JP2007140187A - Method of conveying and attaching mask for exposure device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of conveying and attaching mask for exposure device capable of drastically improving the attaching precision of a mask upon mask attachment and the reproducibility of flatness of the mask. <P>SOLUTION: The method of conveying and attaching mask of exposure device comprises: a step of conveying a holder 70 which is disposed so as to mount the mask M in parallel to a chuck part 16 of a mask stage 1, to an under side position of the chuck part 16; a step of moving the holder 70 on which the mask M is mounted, closely to an under surface of the chuck part 16; and a step of separating the mask M from the holder 70 and attaching the same to the chuck part 16. The holder 70 holds the mask M by only the back surface part corresponding to parts contacting with the chuck part 16 when the mask M is attached to the chuck part 16. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is an exposure apparatus that performs proximity exposure transfer of a mask pattern of a mask onto a substrate of a large flat panel display such as a liquid crystal display or a plasma display by a divided sequential exposure method, and attaches the mask to a mask stage with high accuracy. The present invention relates to a mask transporting and mounting method of an exposure apparatus capable of performing the above.

  In an exposure apparatus that manufactures color filters for flat panel display devices such as liquid crystal display devices and plasma display devices, the work stage that holds the substrate is moved stepwise while positioning it with high precision relative to the mask stage that holds the mask. To transfer. In order to perform such high-accuracy exposure transfer, it is essential not only to perform step movement with high accuracy, but also to hold the mask on the mask stage with high accuracy.

  As a mask transport and mounting method of a conventional exposure apparatus, a mask stage (mask holder) positioned above a work stage (exposure stage) is taken out from a mask stocker storing a plurality of masks by a robot arm. Transport to. Then, the four support pins arranged on the work stage are raised, the mask is placed on the support pins and received from the robot arm, and then the work stage is displaced together with the mask in the horizontal plane to shift the position. A modification is known in which a support pin is lowered to attract a mask onto a mask stage (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 06-267816 (page 6-7, FIG. 15)

  Incidentally, in recent years, flat panel display devices such as liquid crystal displays and plasma display devices have been steadily increasing in size, and accordingly, the mask has been increased in size and is easily bent by its own weight. Therefore, recently, in order to eliminate the influence of self-weight bending due to the upsizing of the mask, the mask pattern surface is formed when the mask is processed into a substantially bowl shape in advance according to the bending of the mask and attached to the mask stage. A mask having a substantially bowl shape that is flat has been proposed.

  However, in the mask transport and attachment method of the exposure apparatus described in Patent Document 1, since the mask is attracted to the mask stage in a state of being placed on the support pins, a portion that is not supported by the support pins is easily bent. Since the mounting position and the mask shape at the time of mounting differ from work to work, when using the above-mentioned mask having a substantially bowl shape, the mask mounting accuracy and mask flatness reproducibility are low and high-accuracy exposure. There was a problem from the viewpoint of transfer.

  The present invention has been made in order to eliminate such inconveniences, and an object of the present invention is to provide an exposure apparatus capable of greatly improving reproducibility of mask mounting accuracy and mask flatness during mask mounting. It is in providing the mask conveyance and attachment method of this.

The above object of the present invention is achieved by the following configurations.
(1) A work stage that holds a substrate as an exposure target, a mask stage that is disposed opposite to the substrate and holds a mask, and an irradiation unit that irradiates the substrate with light for pattern exposure through the mask; A mask transport and mounting method for an exposure apparatus comprising a feed mechanism that relatively moves the work stage and the mask stage stepwise, comprising a holding jig for placing the mask parallel to the chuck portion of the mask stage, The step of transporting the holding jig on which the mask is placed to the lower position of the chuck portion, the step of bringing the holding jig on which the mask is placed close to the lower surface of the chuck portion, and separating the mask from the holding jig. A method of transporting and attaching a mask of an exposure apparatus, comprising: a step of attaching to a chuck portion.
(2) A step of adjusting the position by relatively moving the holding jig and the chuck portion so that the relative position between the mask and the chuck portion becomes a predetermined position after the mask is conveyed to a position below the chuck portion. The mask transport / attachment method for an exposure apparatus according to (1), further comprising:
(3) The holding jig is characterized in that other parts are cut out so as to hold the mask on the back surface part corresponding to the part in contact with the chuck part when the mask is attached to the chuck part. (1) A mask transport and attachment method of the exposure apparatus according to (2).
(4) The mask of the exposure apparatus according to any one of (1) to (3), wherein the mask is processed into a substantially bowl shape according to a deflection amount when the mask is attached to the chuck portion. Transport and mounting method.
(5) The mask transporting process is a process in which the holding jig on which the mask is placed is mounted on the work stage and transported to a position below the chuck portion by the work stage (1) to (4) The mask transport and mounting method of the exposure apparatus according to any one of the above.

