KR20080012224A - Adsorbing film and fabrication method thereof, and adsorbing film with release film adhering thereto and fabrication method thereof - Google Patents

Abstract

An adsorbing film and a producing method for the same, and an adsorbing film attached with a release film and a producing method thereof are provided to prevent adhesion of an adhesive layer from being reduced although the adsorbing film is formed thinly in order to secure air permeability, by increasing flatness of the adhesive surface of the adhesive layer. In an adsorbing film producing method, a hot melt adhesive agent heated at the predetermined temperature is applied on a release film(1). A porous sheet(3) is bonded to the hot melt adhesive agent while the hot melt adhesive agent of the release film is heated lower than the predetermined temperature. The release film, an adhesive layer(2) made of the hot melt adhesive agent, and the porous sheet are laminated in order. An adsorbing film is formed by laminating the adhesive layer and the porous sheet by peeling off the release film from a laminate.

Description

Adsorption film and its manufacturing method, and adsorbent film with release film and its manufacturing method {ADSORBING FILM AND FABRICATION METHOD THEREOF

The present invention relates to an adsorption film suitable for a buffer material interposed between an adsorption plate of an adsorber and a ceramic green sheet when the ceramic green sheet is adsorbed using a adsorber, conveyed to a predetermined position, separated and laminated. . Moreover, this invention relates to the adsorption film with a release film, and its manufacturing method.

Chip capacitors used in cellular phones and the like are produced by laminating ceramic green sheets printed with electrodes. An adsorber for adsorbing the ceramic green sheet, peeling it from the release paper, conveying it to the same place, separating and laminating the same, and the adsorption plate is mounted to adsorb the ceramic green sheet on its entire surface. In order to perform the above series of processes smoothly, the adsorption plate requires surface smoothness, breathability and release property, and appropriate cushioning properties. In the suction plate, a mold having an opening for venting is often used. However, the mold lacks cushioning properties. In order to supplement the cushioning property of a metal mold | die, what is necessary is just to attach a buffer material to the surface. In view of maintaining air permeability, a porous sheet is preferable as the cushioning material.

In patent document 1, the glass sheet which is not a ceramic green sheet is made into object, and the porous sheet used for adsorption of the to-be-processed object on a support stand is disclosed. According to Patent Document 1, when the adhesive layer is partially provided on one surface of the porous sheet, not only the glass plate on the support can be easily arranged, but also subsequent position shift can be more reliably prevented (paragraph 0025). As a material of an adhesive bond layer, although a pressure sensitive adhesive agent is preferable, a hot melt adhesive agent or a thermosetting adhesive agent can also be used (paragraph 0025).

[Patent Document 1] Japanese Unexamined Patent Publication No. Hei 8-169971

It is convenient to apply an adhesive to the surface of the porous sheet disposed on the mold for ceramic green sheet adsorption in advance to form an adhesive layer. In this case, when sucking a ceramic green sheet through the opening part of a metal mold | die, it is necessary to remove an adhesive in the part corresponding to the hole part of a porous sheet, and to form a through hole. In consideration of this, the pressure-sensitive adhesive layer is preferably thinner. In order to form a thin adhesive layer, what is necessary is just to apply the hot melt adhesive which heated and reduced the viscosity.

On the other hand, in order to separate the ceramic green sheet adsorbed to the porous sheet, it is necessary to apply back pressure to the ceramic green sheet through the opening of the mold. For this reason, an adhesive force comparable to back pressure is required between the mold and the porous sheet. Therefore, it is required to form the adhesive layer excellent in the adhesive force on the surface of the porous sheet used for adsorption of a ceramic green sheet.

However, as shown in FIG. 6, when the hot melt adhesive 12 heated directly on the porous sheet 13 is directly applied, the hot melt adhesive 12 enters the hole 19 of the porous sheet 13. . For this reason, if the hot melt adhesive 12 is not thickly applied, the hot melt adhesive 12 will be recessed into the hole 19, and the contact area between the hot melt adhesive 12 and the metal mold 16 will be small and sufficient adhesive force will be provided. Can't get it.

