CN101117397B - Adsorption film and manufacturing method and adsorption film with separative film and manufacturing method thereof - Google Patents
Adsorption film and manufacturing method and adsorption film with separative film and manufacturing method thereof Download PDFInfo
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- CN101117397B CN101117397B CN2007101382022A CN200710138202A CN101117397B CN 101117397 B CN101117397 B CN 101117397B CN 2007101382022 A CN2007101382022 A CN 2007101382022A CN 200710138202 A CN200710138202 A CN 200710138202A CN 101117397 B CN101117397 B CN 101117397B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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Abstract
The invention provides an adhesive film of a buffer material installed on a adhesive board such as die and etc., when adsorbing the objects such as ceramic blank sheet material which is easy to deform. A hotmelt adhesive is coated on the off film. A porous sheet material and the adhesive are adhered when the adhesive is at the lower temperature. A lamination body is composed of an adhesive layer including the off film and the hotmelt adhesive and the porous sheet material in order. The multilayer body removes the off film to get the adhesive film which is composed of the adhesive layer and the porous sheet material lamination. The porous sheet material is a polyethylene resin porous sheet material with a super high molecular. The adhesive film has a stainless steel adhesion force of more than 0.8N/25mm relative to the adhesive layer and an air permeability of more than 5cm<3>/cm<2>.s.
Description
Technical field
The present invention relates to be adapted at adopting the absorption machine to adsorb the ceramic green sheet material, it is transported to given position, separate, during lamination, as the adsorption film and the method for manufacture thereof of the fender between adsorption plate that places the absorption machine and the ceramic green sheet material.Also have, the present invention relates to adsorption film and method of manufacture thereof with dicing film.
Background technology
The chip capacitor of employings such as mobile phone the ceramic green sheet material that has printed electrode in addition lamination process.At absorption ceramic green sheet material, it is peeled off from separate-type paper, transport to same place, to separate, on the absorption machine of lamination, adsorption plate to be installed in order adsorbing the ceramic green sheet material with its whole face.In order successfully to carry out above-mentioned a series of operation, require adsorption plate to have the resiliency of surface smoothing property, ventilation property and release and even appropriateness.Adopt of adsorption plate has the mould that is used for gas-pervious peristome more., mould lacks resiliency.In order to remedy the resiliency of mould, fender is installed is in its surface got final product.From keeping the viewpoint of ventilation property, as fender, porous matter sheet material preferably.
Having disclosed in the patent documentation 1 is not to be object with the ceramic green sheet material but with the sheet glass, is used for being adsorbed onto the porous matter sheet material of supporting on the platform to processed body.According to patent documentation 1,, then not only be configured to sheet glass easily and support on the platform, and can more positively prevent its position deviation (paragraph 0025) after this if bond layer is set in advance on the ground, single face top of porous matter sheet material.As the material of bond layer, preferably pressure-sensitive property caking agent but, also can adopt hot-melt adhesive, heat curable adhesive (paragraph 0025).
Patent documentation 1: the spy opens flat 8-169971 communique
Summary of the invention
The problem that solution is planned in invention
Coating adhesive and form bond layer in advance on the surface of the porous matter sheet material that disposes on the mould of ceramic green sheet material absorption usefulness then is very easily.In this occasion, when the peristome through mould attracts the ceramic green sheet material, need with the corresponding part of hole portion of porous matter sheet material, remove caking agent, form communicating pores.Consider this point, then bond layer is better.In order to form thin bond layer, coating gets final product through the hot-melt adhesive that heating has reduced viscosity.
On the other hand, in order to separate the ceramic green sheet material that adsorbs on the porous matter sheet material, need apply row pressure to the ceramic green sheet material through the peristome of mould.For this reason, between mould and porous matter sheet material, require to be not less than the bonding force of row pressure.Therefore, preferably on the surface of the used porous matter sheet material of the absorption of ceramic green sheet material, form the outstanding bond layer of bonding force.
