a semiconductor manufacturing line performs die bonding, wire bonding, package molding, etc. on a substrate. At this time, the bonding and molding portions should be heated to a high temperature to be cured, and the bonding and molding portions are baked at a high temperature to cure. The device for making it is an oven device.

The oven apparatus needs to maintain a high temperature for a few seconds to a long time depending on the semiconductor to be manufactured, and thus needs an oven apparatus suitable for the same.

There are two types of conventional oven apparatus known to date, one of which is a high temperature heat inside the heating chamber while the substrate is passed in the heating chamber in the in-line form due to the rotation of the belt while the substrate is mounted on the belt. By bonding, the bonding and molding portions of the substrate are cured. The other is a magazine in which a plurality of substrates are mounted in a heating chamber, and the bonding and molding portions of the substrate are cured by supplying high temperature heat into the heating chamber. To make it possible.

The first one of the two types has the advantage of improving the work efficiency by heating a large number of substrates in a short time by continuously passing the bonding and molding process in-line through the heating chamber. Since the substrate cannot be kept in the heating chamber for a long time, there is a disadvantage that it cannot be used when the curing process is performed for a long time.

The other type, which is the second type, mounts a large number of substrates that have undergone bonding and molding in a mega-magnet and then artificially inserts them into the heating chamber to heat them for a long time (as long as the operator desires). Although there is an advantage in that the operator manually mounts a plurality of substrates on the outside of the magazine, and the substrate mounted on the magazine also has a disadvantage in that it is very inconvenient to use because the operator has to pick it up by hand and put it in the heating chamber. .

The present invention has been made in order to solve the above-mentioned conventional problems, by installing an elevator elevating magazine inside the heating chamber in order to sequentially raise the magazine is supplied to the heating chamber through the substrate supply apparatus known in the magazine The purpose of this is to allow a large number of substrates to stay in the heating chamber for the required time at a time, so that it is easy to use and improves work efficiency.

An object of the present invention described above, the front door is installed in the frame body for supporting various components, the heating chamber is fixed to the inside of the frame body is supplied with a high temperature heat by a known hot air fan not shown, An inlet portion formed to connect the frame body and one side of the heating chamber in a horizontal state to serve as a supply passage so that the substrate, which has undergone bonding or molding, enters into the heating chamber by a known substrate transfer device, and the frame body and heating An outlet portion formed on the same horizontal line as the inlet portion so as to keep the other side of the chamber in a horizontal state and acting as a discharge passage so that the substrate subjected to the heating process in the heating chamber is discharged to the outside of the heating chamber by a known substrate transfer device; A motor fixed to the frame body to receive power to generate a forward and reverse driving force, and to be located at one side of the frame body; Drive pulley axially coupled to the motor to rotate forward and reverse according to the driving direction of the motor, and driven out apart from the drive pulley so as to be located on one side of the frame main body driven driven pulley to receive the rotational force of the drive pulley through the belt And a support fixed in the heating chamber in a vertical state, an upper sprocket rotatably installed in connection with the axis of the driven pulley so as to be positioned above the rear outer side of the support, and rotatably in the outer lower portion of the rear of the support. A lower sprocket connected by the upper sprocket and the connection chain so as to be rotated under the rotational force of the upper sprocket, and a part of which is mounted on the front of the support in a fixed state with the connection chain so as to rotate in the direction of rotation of the connection chain. An elevating member that elevates along the elevating member, the elevating member formed in the support base according to the rotational direction of the connection chain Evacuation hole to ensure that the fixed portion of the elevating member and the connection chain does not interfere with the support when the elevating member, and a plurality of mounting grooves on the surface facing each other in a layered layer and is fixed to the elevating member as an upper fixing bracket and a lower fixing bracket It can be achieved by providing an oven apparatus for manufacturing a semiconductor, characterized in that consisting of a magazine for mounting a substrate (lead frame or PCB substrate) that is lifted with the elevating member and introduced into the heating chamber through the inlet.

