KR20080005067A - Exposure apparatus - Google Patents

Abstract

An exposure apparatus is provided to prevent a mask from being damaged by stopping an one-way up/down movement between a mask stage and a work stage so as to avoid the contact between the mask and a substrate when it is detected that the gap between the mask and the substrate, which are close to each other when an exposure process is executed, is below an appointed value. An exposure apparatus, which consists of a work stage(2), a mask stage(1), an irradiation unit(3), and a conveying unit, comprises a laser monitoring unit(70) and a control unit. The work stage(2) maintains a substrate(W). The mask stage(1), arranged opposite to the substrate(W), maintains a mask(M). The irradiation unit(3) irradiates light for pattern exposure to the substrate(W) through the mask(M). The conveying unit shifts the work stage(2) and the mask stage(1) relatively to each other step by step so that the mask pattern of the mask(M) can face a plurality of appointed positions on the substrate(W). The laser monitoring unit(70) has light emitting parts(71,72) and light receiving parts(73,74). The light emitting parts(71,72) emit laser beams which horizontally pass through an appointed location between the mask(M) and the substrate(W). The light receiving parts(73,74) receive the laser beams. The control unit stops an one-way up/down movement between the mask stage(1) and the work stage(2) when the amount of laser beams received to the light receiving parts(73,74) reaches to an appointed value or less.

Description

Exposure apparatus {EXPOSURE APPARATUS}

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which partially exploded the split sequential proximity exposure apparatus of 1st Embodiment of this invention.

2 is an enlarged perspective view of a mask stage portion;

Fig. 3 (a) is a sectional view taken along the line III-III of Fig. 2, and Fig. 3 (b) is a top view of the mask position adjusting means of Fig. 3 (a).

4 is an explanatory diagram for explaining an irradiation optical system of a work side alignment mark.

5 is a configuration diagram illustrating a focus adjustment mechanism of an alignment image.

Fig. 6 is a side view showing the basic structure of the alignment camera and the focus adjustment mechanism of the alignment camera.

FIG. 7 is a front view of the divided sequential proximity exposure apparatus shown in FIG. 1. FIG.

FIG. 8 is a block diagram showing an electrical configuration of a split sequential proximity exposure apparatus shown in FIG. 1. FIG.

9 is a bottom view of the mask stage shown in FIG. 1.

10 is an explanatory diagram for explaining a state of detecting a gap between a mask and a substrate of the exposure apparatus of the second embodiment.

11 is a bottom view of the mask stage in FIG. 10.

12 is a partially exploded perspective view of a divided sequential proximity exposure apparatus according to a third embodiment of the present invention.

(A) is sectional drawing which shows the mask stage cut | disconnected along the III-III line | wire of FIG. 2 with a board | substrate, FIG. 13 (b) is a top view of the mask position adjusting means of FIG.

14 is a bottom view of the chuck of the mask stage;

FIG. 15 is a front view of the divided sequential proximity exposure apparatus shown in FIG. 12. FIG.

FIG. 16 is a block diagram showing an electrical configuration of a split sequential proximity exposure apparatus shown in FIG. 12; FIG.

FIG. 17 is a cross-sectional view showing a mask stage of a divided-sequential proximity exposure apparatus according to a fourth embodiment of the present invention together with a substrate. FIG.

     * Description of the symbols for the main parts of the drawings

1: mask stage 2: work stage

3: Illumination optical system for exposure 4: Device base

[Patent Document 1] Japanese Unexamined Patent Publication No. 2000-35676

[Patent Document 2] Japanese Unexamined Patent Publication No. 2004-272139

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus suitable for proximity (proxy) exposure transfer of a mask pattern of a mask on a substrate of a large flat panel display such as a liquid crystal display or a plasma display in a split sequential exposure method.

Conventionally, the exposure apparatus which manufactures the color filter of flat panel display apparatuses, such as a liquid crystal display device and a plasma display apparatus, is designed variously (for example, refer patent document 1 and 2). The exposure apparatus of patent document 1 uses the mask smaller than the board | substrate as an to-be-exposed material, maintains the mask in a mask stage, holds a board | substrate in a work stage, and arrange | positions them so that they may face each other. In this state, by moving the work stage with respect to the mask and irradiating the substrate with light for pattern exposure from the mask side for each step, the plurality of mask patterns drawn on the mask are exposed and transferred onto the substrate, and a plurality of displays and the like are printed on one substrate. To produce. In the case where the substrate and the mask are disposed to face each other, after the completion of the positioning operation of the substrate, the operation of adjusting the target gap is performed while detecting a gap between the substrate and the mask using a gap sensor.

In addition, the exposure apparatus described in Patent Document 2 provides a non-contact type measuring device and a gate in the middle of a moving path of the substrate, and when the substrate is to be brought into contact with the mask at a position where the substrate is not detected by the measuring device, the substrate is connected with a metal gate. The mask is protected by contact.

By the way, with the recent enlargement of the flat panel display apparatus, the mask for manufacturing a color filter is also large (for example, 1400 mm x 1200 mm), and the price per mask is also increasing. For this reason, it is desired to reliably prevent the substrate from coming in contact with the mask and damaging the mask.

In the exposure apparatus described in Patent Literature 1, the gap is adjusted while detecting the gap between the substrate and the mask, and there is a possibility that a reading error may occur for the non-contact type gap sensor, or the substrate may come into contact with the mask due to an operation miss or the like. .

Moreover, since the exposure apparatus of patent document 2 uses the non-contact gap sensor, when the said board | substrate exists and a board | substrate contacts with a gate, it is necessary for an operator to confirm and control the movement of a work stage. There was.

This invention is made | formed in view of the said situation, and the objective is to provide the exposure apparatus which can reliably prevent damage of a mask.

Means to solve the problem

The said object of this invention is achieved by the following structures.