According to the configuration of (1), the mask placed on the holding jig and held in parallel with the chuck portion is transported together with the holding jig and attached close to the chuck portion. However, it can always convey with a fixed bending state and position accuracy. Accordingly, the mask can be attached to the chuck portion with high accuracy and with flatness and reproducibility. Therefore, the mask pattern of the mask can be exposed and transferred to the substrate with high accuracy.
According to the configuration of (2), after the mask placed on the holding jig is transported to a position below the chuck portion, the holding jig and the chuck portion are moved relative to each other so that the mask and the chuck portion are moved. Since the position of the positional relationship is adjusted to a predetermined position and the mask is attached to the chuck portion, the mask can be attached to the chuck portion with high positional accuracy.
According to the configuration of (3), since the mask is held by the holding jig only on the back surface portion corresponding to the portion in contact with the chuck portion when attached to the chuck portion, the mask is completely different from when attached to the chuck portion. The mask can be held on the holding jig in the same state, and can be attached to the chuck portion in that state. Thereby, a mask can always be attached with a fixed precision, and the reproducibility of the flatness of the mask can be further improved.
According to the configuration of (4), since the mask is processed in advance into a substantially bowl shape according to the amount of deflection when attached to the chuck portion, it is substantially flat when bent by its own weight. It becomes possible to perform a proper exposure transfer.
According to the configuration of (5), since the mask is transported to the lower position of the chuck portion by the work stage while being placed on the holding jig, there is no need to provide a separate mask transport device. It can be downsized.

  According to the mask transport and mounting method of the exposure apparatus of the present invention, the holding jig for placing the mask in parallel with the chuck part of the mask stage is provided, and the holding jig on which the mask is placed is positioned below the chuck part. Since the method includes a step of transporting, a step of bringing the holding jig on which the mask is placed close to the lower surface of the chuck portion, and a step of attaching the mask to the chuck portion while being separated from the holding jig. The reproducibility of mask mounting accuracy and mask flatness can be greatly improved.

Hereinafter, a mask transport and mounting method of an exposure apparatus according to the present invention will be described in detail with reference to the drawings. In the present embodiment, a divided sequential exposure apparatus will be described as an example.
FIG. 1 is a partially exploded perspective view for explaining a divided sequential exposure apparatus used for a mask transport and attachment method of an exposure apparatus according to the present invention, FIG. 2 is an enlarged perspective view of the mask stage shown in FIG. 2A is a cross-sectional view taken along line AA in FIG. 2, FIG. 4B is a top view of the mask position adjusting unit in FIG. 2A, and FIG. 4 is a side view showing the basic structure of the alignment camera and the focus adjustment mechanism of the alignment camera. FIG. 5 is an explanatory diagram for explaining the irradiation optical system of the workpiece side alignment mark, FIG. 6 is a block diagram showing a focus adjustment mechanism of the alignment image, and FIG. 7 is a front view of the division sequential exposure apparatus shown in FIG. 8 is a block diagram showing the electrical configuration of the division sequential exposure apparatus shown in FIG. 1, FIG. 9 is an explanatory diagram for explaining the alignment between the workpiece side alignment mark and the mask side alignment mark, and FIG. 10 is a diagram of the mask and holding jig. Slant FIG, 11 is a mask held by the holding jig is transported to the mask stage is mounted on the work stage is an explanatory diagram for explaining a state mounted to the chuck portion.

  As shown in FIG. 1, the division sequential exposure apparatus PE of this embodiment includes a mask stage 1 that holds a mask M, a work stage 2 that holds a glass substrate (material to be exposed) W, and an irradiation means for pattern exposure. And an apparatus base 4 that supports the mask stage 1 and the work stage 2.

