KR101874883B1 - Centrifugal precipitation apparatus for phosphor of led packages - Google Patents
Centrifugal precipitation apparatus for phosphor of led packages Download PDFInfo
- Publication number
- KR101874883B1 KR101874883B1 KR1020170098277A KR20170098277A KR101874883B1 KR 101874883 B1 KR101874883 B1 KR 101874883B1 KR 1020170098277 A KR1020170098277 A KR 1020170098277A KR 20170098277 A KR20170098277 A KR 20170098277A KR 101874883 B1 KR101874883 B1 KR 101874883B1
- Authority
- KR
- South Korea
- Prior art keywords
- unit
- lead frame
- phosphor
- feeding
- drum
- Prior art date
Links
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 238000001556 precipitation Methods 0.000 title description 14
- 238000000034 method Methods 0.000 claims abstract description 49
- 230000008569 process Effects 0.000 claims abstract description 36
- 238000004062 sedimentation Methods 0.000 claims description 27
- 239000012716 precipitator Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000004904 shortening Methods 0.000 abstract description 3
- 238000001723 curing Methods 0.000 description 48
- 239000004065 semiconductor Substances 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to an LED package manufacturing apparatus capable of shortening the settling time of a phosphor and improving yield, and more particularly, to an LED package manufacturing apparatus for mounting a magazine (4100) having a lead frame (4010) (1000), a feeding part (2000) to which each lead frame detached from the mounting part is fed, a holder part (3110) arranged in a circumferential direction to mount the lead frames transferred from the feeding part, and a holder part And a drum unit 3000 having a hardening unit 3500. The drum unit is cured by a hardening unit in a process of allowing the phosphor to be deposited by centrifugal force while being rotated while the lead frame is mounted, Of the LED package.
Description
The present invention relates to the fabrication of LEDs, and more particularly, to an apparatus for fabricating an LED package that can shorten the settling time of phosphors and improve the yield.
LED (Light Emitting Diode) is a semiconductor device that converts electric energy into light energy. It is composed of a compound semiconductor that emits light with a specific wavelength depending on the energy band gap. Recently, LED has been used in various fields such as optical communication and display. Such LEDs are provided in a predetermined package form so that they can be applied according to various purposes or processes.
Conventional LED manufacturing processes include a die bonding process in which an LED chip is bonded to a lead frame, a wire bonding process in which each lead is connected in a circuit through a wire, And a dispensing process of applying a fluorescent material to the chip.
In the manufacturing process of the LED package, the lead frame is generally cured in a cure oven and then enters the next process.
Korean Patent Laid-Open No. 10-2011-0136290 discloses a method of applying a phosphor of a conventional light emitting diode, and FIG. 1 is a view showing a light emitting diode by such a manufacturing process.
Specifically, the
In the manufacturing process of the light emitting diode chip, the color temperature and the slope are determined between the wavelength of the light
Thereafter, a step of curing the
As described above, in recent years, there is a rapid increase in demand for LEDs. In order to satisfy such demands, it is necessary to improve process efficiency for mass production.
However, a certain amount of time is inevitably required in the precipitation step and the curing step of the phosphor described above, which leads to uneconomical processing.
SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems described above, and it is an object of the present invention to provide a phosphor centrifugal precipitator for an LED package capable of increasing productivity by drastically improving the efficiency of a process for precipitating an LED do.
In addition, the present invention provides a method of manufacturing a LED package, comprising the steps of: preparing a LED package having an LED package in which a centrifugal precipitation is applied to satisfy the requirement for reduction in scattering, It is an object of the present invention to provide a sedimentation apparatus.
The present invention is characterized by a
It is preferable that the curing unit is disposed on the inner circumferential side corresponding to each of the holder portions.
In addition, the curing unit may include a UV lamp or an IR lamp.
In one embodiment, the curing unit may start the operation for curing after the predetermined time has elapsed after the centrifugal sedimentation is started by rotating the drum unit.
A driving
The control motor may provide rotational power by friction force on the outer circumferential side of the drum portion, but the contact state may be released during operation of the drive motor.
And a feeding pusher (1300) for pulling the lead frame from the magazine to the feeding portion. The feeding portion includes a guide (2150) into which the side of the lead frame is inserted, a driving roller (2110) And a
The loading unit includes a
According to the present invention, the time required for semiconductor manufacturing is dramatically reduced by shortening the conventional processes for precipitating and curing phosphors, which leads to an improvement in productivity.