(1) A work stage for holding a substrate as a to-be-exposed material, a mask stage disposed opposite to the substrate for holding a mask, irradiation means for irradiating light for pattern exposure to the substrate through a mask, and a mask pattern of the mask on the substrate An exposure apparatus having a transfer mechanism for relatively moving a work stage and a mask stage so as to face a plurality of predetermined positions,

A laser monitoring apparatus having a light emitting portion for emitting a laser beam passing in a substantially horizontal direction through a predetermined position between the mask held on the mask stage and the substrate held on the work stage, and a light receiving portion for receiving the laser beam;

And a control device for stopping movement of at least one of the mask stage and the work stage in the vertical direction when the received amount of the laser beam in the light receiving portion is equal to or less than a predetermined value.

(2) A work stage for holding a substrate as an object to be exposed, a mask stage arranged opposite to the substrate for holding a mask, irradiation means for irradiating light for pattern exposure to the substrate through a mask, and a mask pattern of the mask on the substrate An exposure apparatus having a transfer mechanism for relatively moving a work stage and a mask stage so as to face a plurality of predetermined positions,

Disposed between the edge of the mask on the mask stage and having a light emitting portion for emitting a laser beam toward the substrate and a light receiving portion for receiving the laser beam reflected from the substrate, between the mask held on the mask stage and the substrate held on the work stage. A laser monitoring device for monitoring the gap by measuring a gap of the

And a control device for stopping movement of at least one of the mask stage and the work stage in the up and down direction when the gap becomes less than or equal to the predetermined value.

Implement the invention  Best form for

EMBODIMENT OF THE INVENTION Hereinafter, each embodiment of the exposure apparatus of this invention is described in detail, referring an accompanying drawing.

( First embodiment)

First, the divided sequential exposure apparatus PE of this invention is demonstrated. As shown in FIG. 1, the divided sequential exposure apparatus PE of the present embodiment includes a mask stage 1 holding a mask M and a work stage 2 holding a glass substrate (exposed material W). And an exposure illumination optical system 3 as irradiation means for irradiating light for pattern exposure, and an apparatus base 4 for supporting the mask stage 1 and the work stage 2.

In addition, the glass substrate W (hereinafter, simply referred to as “substrate W”) is disposed on the surface of the mask M so as to face the mask M to expose and transfer the mask pattern P drawn on the mask M. The opposing surface of (M) is coated with a photosensitive agent to become light transmissive.

For convenience of explanation, from the illumination optical system 3, the illumination optical system 3 is configured to condense, for example, a high-pressure mercury lamp 31, which is a light source for ultraviolet irradiation, and light irradiated from the high-pressure mercury lamp 31. The concave mirror 32, two types of optical integrators 33 arranged so as to be able to switch freely in the vicinity of the focal point of the concave mirror 32, the planar mirrors 35, 36 and the spherical mirror 37 And an exposure control shutter 34 arranged between the planar mirror 36 and the optical integrator 33 to control the opening and closing of the irradiation light path.

When the exposure control shutter 34 is opened and controlled at the time of exposure, the light irradiated from the high-pressure mercury lamp 31 passes through the optical path L shown in FIG. 1, and the mask M held on the mask stage 1, and further, Is irradiated as parallel light for pattern exposure perpendicular to the surface of the substrate W held by the work stage 2. Thereby, the mask pattern P of the mask M is exposed-transferred on the board | substrate W. FIG.

Next, the mask stage 1 and the work stage 2 will be described in order. First, the mask stage 1 is provided with the mask stage base 10, The mask stage base 10 is supported by the mask stage support 11 protruding from the apparatus base 4, and the It is arranged above.

As shown in Fig. 2, the mask stage base 10 has a substantially rectangular shape and has an opening 10a in the center, and the mask holding frame 12 is movable in the X and Y directions in the opening 10a. Is fitted.

As shown in Fig. 3 (a), the mask holding frame 12 mounts the flange 12a formed on the upper peripheral part of the mask on the upper surface of the mask stage base 10 near the opening 10a. It is inserted with a predetermined gap between the inner circumference of the opening 10a of 10). As a result, the mask holding frame 12 is movable in the X and Y directions by this gap.

The lower surface of the mask holding frame 12 is fixed with a chuck portion 16 for holding the mask M via an intermittent seat 20, and together with the mask holding frame 12 a mask stage base. It can move to X and Y directions with respect to (10). The lower surface of the chuck | zipper part 16 is provided with the some suction nozzle 16a for attracting the periphery part which is the edge part of the mask M in which the mask pattern P is drawn. In this way, the mask M is detachably held by a vacuum suction device (not shown) via the suction nozzle 16a.

In addition, on the upper surface of the mask stage base 10, the mask holding frame 12 is based on the detection result by the alignment camera 15 mentioned later in FIG. 2, or the measurement result by the laser measuring device 60 mentioned later. Is moved within the XY plane, and mask position adjusting means 13 is provided to adjust the position and attitude of the mask M held by the mask holding frame 12.

The mask position adjusting means 13 has an X axis direction driving device 13x attached to one side along the Y axis direction of the mask holding frame 12 and one side along the X axis direction of the mask holding frame 12. Two Y-axis direction drive devices 13y mounted are provided.

As shown to FIG.3 (a) and FIG.3 (b), the X-axis direction drive apparatus 13x is a drive actuator (for example, electric actuator; 131) which has the rod 131r which expands and contracts in an X-axis direction. And a linear guide (direct bearing guide) 133 attached to the periphery of the mask holding frame 12 along the Y axis direction. The guide rail 133r of the linear guide 133 extends in the Y axis direction and is fixed to the mask holding frame 12. Moreover, the slider 133s attached to the guide rail 133r so that movement is possible is connected through the pin support mechanism 132 to the front-end | tip of the rod 131r fixed to the mask stage base 10. As shown in FIG.