  A glass substrate W (hereinafter simply referred to as “substrate W”) is disposed to face the mask M, and a surface (opposite surface of the mask M) for exposing and transferring the mask pattern P drawn on the mask M. A photosensitizer is applied to the surface to make it translucent.

  For convenience of explanation, the illumination optical system 3 will be described. The illumination optical system 3 is, for example, a high-pressure mercury lamp 31 that is a light source for ultraviolet irradiation, and a concave mirror 32 that collects light emitted from the high-pressure mercury lamp 31. Two types of optical integrators 33 that are switchably arranged in the vicinity of the focal point of the concave mirror 32, plane mirrors 35 and 36, and a spherical mirror 37, and are arranged between the plane mirror 36 and the optical integrator 33 to change the irradiation light path. And an exposure control shutter 34 that controls opening and closing.

  When the exposure control shutter 34 is controlled to be opened during exposure, the light irradiated from the high-pressure mercury lamp 31 passes through the optical path L shown in FIG. 1 and is held on the mask M held on the mask stage 1 and thus on the work stage 2. Irradiated as parallel light for pattern exposure perpendicularly to the surface of the substrate W. As a result, the mask pad P of the mask M is exposed and transferred onto the substrate W.

  Next, the mask stage 1 and the work stage 2 will be described in this order. First, the mask stage 1 includes a mask stage base 10, and the mask stage base 10 is supported on a mask stage column 11 protruding from the apparatus base 4 and is disposed above the work stage 2.

  As shown in FIG. 2, the mask stage base 10 has a substantially rectangular shape and has an opening 10a at the center. A mask holding frame 12 is mounted on the opening 10a so as to be movable in the X and Y directions. ing.

  As shown in FIG. 3A, the mask holding frame 12 has a flange 12 a provided on the outer periphery of the upper end thereof placed on the upper surface in the vicinity of the opening 10 a of the mask stage base 10. It is inserted through a predetermined gap between the inner periphery. Thereby, the mask holding frame 12 can be moved in the X and Y directions by this gap.

  As shown in FIG. 3, a chuck portion 16 that holds the mask M is fixed to the lower surface of the mask holding frame 12 via a spacer 20. , Y direction. The chuck portion 16 is provided with a plurality of suction nozzles 16a for adsorbing a peripheral edge portion that is an end portion of the mask M on which the mask pattern P is drawn, and the chuck portion 16 constitutes a chuck device. . As a result, the mask M is detachably held on the chuck portion 16 by a vacuum suction device (not shown) through the suction nozzle 16a.

  The mask M has a substantially bowl-like shape in which the lower side is formed in a concave shape in a weightless state (or a vertically placed state) in which gravity does not act (a dashed line in FIG. 3A). In the chucked state, it is held in a flat shape over the entire plane by the action of gravity (solid line in FIG. 3A).

  Further, in FIG. 2, the mask holding frame 12 is moved on the upper surface of the mask stage base 10 in the XY plane based on a detection result by an alignment camera 15 described later or a measurement result by a laser length measuring device 60 described later. A mask position adjusting means 13 for adjusting the position and posture of the mask M held by the mask holding frame 12 is provided.

  The mask position adjusting means 13 includes an X-axis direction driving device 13x attached to one side of the mask holding frame 12 along the Y-axis direction, and two Y-axes attached to one side of the mask holding frame 12 along the X-axis direction. Direction drive device 13y.

  As shown in FIGS. 3A and 3B, the X-axis direction drive device 13x includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the X-axis direction, and the mask holding frame 12 And a linear guide (linear motion bearing guide) 133 attached to a side portion along the Y-axis direction. The guide rail 133r of the linear guide 133 extends in the Y-axis direction and is fixed to the mask holding frame 12. The slider 133 s movably attached to the guide rail 133 r is connected to the tip of a rod 131 r fixed to the mask stage base 10 via a pin support mechanism 132.