In addition, since the curing device is applied to prevent the lead frame from being mixed in the waiting process while applying the centrifugal sedimentation method, it is possible to expect a certain productivity, thereby improving the reliability of the production process.
In addition, there is an effect that the spatial advantage is maximized and the operational reliability is improved.
1 is a view showing a light emitting diode according to a conventional method of applying a phosphor of a light emitting diode.
2 is a configuration diagram of a phosphor centrifugal precipitator of an LED package according to the concept of the present invention.
3 is a perspective view showing the phosphor centrifugal sedimentation apparatus of the LED package of the present invention from the front side.
4 is a rear side perspective view of a phosphor centrifugal precipitator of the LED package of the present invention.
5 is an enlarged view of a holder portion and a curing device portion in the phosphor centrifugal sedimentation apparatus of the LED package of the present invention.
6 is a perspective view of a phosphor centrifugal precipitator of an LED package according to a preferred embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a phosphor centrifugal precipitator of an LED package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
In the following description, when a part is referred to as being 'connected' to another part, it includes not only a direct connection but also a case where another part or device is connected in between. In addition, when a part is referred to as including an element, it is to be understood that the element may include other elements, not the exclusion of any other element, unless specifically stated otherwise.
The present invention basically adopts a sedimentation method by a centrifugal force for sedimentation of a phosphor as a unit of a lead frame to which a plurality of LEDs are mounted. In order to prevent the sedimentation during disturbance of the lead frame from being disturbed, (EN) Disclosed is a fluorescent substance centrifugal precipitator for an LED package, which enables curing of a resin material through a curing device unit in a process.
The present invention basically reduces the time required for the precipitation process in the LED chip prior to the dispensing of the mixed material of the resin material such as epoxy or silicone and the fluorescent material and the curing process, It may be formed integrally with the apparatus for processing. Further, it goes without saying that the curing process described in the prior art can be further applied to a later stage by the phosphor centrifugal sedimentation apparatus of the LED package according to the present invention.
It should be noted that the type and type of LED, lead frame and magazine applied in the present invention are not limited and the concept of the present invention includes a precipitation, precipitation or separation process of mixed materials in various types of semiconductor processes.
2 is a configuration diagram of a phosphor centrifugal precipitator of an LED package according to the concept of the present invention.
The present invention basically comprises a
The
One or
The
The
Further, the
Each of the
The
In the illustrated example, the
In a state where the
It should be noted that according to the concept of the present invention, there is an advantage of shortening the process time remarkably in comparison with the conventional manufacturing process using the natural sedimentation method by the weight difference and the self weight.
According to the above concept, the
The
Accordingly, the driving
The
An
It is preferable that the
The
The driving
The number of the
In order to detach the
To this end, in the present invention, a curing device (3500 in Fig. 3) is provided for each
The
In addition, a hot air unit may be additionally / selectively provided in the drum unit. In addition to the curing unit, the hot air unit may function as a cure unit. In this case, the curing unit may include a resin A predetermined curing is performed on water, and then the hot air device is operated to cure the process. However, it goes without saying that the hot air device may be constituted by a curing device.
The hot air unit may include a heater and a fan. In the first embodiment, a case in which axial flow is generated around the rotational axis of the drum unit may be applied. In this case, a flow can be generated on the side of each lead frame by the axial flow, and in this case, it can be rotated as the drum part or fixed to the drum part. As a second embodiment, the hot air unit may generate hot air directed to each lead frame to replace or adjacent to each curing unit. It is also contemplated that, in some embodiments, the nozzles may be oriented with respect to a single fan in each of the lead frames.
Preferably, the
3 is a perspective view showing the phosphor centrifugal sedimentation apparatus of the LED package of the present invention from the front side.
The
In addition, a housing part may be additionally disposed as a form to entirely cover the mounting
As described above, the mounting
The mounting
The
The
The
In addition, the
In some cases, the
4 is a rear side perspective view of a phosphor centrifugal precipitator of the LED package of the present invention.
As described above, it is preferable that the driving system of the
At this time, the driving
Therefore, the
The
5 is an enlarged view of a holder portion and a curing device portion in the phosphor centrifugal sedimentation apparatus of the LED package of the present invention.
The
To this end, the
The
In addition, the
On the other hand, the
The
A
In the illustrated embodiment, the
6 is a perspective view of a phosphor centrifugal precipitator of an LED package according to a preferred embodiment of the present invention.
