KR20070097760A - Variable grinding device - Google Patents

Abstract

A variable grinding device is provided to improve work efficiency by eliminating the necessity of changing a grinding table even when the size of an object to be ground varies. A variable grinding device(100) includes a base unit(110), a supporter unit(130), and a grinding unit(150). The base unit includes a grinding table(112) for vacuum sucking a panel to be ground, and a pair of linear motors(122) arranged at both sides of the grinding table. The supporter unit includes a first mounting table(132a) and a second mounting table(132b) arranged at one side and the other side of the grinding table such that the first and second mounting table move along the linear motors and prevent an edge of the panel from being deflected downward. The grinding unit includes a first variable table(152a) and a second variable table(152b) and a first grinding assembly and a second grinding assembly. The first and second variable tables are mounted on the linear motors arranged at one side of the first mounting table and the other side of the second mounting table such that the positions of the first and second variable tables vary. The first and second grinding assemblies are mounted on the first and second variable tables so as to grind the panel.

Description

Variable Grinding Equipment {VARIABLE GRINDING DEVICE}

1 and 2 are a perspective view showing a variable polishing apparatus according to the present invention,

3A is an enlarged view of the first polishing assembly shown in FIG. 1, and

3B is an enlarged view of the second polishing assembly illustrated in FIG. 1.

Explanation of symbols on the main parts of the drawing

100: variable grinding apparatus 110: base portion

112: polishing table 114: polishing motor

116: cylinder shaft 118: vacuum adsorption pad

122: fixed linear motor 130: supporter

132a: first seating table 132b: second seating table

134a: first moving frame 134b: second moving frame

136a: first seating plate 136b: second seating plate

138a: first movable linear motor 138b: second movable linear motor

140a: first air blowing hole 140b: second air blowing hole

150: grinding part 152a: first variable table

152b: second variable table 154a: third moving frame

154b: fourth moving frame 158a: third movable linear motor

158b: fourth movable linear motor 160a: first polishing assembly

160b: second polishing assembly 162a: first guide unit

162b: second guide unit 164a: first polishing unit

164b: second polishing unit 166a: first CCD camera unit

166b: second CCD camera unit 176a, 176b: polishing wheel bundle

188a, 188b: Upper spindle motor 190a, 190b: Lower spindle motor

192a, 192b: Upper grinding wheel 194a, 194b: Lower grinding wheel

197a, 197b: CCD camera

The present invention relates to a polishing apparatus for polishing an edge portion of a display panel, and more particularly, because the polishing table does not need to be replaced even if the size of the polishing object is changed, the work of the polishing table is improved. The present invention relates to a variable polishing apparatus capable of maximizing efficiency.

In general, display panels such as TFT-LCDs and PDP panels can operate on large-area glass substrates by low temperature processes, and are widely used liquid crystal display devices because they have the advantage of being sufficiently driven at low voltages.

Such a display panel includes a liquid crystal panel assembly including a liquid crystal panel for displaying image data using optical properties of the liquid crystal and a driving circuit for driving the same, a backlight assembly for supplying light for display, and a liquid crystal panel assembly and a backlight assembly. It is composed of a mold frame for fixing and receiving.

The liquid crystal panel assembly is a substrate manufacturing process for forming a TFT substrate having a thin film transistor error (TFT array) formed on two large glass substrates (hereinafter referred to as a "parent substrate") and a color filter substrate forming a common electrode, respectively. After forming a plurality of liquid crystal cells by forming and polymerizing an alignment layer and a spacer on the above-mentioned mother substrate, and then cutting them into individual liquid crystal cells using various cutting tools to form a liquid crystal panel, an injection hole formed in each liquid crystal panel is formed. And a module process of attaching a driving circuit for supplying an electrical signal to the liquid crystal cell.

The above-described module process uses an ACF bonding method for a signal input pattern for receiving a driving signal on an upper surface of a side end of a TFT substrate, a printed circuit board and a driving IC for applying a driving signal to a source line and a gate line formed on the TFT substrate. It is a process of bonding using soldering bonding. The edge of the liquid crystal panel which has been cleaned after the injection of liquid crystal to prevent the misalignment of the signal input pattern and the printed circuit board during the bonding process and to prevent cracks caused by process impact. Edge grinding process is performed.

