KR20080002506A - Package emission analysis device - Google Patents

Abstract

A package emission analysis device is provided to maintain the reliability of a defect analysis due to analyzing an emission after applying a signal in a memory device to so as to perform the same operation as a real one. A package emission analysis device includes a cable connector(110), sockets(120), and a printing circuit substrate(130). The cable connector inputs a test signal through a transmission cable. At least one socket is placed upward to a rear surface(144) of a package(140) as a test object. The printing circuit substrate lines an electric wire electrically connecting to the cable connector and the sockets after mounting the cable connector and the sockets. The package emission analysis device includes a semiconductor memory device and a TSOP(Thin Small Out Line Package). The package emission analysis device includes a tester applying the test signal to the transmission cable requiring an operation of the semiconductor memory device.

Description

Package emission analysis device {PACKAGE EMISSION ANALYSIS DEVICE}

1 is a plan view of a package emission analysis apparatus according to an embodiment of the present invention;

2 is a side cross-sectional view of the package emission analysis device of FIG.

FIG. 3 is a side cross-sectional view when the package emission analysis device of FIG. 1 is mounted in a photo emission microscope. FIG.

The present invention relates to a package test apparatus, and more particularly, to a package emission analysis apparatus.

In general, testing of semiconductor memory devices includes product testing to eliminate defective products that occur during the manufacturing process, and probe tests to verify that the function or performance of the manufactured product conforms to the design specifications. If these tests reveal defects in the manufacturing process or discrepancies in design specifications and functionality, analysis is needed to investigate the cause.

However, there is a problem in the conventional analysis method using the emission (Emission) of these failure analysis methods.

First, when analyzing the failure of a memory device by using the Photo Emission Microscope device, since only a part of power used in the memory device such as a power voltage and a ground voltage is applied to the memory device, the analysis is performed. There is a difficulty in failure analysis of the operation of the device.

Second, since the backside of the memory device is positioned downward, there is a problem in that the memory device needs to be flipped to perform the analysis.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to enable emission analysis in a state in which a backside of a memory device is mounted on a navigation instrument.

In addition, another object of the present invention is to enable the emission analysis by applying a signal to the memory device to perform the same operation as the actual operation.

In order to achieve the above object, the present invention is a cable connector for receiving a test signal through a transmission cable, at least one socket is mounted so that the back side of the package under test to the upper side and the cable connector and the socket is mounted and the cable connector And a printed circuit board having wires electrically connected to the sockets.

The package includes a semiconductor memory device of the TOSP type.

The present invention further includes a tester (MOSAID) for applying the test signal required for the operation of the semiconductor memory device to the transmission cable, and a photo emission microscope positioned on the rear surface of the package to analyze the emission of the package. do.

In addition, the socket is preferably formed with a contact end in contact with the lead frame of the package is located at the upper end.

In addition, the contact end is preferably formed in an arrangement corresponding to a signal assigned to the lead frame of the package.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view illustrating a package emission analysis apparatus according to an exemplary embodiment of the present invention, and FIG. 2 is a side cross-sectional view of the package emission analysis apparatus of FIG. 1. 1 and 2, the package emission analysis apparatus 100 according to an embodiment of the present invention includes a cable connector 110, a socket 120, and a printed circuit board 130. In the present exemplary embodiment, the package 140 is a case of a semiconductor memory device having a thin small out line package (TOSP) type, but is not limited thereto.

The cable connector 110 is mounted on the printed circuit board 130 and electrically connects the tester (not shown) and the package 140 mounted in the socket 120 by means of a cable (not shown). The cable is preferably a coaxial cable.

The socket 120 is mounted on the printed circuit board 130 and the package 140 to be tested is mounted. The socket 120 has a shape such that the rear surface 144 of the package 140 may be mounted upward. That is, the socket 120 is formed with the contact end 122 contacting the lead frame 142 of the package 140 located at the upper end of the socket 120. The contact end 122 of the socket 120 is preferably formed in an arrangement corresponding to a signal assigned to the lead frame 142 of the package 140.