On the other hand, the Y-axis direction drive device 13y also has the same configuration as the X-axis direction drive device 13x, and has a driving actuator (for example, an electric actuator; 131) having a rod 131r that is extended and contracted in the Y-axis direction. And a linear guide (direct bearing guide) 133 attached to the edge portion of the mask holding frame 12 along the X axis direction. The guide rail 133r of the linear guide 133 extends in the X axis direction and is fixed to the mask holding frame 12. In addition, the slider 133s mounted to the guide rail 133r so as to be movable is connected to the tip of the rod 131r via the pin support mechanism 132. And the X-axis direction of the mask holding frame 12 is adjusted by the X-axis direction drive device 13x, and the Y-axis direction and (theta) of the mask holding frame 12 are controlled by two Y-axis direction drive devices 13y. Adjust the axial direction (swing in the Z axis direction).

Moreover, the gap sensor as a means which measures the gap between the mask M and the opposing surface of the board | substrate W inside the two sides which mutually oppose each other in the X-axis direction of the mask holding frame 12 as shown in FIG. (14) and the alignment camera 15 as a means for detecting the plane deviation amount of the mask M and the alignment reference are arrange | positioned. The gap sensor 14 and the alignment camera 15 are both movable in the X axis direction through the moving mechanism 19.

As for the movement mechanism 19, the holding mount 191 which hold | maintains the gap sensor 14 and the alignment camera 15 in the Y-axis direction in the upper surface side of the two sides which mutually opposes in the X-axis direction of the mask holding frame 12, respectively. It extends and is arrange | positioned, and the edge part of the side separated from the Y-axis direction drive apparatus 13y of the holding mount 191 is supported by the linear guide 192. As shown in FIG. The linear guide 192 is provided with the guide rail 192r installed on the mask stage base 10 and extending along the X-axis direction, and the slider (not shown) which moves on the guide rail 192r, The end of the holding mount 191 is fixed to the slider.

The gap sensor 14 and the alignment camera 15 are moved in the X-axis direction through the holding mount 191 by driving the slider by the driving actuator 193 composed of a motor and a ball screw.

As shown in FIG. 4, the alignment camera 15 masks the mask side alignment mark 101 of the surface (mask pattern surface Mm) of the mask M hold | maintained on the lower surface of the mask stage 1 when it is a mask. By optically detecting from the side, the focus adjustment mechanism 151 moves the approach M with respect to the mask M, and the focus adjustment is performed.

The focus adjustment mechanism 151 includes a linear guide 152, a ball screw 153, and a motor 154. The linear guide 152 is provided with a guide rail 152r and a slider 152s, among which the guide rail 152r is in the up-down direction to the holding mount 191 of the moving mechanism 19 of the mask stage 1. While being extended and mounted, the alignment camera 15 is fixed to the slider 152s of the linear guide 152 via the table 152t. The nut screwed by the screw shaft of the ball screw 153 is connected to the table 152t, and the screw shaft is rotationally driven by the motor 154.

In this embodiment, as shown in FIG. 5, the work side alignment mark 100 has a light source 781 and a condenser lens 782 below the work chuck 8 provided in the work stage 2. The projection optical system 78 for projecting the light beams from below is integrally disposed with the Z-axis fine moving stage 24 in accordance with the optical axis of the alignment camera 15. In addition, through-holes corresponding to the optical path of the projection optical system 78 are formed in the work stage 2 and the Y-axis feed table 52.

In addition, in this embodiment, as shown in FIG. 6, the position (mask pattern surface Mm) which has the mask side alignment mark 101 of the mask M is detected, and the focus shift of the alignment camera 15 is detected. The best focus adjustment mechanism 150 of the alignment image to prevent is provided. In addition to the alignment camera 15 and the focus adjustment mechanism 151, the best focus adjustment mechanism 150 uses the gap sensor 14 as the focus shift detection means. That is, a difference is obtained by comparing the measured value of the mask lower surface position measured by this gap sensor 14 with the focus position preset by the control apparatus 80, and from the difference, the relative focus position change amount from the setting focus position is calculated. It calculates and controls the motor 154 of the focus adjustment mechanism 151 to move the alignment camera 15 according to the calculation change amount, and adjusts the focus of the alignment camera 15 by this.

By using this best focus adjustment mechanism 150, high-precision focus adjustment of the alignment image is attained irrespective of the plate | board thickness change of the mask M and the deviation of plate | board thickness. That is, in the case of using a plurality of types of masks M interchangeably, an appropriate focus can always be obtained even when the thicknesses of the individual masks are different. In addition, the focus adjustment mechanism 151, the projection optical system 78, the best focus adjustment mechanism 150, etc. not only correspond to the high precision of the alignment of the first layer division pattern, but also to the high precision of the alignment after the second layer. If the thickness of the mask M is known, the best focus adjustment mechanism 150 may be omitted, and the focus adjustment mechanism 151 may be moved in accordance with the thickness.

In addition, masking apertures (shielding plates) 17 that shield both ends of the mask M as necessary at both ends in the Y axis direction of the opening 10a of the mask stage base 10 above the mask M. The masking aperture 17 is movable in the Y-axis direction by a masking aperture driving device 18 composed of a motor, a ball screw, and a linear guide. The shielding area can be adjusted.

Next, the work stage 2 is provided on the apparatus base 4, and the chuck surface 8a which hold | maintains the board | substrate W so that attachment or detachment is possible by a vacuum suction apparatus (not shown) etc. on an upper surface is carried out. Z-axis feeder (gap adjusting means; 2A) which adjusts the clearance between the workpiece chuck 8 which has, the opposing surface of the mask M and the board | substrate W to predetermined amount, and this Z-axis feeder 2A. It is provided with the work stage feed mechanism 2B arrange | positioned on and moving the work stage 2 to an XY axis direction.