As a method of polishing the liquid crystal panel described above, a liquid crystal panel is usually placed on a polishing table, and then the polishing table is rotated so that the liquid crystal panel is perpendicular to the spindle axis on which the abrasive stone is mounted. Both sides of the liquid crystal panel are processed while being moved to pass the polishing table between the spindle axes. In addition, in order to process the other side of the liquid crystal panel, the polishing table is rotated 90 degrees, the spindle axis is transferred to the machining position again, and then the other side of the liquid crystal panel is processed while passing the polishing table between the spindle axes again. Done.

However, the above-described polishing table can be used without any problem when processing the same size liquid crystal panel. However, if the size of the liquid crystal panel to be processed is changed, the polishing table needs to be replaced according to the size of the liquid crystal panel. There was a problem of low efficiency.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to provide a polishing table which is variable in correspondence with the size of the polishing object and a grinder, so that the polishing table can be changed even if the size of the polishing object is changed. Since it does not need to replace the improved polishing process of the work according to the polishing table replacement relates to a variable polishing apparatus that can maximize the work efficiency.

In order to achieve the object of the present invention as described above, the present invention,

A base portion having a polishing table for vacuum-adsorbing a panel to be polished, a pair of fixed linear motors disposed on both sides of the polishing table,

A supporter portion having a first seating table and a second seating table, which vary along the fixed linear motor to one end and the other end of the polishing table in accordance with the size of the panel and prevent the edges of the panel from sagging;

A first variable table and a second variable table mounted on a fixed linear motor disposed at one end side of the first seating table and the other end side of the second seating table, the positions of which are variable, and the first variable table and the second variable table To provide a variable polishing apparatus having a polishing portion having a first polishing assembly and a second polishing assembly for polishing a panel.

As described above, according to the present invention, since the polishing table does not need to be replaced even if the size of the polishing object is changed, it is possible to maximize the work efficiency by improving the cumbersome work of replacing the polishing table.

Hereinafter, a variable polishing apparatus according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

1 and 2 are perspective views showing a variable polishing apparatus according to the present invention. In FIG. 1 and FIG. 2, the left side of the drawing will be described as one end, and the right side of the drawing will be described as the other end.

1 and 2, the variable polishing apparatus 100 according to the present invention includes a base portion 110 having a polishing table 112 for vacuum suction of a panel to be polished, and a polishing table ( The supporter part 130 which is variable to one end side and the other end side of the 112 and prevents the edge of the panel from sagging, and to the one end side and the other end side of the polishing table 112 so as not to interfere with the supporter 130. And a polishing unit 150 for processing the edges of the panel supported by the polishing table 112 and the supporter unit 130.

First, the base unit 110 further includes a stone stage 120 on which the polishing table 112 is placed, and a fixed linear motor 122.

The polishing table 112 includes a polishing motor 114 disposed inside the central portion of the stone stage 120 and a cylinder shaft 116 disposed above the polishing motor 114. The cylinder shaft 116 is disposed to be exposed to the top of the stone stage 120, the vacuum suction pad 118 is integrally mounted on the top of the cylinder shaft 116. As the vacuum adsorption pad 118, anyone can know a conventional vacuum suction pipe line (not shown) is connected. Preferably, the polishing motor 114 employs a conventional direct drive motor (DD-MOTOR), which rotates the panel to be polished 90 degrees.

On the other hand, the fixed linear motor 122 is disposed on the upper surface of the stone stage 120. The fixed linear motor 122 is disposed on both sides of the cylinder shaft 116 exposed to the upper portion of the stone stage 120 and at the other end of the stone stage 120, that is, along the longitudinal direction of the stone stage 120. Extend horizontally. The supporter 130 and the polishing unit 150 are disposed in the base part 100 formed as described above so as to be selectively varied according to the size of the panel.

The supporter unit 130 includes a first seating table 132a and a second seating table 132b disposed at one end side and the other end side of the polishing table 112. The first seating table 132a and the second seating table 132b have shapes corresponding to each other.

The first seating table 132a and the second seating table 132b include a pair of vertical first moving frames 134a mounted on the fixed linear motor 122 at one end side and the other end side of the polishing table 112; The first seating plate 136a and the second seating plate connecting the pair of second moving frames 134b and the upper part of the pair of first moving frames 134a and the pair of second moving frames 134b. 136b. Under the first moving frame 134a and the second moving frame 134b, a first movable linear motor 138a and a second movable linear motor 138b sliding along the fixed linear motor 122 are provided. It is formed integrally. In addition, a plurality of first air ejection holes 140a and a plurality of second air ejection holes 140b are formed in the first seating plate 136a and the second seating plate 136b, and the first air ejection holes 140a are formed. ) And the second air blowing hole 140b ejects air when the cylinder shaft 116 of the polishing table 112 rotates the panel to prevent the panel from being scratched. The first seating plate 132a and the second seating As can be seen by the plate 132b, a conventional air blowing pipe line (not shown) is connected.