Hereinafter, with reference to the accompanying Figures 1 to 7 showing the present invention as an embodiment in more detail as follows.

1 is a perspective view of an external appearance of an oven apparatus for manufacturing a semiconductor of the present invention from one side, and FIG. 2 is a perspective view of an external apparatus of an oven apparatus for a semiconductor manufacturing of the present invention from another side, and FIG. 4 is a perspective view showing a rear side of the main portion of an oven apparatus for manufacturing a semiconductor according to the present invention, and FIG. 5 is a combined configuration of a guide bent piece and a guide roller that are components of the oven apparatus for manufacturing a semiconductor of the present invention. 6 is a cross-sectional perspective view showing an oven apparatus for manufacturing a semiconductor of the present invention, and FIGS. 7A and 7B are cross-sectional views taken along line II of FIG. 6.

The present invention is provided with a frame body (1) having a door (2) in the front and supporting a plurality of components, the heating chamber in which high temperature heat is supplied to the inside by a known hot air fan not shown inside the frame body (3) is fixed, and one side of the frame body (1) and the heating chamber (3) serves as a supply passage so that the substrate subjected to the bonding or molding process enters into the heating chamber (3) by a known substrate transfer device. The inlet part 4 is formed to be horizontally connected, and the other side of the frame main body 1 and the heating chamber 3 is positioned on the same horizontal line as the inlet part 4 and is subjected to the heating process in the heating chamber 3. By this known substrate transfer device, the outlet portion 5 serving as the discharge passage so as to exit to the outside of the heating chamber 3 is formed to be horizontally connected.

The motor main body 6 is fixed to the frame body 1 to generate a forward and reverse driving force by receiving power, and the driving direction of the motor is axially coupled to the motor 6 on one side of the frame body 1. According to the drive pulley 7 is installed so as to rotate forward and reverse, and one side of the frame body (1) to receive the rotational force of the drive pulley in the state spaced apart from the drive pulley (7) through the belt (8) to rotate Driven pulley (9) is installed,

The support 20 is fixed in the heating chamber in a vertical state, and the upper sprocket 10 is rotatably installed in a state connected to the axis of the driven pulley 9 on the outer upper portion of the rear of the support, and the support ( The lower sprocket 12 is installed at an outer lower portion of the rear surface of the rear surface 20 while being connected by the upper sprocket 10 and the connection chain 11 so as to rotate under the rotational force of the upper sprocket 10, and the support ( A lifting member 13 is installed on the front surface of the lifting member 13 so as to move in accordance with the rotational direction of the connection chain while a part thereof is fixed to the connection chain 11.

Evacuate the rear of the support 20 so that the fixed portion of the elevating member and the connecting chain 11 does not interfere with the support 20 when the elevating member 13 is elevated in accordance with the rotation direction of the connecting chain 11. A ball 14 is formed, and is fixed to the elevating member 13 as the upper fixed bracket 15 and the lower fixed bracket 16 to be elevated together with the elevating member, and the heating chamber 3 through the inlet 4. ) Mega-magazine 17 having a plurality of mounting grooves 17a on a side facing each other to mount a lead frame or a PCB substrate (hereinafter referred to as a "substrate") to be introduced into the inside.

In addition, the guide bending piece 18 is fixed to the inside of the rear side and the side of the support 20, respectively, and the guide roller 19 in the state fitted to each guide bending piece 18 on the upper and lower portions of the elevating member 13, respectively. Is rotatably installed so that the lifting and lowering of the elevating member 13 is performed stably as the guide roller 19 is guided to the guide bending piece 18 while the elevating member 13 is being moved. do.

In the above configuration, an upper pulley may be used instead of the upper sprocket 10, an upper pulley may be used instead of the lower sprocket 12, and a connecting belt may be used instead of the connecting chain 11.