  On the other hand, the Y-axis direction drive device 13y has the same configuration as the X-axis direction drive device 13x, and includes a drive actuator (for example, an electric actuator) 131 having a rod 131r that expands and contracts in the Y-axis direction, and a mask holding frame. 12 linear guides (linear motion bearing guides) 133 attached to side portions along the X-axis direction. The guide rail 133r of the linear guide 133 extends in the X-axis direction and is fixed to the mask holding frame 12. A slider 133s attached to the guide rail 133r so as to be movable is connected to the tip of the rod 131r via a pin support mechanism 132. The X-axis direction driving device 13x adjusts the mask holding frame 12 in the X-axis direction. The two Y-axis direction driving devices 13y adjust the mask holding frame 12 in the Y-axis direction and the θ-axis direction (oscillation around the Z-axis). ).

  Further, inside the two sides facing each other in the X-axis direction of the mask holding frame 12, as shown in FIG. 2, a gap sensor 14 as a means for measuring the gap between the opposing surfaces of the mask M and the substrate W, An alignment camera 15 is provided as means for detecting the amount of plane deviation between the mask M and the alignment reference. Both the gap sensor 14 and the alignment camera 15 are movable in the X-axis direction via a moving mechanism 19.

  The moving mechanism 19 has a holding frame 191 for holding the gap sensor 14 and the alignment camera 15 extending in the Y-axis direction on the upper surfaces of the two sides facing each other in the X-axis direction of the mask holding frame 12. The end of the holding base 191 that is separated from the Y-axis direction drive device 13 y is supported by a linear guide 192. The linear guide 192 includes a guide rail 192r installed on the mask stage base 10 and extending along the X-axis direction, and a slider (not shown) that moves on the guide rail 192r. The end portion of 191 is fixed.

  Then, the gap sensor 14 and the alignment camera 15 are moved in the X-axis direction via the holding frame 191 by driving the slider by a driving actuator 193 including a motor and a ball screw.

  As shown in FIG. 4, the alignment camera 15 optically detects the mask side alignment mark 101 on the surface of the mask M held on the lower surface of the mask stage 1 from the back side of the mask, and the focus adjustment mechanism 151. As a result, the focus is adjusted by moving toward and away from the mask M.

  The focus adjustment mechanism 151 includes a linear guide 152, a ball screw 153, and a motor 154. The linear guide 152 includes a guide rail 152r and a slider 152s. Of these, the guide rail 152r is attached to the holding frame 191 of the moving mechanism 19 of the mask stage 1 so as to extend in the vertical direction. On the other hand, the alignment camera 15 is fixed to the slider 152s of the linear guide 152 via a table 152t. A nut screwed to the screw shaft of the ball screw 153 is connected to the table 152t, and the screw shaft is rotated by a motor 154.

  Further, in the present embodiment, as shown in FIG. 5, a projection for projecting the workpiece side alignment mark 100 from below with a light source 781 and a condenser lens 782 below the workpiece chuck 8 provided on the workpiece stage 2. An optical system 78 is disposed integrally with the Z-axis fine movement stage 24 in accordance with the optical axis of the alignment camera 15. A through hole corresponding to the optical path of the projection optical system 78 is formed in the work stage 2 and the Y-axis feed base 52.

  Furthermore, in this embodiment, as shown in FIG. 6, the best focus of the alignment image that detects the position of the mask M having the mask-side alignment mark 101 (mask mark surface Mm) and prevents the alignment camera 15 from being out of focus. An adjustment mechanism 150 is provided. In addition to the alignment camera 15 and the focus adjustment mechanism 151, this best focus adjustment mechanism 150 uses the gap sensor 14 as a focus deviation detection means. That is, the measured value of the mask lower surface position measured by the gap sensor 14 is compared with the focus position preset by the control device 80 to obtain a difference, and the relative focus position change amount from the set focus position is calculated from the difference. The alignment camera 15 is moved by controlling the motor 154 of the focus adjustment mechanism 151 according to the calculated change amount, and thereby the focus of the alignment camera 15 is adjusted.

  By using the best focus adjustment mechanism 150, it is possible to perform high-precision focus adjustment of the alignment image regardless of the plate thickness change of the mask M and the plate thickness variation. That is, when a plurality of types of masks M are exchanged and used, proper focus can always be obtained even if the thicknesses of the individual masks are different. Note that the focus adjustment mechanism 151, the projection optical system 78, the best focus adjustment mechanism 150, and the like not only correspond to the high accuracy of the alignment of the first layer divided pattern, but also the high accuracy of the alignment after the second layer. If the thickness of the mask M is known, the best focus adjustment mechanism 150 may be omitted and the focus adjustment mechanism may be moved according to the thickness.