But, as shown in Figure 6, on porous matter sheet material 13, directly be coated with warmed-up hot-melt adhesive 12, hot-melt adhesive 12 will get into the hole portion 19 of porous matter sheet material 13.Therefore, not really heavy back is coated with hot-melt adhesive 12, and hot-melt adhesive 12 will be submerged in hole portion 19, and the contact area of hot-melt adhesive 12 and mould 16 diminishes, and can not obtain enough bonding forces.
Be coated with the hot-melt adhesive 12 of q.s in order to ensure bonding force, just be difficult to guarantee the ventilation property of porous matter sheet material 13.Promptly; In order to let porous matter sheet material 13 absorption ceramic green sheet materials 17; Peristome 16a through mould 16 begins to attract (with reference to the arrow of Fig. 6), but leaves hot-melt adhesive 12 easily in the hole portion 19 of porous matter sheet material 13, can not form the communicating pores 18 of sufficient amount on the adsorption film 20.The ventilation property of adsorption film 20 is low, with regard to the degree that must promote the related decompression of absorption machine and attract ceramic green sheet material 17 very doughtily., attract very doughtily, ceramic green sheet material 17 just is easy to generate distortion.If ceramic green sheet material 17 produces distortion, in the laminate electrode layer at the middle and upper levels and the just possibility short circuit of electrode layer of lower floor of ceramic green sheet material 17, the capacity of chip capacitor just possibly descend.
In view of above situation; The object of the present invention is to provide a kind of when the such easy deformation of absorption ceramic green sheet material tabular is adsorbed body; Be suitable as the adsorption film and the method for manufacture thereof of the fender on the adsorption plates such as being installed in mould; Adsorption film and method of manufacture thereof that particularly bonding force and ventilation property are outstanding, and adsorption film and the method for manufacture thereof of being with dicing film is provided.
Be used to solve the scheme of problem
The present invention provides a kind of on dicing film, the coating to be heated to the hot-melt adhesive to fixed temperature; Become than above-mentioned to fixed temperature under the state of low temperature at the above-mentioned hot-melt adhesive on the above-mentioned dicing film; Porous matter sheet material is engaged with this hot-melt adhesive; Bond layer that formation is formed by above-mentioned dicing film, with above-mentioned hot-melt adhesive and above-mentioned porous matter sheet material be the laminate of lamination gained in this order, peels off above-mentioned dicing film from above-mentioned laminate and obtains the method for manufacture by the adsorption film of the adsorption film of above-mentioned bond layer and above-mentioned porous matter sheet material lamination gained.
Also have, the present invention provides a kind of and is formed by bond layer of forming with hot-melt adhesive and porous matter sheet material lamination, and relevant with above-mentioned bond layer is more than the 0.8N/25mm to the given bonding force of stainless steel bonding force test, and Gas permeability is 5cm
3/ cm
2Adsorption film more than second.Here, above-mentionedly stainless steel bonding force test is peeled off method according to 180 degree of stipulating among the JIS Z0237 carry out, above-mentioned Gas permeability draws several Shandongs method to measure according to paying of stipulating among the JIS L1096 and determines.
Also have; The present invention provides a kind of on dicing film, the coating to be heated to the hot-melt adhesive to fixed temperature; Become than above-mentioned to fixed temperature under the state of low temperature at the above-mentioned hot-melt adhesive on the above-mentioned dicing film; Porous matter sheet material is engaged with this hot-melt adhesive; The bond layer that acquisition is formed by above-mentioned dicing film, with above-mentioned hot-melt adhesive and above-mentioned porous matter sheet material be the lamination gained in this order, the method for manufacture of the adsorption film of the band dicing film of the adsorption film of the band dicing film that above-mentioned dicing film can be peeled off from the adsorption film of being made up of above-mentioned bond layer and above-mentioned porous matter sheet material.