On the other hand, the drive pulley 7 installed on one side of the frame main body 1 in the state coupled to the motor 6 and the driven pulley 9 provided on one side of the frame main body 1 in a state spaced apart from the drive pulley and the The belt 8 which transmits the rotational force of the driving pulley 7 to the driven pulley 9 has a risk of a safety accident during the working process, so that a safety cover is fixed to one outside of the frame body 1 to the safety cover. By this means, the drive pulley 7, the driven pulley 9 and the belt 8 are preferably protected at the same time.

The process of allowing the bonding or molding portion to be cured by heating the substrate subjected to the bonding or molding process to a high temperature by the oven apparatus for manufacturing a semiconductor of the present invention configured as described above is as follows.

The substrates, which have been subjected to die bonding, wire bonding, package molding, and the like, are supplied one by one to the inlet portion 4 of one side of the frame body 1, which is one of the components of the present invention, using a known substrate transfer device, not shown. At this time, the magazine 17 located in the heating chamber 3 in the frame body 1 is completely lowered, and in this case, each mounting groove 17a formed in a layered layer on the mutually facing surfaces of the magazine 17 is provided. Since the uppermost mounting groove of the upper part maintains the same horizontal line as the inlet part 4, the single substrate supplied through the inlet part 4 is mounted in the mounting groove formed at the top of the magazine 17.

After the one board is mounted in the mounting groove 17a at the top of the magazine 17 as described above, the control signal of the controller (not shown) is the motor 6 fixed to the frame main body 1. According to the constant driving for a predetermined time so that the drive pulley (7) axially coupled to the motor rotates in one direction to the regular driving force of the motor (6), the one-way rotational force of the drive pulley (7) is also framed through the belt (8) The driven pulley 9 is axially coupled to the main body 1 so that the driven pulley rotates in the same direction as the driving pulley 7, and when the driven pulley 9 rotates, it is connected to the axis of the driven pulley. The upper sprocket 10, which is rotatably installed on the rear outer top of the furnace support 20, is rotated in one direction, and when the upper sprocket is rotated, the upper sprocket 10 is rotatably installed on the lower rear outer side of the support 20. Opening with upper sprocket (10) Lower sprockets 12 that are linked by a chain 11 to rotate in one direction.

Therefore, the connecting chain 11 connecting the upper sprocket 10 and the lower sprocket 12 rotates in the clockwise direction in the state as shown in FIG. 7A so that the connecting chain 11 can be lifted and supported by the support 20. A part of the installed elevating member 13 is fixed, and the mega board 17 is fixed to the elevating member by upper and lower fixing brackets 15 and 16. The excitation 17 rises as shown in FIG. 7B, in which the forward driving of the motor 6 is performed immediately below the first on which the substrate is mounted among the mounting grooves 17a formed in the mega 17 according to the control signal of the controller. Since the mounting groove is made until it is positioned on the same horizontal line as the inlet 4, and stops, the substrate continuously supplied to the inlet 4 by the substrate moving device is formed in the mega 17 when the operation is repeated. Top of the mounting groove 17a In order from the home will be equipped with savory can be understood.

The connection chain 11 and the elevating member 13 is fixed when the elevating member rises due to the rotation of the connecting chain 11 in a state where a part of the elevating member 13 is fixed to the connecting chain 11. You will think that the part will interfere with the support 20, but since the evacuation hole 14 is formed on the back of the support 20, the lifting member 13 actually rises or descends in the operation described later in connection with the chain ( 11) and the fixing portion of the elevating member 13 will never interfere with the support 20.

On the other hand, after all the substrates supplied to the inlet 4 through the above process is mounted in the magazine 17, the heating chamber (3) in which the magazine is located inside is completely sealed and a hot air fan (not shown) operates. Since the high temperature heat is supplied to the heating chamber 3, the bonding or molding portion of the substrate mounted on the magazine 17 undergoes a curing process for a necessary time by high temperature heat. In the curing process, the motor 6 is Bonding and molding hardening of the substrate is performed quickly and completely over the entire part as the rising and falling of the mega 17 is repeated several times in the heating chamber 3 when the driving is repeatedly performed forward and backward as necessary. will be.