As shown in FIG. 7, the Z-axis feeder 2A includes a Z-axis coarse stage 22 supported by the up-and-down coarse device 21 standing up on the apparatus base 4 so as to be able to coarse in the Z-axis direction. And the Z axis fine movement stage 24 supported on the Z axis coarse motion stage 22 via the vertical movement device 23. The vertical actuator 21 uses an electric actuator made of a motor, a ball screw or the like, or an air pressure seal, and by simply performing the vertical motion, the Z axis coarse stage 22 to a predetermined position. The lifting and lowering is performed without measuring the gap between the mask M and the substrate W. FIG.

On the other hand, the up-and-down fine motion device 23 shown in FIG. 1 is equipped with the movable wedge mechanism which combines a motor, a ball screw, and a wedge, In this embodiment, it is installed in the upper surface of the Z axis coarse motion stage 22, for example. The screw shaft 232 is driven to rotate by the motor 231, and the ball screw nut 233 is formed in a wedge shape, and the inclined surface of the wedge nut 233 is Z-axis fine stage. It engages with the inclined surface of the wedge 241 which protruded and provided in the lower surface of 24, and this comprises the movable wedge mechanism.

Then, when the screw shaft 232 of the ball screw is driven to rotate, the wedge-shaped nut 233 is horizontally moved in the Y-axis direction, and this horizontal fine movement is performed by the slope action of both wedges 233 and 241 with high precision. Converted to vertical motion.

The up-and-down fine motion device 23 which consists of this movable wedge mechanism is two in the one end side (front side of FIG. 1) of the Z-axis fine movement stage 24 in the Y-axis direction, and one in the other end side (not shown), and total 3 It is largely provided, and each drive control is performed independently. Thereby, the vertical motion device 23 also has a tilt function, and based on the measurement result of the clearance of the mask M and the board | substrate W by the three gap sensors 14, the mask M and The height of the Z axis fine movement stage 24 is fine-adjusted so that the board | substrate W may be parallel and oppose through a predetermined clearance gap. In addition, the up-and-down coarse motion device 21 and the up-down motion control device 23 may be provided in the part of the Y-axis feed stand 52.

As shown in FIG. 7, the work stage feed mechanism 2B is a kind of two sets of rolling guides arranged on the upper surface of the Z-axis fine moving stage 24 in the Y-axis direction and spaced apart from each other and connected in the X-axis direction. X-axis feed drive device for moving the in-linear guide 41, the X-axis feed table 42 mounted on the slider 41a of the linear guide 41, and the X-axis feed table 42 in the X-axis direction. The X-axis feed table 42 is provided with a ball screw nut 433 provided with a 43 and screwed to the ball screw shaft 432 that is rotationally driven by the motor 431 of the X-axis feed drive device 43. Is connected.

Moreover, on the upper surface of this X-axis feed stand 42, the linear guide 51 which is one kind of two sets of rolling guides arrange | positioned mutually in the X-axis direction, respectively, and connected in series along the Y-axis direction, and the linear guide 51 Y-axis feed table 52 attached to the slider 51a of the "), and Y-axis feed drive device 53 for moving the Y-axis feed table 52 in the Y-axis direction. The Y-axis feeder 52 is connected to a ball screw nut (not shown) screwed to the ball screw shaft 532 which is rotationally driven by the motor 531 of the 53. The work stage 2 is attached to the upper surface of the Y-axis feed table 52.

And the laser measuring device 60 as a movement distance measuring part which detects the X-axis and Y-axis position of the work stage 2 is provided in the apparatus base 4. In the work stage 2 configured as described above, due to errors such as the shape of the ball screw and the linear guide itself, mounting errors thereof, and the like, positioning errors, yawing, straightness, and the like during the movement of the work stage 2 are caused. It is inevitable. Therefore, this laser measuring device 60 is aimed at measuring these errors.

As shown in FIG. 1, the laser measuring device 60 is provided with a pair of Y-axis interferometers 62 and 63 provided with a laser facing the Y-axis direction end portion of the work stage 2, and the work stage. One X-axis interferometer 64 provided with a laser at the X-axis direction end of (2) and a Y-axis mirror disposed at a position opposite to the Y-axis interferometers 62 and 63 of the work stage 2 ( 66 and an X-axis mirror 68 disposed at a position opposite to the X-axis interferometer 64 of the work stage 2.

Thus, by providing two Y-axis interferometers 62 and 63 with respect to the Y-axis direction, not only the information of the Y-axis direction position of the work stage 2 but the difference of the position data of the Y-axis interferometers 62 and 63 are shown. Yaw error can be known by minute. About the Y-axis direction position, it can calculate by adding correction to the average value of both, adding the X-axis direction position and yaw error of the work stage 2 suitably.

And when connecting the next division pattern after exposure of the XY direction position of the work stage 2, the Y-axis feeder 52, and also the previous division pattern, it sends a board | substrate W to the next area. In the step, detection signals output from the interferometers 62 to 64 are input to the control device 80 as shown in FIG. 8. The control device 80 controls the X-axis feed drive device 43 and the Y-axis feed drive device 53 while adjusting the amount of movement in the XY direction for the divided exposure based on this detection signal, and X Based on the detection result by the axis interferometer 64 and the detection result by the Y axis interferometers 62 and 63, the positioning correction amount for the connection exposure is calculated, and the calculation result is used as the mask position adjusting means 13 and required. According to the upper and lower microscopic devices 23). Thereby, the mask position adjusting means 13 etc. are driven according to this correction amount, and the influence of positioning error, straightness error, yawing, etc. by the X-axis feed drive apparatus 43 or the Y-axis feed drive apparatus 53 is carried out. This is solved.