Also have; The present invention provides a kind of bond layer of forming by dicing film, with hot-melt adhesive and porous matter sheet material lamination gained in this order; The adsorption film of the band dicing film that above-mentioned dicing film can be peeled off from the adsorption film of being made up of above-mentioned bond layer and above-mentioned porous matter sheet material; And be that relevant with above-mentioned bond layer is more than the 0.8N/25mm to the given bonding force of stainless steel bonding force test for the above-mentioned adsorption film that obtains for peeling off above-mentioned dicing film, Gas permeability is 5cm
3/ cm
2Adsorption film more than second.Here, above-mentioned measurement to test of stainless steel bonding force and above-mentioned Gas permeability is carried out according to aforesaid way.
The invention effect
The method of manufacture of adsorption film of the present invention is that coating has reduced the hot-melt adhesive of viscosity through heating on dicing film, very unfertile land forms smooth bond layer, and after this make becomes low temperature and bond layer and porous matter sheet material that viscosity has risen are bonding.Therefore, compare, can suppress the hole portion that hot-melt adhesive gets into porous matter sheet material with the occasion that on porous matter sheet material, directly has been coated with hot-melt adhesive.And the bonding plane of the bond layer that forms according to aforesaid method is promptly peeled off dicing film and the flatness on the surface revealed is high.Thereby, adsorption film of the present invention, even the very unfertile land formation in order to ensure ventilation property, the given bonding force of bond layer also is difficult for reducing.
Description of drawings
Fig. 1 is the sectional view of dicing film.
Fig. 2 is illustrated in the sectional view that is coated with hot-melt adhesive on the dicing film and has formed the state of bond layer.
Fig. 3 is the sectional view of the adsorption film of bonding again porous matter sheet material and the band dicing film that obtains on bond layer.
Fig. 4 peels off dicing film and the sectional view of the adsorption film that obtains from the adsorption film of band dicing film.
Fig. 5 is illustrated in adsorption plate (mould) to go up installation, attract adsorption film, has adsorbed the sectional view of the state of ceramic green sheet material.
Fig. 6 is illustrated on the mould to install, attract existing adsorption film, has adsorbed the sectional view of the state of ceramic green sheet material.
Fig. 7 is the state of the adsorption film gained of in comparative example, making is observed in expression with scanning electron microscope figure.
Fig. 8 is the state of the adsorption film gained of making is in an embodiment observed in expression with scanning electron microscope figure.
Fig. 9 is the glue spread of expression hot-melt adhesive and to the figure of the relation of stainless steel bonding force.
Figure 10 is the figure of relation of Gas permeability of glue spread and the adsorption film of expression hot-melt adhesive.
Nomenclature
1 dicing film
2 bond layers
The 2a bonding plane
3 porous matter sheet materials
The adsorption film of 4 band dicing films
5 adsorption films
6 moulds
The peristome of 6a mould
7 ceramic green sheet materials
8 communicating poress
9 hole portions
Embodiment
Below, with reference to accompanying drawing preferred implementation of the present invention is described.At first, on dicing film shown in Figure 11, be coated with hot-melt adhesive and form bond layer 2 (Fig. 2).Dicing film 1 is provided for being coated with the smooth surface of hot-melt adhesive.Dicing film 1, not special the qualification can be adopted resin moldings such as silicone, polyethyleneterephthalate.Dicing film 1 is in order to remove, so long as the getting final product of imporosity in use.
Hot-melt adhesive is applied under warmed-up molten state, turns cold then to be solidified to form bond layer 2.Hot-melt adhesive, not special the qualification adopts to show that at normal temperatures the thing of enough tackinesss (cementability) gets final product.For example, hot-melt adhesive is at high temperature (170～200 ℃), high pressure (2～5kg/cm
2) spraying down.Be heated to above-mentioned degree coating, on dicing film 1, just form the uniform bond layer 2 of thickness easily.Also have, for example, hot-melt adhesive also can be on dicing film 1, and partly, after this mesh-shape or scatter shape ground and be coated with for example, is pushed and on whole, spread out.In this occasion, the diameter (or constitute the point of the point that looses diameter) that hot-melt adhesive is coated with into the lines of formation mesh etc. becomes 5～30 μ m, and the interval of lines (or point) becomes the degree of 5～100 μ m and draws Micropicture and get final product.