  Note that masking apertures (shielding plates) 17 that shield both ends of the mask M as necessary are disposed at both ends in the Y-axis direction of the opening 10a of the mask stage base 10 so as to be positioned above the mask M. The masking aperture 17 can be moved in the Y-axis direction by a masking aperture driving device 18 including a motor, a ball screw, and a linear guide so that the shielding areas at both ends of the mask M can be adjusted.

  Next, the work stage 2 is installed on the apparatus base 4, and a Z-axis feed base (gap adjusting means) 2A for adjusting the gap between the opposing surfaces of the mask M and the substrate W to a predetermined amount, and this Z A work stage feed mechanism 2B disposed on the axis feed base 2A and moving the work stage 2 in the XY-axis direction is provided.

  As shown in FIG. 7, the Z-axis feed base 2A includes a Z-axis coarse movement stage 22 supported by a vertical coarse movement device 21 erected on the apparatus base 4 so as to be capable of coarse movement in the Z-axis direction. A Z-axis fine movement stage 24 supported on a coarse shaft movement stage 22 via a vertical fine movement device 23 (see FIG. 1). For example, an electric actuator composed of a motor and a ball screw or a pneumatic shilling is used for the vertical movement device 21, and the Z-axis coarse movement stage 22 is moved to a preset position by performing a simple vertical movement. Then, it is moved up and down without measuring the gap between the mask M and the substrate W.

  On the other hand, the vertical fine movement device 23 shown in FIG. 1 includes a movable wedge mechanism formed by combining a motor, a ball screw, and a wedge. In this embodiment, for example, a motor 231 installed on the upper surface of the Z-axis coarse movement stage 22. The screw shaft 232 of the ball screw is driven to rotate, the ball screw nut 233 is formed in a wedge shape, and the slope of the wedge nut 233 protrudes from the lower surface of the Z-axis fine movement stage 24. Thus, a movable wedge mechanism is configured.

  When the screw shaft 232 of the ball screw is driven to rotate, the wedge-shaped nut 233 is finely moved in the Y-axis direction, and this horizontal fine movement is converted into a highly accurate vertical fine movement by the action of the slopes of both wedges 233 and 241. The

  The vertical fine movement device 23 composed of the movable wedge mechanism includes a total of three units, two on one end side (front side in FIG. 1) in the Y-axis direction and one on the other end side (not shown) of the Z-axis fine movement stage 24. It is installed and each is driven and controlled independently. Accordingly, the vertical fine movement device 23 also has a tilt function. Based on the measurement results of the gaps between the mask M and the substrate W by the three gap sensors 14, the mask M and the substrate W are parallel and predetermined. The height of the Z-axis fine movement stage 24 is finely adjusted so as to face each other through the gap. Note that the vertical coarse motion device 21 and the vertical fine motion device 23 may be provided in the Y-axis feed base 52.

  As shown in FIG. 7, the work stage feed mechanism 2B is a kind of two sets of rolling guides that are spaced apart from each other in the Y-axis direction and extended along the X-axis direction on the upper surface of the Z-axis fine movement stage 24. A linear guide 41, an X-axis feed base 42 attached to a slider 41a of the linear guide 41, and an X-axis feed drive device 43 that moves the X-axis feed base 42 in the X-axis direction. The X-axis feed base 42 is connected to a ball screw nut 433 that is screwed onto a ball screw shaft 432 that is rotationally driven by a motor 431 of the X-axis feed driving device 43.

  Further, on the upper surface of the X-axis feed base 42, a linear guide 51 which is a kind of two sets of rolling guides that are spaced apart from each other in the X-axis direction and extend along the Y-axis direction, and the linear guide 51, a Y-axis feed base 52 attached to a slider 51a, and a Y-axis feed drive device 53 that moves the Y-axis feed base 52 in the Y-axis direction. A Y-axis feed base 52 is connected to a ball screw nut (not shown) screwed to a ball screw shaft 532 that is rotationally driven. The work stage 2 is attached to the upper surface of the Y-axis feed base 52.