Preferably, the first mounting plate 132a and the second mounting plate 132b are formed at the center of one end surface of the first mounting plate 132a and the second mounting plate 132b facing each other. The first interference preventing grooves 142a and the second interference preventing grooves 142b are formed to be concave so as not to interfere with the cylinder shaft 116 when sliding to the 116 side.

On the other hand, the polishing unit 150 is a first variable table (slidably mounted to the fixed linear motor 122 disposed on one end side of the first seating table 132a and the other end side of the second seating table 132b ( 152a and second variable table 152b and a first polishing assembly 160a and a second polishing assembly 160b mounted on opposing surfaces of the first and second variable tables 152a and 152b. do.

The first variable table 152a and the second variable table 152b include a pair of vertical third moving frames 154a and a pair of fourth moving frames 154b mounted on the fixed linear motor 122, A first horizontal frame 156a and a second horizontal frame 156b connecting the upper portions of the pair of third moving frames 154a and the pair of fourth moving frames 154b are provided. The third moving frame 154a is spaced apart from one end of the first moving frame 134a, and the fourth moving frame 154b is spaced apart from the other end of the second moving frame 134b. And a third movable linear motor (158a) slid along the fixed linear motor 122 similarly to the first moving frame 134a and the second moving frame 134b below the fourth moving frame 154b. A fourth movable linear motor 158b is integrally formed.

Preferably, the third moving frame 154a and the fourth moving frame 154b have a length higher than the height of the height of the first moving frame 134a and the second moving frame 134b. The first polishing assembly 160a is mounted on the other end surface of the first horizontal moving frame 134a formed as described above, and the second polishing assembly 160b is mounted on one end surface of the second horizontal moving frame 134b. That is, the first polishing assembly 160a and the second polishing assembly 160b are mounted to face each other.

The first polishing assembly 160a includes a first guide unit 162a extending along the longitudinal direction of the first horizontal moving frame 156a, a first polishing unit 164a mounted on the first guide unit 162a, and And a first CCD camera unit 166a mounted in the advancing direction of the first polishing unit 164a. Similarly, the second polishing assembly 160b having the same configuration as the first polishing assembly 160a and symmetrically arranged may include a second guide unit 162b extending along the longitudinal direction of the second horizontal frame 156b; A second polishing unit 164b attached to the second guide unit 162b and a second CCD camera unit 166b mounted in the advancing direction of the second polishing unit 164b are provided.

3A is an enlarged view of the first polishing assembly shown in FIG. 1, and FIG. 3B is an enlarged view of the second polishing assembly shown in FIG. 1.

3A and 3B, the first guide unit 162a and the second guide unit 162b are disposed to extend in the longitudinal direction of the first horizontal frame 156a and the second horizontal frame 156b. Guide housings 168a and 168b are provided, respectively. Inside the respective guide housings 168a and 168b, there are guide ballscrews 170a and 170b and a conventional LM guide (not shown), respectively, which extend one of the respective guide ball screws 170a and 170b. At the end, sub-motors 172a and 172b for rotating the guide ball screws 170a and 170b are mounted. The first guide unit 162a and the second guide unit 162b formed as described above include a first polishing unit 164a and a second polishing unit 164b, a first CCD camera unit 166a, and a second CCD camera unit. 166b are mounted respectively.

The first polishing unit 164a and the second polishing unit 164b are provided with polishing brackets 174a and 174b connected to the respective guide ball screws 170a and 170b, and face each of the polishing brackets 174a and 174b. Polishing wheel bundles 176a and 176b disposed on the surface, and polishing wheel adjusting guides 178a and 178b disposed between the respective polishing brackets 174a and 174b and the respective polishing wheel bundles 176a and 176b. do.

