KR20080035886A - Heat-sink - Google Patents

Abstract

A heat sink is provided to implement assembly by only performing a pressing operation through a substrate insertion hole when a guide pin is coupled to a body of the heat sink. A heat sink(10) includes a heat sink body(11) and a guide pin(20). The heat sink body includes a plurality of heat radiating pins(12) formed on a front surface and a rear surface of the heat sink body, which is parallel to a substrate. Heat emitted from various elements including a plurality of semiconductor chips is absorbed in the substrate and a top surface of the substrate. The absorbed heat is radiated to the outside through the radiating pins. The guide pin is mounted on the heat sink body and a lower end of the guide pin is penetratively coupled onto the substrate through an insertion hole of the substrate.

Description

Heat Sink {Heat-sink}

1 is a perspective view of a conventional heat sink fixing device.

Figure 2 is a perspective view of a heat sink with a conventional fixing device.

3 is a perspective view of a heat sink according to the present invention;

Figure 4 is a perspective view of the guide pin mounted to the heat sink of the present invention.

Figure 5 is a perspective view of the heat sink of the present invention coupled to the substrate.

6 is a cross-sectional view of the heat sink of the present invention coupled to a substrate.

7 is a cross-sectional view illustrating a detachable structure of a heat sink according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10. Heat sink 11. Heat sink body

12. Heat sink fins 20. Guide pins

21. Central axis 22. Screw connection

23. Hook 24. Spacer

30. Board 31. Insertion hole

The present invention relates to a heat sink installed in a printed circuit board, and more particularly, a guide pin having elasticity is mounted at a lower end of the heat sink body, and the guide pin is a printed circuit board by elasticity of a hook. By closely coupling onto the heat sink, the heat sink body can be easily fixed to a printed circuit board and a heat sink that can be reused.

In general, a switching mode power supply (hereinafter referred to as SMPS) uses a semiconductor device such as a power transistor as a high-speed switch to convert a DC input voltage into a square wave voltage and rectify through a filter. It is a device to obtain the DC voltage. Control of the DC output is achieved by controlling the switch on / off time, and includes a transformer with various turns ratios to obtain the desired output. In addition, when the output voltage of the transformer is an overvoltage, various circuits for stabilizing the power supply have been used, such as to feed back the output voltage to stabilize the output of the transformer.

The inside of electronic products such as SMPS absorbs heat generated by various elements such as semiconductor chips mounted on printed circuit boards or heat generated by internal heat generation and dissipates them to the outside, thereby adversely affecting electronic components by heat. The heat sink is installed so as not to fall, the heat sink is mounted on the printed circuit board vertically or horizontally the sink body consisting of a plurality of heat radiation fins.

In particular, the heat sink mounted on the SMPS is used for heat dissipation of various ICs including a semiconductor chip mounted on a printed circuit board (PCB). Referring to FIGS. 1 and 2 shown below, a conventional heat sink coupling structure is shown. Looking briefly as follows.

1 is a perspective view of a conventional heat sink fixing device, and FIG. 2 is a perspective view of a heat sink in which a conventional fixing device is attached. As shown in the drawings, a conventional heat sink 1 is a substrate on which a plurality of semiconductor chips and various elements are mounted. It is mounted vertically on the upper surface of (2) by the board | substrate 2 of the guide 3 provided in the lower end part.

The guides 3 are separated or integrally formed from the heat sink 1, and the leads 4 are respectively extended downward at the lower ends. The lead 4 is inserted through the through hole 2a formed in the substrate 2 and bent at a right angle so that the lead 4 protruding to the lower surface of the substrate 2 is in close contact with the lower surface of the substrate 2. do.

A process for binding the lead 4 to the substrate 2 in the mounting process of the heat sink 1 is called a clinching process, and the conventional clinching process is performed by an operator's manual work using tweezers or the like. Is performed. Accordingly, the heat sink 1 has the upper surface of the substrate 2 because the guide 3 is vertically coupled to the substrate 2 and the lid 2 below the guide 3 is tightly coupled to the lower surface of the substrate 2. Is mounted vertically on the

However, in the conventional fixing structure of the heat sink, when the guide 3 for fixing the heat sink 1 to the upper surface of the substrate 2 is assembled by the worker, the lead 4 protrudes into the lower surface of the substrate 2 by hand. Since the clinching process, which must bend, must be carried out, process losses that take time to proceed with the process are incurred.

In addition, in the conventional heat sink fixing structure, unnecessary manpower for only the clinching process may be consumed on the continuous production line, thereby increasing the manufacturing cost of the SMPS.

In addition, the replacement of the heat sink that has reached the end of the heat dissipation life or the AS of the heat sink has a disadvantage in that the lead 4 in a bent state can only be cut.