3, the mounting
A plurality of
For this purpose, the
In the mounting space in which the
A housing portion (not shown) may be disposed on the
In addition, a monitor unit 4500 may be additionally disposed to output the operation state of each part by the operation of the control unit and receive the user's control input. The monitor unit 4500 can mainly perform a function of displaying the progress status of the precipitation process to the user.
Operation of the phosphor centrifugal precipitator of the LED package according to the present invention will now be described.
When the one or
The
In the description of the present invention, the curing of the resin material by the curing device does not necessarily mean a complete curing state, but a degree of providing a non-fluidity or a low fluidity so that the fluorescent material precipitated in the previous stage of the curing process is not mixed again by its own weight It suffices.
The phosphor centrifugal sedimentation apparatus of the LED package according to the present invention shortens the time required for conventional phosphor deposition and curing, thereby dramatically reducing the time required for semiconductor manufacturing, which leads to an improvement in productivity.
In addition, since the curing device is applied to prevent mixing of the lead frames in the waiting process while applying the centrifugal sedimentation method, a certain yield can be expected and the reliability of the production process is improved.
It also has a structure that maximizes spatial advantages and improves operational reliability.
In the foregoing, the present invention has been described in detail based on the embodiments and the accompanying drawings. However, the scope of the present invention is not limited by the above embodiments and drawings, and the scope of the present invention will be limited only by the content of the following claims.
1000 ... mounting
1100 ... loading
1300 ...
2110 ... drive
2130 ...
2150 ...
3000 ...
3110 ...
3112 ...
3300 ... control
3500 ... Curing
4100 ... Magazine 4500 ... Monitor part
Claims (8)
A feeding part (2000) to which each lead frame detached from the mounting part is fed; And
And a drum unit (3000) having a holder unit (3110) arranged in the circumferential direction to mount the lead frames transferred from the feeding unit and a hardening unit (3500) arranged corresponding to each of the holder units,
The drum unit,
Wherein the lead frame is rotated in a state where the lead frame is mounted, and the phosphor is cured by the curing unit during the process of causing the phosphor to settle by the centrifugal force to maintain the precipitated state.
The curing device unit,
A phosphor centrifugal precipitator for an LED package comprising a UV lamp.
The curing device unit,
And the drum portion is rotated to start the centrifugal sedimentation and to start the operation for curing after the set time has elapsed.
A driving motor (3200) connected to a rotating shaft of the drum unit to provide a rotational force in a centrifugal sedimentation process of the drum unit; And
And a control motor (3300) for positioning the lead-in and lead-out holder portion of the lead frame by the feeding portion to correspond to the feeding portion.
The control motor includes:
Wherein a rotational force is provided by frictional force at the outer circumference side of the drum portion, and a contact state is released at the time of operation of the drive motor.
And a strip pusher (1300) for pulling out the lead frame from the magazine to the feeding portion,
The feeding unit includes:
A driving roller 2110 for providing a feeding power at the bottom of the lead frame, a tension roller 2110 for providing an elastic force downward to maintain the contact state between the lead frame and the driving roller 2130). ≪ / RTI >
Wherein,
A loading unit 1100 having a loading driving unit for loading a plurality of magazines on which a lead frame having a completed dispensing process is mounted and being sequentially transferred to a strip pusher side, and an unloading unit 1200 disposed above the loading unit A phosphor centrifugal precipitator in a LED package.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170098277A KR101874883B1 (en) | 2017-08-02 | 2017-08-02 | Centrifugal precipitation apparatus for phosphor of led packages |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170098277A KR101874883B1 (en) | 2017-08-02 | 2017-08-02 | Centrifugal precipitation apparatus for phosphor of led packages |
Publications (1)
Publication Number | Publication Date |
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KR101874883B1 true KR101874883B1 (en) | 2018-07-05 |
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KR1020170098277A KR101874883B1 (en) | 2017-08-02 | 2017-08-02 | Centrifugal precipitation apparatus for phosphor of led packages |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008311477A (en) * | 2007-06-15 | 2008-12-25 | Minami Kk | Led display and method of manufacturing the same |
KR101539037B1 (en) * | 2014-05-21 | 2015-07-30 | 비케이전자 주식회사 | Apparatus for transfering pcb |
-
2017
- 2017-08-02 KR KR1020170098277A patent/KR101874883B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008311477A (en) * | 2007-06-15 | 2008-12-25 | Minami Kk | Led display and method of manufacturing the same |
KR101539037B1 (en) * | 2014-05-21 | 2015-07-30 | 비케이전자 주식회사 | Apparatus for transfering pcb |
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