  A laser length measuring device 60, which is a position measuring device that detects the X-axis and Y-axis positions of the work stage 2, is provided on the device base 4. In the work stage 2 configured as described above, due to errors such as the shape of the ball screw and the linear guide itself, and mounting errors thereof, when the work stage 2 is moved, positioning errors, yawing, straightness, etc. Occurrence is inevitable. The laser length measuring device 60 is intended to measure these errors. As shown in FIG. 1, the laser length measuring device 60 is provided with a pair of Y axis interferometers (length measuring devices) 62 and 63 provided facing a Y axis direction end of the work stage 2 and provided with a laser, One X-axis interferometer (length measuring device) 64 provided at the end of the stage 2 in the X-axis direction and provided with a laser, and the Y-axis disposed at a position facing the Y-axis interferometers 62 and 63 of the work stage 2 And an X-axis mirror 68 disposed at a position facing the X-axis interferometer 64 of the work stage 2.

  As described above, by providing the two Y-axis interferometers 62 and 63 in the Y-axis direction, not only the information on the Y-axis direction position of the work stage 2 but also the difference between the position data of the Y-axis interferometers 62 and 63. You can also know yawing error. The position in the Y-axis direction can be calculated by appropriately correcting both the average value of the two in consideration of the position in the X-axis direction of the work stage 2 and the yawing error.

  Then, when the next divided pattern is connected and exposed following the exposure of the work stage 2 in the XY direction and the Y-axis feed base 52 and the previous divided pattern, each interference is performed at the stage of sending the substrate W to the next area. The detection signals output from the total 62 to 64 are input to the control device 80 as shown in FIG. The control device 80 controls the X-axis feed driving device 43 and the Y-axis feed driving device 53 in order to adjust the amount of movement in the XY direction for the divided exposure based on the detection signal, and also the X-axis interferometer 64. And the detection results of the Y-axis interferometers 62 and 63 are used to calculate a positioning correction amount for joint exposure, and the calculated result is used as the mask position adjustment means 13 (and the vertical fine movement device 23 as required). Output to. As a result, the mask position adjusting means 13 and the like are driven in accordance with the correction amount, and the influence of positioning error, straightness error, yawing and the like caused by the X-axis feed driving device 43 or the Y-axis feed driving device 53 is eliminated.

  Even when there is no error in feeding the work stage 2, if the orientation of the mask pattern P of the mask M is deviated from the feed direction of the work stage 2 in the initial state, the divided sequential exposure is performed on the substrate W. Each pattern to be formed is formed in an inclined state, or the joints of the patterns formed separately on the substrate W by connection exposure are shifted and not aligned.

  Further, as described above, the mask M is sucked and held on the lower surface of the chuck portion 16 via a vacuum suction device. When sucking and holding the mask M, the orientation of the mask pattern P of the mask M and the work stage feed mechanism 2B are used. It is difficult to match the moving direction of the work stage 2 with high accuracy.

  For example, as shown in FIG. 9A, when exposure is performed in a tilted state at the first position, the exposure pattern at the next position is similarly tilted as indicated by a two-dot chain line even when there is no feed error. It is formed in the state.

  Therefore, in the present embodiment, as shown in FIG. 9, at least two places on the upper surface of the work stage 2 (actually, the work chuck 8 installed on the work stage 2) have, for example, a cross shape (reticle). The workpiece-side alignment marks 100 having the above are formed apart from each other in the X-axis direction. On the other hand, the mask side alignment mark 101 corresponding to the workpiece side alignment mark 100 is formed on the mask M. The line connecting the centers of the two alignment marks 100 on the reference side is adjusted in advance so as to coincide with the X-axis direction in the initial state (reference position) and to be orthogonal to the Y-axis direction.

  Then, as shown in FIG. 9B, in the initial state (reference position), the alignment camera 15 detects the amount of misalignment between the alignment marks 100 and 101, and the X-axis direction drive device 13x and the Y-axis direction are detected. By adjusting the position of the mask holding frame 12 by the driving device 13y, the centers of the workpiece side alignment mark 100 and the mask side alignment mark 101 are substantially aligned and aligned in the XY plane.