Applying a sufficient amount of hot melt adhesive 12 to secure the adhesive force, it is difficult to ensure the air permeability of the porous sheet 13. That is, in order to adsorb the ceramic green sheet 17 to the porous sheet 13, even if suction is started through the opening 16a of the mold 16 (see the arrow in FIG. 6), the hole portion of the porous sheet 13 ( The hot melt adhesive 12 is likely to remain in 19, so that a sufficient number of through holes 18 are not formed in the adsorption film 20. When the air permeability of the adsorption film 20 is low, the degree of decompression by the adsorber must be increased to strongly suction the ceramic green sheet 17. However, if strongly attracted, deformation of the ceramic green sheet 17 tends to occur. When deformation occurs in the ceramic green sheet 17, the upper electrode layer and the lower electrode layer are short-circuited in the laminate of the ceramic green sheet 17, which may cause the capacity of the chip capacitor to decrease.

In view of the above circumstances, the present invention, when adsorbing a plate-like adsorbent that is susceptible to deformation, such as a ceramic green sheet, is suitable for an absorbing film suitable for a cushioning material to be attached to an adsorption plate such as a mold and a manufacturing method thereof, in particular, excellent adhesion and breathability It aims at providing the adsorption film and its manufacturing method, and providing the adsorption film with a release film, and its manufacturing method.

This invention applies the hot melt adhesive heated at the predetermined temperature on a release film, and makes a porous sheet | seat to the said hot melt adhesive in the state in which the said hot melt adhesive on the said release film became temperature lower than the said predetermined temperature. A laminate is formed by bonding the release film, the pressure-sensitive adhesive layer made of the hot melt adhesive, and the porous sheet in this order, and peeling the release film from the laminate to form the pressure-sensitive adhesive layer and the porous sheet. The manufacturing method of the adsorption film which obtains the adsorption film which is laminated | stacked is provided.

Moreover, this invention consists of laminating | stacking the adhesive layer which consists of hot melt adhesives, and a porous sheet, the adhesive force by the large stainless adhesive test with respect to the said adhesive layer is 0.8 N / 25mm or more, and air permeability is 5 cm <3> / cm <2>. It provides an adsorbent film that is at least second. However, the said large stainless adhesive test is performed based on the 180 degree peeling method prescribed | regulated to JISZ0237, and the said air permeability shall be determined by measuring by the fragile method prescribed | regulated to JIS L1096.

Moreover, this invention apply | coats the hot melt adhesive heated at the predetermined temperature on a release film, and is porous to the said hot melt adhesive in the state in which the said hot melt adhesive on the said release film became temperature lower than the said predetermined temperature. A sheet is bonded, the release film, the pressure-sensitive adhesive layer made of the hot melt adhesive, and the porous sheet are laminated in this order, and the release film is peelable from the adsorption film made of the pressure-sensitive adhesive layer and the porous sheet. The manufacturing method of the adsorption film with a release film which obtains the adsorption film with a release film is provided.

Moreover, this invention is a release film in which the release film, the adhesive layer which consists of a hot melt adhesive, and a porous sheet are laminated | stacked in this order, and the release film is peelable from the adsorption film which consists of the said adhesive layer and the said porous sheet. It is this adsorbed film with which it adhered, With respect to the said adsorption film obtained by peeling the said release film, the adhesive force by the large stainless adhesive force test with respect to the said adhesive layer is 0.8 N / 25 mm or more, and air permeability is 5 cm <3> / cm <2> * sec or more Provide an adsorbent film. However, the said large stainless adhesive force test and the measurement of the said air permeability are performed based on the above.

In the manufacturing method of the adsorption film of this invention, the hot melt adhesive which heated and reduced the viscosity was apply | coated on a release film, and a thin flat adhesive layer is formed, and after that, it becomes low temperature and joins the adhesive layer which the viscosity increased and the porous sheet. It was assumed that. For this reason, compared with the case where a hot melt adhesive is apply | coated directly on a porous sheet, pulling in of a hot melt adhesive to the hole part of a porous sheet can be suppressed. In addition, the adhesive surface in the adhesive layer formed by the said method, ie, the surface shown by peeling a release film, has high flatness. Therefore, even if the adsorption film of this invention is thin in order to ensure air permeability, the adhesive force by an adhesive layer hardly falls.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described, referring drawings. First, the hot melt adhesive is apply | coated on the release film 1 shown in FIG. 1, and the adhesive layer 2 is formed (FIG. 2). The release film 1 provides a flat surface for applying a hot melt adhesive. Although the release film 1 is not specifically limited, Resin film, such as silicone and a polyethylene terephthalate, may be used. Since the release film 1 is removed at the time of use, it may be nonporous.