Polishing wheel adjustment guide (178a, 178b) is a control ball screw (180a, 180b) disposed perpendicular to each of the polishing brackets (174a, 174b), and adjustment guide block (182a) mounted to the adjustment ball screw (180a, 180b) And 182b, each of which is equipped with up-down motors 184a and 184b for rotating the adjusting ball screws 180a and 180b on the upper portions of the adjusting ball screws 180a and 180b, respectively. 182b) are equipped with polishing wheel bundles 176a and 176b. Each of the polishing wheel bundles 176a and 176b includes wheel covers 186a and 186b mounted to the adjustment guide blocks 182a and 182b, and upper spindle motors 188a and 188b disposed up and down inside the wheel covers 186a and 186b. And a plurality of upper abrasive wheels 192a exposed to one side of the wheel covers 186a and 186b while being mounted on the lower spindle motors 190a and 190b, the upper spindle motors 188a and 188b, and the lower spindle motors 190a and 190b. 192b) and a plurality of lower abrasive wheels 194a and 194b. At this time, the polishing wheels (192a, 192b) disposed at both ends of the plurality of upper polishing wheels (192a, 192b) has a corner polishing polishing wheels (192a, 192b) formed on the circumferential surface to process the edge of the panel Is mounted.

On the other hand, the first CCD camera unit 166a and the second CCD camera unit 166b are camera brackets 196a and 196b mounted to the respective polishing brackets 174a and 174b, and respective camera brackets 196a and 196b. In addition, it is equipped with CCD cameras 197a and 197b which are mounted in front of the upper polishing wheels 192a and 192b and the lower polishing wheels 194a and 194b in the advancing direction and photograph the polishing portion of the panel. CCD camera lamps 198a and 198b are mounted below the respective CCD cameras 197a and 197b. Preferably, the CCD cameras 197a and 197b are positioned by conventional adjustment stages 199a and 199b disposed between the camera brackets 196a and 196b and the CCD cameras 197a and 197b. More preferably, one side of each of the CCD cameras 197a and 197b is provided with air blower nozzles N so as to remove foreign substances from the polishing sites.

Hereinafter, the operating state of the variable polishing apparatus 100 formed as described above will be briefly described.

First, to polish the short width edge of the panel to be polished, the panel is seated on the polishing table 112. At this time, the panel is seated on the polishing table 112 so that the short width edge of the panel lies on the first polishing assembly 160a and the second assembly 160b, and the panel is vacuum-adsorbed. When the panel is sucked and fixed to the polishing table 112 in this way, the first seating table 132a and the second seating table 132b are transferred to a position adjacent to the short width edge of the panel. In this case, the first seating table 132a and the second seating table 132b may include a first movable linear motor 138a and a second movable linear motor formed under the first moving frame 134a and the second moving frame 134b. Operation of the 138b and the fixed linear motor 122 is carried to a position adjacent to the short width edge of the panel.

Meanwhile, when the first seating table 132a and the second seating table 132b are transferred, the first variable table 152a and the second variable on which the first polishing assembly 160a and the second polishing assembly 160b are mounted. The table 152b is transferred to the machining position of the short width edge. In this case, the first variable table 152a and the second variable table 152b may include the third movable linear motor 158a and the fourth movable linear formed under the third moving frame 154a and the fourth moving frame 154b. By the operation of the motor 158b and the fixed linear motor 122 is transferred to the machining position of the short width edge of the panel.

When the first polishing assembly 160a and the second polishing assembly 160b are transferred to the machining position, the respective CCD cameras 197a and 197b mounted on the first polishing assembly 160a and the second polishing assembly 160b are transferred. In order to find the optimum machining position, the sub-motors 172a and 172b and the third movable linear motor 158a and the fourth movable linear motor 158b are operated to center the CCD cameras 197a and 197b. The first polishing assembly 160a and the second polishing assembly 160b are moved in such a way that an optimum machining position is at the same position. Preferably, the optimum machining position such as a cross mark can be displayed in advance on the edge portion of the panel. On the other hand, when the edges photographed by the CCD cameras 197a and 197b are turned to one side, the polishing motor 114 is finely operated to align the panel.

As described above, when the machining position of the short width edge of the panel is searched, each of the upper spindle motors 188a and 188b and each of the lower spindle motors 190a and 190b is driven to drive the respective upper grinding wheels 192a and 192b and The lower polishing wheels 194a and 194b are rotated.

When the upper grinding wheels 192a and 192b and the lower grinding wheels 194a and 194b are rotated in this manner, the upper grinding wheels 192a and 192b are operated by operating the up-down motors 184a and 184b to process corner portions of the short width edges. ) On the short edge edge. At this time, each of the sub-motors 172a and 172b and the third movable linear motor 158a and the third grinding wheel 192a and 192b under the state in which the polishing wheels 192a and 192b provided at one end of the upper grinding wheels 192a and 192b are brought into close contact with the edge processing portion. 4 Operate the movable linear motor (158b) to machine the corners. At this time, the third movable linear motor 158a and the fourth movable linear motor 158b are operated to fix the first polishing assembly 160a to one end of the fixed linear motor 122 and to fix the second polishing assembly 160b. It transfers to the other end side of the linear motor 122.