  Further, the alignment between the workpiece side alignment mark 100 and the mask side alignment mark 101 is configured so as to be easily and accurately performed by the alignment camera 15 which is an alignment mark detection means.

  The control device 80 of the present embodiment controls the opening control of the exposure control shutter 34, the feed control of the work stage 2, the calculation of the correction amount based on the detection values of the laser interferometers 62 to 64, and the drive control of the mask position adjusting means 13. In addition to this, most of them are incorporated in the division sequential exposure apparatus, such as calculation of the correction amount at the time of alignment adjustment, drive control of the Z-axis feed base (gap adjustment means) 2A, drive control of the automatic workpiece feeder (not shown), etc. The actuator is driven and predetermined arithmetic processing is executed based on sequence control using a microcomputer, a sequencer, or the like.

  Next, a mask conveyance and attachment method by the division sequential exposure apparatus PE of this embodiment will be described in detail with reference to FIGS.

  As shown in FIG. 10, the holding jig 70 is a rectangular frame-shaped member, and a rectangular recess 71 having the same size as the outer shape of the mask M is formed on the surface (upper surface). Inside, a rectangular through hole (thickening) 72 having the same size as the mask pattern P formed on the mask M is formed. Thereby, a frame-shaped stepped portion 73 is formed around the rectangular through hole 72.

  The frame-like stepped portion 73 is formed in the same size (area) as the portion that contacts the chuck portion 16 when the mask M is chucked by the chuck portion 16. The mask M is fitted into the rectangular recess 71, supported by the frame-shaped stepped portion 73, and placed in parallel with the holding jig 70. That is, when the mask M placed on the holding jig 70 is chucked by the chuck portion 16, the back side portion corresponding to the portion that contacts the chuck portion 16 contacts the frame-shaped step portion 73. Held. As a result, the mask M is held by the holding jig 70 in exactly the same state as when it is chucked by the chuck portion 16, and is placed on the holding jig 70 while maintaining a flat shape.

  As shown in FIG. 11, the holding jig 70 that holds the mask M in the same state as when chucked by the chuck portion 16 is placed on the work chuck 8 by a loader (not shown) at a loading position LP indicated by a broken line on the right side of FIG. Is moved in the X direction (arrow A direction) and conveyed to a position below the chuck portion 16. Next, by operating the vertical coarse motion device 21 and the vertical fine motion device 23, the mask M is moved upward (in the direction of arrow B) together with the holding jig 70, and the mask M is brought close to the lower surface of the chuck portion 16. Further, by detecting the mask-side alignment mark 101 with the alignment camera 15, the amount of positional deviation between the mask M and the chuck portion 16 is detected, and based on this, the work stage feed mechanism 2B, the X-axis direction drive devices 13x and Y The axial driving device 13y is operated to relatively adjust the positions of the mask M and the chuck portion 16. As a result, the mask M is disposed opposite to the chuck portion 16 at a predetermined position with high positional accuracy. Then, by sucking air from the suction nozzle 16 a of the chuck portion 16 to make a vacuum, the peripheral portion of the mask M is sucked away from the holding jig 70 and attached to the chuck portion 16.

  Therefore, according to the mask transport and attachment method of the exposure apparatus of the present embodiment, the mask M placed on the holding jig 70 and held in parallel with the chuck portion 16 is transported together with the holding jig 70, and the chuck portion. Since the mask M is attached close to the thin film 16, even the mask M which is thin and easily bent can always be conveyed with a fixed bending state and positional accuracy. As a result, the mask M can be attached to the chuck portion 16 with high accuracy and with reproducibility in flatness. Therefore, the mask pattern P of the mask M can be exposed and transferred onto the substrate with high accuracy.

  Further, according to the mask transport and attachment method of the exposure apparatus of the present embodiment, after the mask M placed on the holding jig 70 is transported to a position below the chuck portion 16, the holding jig 70 and the chuck portion 16 The relative position of the mask M and the chuck portion 16 is adjusted so that the positional relationship between the mask M and the chuck portion 16 becomes a predetermined position, and the mask M is attached to the chuck portion 16. Can be installed well.