One or more sockets 120 may be mounted, and each socket may correspond to a semiconductor memory device operating in various modes, such as X4 mode, X8 mode, and X16 mode. The X4 mode, X8 mode, or X16 mode refers to an operation mode of a semiconductor memory device in which data is input and output in units of 4 bits, 8 bits, or 16 bits.

The printed circuit board 130 has a cable connector 110 and a socket 120 mounted thereon, and a conductor 132 for electrically connecting the cable connector 110 and the socket 120 is wired.

The package emission analysis apparatus according to an embodiment of the present invention may further include a tester (not shown) and a photo emission microscope (not shown).

The tester generates an electrical test signal necessary for the operation of the semiconductor memory device and applies it to the transmission cable.

The photo emission microscope is located on the back of the package to analyze the package's emission during normal operation. The photo emission microscope includes a detection lens.

Meanwhile, the package emission analysis apparatus according to another exemplary embodiment of the present invention may be manufactured by fabricating a printed circuit board having the socket and the cable connector formed integrally with a tester, or mounted in a photo emission microscope.

3 is a side cross-sectional view when a printed circuit board having a socket and a cable connector formed therein according to another embodiment of the present invention is mounted in a photo-emitter microscope. Referring to FIG. 3, the detection lens 160 for emission analysis is positioned on the rear surface of the package 140 mounted in the socket 120, and the cable connector 110 and the tester 150 are connected to the cable 112. Connected through. Therefore, in this case, the process of locating the detection lens 160 on the rear surface 144 of the package 140 may be omitted separately in the package emission analysis process.

Hereinafter, a process of performing emission analysis using a package emission analysis apparatus according to an embodiment of the present invention will be described.

First, the cable connector 110 and the tester 150 are electrically connected using the coaxial cable 112. In addition, the package 140 is mounted on the socket 120 so that each of the lead frames 142 of the package 140 to be tested may be in contact with the corresponding contact end 122 of the socket 120. At this time, unlike the prior art, the rear surface 144 of the package 140 is directed upward.

Then, the detection lens 160 of the photo emission microscope (not shown) capable of analyzing the emission of the package 140 is positioned on the rear surface 144 of the package 140, and then the tester 150 is placed. By using the semiconductor memory device to generate an electrical signal that can operate normally to apply to the test target package (14).

This makes it possible to find defects by performing emission measurements in the same state as the actual operation of the semiconductor.

As described above, since the package emission analysis apparatus of the present invention enables the emission analysis while the backside of the package is mounted on the navigation measuring equipment, it is inconvenient to invert the package for the emission analysis. There is an effect that the box is removed.

In addition, since the present invention enables the emission analysis by applying a signal to the memory device to perform the same operation as the actual operation, there is another effect of ensuring the reliability of failure analysis.

In addition, preferred embodiments of the present invention are disclosed for the purpose of illustration, those skilled in the art will be able to various modifications, changes, additions, etc. within the spirit and scope of the present invention, these modifications and changes should be seen as belonging to the following claims. something to do.

Claims (7)

A cable connector configured to receive a test signal through a transmission cable; At least one socket mounted on a rear surface of a package under test to face upward; And A printed circuit board on which the cable connector and the socket are mounted and wired to electrically connect the cable connector and the socket; Package emission analysis device comprising a. The method of claim 1, wherein the package, A semiconductor memory device Package emission analysis device. The method of claim 2, wherein the package, Includes Thin Small Out Line Package (TOSP) Package emission analysis device. The method of claim 1, A tester for applying the test signal required for the operation of the semiconductor memory device to the transmission cable Package emission analysis device further comprising. The method of claim 1, A photo emission microscope, positioned at the upper back side of the package, for analyzing the package's emission Package emission analysis device further comprising. The method of claim 1, wherein the socket, A contact end contacting the lead frame of the package is formed on the upper portion Package emission analysis device. The method of claim 6, wherein the contact end, And a package emission analysis apparatus formed in an array corresponding to a signal assigned to a lead frame of the package.

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