When the processing of the corner portion of the short width edge is completed, the up-down motors 184a and 184b, the third movable linear motor 158a and the fourth movable linear motor 158b are operated to operate the first polishing assembly 160a and The sub-motors 172a and 172b are operated in the state where the second polishing assembly 160b is transferred to the short width edge processing position to perform short width edge processing. In this case, the short width edge is disposed between the upper polishing wheels 192a and 192b and the lower polishing wheels 194a and 194b, and the first polishing assembly 160a and the second polishing assembly 160b are the sub-motors 172a and 172b. After processing the short width edge while conveying along the guide units 162a and 162b), the rear edge part is processed, and the upper grinding wheel is operated by operating the up-down motors 184a and 184b to process the rear edge part. The sub-motors 172a and 172b and the third movable linear motor 158a and the fourth movable linear motor in a state in which the polishing wheels 192a and 192b formed at the other ends of the 192a and 192b are brought into close contact with the rear edge processing positions. 158b) actuates the trailing edge.

As described above, when the processing of the front edge, the short edge edge, and the rear end edge of the short width edge is completed, the first variable table 152a and the second variable table 152b include the third movable linear motor 158a and the fourth movable linear motor. 158b and the fixed linear motor 122 are opened to both ends, and the cylinder shaft 116 of the polishing table 112 rotates the panel 90 degrees so as to polish the long width of the panel. At this time, in the first air ejection hole 140a and the second air ejection hole 140b formed in the first seating plate 136a and the second seating plate 136b, compressed air is ejected and scratches are formed on the lower part of the rotating panel. At the same time, the first mounting plate 136a and the second mounting plate 136b are used for the operation of the first movable linear motor 138a and the second movable linear motor 138b and the fixed linear motor 122. This is conveyed to an adjacent position of the long width edge of the panel to prevent sagging of the long width edge.

As described above, when the panel is rotated 90 degrees, the third movable linear motor 158a and the fourth movable linear motor 158b and the fixed linear motor 122 are operated simultaneously with the updown motors 184a and 184b. The sub-motors 172a and 172b are reversely rotated while the first polishing assembly 160a and the second polishing assembly 160b are transferred to the long width edge processing position of the panel, thereby processing the long width edge surface of the panel. That is, the first polishing assembly 160a and the second polishing assembly 160b return along the first guide unit 162a and the second guide unit 162b to process the long edge surface of the panel.

As described above, the variable polishing apparatus 100 according to the present invention includes a first seating table 132a and a second seating table 132b and edges of the panel, which can prevent the edge portion from sagging at the time of polishing operation. Since the first polishing assembly 160a and the second polishing assembly 160b for polishing the wafers can be varied in accordance with the supplied panel size, replacement time and work occurring when replacing the polishing table according to the size change of the panel as in the prior art. There is an advantage to maximizing work efficiency by reducing manpower.

In addition, since the short width edge and the long width edge of the panel can be processed in one polishing table 112, it is easy to arrange in a narrow work space, and precise polishing can be performed by minimizing the movement of the panel to be polished. have.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the invention described in the claims. You will understand.

Claims (16)