After the bonding of the substrate and the hardening of the holding part is completed, the substrate, which is mounted in the magazine 17 in the heating chamber 3, must be discharged to the outside. The discharge process of the substrate will be described below. .

The operator selects the discharge of a specific substrate among the plurality of substrates mounted in the magazine 17 in the heating chamber 3 by the operation of the controller provided in the frame main body 1, or sequentially discharges all the substrates. If selected, the driving direction and the driving amount of the motor 6 are determined according to the selection, so the mega 17 in the heating chamber 3 is raised or lowered together with the elevating member 13 to select one of the substrates mounted thereon. The substrate is positioned on the same horizontal line as the outlet portion 5, and then a substrate moving device (not shown) is operated to push the substrate positioned on the same horizontal line as the outlet portion toward the outlet portion 5, so that the substrate Is drawn out through the exit.

For reference, in the present invention, the safety cover 20 fixed to one outside of the frame body 1 to protect the driving pulley 7, the driven pulley 9, and the belt 8 is for preventing a safety accident during the working process. It is necessary and not for any other purpose.

Therefore, the present invention has various effects as follows.

First, the bonded or molded substrates can be automatically mounted in the magazine 17 in an inline form as well as a specific substrate required from the several substrates mounted on the magazine and the heating operation is completed, and then inlined again. Since it can be discharged automatically, productivity is improved by improving workability.

Second, since several substrates mounted in MegaZine are selectively heated in the heating chamber for the required time at once to cure the bonding or molding part, substrates with different curing time can be used as a device. As the choice is widened, the economic burden on the user of purchasing the oven apparatus is reduced.

Claims (2)

A frame body installed at the front and supporting various components, A heating chamber fixed inside the frame body and supplied with high temperature heat therein by a known hot air fan, not shown; An inlet portion formed to connect the frame body and one side of the heating chamber in a horizontal state to serve as a supply passage so that the substrate, which has undergone bonding or molding, enters into the heating chamber by a known substrate transfer device; The substrate is formed on the same horizontal line as the inlet part so that the other side of the frame body and the heating chamber in a horizontal state, and serves as a discharge passage so that the substrate subjected to the heating process in the heating chamber exits the heating chamber by a known substrate transfer device. With the exit part to say, A motor fixed to the frame body to receive power to generate forward and reverse driving force; A driving pulley which is axially coupled to the motor so as to be located at one side of the frame main body and rotates forward and backward according to the driving direction of the motor; A driven pulley which is coupled to the driving pulley so as to be positioned at one side of the frame main body and is rotated by receiving a rotational force of the driving pulley through a belt; A support fixed vertically in the heating chamber; An upper sprocket rotatably installed in a state connected to the axis of the driven pulley so as to be positioned on the rear outer side of the support; A lower sprocket rotatably installed at an outer lower side of the rear surface of the support and connected to the upper sprocket by a connection chain to rotate under the rotational force of the upper sprocket; A lifting member which is installed on the front of the support to be lifted in a fixed state with a connection chain and is lifted according to the rotation direction of the connection chain; An evacuation hole formed in the support to prevent the fixing member of the elevating member and the connecting chain from interfering with the support when the elevating member is elevated according to the rotational direction of the connecting chain; A substrate (lead frame or PCB board) having a plurality of mounting grooves on a side facing each other and having a top fixing bracket and a bottom fixing bracket fixed to the elevating member and being elevated together with the elevating member to be introduced into the heating chamber through an inlet part. Oven device for manufacturing a semiconductor, characterized in that consisting of a magazine mounted. The method of claim 1, Guide bending pieces are fixed to the inner side and the rear side of the support, respectively, and the guide rollers are rotatably installed on the upper and lower portions of the elevating member so that the guide rollers are rotatably guided when the elevating member is elevated. An oven apparatus for manufacturing a semiconductor, characterized in that the lifting of the lifting member is performed stably as the rotating movement by the contact is guided to the bending piece.

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