1 and 7, the apparatus base 4 monitors the gap between the mask M held on the mask stage 1 and the substrate W held on the work stage 2. The laser monitoring device 70 is provided. The laser monitoring apparatus 70 includes light emitting parts 71 and 72 for emitting a laser beam LB which passes through a predetermined position between the mask M and the substrate W in a substantially horizontal direction, and a laser beam ( It has the light receiving parts 73 and 74 which receive LB). The light emitting parts 71 and 72 and the light receiving parts 73 and 74 are arranged outside the two-dimensional region where the work stage 2 steps, and are set to pass through two opposite sides of the mask M, respectively. (See FIG. 9).

For example, when exposure is performed using the gap g of the mask M and the board | substrate W as 150 micrometers, the light emission parts 71 and 72 of this embodiment are made to carry out the laser beam LB. It arrange | positions so that it may pass through the position which is about 80 micrometers from the lower surface of the mask M. FIG. For this reason, when the clearance gap between the mask M and the board | substrate W becomes 80 micrometers or less, the laser beam LB from the light emission parts 71 and 72 will be cut off, and the light reception amount in the light reception part 73 will change. . When the received amount of light received by the light receiving portion 73 is input to the control device 80 and the received amount is less than or equal to the predetermined value, it is determined that the substrate W and the mask M are in danger of collision, and the Z-axis feeder 2A Up / down motion control device; 21 or up / down motion control device; 23 stop control of the motor drive.

Moreover, the control apparatus 80 of this embodiment calculates the correction amount based on the opening control of the shutter 34 for exposure control, the feed control of the work stage 2, and the detection value of the laser interferometers 62-64, and a mask. In addition to the drive control of the position adjustment means 13, the operation and predetermined operation of most actuators inserted into the divided-sequential proximity exposure apparatus PE, such as calculation of the correction amount during alignment adjustment, drive control of an automatic work supply device (not shown), and the like. Is executed based on sequence control using a microcomputer, a sequencer, or the like.

Next, in the division sequential proximity exposure apparatus PE of this embodiment, the process which avoids the collision of the board | substrate W and the mask M is demonstrated with reference to FIG. 3 (a).

The mask M is held on the mask stage 1, the substrate W is mounted on the work stage 2 by the transfer mechanism in the state where alignment adjustment is made, and the substrate W is vacuum-adsorbed on the work chuck. . Then, the Z-axis feeder 2A of the gap adjusting means is driven so that the gap between the lower surface of the mask M and the upper surface of the substrate W becomes a predetermined value (for example, 150 µm) necessary for exposure. Adjusting while monitoring with sensor (14). At the same time, the laser beam LB irradiated from the light emitting sections 71 and 72 passes through the lower surfaces of the two sides near the mask M, respectively, and the light reception amounts are detected by the light receiving sections 73 and 74.

As shown by the dashed-dotted line in the figure, when the Z-axis feeder 2A rises and the substrate W blocks the laser beam LB from the light emitting portions 71 and 72, the light receiving portions 73 and 74 are connected to the light receiving portions 73 and 74. The amount of received light is changed by this. When the control apparatus 80 detects that this light reception amount is below a predetermined value, it judges that the board | substrate W and the mask M are in a collision danger state, Z-axis feeder 2A; The motor drive of the fine motion device 23 is stopped. As a result, contact between the substrate W and the mask M is avoided.

In addition, since the laser beam LB passes through the lower surface of the two sides vicinity of the mask M, respectively, even if the board | substrate W approaches the mask M in the inclined state, the board | substrate W and the mask M Can detect a vertex of the substrate W having the narrowest gap, thereby making it possible to reliably avoid contact between the substrate W and the mask M. As shown in FIG. Incidentally, in the above description, the laser monitoring device 70 is constituted by two sets of light emitting parts 71 and 72 and light receiving parts 73 and 74, but the area between the two sides using a larger number of light emitting parts and light receiving parts. By monitoring also, the partial protrusion of the board | substrate W, the foreign material on the board | substrate W, etc. can also be detected, and the damage of the mask M by a protrusion, a foreign material, etc. can be prevented more reliably.

Therefore, according to the divided sequential proximity exposure apparatus PE of this embodiment, the predetermined position between the mask M held by the mask stage 1 and the substrate W held by the work stage 2 is substantially horizontal. Laser monitoring device 70 having light emitting parts 71 and 72 for emitting laser beam LB passing in the direction, light receiving parts 73 and 74 for receiving laser beam LB, and light receiving parts 73 and 74 Since the control apparatus 80 which stops the upward movement of the work stage when the light reception amount of the laser beam LB in the below) becomes below a predetermined value is provided, the mask M and the substrate W which are close at the time of exposure are provided. ) Can be avoided and the damage of the mask M can be reliably prevented.

(2nd embodiment)

Next, the division sequential proximity exposure apparatus which concerns on 2nd Embodiment of this invention is demonstrated with reference to FIG. 10 and FIG. In addition, since the exposure apparatus of this embodiment differs only from the thing of 1st Embodiment in the structure of a laser monitoring apparatus, about the same structure as 1st Embodiment, the same code | symbol is attached | subjected, and description is abbreviate | omitted or simplified.

As shown in FIG. 10 and FIG. 11, the exposure apparatus of the present embodiment includes the mask M and the work stage 2 held in the mask stage 1 in the vicinity of four vertices of the mask M on the mask stage 1. The laser monitoring apparatus 90 which measures the space | interval between the board | substrate W hold | maintained in (), and monitors the space | interval is provided. The laser monitoring device 90 includes a light emitting portion 91 that emits the laser beam LB inclined downward toward the substrate W and a light receiving portion that receives the laser beam LB reflected from the upper surface of the substrate W. FIG. (92) has. The light receiving portion 91 measures the gap between the mask M held on the mask stage 1 and the substrate W held on the work stage 2 by the position of the received laser beam LB. This gap is being monitored. In addition, the position of the lower surface of the mask M hold | maintained by suction is grasped | ascertained previously, The clearance gap between the mask M and the board | substrate W is the position of the laser beam LB detected by the light receiving part 92, It is provided by considering the position of the lower surface of the mask M.