The thickness that hot-melt adhesive preferably is coated with into bond layer 2 becomes 3～10 μ m.Bond layer is too thin then not enough to the bonding force of mould, too thickly then when attracting, is difficult to form communicating pores.
Secondly, as shown in Figure 3, bonding and obtain the adsorption film 4 of band dicing film porous matter sheet material 3 and bond layer 2.Porous matter sheet material 3 and bond layer 2 adherent methods, not special the qualification for example, lets the dicing film 1 and the porous matter sheet material 3 that have formed bond layer 2 get final product through pasting between a pair roller.At this moment, the hot-melt adhesive that constitutes bond layer 2 has cooled off and viscosity increases, and is fixed along an interarea of dicing film 1, so be difficult to get into the hole portion 9 of porous matter sheet material 3.
As shown in Figure 4, peel off dicing film 1 from the adsorption film 4 of the band dicing film of Fig. 3 and just can obtain adsorption film 5.Through peeling off of dicing film 1, bond layer 2 just is transferred on the porous matter sheet material 3 from dicing film 1.The face 2a of the bond layer 2 that contacts with dicing film 1 just becomes the good bonding plane 2a of flatness.
As porous matter sheet material 3, preferably resin porous matter sheet material, particularly polyvinyl resin with super-high molecular weight porous matter sheet material.It is low that polyvinyl resin with super-high molecular weight porous matter sheet material and rubber sheet are compared frictional coefficient, with paper, that non-woven fabrics is compared the life-span is long.Ultrahigh molecular weight polyethylene(UHMWPE) has about molecular weight (viscosity-average molecular weight) more than 1,000,000.
Polyvinyl resin with super-high molecular weight porous matter sheet material; Not special the qualification, its thickness is 0.05～0.5mm preferably, particularly preferably is 100～300 μ m; Mean pore size is 1～100 μ m preferably; Particularly preferably be 5～40 μ m, arithmetic average roughness (Ra) is 0.5～1.2 μ m preferably, and elasticity of compression rate (JIS K7181) is 100～1000kgf/m preferably
2, particularly preferably be 200～400kgf/m
2, Gas permeability (paying several Shandongs (Off ラ ジ one Le) method (JIS L1096) of drawing) is 5～20cm preferably
3/ cm
2Second.
Fig. 5 is illustrated in the state that adsorption film 5 has been installed on the mould 6 as adsorption plate of absorption machine.Adsorption film 5 is to be fixed with the surface bonding of mould 6 with bond layer 2.The porous matter sheet material 3 of adsorption film 5 is adjacent to the ceramic green sheet material 7 that will transport.Under this state, the words (with reference to the arrow of Fig. 5) that begin to attract from the peristome 6a of mould 6, above the hole portion 9 of porous matter sheet material 5, the part of bond layer 2 just is removed, and on adsorption film 5, forms communicating pores 8.Then, attract ceramic green sheet material 7 through communicating pores 8.Like this, ceramic green sheet material 7 is just transported to given place by mould 6 absorption, separates from mould 6 by means of the row pressure that applies from peristome 6a (to the opposite direction applied pressure of Fig. 5 arrow) in this place.
In adsorption film 5, the flatness of the bonding plane 2a that contacts with mould 6 of bond layer 2 is high.Therefore, even not really heavy back forms bond layer 2, also can guarantee and mould 6 between enough bonding forces are arranged.Thereby even apply row pressure in order to separate ceramic green sheet material 7, adsorption film 5 can not peeled off from mould 6 yet.
Below, through embodiment the present invention is described more specifically.But the present invention is not limited by following examples.
(comparative example)
At polyvinyl resin with super-high molecular weight porous matter sheet material (the system Sang Mapu (サ Application マ Star プ) of Nitto Denko Corp: thickness 0.22mm, mean pore size 20 μ m, arithmetic average roughness (Ra) 2.2 μ m, elasticity of compression rate 300kgf/m as porous matter sheet material
2, Gas permeability 7cm
3/ cm
2Second) on, be heated to 190 ℃ to hot-melt adhesive (pacifying the black Lou dyne (ヒ ロ ダ イ Application) of former KCC system), with 5kgf/cm
2Pressure evenly spray.Spraying given glue spread is 7g/m
2The thick of bond layer that forms like this is 7～8 μ m.