The hot melt adhesive is applied in a heated molten state, and when cooled, hardens to form the pressure-sensitive adhesive layer 2. Although a hot melt adhesive agent is not specifically limited, What shows sufficient tag (adhesiveness) at normal temperature may be used. For example, the hot melt adhesive is applied by spraying at a high temperature (170 to 200 ℃), high pressure (2 to 5 kg / ㎠). When it heats and apply | coats to the said grade, it becomes easy to form the adhesive layer 2 with a uniform thickness on the release film 1. For example, the hot melt adhesive may be partially applied on the release film 1, for example, in a mesh shape or a dotted shape, and then may be pressed to enlarge the whole. In this case, the hot melt adhesive draws a fine pattern such that the diameter of the lines constituting the mesh or the like (or the diameter of the dots constituting the dotted dots) is 5 to 30 µm, and the interval between the lines (or dots) is 5 to 100 µm. What is necessary is just to apply.

It is preferable to apply | coat a hot melt adhesive so that the thickness of the adhesive layer 2 may become 3-10 micrometers. If the pressure-sensitive adhesive layer is too thin, the adhesive force to the mold may be insufficient. If the pressure-sensitive adhesive layer is too thick, it is difficult to form the through hole at the time of suction.

Next, as shown in FIG. 3, the porous sheet 3 is bonded to the adhesive layer 2, and the adsorption film 4 with a release film is obtained. Although the method of bonding the porous sheet 3 to the adhesive layer 2 is not specifically limited, For example, the release film 1 in which the adhesive layer 2 was formed, and the porous sheet 3 between a pair of rolls What is necessary is just to make it pass through. At this time, the hot-melt adhesive constituting the pressure-sensitive adhesive layer 2 is already cooled, the viscosity increases, and is fixed along one main surface of the release film 1, so that it enters the hole 9 of the porous sheet 3. it's difficult.

As shown in FIG. 4, when the release film 1 is peeled from the adsorption film 4 with a release film of FIG. 3, the adsorption film 5 can be obtained. The adhesive layer 2 is transferred from the release film 1 to the porous sheet 3 by peeling of the release film 1. The surface 2a of the pressure-sensitive adhesive layer 2 that is in contact with the release film 1 becomes a pressure-sensitive adhesive surface 2a having good flatness.

As the porous sheet 3, a resin porous sheet, particularly an ultra high molecular weight polyethylene resin porous sheet, is preferable. The ultrahigh molecular weight polyethylene resin porous sheet has a lower coefficient of friction than a rubber sheet and a longer life than paper or nonwoven fabric. Ultra high molecular weight polyethylene has a molecular weight (viscosity average molecular weight) of about 1 million or more.

The ultrahigh molecular weight polyethylene resin porous sheet is not particularly limited, but the thickness is 0.05 to 0.5 mm, especially 100 to 300 m, the average pore diameter is 1 to 100 m, especially 5 to 40 m, and the arithmetic mean roughness Ra is 0.5 to 1.2 µm, compressive modulus (JIS K7181) of 100 to 1000 kgf / m 2, particularly of 200 to 400 kgf / m 2, preferably air permeability (by Frazyle method (JIS L1096)) of 5 to 20 cm 3 / cm 2 · sec. Do.

Fig. 5 shows a state in which the adsorption film 5 is attached to the mold 6 which is the adsorption plate of the adsorber. The adsorption film 5 adhere | attaches the adhesive layer 2 to the surface of the metal mold | die 6, and is fixed. The porous sheet 3 of the adsorption film 5 is pressed against the ceramic green sheet 7 to be conveyed. In this state, when suction is started from the opening part 6a of the metal mold | die 6 (refer FIG. 5 arrow), a part of adhesive layer 2 is removed above the hole part 9 of the porous sheet 5, The through hole 8 is formed in the adsorption film 5. Then, the ceramic green sheet 7 is sucked through the through hole 8. In this way, the ceramic green sheet 7 is adsorbed by the metal mold | die 6 and conveyed to a predetermined | prescribed place, and the back pressure applied from the opening part 6a in that place (pressure application to the opposite direction of the arrow of FIG. 5). Is separated from the mold (6).

In the adsorption film 5, the adhesive face 2a which contacts the metal mold | die 6 of the adhesive layer 2 is high in flatness. For this reason, even if the adhesive layer 2 is not formed too thick, sufficient adhesive force with the metal mold | die 6 can be ensured. Therefore, the adsorption film 5 does not peel from the metal mold | die 6 even if back pressure is applied in order to isolate the ceramic green sheet 7.