A base portion having a polishing table for vacuum-adsorbing a panel to be polished, a pair of fixed linear motors disposed on both sides of the polishing table, A supporter portion having a first seating table and a second seating table which are variable along the fixed linear motor to one end side and the other end side of the polishing table in accordance with the size of the panel and prevent the edge of the panel from sagging; A first variable table and a second variable table mounted on the fixed linear motor disposed at one end side of the first seating table and the other end side of the second seating table, and having a variable position; the first variable table and the first variable table; And a polishing unit having a first polishing assembly and a second polishing assembly mounted on the variable table to polish the panel. According to claim 1, wherein the base portion further comprises a stone stage in which the polishing table is seated in the center portion, the fixed linear motor is characterized in that extending along the longitudinal direction of the stone stage on the top surface of the stone stage Variable grinding machine. 3. The polishing table of claim 2, wherein the polishing table comprises: a polishing motor disposed inside the central portion of the stone stage, a cylinder shaft disposed on the polishing motor and exposed to the top of the stone stage; Variable polishing apparatus comprising a vacuum suction pad to be mounted. The vertical mounting pair and the pair of second moving frames of claim 1, wherein the first seating table and the second seating table are mounted to the fixed linear motors at one end and the other end of the polishing table. And a first seating plate and a second seating plate for connecting the upper part of the moving frame and the pair of the first moving frame and the pair of the second moving frame to prevent sagging at the lower part of the panel. Variable grinding machine. The variable polishing apparatus according to claim 4, wherein a first movable linear motor and a second movable linear motor slid along the fixed linear motor are integrally formed under the first moving frame and the second moving frame. . The variable polishing apparatus according to claim 4, wherein the first seating plate and the second seating plate are provided with a plurality of first air ejection holes and a plurality of second air ejection holes to eject compressed air. 5. The method of claim 4, wherein the other end face of the first seating plate facing each other and the central portion of the one end surface of the second seating plate so as not to interfere with the polishing table when sliding to the polishing table side and the first interference preventing groove and A variable polishing apparatus, characterized in that the second interference preventing grooves are formed concave. 2. The apparatus of claim 1, wherein the first variable table and the second variable table comprise a pair of vertical third moving frames and a pair of fourth moving frames mounted to the fixed linear motor, and a pair of the third moving tables. A first horizontal frame and a second horizontal frame, the first frame and a second frame being connected to each other; The first polishing assembly and the second polishing assembly is mounted on one side of the variable polishing apparatus, characterized in that the mounting. 9. The variable polishing apparatus according to claim 8, wherein a third movable linear motor and a fourth movable linear motor slid along the fixed linear motor are integrally formed under the third moving frame and the fourth moving frame. . 9. The method of claim 8, wherein the first polishing assembly comprises a first guide unit extending along the longitudinal direction of the first horizontal moving frame, a first polishing unit mounted on the first guide unit and the first polishing unit. A first CCD camera unit mounted in the advancing direction, and similarly, the second polishing assembly having the same configuration as the first polishing assembly and symmetrically disposed extends along the longitudinal direction of the second horizontal moving frame; And a second CCD unit attached to the traveling direction of the second polishing unit and a second polishing unit mounted to the second guide unit. 11. The method of claim 10, wherein the first guide unit and the second guide unit is provided with a guide housing which is disposed to extend along the longitudinal direction of the first horizontal frame and the second horizontal frame, respectively, A guide ball screw and a general LM guide are respectively built in the guide housing, and one of the extension ends of each of the guide ball screws is equipped with a sub-motor for rotating the guide ball screw. . 12. The polishing apparatus according to claim 10 or 11, wherein the first polishing unit and the second polishing unit are polishing brackets connected to respective guide ball screws, and polishing wheel bundles disposed on opposite surfaces of each polishing bracket. And a polishing wheel adjustment guide disposed between each of the polishing brackets and each of the polishing wheel bundles, and the polishing wheel adjustment guides include adjustment ball screws disposed perpendicular to the respective polishing brackets, and the adjustment balls. It is provided with a control guide block mounted to the screw, the upper and lower motors for rotating the control ball screw is mounted on each of the adjustment ball screw, characterized in that each of the adjustment guide block is equipped with the polishing wheel bunch is mounted. Variable grinding machine. The method of claim 12, wherein each of the polishing wheel bundle is a wheel cover mounted to the adjustment guide block, the upper spindle motor and the lower spindle motor disposed up and down inside the wheel cover, the upper spindle motor and the lower spindle motor A variable grinding apparatus comprising a plurality of upper grinding wheels and a plurality of lower grinding wheels. The variable polishing apparatus according to claim 13, wherein the polishing wheels disposed at both ends of the plurality of upper polishing wheels have an inclined surface formed on a circumferential surface thereof. 15. The method according to claim 10 or 13, wherein the first CCD camera unit and the second CCD camera unit are mounted on the first polishing assembly and the second polishing assembly, and are mounted on the respective camera brackets. In addition, a CCD camera which is disposed in front of the advancing direction of the upper grinding wheel and the lower grinding wheel to photograph the polishing portion, and the CCD camera lamp is mounted to the lower portion of each CCD camera, characterized in that the variable polishing apparatus . 16. The variable polishing apparatus according to claim 15, wherein an air blower nozzle is mounted on one side of each of the CCD cameras to remove foreign substances from the polishing site.

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