Let bond layer be cooled to normal temperature, be pressed in bond layer on the surface of mould, thereby be fixed on adsorption film on the mould with opening.Begin to attract from the peristome of mould again, remove the part of bond layer and formed communicating pores.Observed formation communicating pores adsorption film afterwards with scanning electron microscope.The result is as shown in Figure 7.
(embodiment)
On dicing film (the system RT-75S of Nitto Denko Corp), the same with comparative example, evenly spray hot-melt adhesive (identical) with comparative example, formed the bond layer of thickness 7～8 μ m.
Reach normal temperature and show viscosity (tackiness) afterwards at bond layer; Polyvinyl resin with super-high molecular weight porous matter sheet material (the system Sang Mapu of Nitto Denko Corp as porous matter sheet material; The same with comparative example) superimposed, by being pressed on the bond layer, obtain by dicing film, bond layer, the porous matter sheet material adsorption film of the band dicing film that forms of lamination in this order.
Secondly, peel off dicing film, expose bond layer from the adsorption film of band dicing film.Under this state, be pressed in bond layer on the surface of mould, thereby be fixed on adsorption film on the mould with opening.Begin to attract from the peristome of mould again, remove the part of bond layer and formed communicating pores.The condition of used attraction from mould and peristome is identical with comparative example.Fig. 8 representes the same with comparative example, observes the result who forms communicating pores adsorption film gained afterwards with scanning electron microscope.Comparison diagram 7 can be found out with Fig. 8, on the adsorption film of embodiment, form more communicating pores.
In embodiment and existing example, change the glue spread of hot-melt adhesive respectively and processed adsorption film.Then, the bonding force (to the stainless steel bonding force) and the Gas permeability of bond layer have been measured for these adsorption films.
The stainless steel bonding force is peeled off method according to JIS Z0237 180 degree to carry out.Also have, the measurement of Gas permeability draws several Shandongs method (JIS L1096) to carry out according to paying.
Fig. 9 representes the measuring result of bonding force.The measuring result of the Gas permeability that Fig. 1 representes.On porous matter sheet material, directly be coated with in the comparative example (existing example) of hot-melt adhesive, 0.8N/25mm above to stainless steel bonding force and 5cm
3/ cm
2Gas permeability more than second is difficult to take into account.In the transporting of ceramic green sheet material, preferably take into account the bonding force and the Gas permeability of this degree.On the other hand, on dicing film, be coated with among the embodiment of hot-melt adhesive, above-mentioned taking into account becomes possibility.Can find out that from Fig. 9 and Figure 10 the glue spread of hot-melt adhesive is 3～10g/m preferably
2Degree.
Industrial applicibility
By adsorption film of the present invention absorption ceramic green sheet material, it is peeled off from separate-type paper, be transported to after the same place, separate, lamination, make employed chip capacitor such as mobile phone and will become easy.
Be included on the adsorption plate of the adsorption film that adsorption film involved in the present invention or manufacturing method according to the invention acquisition have been installed; Adsorb the ceramic green sheet material contiguously with adsorption film, transport, the operation of lamination has very big utility value in the method for manufacture of interior electronic component (for example chip capacitor) on industry.
Claims (4)
1. the method for manufacture of an adsorption film:
Coating is heated to the hot-melt adhesive to fixed temperature on dicing film,
Become than above-mentioned to fixed temperature under the state of low temperature at the above-mentioned hot-melt adhesive on the above-mentioned dicing film; Porous matter sheet material is engaged with this hot-melt adhesive; Bond layer that formation is formed by above-mentioned dicing film, with above-mentioned hot-melt adhesive and above-mentioned porous matter sheet material be the laminate of lamination gained in this order
Peel off above-mentioned dicing film and obtain adsorption film from above-mentioned laminate by above-mentioned bond layer and above-mentioned porous matter sheet material lamination gained, wherein,
Above-mentioned porous matter sheet material is a polyvinyl resin with super-high molecular weight porous matter sheet material,
The thickness of above-mentioned porous matter sheet material is below the above 300 μ m of 100 μ m,
The arithmetic average roughness (Ra) on the surface of above-mentioned porous matter sheet material is below the above 1.2 μ m of 0.5 μ m,
The above-mentioned hot-melt adhesive of coating on above-mentioned dicing film makes that the thickness of above-mentioned bond layer is below the above 10 μ m of 3 μ m,
Above-mentioned being in to fixed temperature in 170～200 ℃ the scope.