It is preferable that the adsorption film 5 exhibits the adhesive force of 0.8 N / 25 mm or more, or 2.0 N / 25 mm or more in a large stainless adhesive test (JIS Z0237 180 degree peeling method). In addition, it is preferable that the adsorption film 5 shows the air permeability of 5 cm <3> / cm <2> * sec or more, or 5.5 cm <3> / cm <2> * sec or more in the measurement based on the praxyl method.

Hereinafter, the present invention will be described in more detail with reference to Examples. However, this invention is not limited to a following example.

(Comparative Example)

Ultra-high molecular weight polyethylene resin porous sheet which is a porous sheet [Sunmap made by Nitto Denko Corporation; Thickness of 0.22 mm, average pore diameter of 20 µm, arithmetic mean roughness (Ra) of 2.2 µm, compressive modulus of 300 kgf / m 2, air permeability of 7 cm 3 / cm 2 / sec], and hot melt adhesive (Hirodine, manufactured by Yashara Chemical Co., Ltd.) at 190 ° C. Heated to and uniformly sprayed at a pressure of 5 kgf / cm 2. The coating amount by spraying was 7 g / m 2. Thus, the thickness of the adhesive layer formed was 7-8 micrometers.

The adsorption film was fixed to the metal mold | die by cooling until an adhesive layer became normal temperature, and pressing an adhesive layer on the surface of the metal mold | die which has an opening. Moreover, suction was started from the opening part of a metal mold | die, and a part of adhesive layer was removed and the through hole was formed. The adsorption film after forming a through hole was observed with the scanning electron microscope. The results are shown in FIG.

(Example)

On the release film (RT-75S by Nitto Denko Co., Ltd.), the hot melt adhesive agent (the same as the comparative example) was sprayed uniformly similarly to a comparative example, and the adhesive layer of thickness 7-8 micrometers was formed.

After the pressure-sensitive adhesive layer was brought to room temperature to show adhesiveness (tag), the ultra-high molecular weight polyethylene resin porous sheet (sun map made by Nitto Denko Co., Ltd .; the same as the comparative example), which is a porous sheet, was overlaid on the pressure-sensitive adhesive layer, and the release film and pressure-sensitive adhesive layer The adsorption film with a release film in which the porous sheet was laminated | stacked in this order was obtained.

Then, the release film was peeled from the adsorption film with a release film, and the adhesive layer was exposed. In this state, the adsorption film was fixed to the mold by pressing the pressure-sensitive adhesive layer on the surface of the mold having the opening. Moreover, suction was started from the opening part of a metal mold | die, and a part of adhesive layer was removed and the through hole was formed. The conditions of suction from the used metal mold | die and the opening part were made the same as the comparative example. Similarly to the comparative example, Fig. 8 shows the results of observing the adsorption film after the through hole was formed by a scanning electron microscope. 7 and 8 show that in the adsorptive film of the example, more through holes are formed.

For each of the examples and the conventional examples, the application amount of the hot melt adhesive was varied to produce an adsorptive film. And the adhesive force (large stainless adhesive force) and air permeability of an adhesive layer were measured about these adsorption films.

Large stainless adhesive force was performed according to JIS Z0237 180 degree peeling method. In addition, the air permeability was measured according to the fragile method (JIS L1096).

The measurement result of adhesive force is shown in FIG. The measurement result of air permeability is shown in FIG. In the comparative example (conventional example) in which the hot melt adhesive was applied directly to the porous sheet, it was difficult to achieve both a large stainless adhesive strength of 0.8 N / 25 mm or more and an air permeability of 5 cm 3 / cm 2 / sec or more. It is preferable that adhesive force and air permeability are compatible with this grade for conveyance of a ceramic green sheet. On the other hand, in the Example which apply | coated the hot melt adhesive agent on a release film, said compatibility was made possible. 9 and 10, it can be seen that the coating amount of the hot melt adhesive is preferably about 3 to 10 g / m 2.

The adsorption film of this invention makes it easy to manufacture the chip | tip capacitor used for mobile telephone etc. by adsorbing a ceramic green sheet, peeling from a release paper, conveying to the same place, and separating and laminating | stacking.

An electronic component (for example, a chip) comprising a step of adsorbing and conveying a ceramic green sheet so as to be in contact with the adsorption film, and stacking the adsorption film on the adsorption film according to the present invention or the adsorption film obtained by the production method of the present invention The manufacturing method of a capacitor | condenser has industrial value of great use.

1 is a cross-sectional view of a release film.