Accordingly, the present invention was devised to solve the above-mentioned disadvantages and problems in the conventional heat sink, so that the heat sink with a plurality of heat dissipation fins is mounted on the substrate by a guide pin with elasticity. Accordingly, an object of the present invention is to provide a heat sink having a fixing device for easily coupling the heat sink body to the upper portion of the substrate by inserting the guide pin into the substrate.

The object of the present invention is achieved by providing a heat sink including a heat sink body provided with a plurality of heat dissipation fins, and guide pins coupled to both lower ends of the heat sink body and having radial hooks formed thereon.

The heat sink main body has a plurality of heat dissipation fins horizontally extended so that heat absorbed in the front and rear of the plate-shaped main body can be emitted to the air.

In addition, a guide pin is detachably fastened to a lower end of the heat sink main body, and is mainly mounted to support both lower ends of the heat sink main body, but may be appropriately disposed and coupled according to the size and thickness of the heat sink main body. have.

On the other hand, the guide pin is provided with a screw fastening portion at the top, a hook is provided with elasticity at the bottom, it is composed of a gap adjusting device disposed between the screw fastening portion and the hook.

The screw fastening portion is formed with a screw line on the outer circumferential surface so that the guide pin is vertically coupled to the lower end of the heat sink body by rotation, and the hook at the bottom thereof is inserted into the substrate while the guide pin is vertically coupled to the heat sink body. Through hooked through the upper end of the hook is elastically in close contact with the lower surface of the substrate.

Therefore, the heat sink body is vertically coupled to the upper surface of the substrate by at least two guide pins fastened to the lower end, and the guide pin is hooked only by pushing the hook forming portion of the guide pin into the insertion hole of the substrate. By being tightly fixed to the substrate by the elasticity of the heat sink, the conventional clinching process can be omitted when assembling the heat sink.

Here, the spacing adjuster is to allow the gap between the bottom surface of the substrate and the upper end of the hook that is in close contact with the bottom surface of the substrate can be adjusted according to the thickness of the substrate, the type of substrate that can be combined in the design of the guide pin It is preferable to set at a predetermined interval according to.

Matters relating to the operational effects including the technical configuration for achieving the above technical object for the heat sink of the present invention will be clearly understood by the following detailed description with reference to the drawings in which preferred embodiments of the present invention are shown.

First, Figure 3 is a perspective view of a heat sink according to the present invention, Figure 4 is a perspective view of a guide pin mounted to the heat sink of the present invention, Figure 5 is a perspective view of the heat sink of the present invention coupled to the substrate, 6 is a cross-sectional view of the heat sink of the present invention coupled to a substrate.

As shown, the heat sink 10 of the present invention comprises a heat sink body 11 and a guide pin 20 mounted on the heat sink body 11 and having a lower end penetratingly coupled to the substrate 30. do.

The heat sink main body 11 is provided with a plurality of heat dissipation fins 12 in a state parallel to the substrate 30 on the front and rear, and various devices including a plurality of semiconductor chips mounted on the substrate 30 and its upper surface. Heat emitted from is absorbed, and the absorbed heat is radiated to the outside through the heat radiating fin 12.

The heat sink main body 11 is formed in a plate shape can be adjusted the number of mounting of the guide pin 20 is fastened to the lower end, preferably, the heat sink main body 11 is parallel to the upper surface of the substrate 30 Guide pins 20 having the same height are coupled to both side portions so as to be supported, and according to the thickness of the main body 11, the separate guide pins 20 are provided in the right number inside the guide pins 20 on the left and right sides. Is mounted.

In addition, the guide pin 20 is fastened to the heat sink body 11 is detachably coupled to the lower end, the screw fastening portion 22 formed on the upper end relative to the central axis 21 and the lower side It consists of a hook 23 formed of a radiator provided with elasticity, and the spacing adjuster 24 provided in the central portion of the central axis (21).

The guide pin 20 is the screw fastening portion 22 is inserted through the lower surface of the heat sink body 11 is vertically coupled directly under the heat sink body (11). At this time, the screw fastening portion 22 is coupled by being rotated in the lower portion of the heat sink body 11 by the outer peripheral surface is screwed.

In addition, the lower end of the central shaft 21 extending from the screw fastening portion 22 is provided with a hook 23 is provided with elasticity and elastically coupled through the insertion hole 31 formed on the substrate 30 do.

The hooks 23 are radially around at least three, preferably left and right symmetry around the central axis 21 so that the four hooks 23 are based on the lower end of the central axis 21. By being branched and formed upwardly inclined, the free end side of each hook 23 is provided with a predetermined elasticity with respect to the lower end of the central axis 21.

At this time, the upward inclination angle θ of the hook 23 has an angle of about 30 ° with respect to the central axis 21.