The controller 80 measures the gap between the mask M and the substrate W by the light receiving position in the light receiving unit 92, and when the gap is equal to or less than the predetermined value, the substrate W and the mask M Is judged to be a collision risk state, the motor drive of the Z-axis feed table 2A (up and down coarse motion device 21 or up and down fine motion device 23) is stopped and controlled. Thereby, the contact of the mask M and the board | substrate W can be avoided and the damage of the mask M can be prevented reliably.

Other configurations and actions are the same as those of the first embodiment. In addition, although the laser monitoring apparatus 90 of this embodiment is provided in the vicinity of four vertices of the mask M, it is not limited to this, If it is arrange | positioned in the position of the edge part of the mask M, What is necessary is just to arrange | position appropriately according to the outer shape of the mask M. FIG.

(Third embodiment)

Next, the divided sequential exposure apparatus PE according to the third embodiment of the present invention will be described. In addition, about the structure similar to 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted or simplified. As shown in FIG. 12, the divided sequential exposure apparatus PE of this embodiment is the mask stage 1 holding the mask M, and the work stage 2 holding a glass substrate (exposed material W). And an illumination optical system 3 as the irradiation means for pattern exposure, and an apparatus base 4 for supporting the mask stage 1 and the work stage 2. As shown to FIG. 13 and FIG. 14, the contact part window part 16b is formed in the chuck | zipper part 16 of the vertex vicinity of four points of the mask M, and this window part 16b contacts like a pressure sensor. The sensor 30 is attached. The contact sensor 30 has a lower surface of the mask M such that the substrate W on the work stage 2 contacts the substrate W before contacting the mask M held on the mask stage 1. It has the reaction part 30a in the position which becomes further downward.

For example, when exposure is performed by making the gap g of the mask M and the board | substrate W into 150 micrometers, the distance l from the lower surface of the mask M to the reaction part 30a is 80 The contact sensor 30 is mounted so that it may become micrometer. Thereby, when the gap of the mask M and the board | substrate W became 80 micrometers or less, the contact sensor 30 contacts the board | substrate W with the reaction part 30a, and the mask M and the board | substrate W ) Is detected as a collision danger state, and the danger signal is transmitted to the control device 80.

In addition, masking apertures (shielding plates) 17 that shield both ends of the mask M as necessary at both ends in the Y axis direction of the opening 10a of the mask stage base 10 above the mask M. The masking aperture 17 is movable in the Y-axis direction by a masking aperture driving device 18 composed of a motor, a ball screw, and a linear guide. The shielding area can be adjusted.

Next, as shown in FIG. 15, the work stage 2 is provided on the apparatus base 4, and keeps the board | substrate W freely detachable by a vacuum suction apparatus (not shown) etc. A workpiece chuck 8 having the chuck face 8a on its upper surface, a Z-axis feed table (gap adjusting means; 2A) for adjusting the gap between the mask M and the opposing surface of the substrate W to a predetermined amount; It is provided with the work stage feed mechanism 2B which is arrange | positioned on 2 A of Z axis feeders, and moves the work stage 2 to an XY axis direction.

2 A of Z-axis feed stages are the Z-axis coordination stage 22 supported by the up-and-down coarse motion apparatus 21 standing up on the apparatus base 4 in the Z-axis direction, and this Z-axis coordination stage ( It is provided with the Z-axis fine motion stage 24 supported on the 22 through the up-down fine motion device 23. As shown in FIG. An electric actuator made of a motor, a ball screw or the like or an air pressure seal is used for the up and down coarse motion device 21. By performing a simple up and down motion, the Z axis coarse motion stage 22 is set to a predetermined position. The gap between the mask M and the substrate W is elevated without measuring the gap.

On the other hand, the up-and-down fine motion device 23 shown in FIG. 12 is equipped with the movable wedge mechanism which combines a motor, a ball screw, and a wedge. In this embodiment, the ball screw nut 233 is rotated while the screw shaft 232 of the ball screw is rotationally driven, for example, by the motor 231 provided on the surface of the Z axis coarse motion stage 22. The inclined surface of the wedge-shaped nut 233 is formed into a wedge shape and is engaged with the inclined surface of the wedge 241 which protrudes to the lower surface of the Z-axis fine moving stage 24, thereby constituting a movable wedge mechanism.

Then, when the screw shaft 232 of the ball screw is driven to rotate, the wedge-shaped nut 233 moves horizontally in the Y-axis direction, and this horizontal fine movement is performed by the inclined surface action of both wedges 233 and 241. Converted to vertical motion.

The up-and-down fine motion device 23 which consists of this movable wedge mechanism is two in the one end side (front side of FIG. 12) of the Z-axis fine movement stage 24 in the Y-axis direction, and one in the other end side (not shown), and total 3 It is largely provided, and each drive control is performed independently. Thereby, the up-and-down fine motion device 23 also has a tilt function, and based on the measurement result of the clearance of the mask M and the board | substrate W by the three gap sensors 14, the mask M The height of the Z-axis fine motion stage 24 is fine-adjusted so that the substrate W and the substrate W are parallel to each other and face each other via a predetermined gap. In addition, the up-and-down coarse motion device 21 and the up-down motion control device 23 may be provided in the part of the Y-axis feed stand 52.

As shown in FIG. 15, the work stage feed mechanism 2B is a kind of two sets of rolling guides which are arranged on the upper surface of the Z axis fine moving stage 24 so as to be spaced apart from each other in the Y axis direction, and are connected in the X axis direction. X-axis feed drive device for moving the in-linear guide 41, the X-axis feed table 42 mounted on the slider 41a of the linear guide 41, and the X-axis feed table 42 in the X-axis direction. The X-axis feed table 42 is provided with a ball screw nut 433 provided with a 43 and screwed to the ball screw shaft 432 that is rotationally driven by the motor 431 of the X-axis feed drive device 43. Is connected.