  Further, according to the mask conveyance and attachment method of the exposure apparatus of the present embodiment, the mask M is held by the holding jig 70 only on the back surface portion corresponding to the portion that contacts the chuck portion 16 when attached to the chuck portion 16. Therefore, the mask M can be held on the holding jig 70 in exactly the same state as when attached to the chuck portion 16, and can be attached to the chuck portion 16 in that state. As a result, the mask M can always be attached with a constant accuracy, and the reproducibility of the flatness of the mask M can be further improved.

  In addition, according to the mask transport and attachment method of the exposure apparatus of the present embodiment, the mask M is pre-processed into a substantially bowl shape according to the amount of deflection when attached to the chuck portion 16, so that it bends by its own weight. In this state, it becomes almost flat, so that highly accurate exposure transfer can be performed.

  Furthermore, according to the mask transport and attachment method of the exposure apparatus of the present embodiment, the mask M is transported to the lower position of the chuck portion 16 by the work stage 2 while being placed on the holding jig 70, and therefore separately. Since it is not necessary to provide a mask transfer device, the exposure device PE can be reduced in size.

It is a partial exploded perspective view for demonstrating the division | segmentation sequential exposure apparatus used for the mask conveyance and attachment method of the exposure apparatus which concerns on this invention. It is an expansion perspective view of the mask stage shown in FIG. (A) is the sectional view on the AA line of FIG. 2, (b) is a top view of the mask position adjustment means of (a). It is a side view which shows the basic structure of an alignment camera and the focus adjustment mechanism of this alignment camera. It is explanatory drawing for demonstrating the irradiation optical system of the workpiece | work side alignment mark. It is a block diagram which shows the focus adjustment mechanism of an alignment image. It is a front view of the division | segmentation sequential exposure apparatus shown in FIG. It is a block diagram which shows the electrical structure of the division | segmentation sequential exposure apparatus shown in FIG. It is explanatory drawing for demonstrating the alignment of a workpiece | work side alignment mark and a mask side alignment mark. It is a perspective view of a mask and a holding jig. It is explanatory drawing for demonstrating the state in which the mask hold | maintained at the holding jig is mounted in a work stage, is conveyed to a mask stage, and is attached to a chuck | zipper part.

Explanation of symbols

PE division sequential exposure equipment (exposure equipment)
W Glass substrate (material to be exposed)
M Mask P Mask pattern 1 Mask stage 2 Work stage 2A Z-axis feed base 2B Work stage feed mechanism 3 Illumination optical system (irradiation means)
DESCRIPTION OF SYMBOLS 4 Apparatus base 8 Work chuck 10 Mask stage base 12 Mask holding frame 13 Mask position adjustment means 16 Chuck part 16a Suction nozzle 70 Holding jig 71 Rectangular recessed part 72 Rectangular through-hole (thickening)
73 Frame-shaped step

Claims (5)

A work stage for holding a substrate as a material to be exposed, a mask stage that is arranged opposite to the substrate and holds a mask, and irradiation means for irradiating the substrate with light for pattern exposure through the mask; A mask transport and attachment method of an exposure apparatus comprising: a feed mechanism that relatively steps the work stage and the mask stage;
A holding jig for placing the mask in parallel with the chuck portion of the mask stage;
Transporting the holding jig on which the mask is placed to a position below the chuck portion;
Bringing the holding jig on which the mask is placed close to the lower surface of the chuck portion;
A mask transporting and mounting method for an exposure apparatus, comprising: a step of separating the mask from the holding jig and mounting the mask on the chuck portion.   After the mask is conveyed to a position below the chuck portion, the position is adjusted by relatively moving the holding jig and the chuck portion so that the relative position between the mask and the chuck portion becomes a predetermined position. The method for transporting and attaching a mask of an exposure apparatus according to claim 1, further comprising a step of:   The holding jig has other portions cut out so as to hold the mask at a back surface portion corresponding to a portion in contact with the chuck portion when the mask is attached to the chuck portion. A mask transporting and mounting method for an exposure apparatus according to claim 1.   The mask transport of the exposure apparatus according to claim 1, wherein the mask is processed into a substantially bowl shape according to a deflection amount when the mask is attached to the chuck portion. Mounting method.   2. The mask transporting step is a step in which the holding jig on which the mask is placed is mounted on the work stage and transported to a position below the chuck portion by the work stage. The mask conveyance of the exposure apparatus in any one of -4, and the attachment method.

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