And, the reason why the hook 23 is formed in the radial shape based on the central axis 21, the outer surface of the hook 23 protruding to the lower substrate 30 after the substrate coupling of the guide pin 20 When soldering, solder penetrates between the radial hooks 23 to improve the soldering efficiency due to viscosity retention.

Therefore, the hook 23 is elastically expanded when passing through the insertion hole 31 formed in the substrate 30 so that the upper end of each of the hooks 23 is lower than the substrate 30 around the insertion hole 31. Close to

In addition, the lower surface of the interval adjusting opening 24 formed between the screw fastening portion 22 and the hook 23 is in close contact with the upper surface of the insertion hole 31 through which the hook 23 is guide pin ( 20 is mounted in the state inserted through the substrate 30.

The gap adjusting device 24 serves to space the gap between the heat sink body 11 and the upper surface of the substrate 30, and at the same time, the lower surface thereof corresponds to the thickness of the upper portion of the hook 23 and the substrate 30. By being spaced apart from each other, the upper surface of the hook 23 and the lower surface of the spacer 24 is in close contact with the upper and lower surfaces of the substrate 30, so that the guide pin 20 does not flow on the substrate 30 without flow. To be fixed.

In this case, the spacing adjuster 24 may have a variable position, and the upper end of the hook 23 and the spacing is determined according to the type and thickness of the substrate 30 that can be coupled to the guide pin 20. It is preferably designed by the separation distance of the sphere 24.

Meanwhile, the guide pin 20 has an upper end screwed to the heat sink main body 11 and a lower end penetrated through the insertion hole 31 formed in the substrate 30 to heat sink the upper surface of the substrate 30. The main body 11 is mounted with a predetermined space with respect to the substrate 30, and the hook 23 at the bottom of the guide pin 20 is soldered while penetrating the substrate 30 to the Guide pin 20 is firmly coupled to the substrate (30).

In this case, as the hook 23 is elastically in close contact with the bottom surface of the substrate 30 as described above, the inclination or lifting of the heat sink body 11 supported on the guide pin 20 is prevented.

In addition, since the outer circumferential surface of the central shaft 21 formed with the hook 23 and the hook 23 is plated with tin (Sn), the affinity with the solder during soldering is improved.

In the heat sink 10 of the present invention configured as described above, the heat sink main body 11 should be separated from the substrate 30 for replacement or AS of the heat sink 10 as shown in FIG. 7 shown below. By separating the guide pin 20 from the insertion hole 31 of the substrate 30 by using the elasticity of the hook 23, the productivity is dramatically reduced compared to the technical configuration that is not possible to reuse the conventional heat sink fixing device Production costs can be lowered by improving the recycling rate of parts to improve and support heat sinks.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

As described above, the heat sink of the present invention is coupled to the lower portion of the heat sink body, the heat sink body is vertically mounted on the upper surface of the substrate through the guide pin provided with a resilient hook at the lower end, the operator heat sink There is an advantage that the heat sink can be easily assembled only by the operation of pressurizing through the board insertion hole in the state where the guide pin is fastened to the main body, and the clinching process is unnecessary as in the prior art, and the productivity is increased by reducing the number of operations. At the same time, there is an advantage in reducing the production cost by reducing the workforce.

Claims (9)

A heat sink body having a plurality of heat dissipation fins; And A guide pin detachably screwed to a lower end of the heat sink body and a radially extended hook is formed at a lower end of the heat sink to elastically penetrate through the insertion hole of the substrate; Heat sink comprising a. The method of claim 1, And at least two guide pins mounted at a lower portion of the heat sink body, including lower ends of both sides of the heat sink body. The method of claim 1, The guide pin is a heat sink comprising a screw fastening portion formed at an upper end with respect to a central axis of the center, a hook made of a radiator having elasticity at a lower side thereof, and a spacing adjuster provided at a central portion of the central axis. . The method according to claim 1 or 3, The hook is a heat sink, characterized in that formed on the lower end of the central axis to at least three branches radially upwardly inclined upwardly. The method of claim 4, wherein The hook has a heat sink, characterized in that the elastic provided on the free end side extending from the lower end of the central axis. The method of claim 4, wherein The hook, the heat sink, characterized in that the upward inclination angle of the center axis is formed in about 30 degrees. The method of claim 4, wherein And the hook is fixed by solder fixed in shape by viscosity that penetrates and is maintained between the individual radial hooks. The method of claim 3, The spacing adjuster is a heat sink, the bottom surface of which is spaced apart to form a gap corresponding to the thickness of the hook upper portion and the substrate, the heat sink is formed to a height that can be spaced apart from the bottom surface of the heat sink body and the upper surface of the substrate. . The method according to claim 1 or 3, And the hook and the outer peripheral surface of the central axis around the hook are plated with tin (Sn).

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