Moreover, on the upper surface of this X-axis feed stand 42, the linear guide 51 which is a kind of two sets of rolling guides arrange | positioned mutually in the X-axis direction, respectively, and connected in series along the Y-axis direction, and this linear guide 51 Y-axis feed table 52 attached to the slider 51a of the "), and Y-axis feed drive device 53 for moving the Y-axis feed table 52 in the Y-axis direction. The Y-axis feeder 52 is connected to a ball screw nut (not shown) screwed to the ball screw shaft 532 which is rotationally driven by the motor 531 of the 53. The work stage 2 is attached to the upper surface of the Y-axis feed table 52.

And the laser measuring device 60 as a movement distance measuring part which detects the X-axis and Y-axis position of the work stage 2 is provided in the apparatus base 4. In the work stage 2 configured as described above, the positioning errors, yawing, straightness, etc. are generated during the movement of the work stage 2 due to errors such as the shape of the ball screw and the linear guide itself, mounting errors thereof, and the like. Is inevitable. Therefore, this laser measuring device 60 aims at measuring these errors. As shown in FIG. 12, the laser length measuring device 60 is provided with a pair of Y-axis interferometers 62 and 63 provided opposite to the Y-axis direction end portion of the work stage 2 and provided with a laser, and the work stage. One X-axis interferometer 64 provided with a laser at the X-axis direction end of (2) and a Y-axis mirror disposed at a position opposite to the Y-axis interferometers 62 and 63 of the work stage 2 ( 66 and an X-axis mirror 68 disposed at a position opposite to the X-axis interferometer 64 of the work stage 2.

Thus, by providing two Y-axis interferometers 62 and 63 with respect to the Y-axis direction, not only the information of the Y-axis direction position of the work stage 2, but also the position data of the Y-axis interferometers 62 and 63 are shown. The yaw error can be known by the difference of. About the Y-axis direction position, it can calculate by adding correction to the average value of both, adding the X-axis direction position and yaw error of the work stage 2 suitably.

And when connecting the next division pattern after exposure of the XY direction position of the work stage 2, the Y-axis feeder 52, and also the previous division pattern, the board | substrate W is sent to the next area. In the step, detection signals output from the interferometers 62 to 64 are input to the control device 80 as shown in FIG. 16. The control device 80 controls the X-axis feed drive device 43 and the Y-axis feed drive device 53 while adjusting the amount of movement in the XY direction for the divided exposure based on this detection signal, and X Based on the detection result by the axis interferometer 64 and the detection result by the Y axis interferometers 62 and 63, the positioning correction amount for the connection exposure is calculated, and the calculation result is converted into the mask position adjusting means 13 and required. According to the above, and outputs it to the up-and-down fine motion device 23). Thereby, the mask position adjusting means 13 etc. are driven according to this correction amount, and the influence of positioning error, straightness error, yawing, etc. by the X-axis feed drive apparatus 43 or the Y-axis feed drive apparatus 53 is carried out. This is solved.

Moreover, the control apparatus 80 drives-controls the mask position adjusting means 13 by the position deviation amount of the mask side alignment mark 101 and the workpiece side alignment mark 100 which were detected by the alignment camera 15, and The upper and lower microscopic movement devices 23 are drive controlled while detecting the gap between the mask M and the substrate W by the gap sensor 14. Moreover, the control apparatus 80, when the danger of collision with the mask M of the board | substrate W is detected by the contact sensor 30, will drive the motor of the up-and-down coarse motion device 21 or the up-down motion control device 23. FIG. Stop control.

In addition, the control apparatus 80 of this embodiment calculates the correction amount based on the opening control of the exposure control shutter 34, the feed control of the work stage 2, and the detection value of the laser interferometer 62-64, and a mask. In addition to the drive control of the position adjusting means 13, most of the actuators inserted into the divided sequential proximity exposure apparatus, such as the calculation of the correction amount during alignment adjustment, the drive control of the automatic work supply device (not shown), and the predetermined calculation processing Is executed based on sequence control using a microcomputer, a sequencer, or the like.

Next, in the divided sequential proximity exposure apparatus PE of this embodiment, the process which avoids the collision of the board | substrate W and the mask M is demonstrated with reference to FIG.

The mask M is held by the mask stage 1, the substrate W is mounted on the work stage 2 by the transfer mechanism in the state where alignment adjustment is made, and the substrate W is vacuum-adsorbed by the work chuck. do. Then, the gap sensor is driven 2A of the Z-axis feeder and the gap sensor is set to a predetermined value (for example, 150 µm) required when the gap between the lower surface of the mask M and the upper surface of the work W is exposed. It is adjusted while monitoring with (14).

If the reaction part 30a of the contact sensor 30 detects the contact with the board | substrate W during the raising operation | movement of this Z-axis feed stand 2A, the contact sensor 30 detects a collision danger state, and is dangerous The signal is transmitted to the control device 80. Thereby, the control apparatus 80 stop-controls the motor drive of 2 A of Z axis feeders, and the contact of the board | substrate W and the mask M is avoided. In addition, since the reaction part 30a is located away from the lower surface of the mask M by a predetermined distance l, when the contact sensor 30 detects a collision danger state, the board | substrate W also masks ( It is separated by the distance l from M, and contact of the board | substrate W and the mask M is reliably avoided. Moreover, since the contact sensor 30 is attached in the vicinity of the vertex of 4 points | pieces of the mask M, even when the board | substrate W is close to the mask M in the inclined state, any one of the contact sensors 30 may be carried out. The contact with the highest part of the substrate W detects a collision risk state, and the contact between the substrate W and the mask M can be more reliably avoided.