2. adsorption film:
Form by bond layer of forming with hot-melt adhesive and porous matter sheet material lamination,
Relevant with above-mentioned bond layer is more than the 0.8N/25mm to the given bonding force of stainless steel bonding force test,
Gas permeability is 5cm
3/ cm
2More than second,
Here, above-mentionedly stainless steel bonding force test is peeled off method according to 180 degree of stipulating among the JIS Z0237 carry out, above-mentioned Gas permeability draws several Shandongs method to measure according to paying of stipulating among the JIS L1096 and determines,
Above-mentioned porous matter sheet material is a polyvinyl resin with super-high molecular weight porous matter sheet material,
The thickness of above-mentioned porous matter sheet material is below the above 300 μ m of 100 μ m,
The arithmetic average roughness (Ra) on the surface of above-mentioned porous matter sheet material is below the above 1.2 μ m of 0.5 μ m,
The thickness of above-mentioned bond layer is below the above 10 μ m of 3 μ m.
3. method of manufacture with the adsorption film of dicing film:
Coating is heated to the hot-melt adhesive to fixed temperature on dicing film,
Become than above-mentioned to fixed temperature under the state of low temperature at the above-mentioned hot-melt adhesive on the above-mentioned dicing film; Porous matter sheet material is engaged with this hot-melt adhesive; The bond layer that acquisition is formed by above-mentioned dicing film, with above-mentioned hot-melt adhesive and above-mentioned porous matter sheet material be the lamination gained in this order; The adsorption film of the band dicing film that above-mentioned dicing film can be peeled off from the adsorption film of being made up of above-mentioned bond layer and above-mentioned porous matter sheet material, wherein
Above-mentioned porous matter sheet material is a polyvinyl resin with super-high molecular weight porous matter sheet material,
The thickness of above-mentioned porous matter sheet material is below the above 300 μ m of 100 μ m,
The arithmetic average roughness (Ra) on the surface of above-mentioned porous matter sheet material is below the above 1.2 μ m of 0.5 μ m,
The above-mentioned hot-melt adhesive of coating on above-mentioned dicing film makes that the thickness of above-mentioned bond layer is below the above 10 μ m of 3 μ m,
Above-mentioned being in to fixed temperature in 170～200 ℃ the scope.
4. adsorption film with dicing film:
The bond layer of forming by dicing film, with hot-melt adhesive and porous matter sheet material be the lamination gained in this order, the adsorption film of the band dicing film that above-mentioned dicing film can be peeled off from the adsorption film of being made up of above-mentioned bond layer and above-mentioned porous matter sheet material,
For the above-mentioned adsorption film that obtains for peeling off above-mentioned dicing film,
Relevant with above-mentioned bond layer is more than the 0.8N/25mm to the given bonding force of stainless steel bonding force test,
Gas permeability is 5cm
3/ cm
2More than second,
Here, above-mentionedly stainless steel bonding force test is peeled off method according to 180 degree of stipulating among the JIS Z0237 carry out, above-mentioned Gas permeability draws several Shandongs method to measure according to paying of stipulating among the JIS L1096 and determines,
Above-mentioned porous matter sheet material is a polyvinyl resin with super-high molecular weight porous matter sheet material,
The thickness of above-mentioned porous matter sheet material is below the above 300 μ m of 100 μ m,