2 is a cross-sectional view showing a state in which a pressure-sensitive adhesive layer is formed by applying a hot melt adhesive on a release film.

3 is a cross-sectional view of the adsorption film with a release film obtained by bonding a porous sheet to the pressure-sensitive adhesive layer.

4 is a cross-sectional view of an adsorption film obtained by peeling a release film from an adsorption film with a release film;

Fig. 5 is a cross sectional view showing a state in which an adsorption film is attached to a suction plate (mould) and sucked to adsorb a ceramic green sheet;

Fig. 6 is a cross sectional view showing a state in which a conventional adsorption film is attached to a mold and sucked to adsorb a ceramic green sheet;

Fig. 7 is a diagram showing a state in which the adsorption film produced in the comparative example was observed with a scanning electron microscope.

Fig. 8 is a diagram showing a state in which the adsorption film produced in the example was observed with a scanning electron microscope.

9 is a diagram showing a relationship between the coating amount of a hot melt adhesive and a large stainless adhesive force.

Fig. 10 is a graph showing the relationship between the coating amount of a hot melt adhesive and the air permeability of an adsorption film.

<Explanation of symbols for the main parts of the drawings>

1: release film

2: adhesive layer

2a: adhesive side

3: porous sheet

4: adsorption film with release film

5: adsorption film

6: mold

6a: opening of mold

7: ceramic green sheet

8: through hole

9: hole

Claims (9)

Applying a hot melt adhesive heated to a predetermined temperature on a release film, A porous sheet is bonded to the hot melt adhesive in a state where the hot melt adhesive on the release film is at a temperature lower than the predetermined temperature, the pressure-sensitive adhesive layer made of the release film, the hot melt adhesive, and the porous sheet. Forms a laminate formed by laminating in this order, The manufacturing method of the adsorption film which peels the said release film from the said laminated body, and obtains the adsorption film by which the said adhesive layer and the said porous sheet are laminated | stacked. The manufacturing method of the adsorption film of Claim 1 whose said porous sheet is an ultrahigh molecular weight polyethylene resin porous sheet. The manufacturing method of the adsorption film of Claim 1 whose thickness of the said porous sheet is 100 micrometers or more and 300 micrometers or less. The arithmetic mean roughness Ra of the surface of the said porous sheet is a manufacturing method of the adsorption film of Claim 1 which is 0.5 micrometer or more and 1.2 micrometers or less. The method for producing an adsorption film according to claim 1, wherein the hot melt adhesive is applied onto the release film so that the pressure-sensitive adhesive layer has a thickness of 3 µm or more and 10 µm or less. The manufacturing method of the adsorption film of Claim 1 in which the said predetermined temperature exists in the range of 170-200 degreeC. The pressure-sensitive adhesive layer made of hot melt adhesive and the porous sheet are laminated, The adhesion by the large stainless adhesion test to the pressure-sensitive adhesive layer is 0.8 N / 25 mm or more, Adsorption film whose air permeability is 5 cm <3> / cm <2> * sec or more. However, the said large stainless adhesive test is performed based on the 180 degree peeling method prescribed | regulated to JIS Z0237, and the said air permeability shall be determined by measuring by the fragile method prescribed | regulated to JIS L1096. Applying a hot melt adhesive heated to a predetermined temperature on a release film, A porous sheet is bonded to the hot melt adhesive in a state where the hot melt adhesive on the release film is at a temperature lower than the predetermined temperature, the pressure-sensitive adhesive layer made of the release film, the hot melt adhesive, and the porous sheet. Is laminated | stacked in this order, and the manufacturing method of the adsorption film with a release film which obtains the adsorption film with a release film from which the release film can peel from the adsorption film which consists of the said adhesive layer and the said porous sheet. The release film, the adhesive layer which consists of a hot melt adhesive, and a porous sheet are laminated | stacked in this order, and it is an adsorption film with a release film with which the release film can peel from the adsorption film which consists of the said adhesive layer and the said porous sheet. , About the said adsorption film obtained by peeling the said release film, The adhesion by the large stainless adhesion test to the pressure-sensitive adhesive layer is 0.8 N / 25 mm or more, The adsorption film whose air permeability by a breathability test is 5 cm <3> / cm <2> * sec or more. However, the said large stainless adhesive force test is performed based on the 180 degree peeling method prescribed | regulated to JIS Z0237, and the said air permeability is determined by measuring by the fragile method prescribed | regulated to JIS L1096.

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