Therefore, according to the divided sequential proximity exposure apparatus PE of this embodiment, the reaction part 30a is located below the lower surface of the mask M hold | maintained in the mask stage 1 in the vicinity of the vertex of four points of the mask M. FIG. Since the contact sensor 30 having a) is provided, it is possible to control the driving of the Z-axis feed table 2A by controlling the danger signal detected from the contact sensor 30, so that the mask M and the substrate W are controlled. This contact can be avoided and the damage of the mask M can be prevented reliably.

(4th Embodiment)

Next, the division sequential proximity exposure apparatus PE which concerns on 4th Embodiment of this invention is demonstrated with reference to FIG. In addition, since the exposure apparatus PE of this embodiment differs only from the thing of 3rd Embodiment in the structure of a contact sensor, about the same structure as 3rd Embodiment, the same code | symbol is attached | subjected, and description is abbreviate | omitted or simplified. .

As shown in FIG. 17, the contact sensor 50 of this embodiment is attached directly in the vicinity of the vertex of four points of the lower surface of the mask M. As shown in FIG. In addition, the contact sensor 50 is similar to the third embodiment in that the substrate W and the substrate W on the work stage 2 are in contact with the substrate W before the contact with the mask M held on the mask stage 1. If the reaction part 50a is located at a position below the lower surface of the mask M so that the contact part is in contact, and the reaction part 50a is in contact with the substrate W, the risk of collision between the mask M and the substrate W is reached. The state is detected, and the danger signal is transmitted to the control device 80.

Thereby, the drive of the Z-axis feed table 2A can be controlled by controlling the danger signal detected from the contact sensor 50, and the mask M and the board | substrate W are avoided and the mask M is avoided. Can be reliably prevented. Moreover, since the contact sensor 50 is directly attached to the mask M, even if there is a deviation in the plate thickness of the mask M, the contact of the mask M and the board | substrate W can be reliably avoided. have.

Other configurations and actions are the same as those in the third embodiment.

In addition, this invention is not limited to embodiment mentioned above at all, It can implement in various forms in the range which does not deviate from the summary.

Although the contact sensor 30 of this embodiment is provided in the chuck | zipper part 16 of four vertex vicinity of the mask M, it is not limited to this, The form of mask stages, such as the mask holding frame 12, etc. It may be attached to any member on the mask stage side according to this. In addition, although the contact sensors 30 and 50 of this embodiment are arrange | positioned in the vicinity of the vertex of four points of the mask M, it is not limited to this, At least in the position of the edge vicinity of the mask M at least. What is necessary is just to arrange | position four or more points, and what is necessary is just to arrange | position appropriately according to the outer shape of the mask M.

Moreover, the reaction part arrange | positioned so that it may become lower than the lower surface of the mask M hold | maintained in the mask stage 1, for example, when the mask M is bent in the center part, What is necessary is just to set suitably in consideration of the position of this lowest surface, the magnitude | size of the gap of the mask M and the board | substrate W, etc. so that it may become below the lowest position.

As mentioned above, when the structure of invention of 3rd Embodiment and 4th Embodiment mentioned above is put together, the workpiece | work stage which hold | maintains the board | substrate as an to-be-exposed material, the mask stage which is arrange | positioned facing the said board | substrate, and will hold the mask, Irradiation means for irradiating light for pattern exposure with respect to the mask through the mask, and a transfer mechanism for relatively moving the work stage and the mask stage so that the mask pattern of the mask faces a plurality of predetermined positions on the substrate. As an exposure apparatus, the contact sensor which has a reaction part below the lower surface of the said mask stage hold | maintained at the said mask edge part is provided in the structure of the exposure apparatus characterized by the above-mentioned.

According to this structure, since the contact sensor which has a reaction part below the lowermost surface of the mask hold | maintained by the mask stage is provided in at least 4 points of the edge part of a mask, the conveyance mechanism is controlled by controlling the danger signal detected from a contact sensor. The driving of can be controlled, and the mask and the substrate can be avoided from contacting each other, whereby the breakage of the mask can be reliably prevented.

In addition, this invention is not limited to embodiment mentioned above at all, It can implement in various forms in the range which does not deviate from the summary.

According to the present invention, when it is detected by the laser monitoring device that the gap between the mask and the substrate is less than or equal to the predetermined value, the control device stops movement of at least one of the up and down directions of the mask stage and the work stage. The breakage of the mask can be reliably prevented by avoiding contact between the mask and the substrate.

Claims (2)

A work stage for holding a substrate as an exposed material, A mask stage disposed opposite the substrate to hold a mask; Irradiation means for irradiating the substrate with light for pattern exposure through the mask, and An exposure apparatus comprising a transfer mechanism for relatively moving the work stage and the mask stage so that a mask pattern of the mask faces a plurality of predetermined positions on the substrate, A laser monitoring device having a light emitting portion for emitting a laser beam passing in a substantially horizontal direction through a predetermined position between the mask held on the mask stage and the substrate held on the work stage, and a light receiving portion for receiving the laser beam; And a control device for stopping the movement of at least one of the mask stage and the work stage in the up and down direction when the light receiving amount of the laser beam in the light receiving portion is equal to or less than a predetermined value. A work stage for holding a substrate as an exposed material, A mask stage disposed opposite the substrate to hold a mask; Irradiation means for irradiating the substrate with light for pattern exposure through the mask, and An exposure apparatus comprising a transfer mechanism for relatively moving the work stage and the mask stage so that a mask pattern of the mask faces a plurality of predetermined positions on the substrate, A mask disposed in the vicinity of an edge of the mask on the mask stage, having a light emitting portion for emitting a laser beam toward the substrate, and a light receiving portion for receiving the laser beam reflected from the substrate, the mask held on the mask stage and the A laser monitoring device for monitoring the gap by measuring a gap between the substrates held in the work stage, and And a control device for stopping movement of at least one of the mask stage and the work stage in the vertical direction when the gap is equal to or less than a predetermined value.

Images