The arithmetic average roughness (Ra) on the surface of above-mentioned porous matter sheet material is below the above 1.2 μ m of 0.5 μ m,
The thickness of above-mentioned bond layer is below the above 10 μ m of 3 μ m.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-211311 | 2006-08-02 | ||
| JP2006211311A JP5020563B2 (en) | 2006-08-02 | 2006-08-02 | Method for producing adsorption film and method for producing adsorption film with release film |
| JP2006211311 | 2006-08-02 |
Publications (2)
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| CN102539384B (en) | 2004-11-12 | 2016-08-03 | 爱克斯崔里斯科技有限公司 | Particle detector, System and method for |
| KR101801994B1 (en) * | 2010-01-25 | 2017-11-27 | 닛토덴코 가부시키가이샤 | Method of suction of object to be worked upon suction unit and method of manufacture of ceramic capacitor |
| CN101992573A (en) * | 2010-08-31 | 2011-03-30 | 刘烈新 | Novel release film |
| JP5699320B2 (en) * | 2010-09-16 | 2015-04-08 | 大日本印刷株式会社 | Roll film base |
| US20150030810A1 (en) * | 2012-02-17 | 2015-01-29 | Nitto Denko Corporation | Porous suction sheet and replaceable surface layer used therein |
| TWI561387B (en) * | 2012-11-14 | 2016-12-11 | Ind Tech Res Inst | Film debonding apparatus |
| CN107529840B (en) * | 2015-04-28 | 2021-10-01 | 东丽株式会社 | Waterproof moisture-permeable fabric and infection protective clothing |
| KR101876149B1 (en) | 2016-12-12 | 2018-07-06 | 아사히 가세이 가부시키가이샤 | Polyethylene powder |
| JP6968751B2 (en) * | 2018-05-31 | 2021-11-17 | 日東電工株式会社 | Work protection sheet |
| JP7060451B2 (en) * | 2018-06-06 | 2022-04-26 | 東芝ライフスタイル株式会社 | Method for manufacturing oxygen-enriched membrane |
| KR102076251B1 (en) * | 2019-05-15 | 2020-02-11 | 정경우 | Multilayer structure for exfoliating and transferring ceramic green sheet |
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| US5208103A (en) * | 1991-02-28 | 1993-05-04 | Sumitomo Bakelite Company Limited | Cover tape for packaging chip type electronic parts |
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| JPH05239425A (en) * | 1992-03-02 | 1993-09-17 | Sekisui Chem Co Ltd | Pressure-sensitive acrylic emulsion adhesive |
| JP3502959B2 (en) * | 1994-12-19 | 2004-03-02 | 日東電工株式会社 | Porous sheet used for adsorption fixing and adsorption fixing method using the porous sheet |
| JPH08257474A (en) * | 1995-03-23 | 1996-10-08 | Nitto Denko Corp | Sucking and fixing sheet and sucking and fixing method using the sheet |
| JP2001028390A (en) * | 1999-07-13 | 2001-01-30 | Nitto Denko Corp | Sucking fixing carrying sheet |
| KR100312994B1 (en) * | 1999-12-11 | 2001-11-05 | 오대식 | hot melt adhesive tape for attaching a refrigerant pipe |
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| JP2005056658A (en) * | 2003-08-04 | 2005-03-03 | Nitto Denko Corp | Adhesive tape or sheet for winding and stopping lithium ion battery element |
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| CN1152760A (en) * | 1995-10-19 | 1997-06-25 | 林特克株式会社 | Adhesive-stick type label |
| CN1354085A (en) * | 2000-10-23 | 2002-06-19 | 松下电工株式会社 | Laminated board with stripping surface layer and method for stripping surface layer from laminated board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101117397A (en) | 2008-02-06 |
| KR20080012224A (en) | 2008-02-11 |
| KR20130142095A (en) | 2013-12-27 |
| TWI555635B (en) | 2016-11-01 |
| JP2008036885A (en) | 2008-02-21 |
| TWI605952B (en) | 2017-11-21 |
| TW200821148A (en) | 2008-05-16 |
| JP5020563B2 (en) | 2012-09-05 |
| TW201534479A (en) | 2015-09-16 |
| KR101440616B1 (en) | 2014-09-15 |
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