KR20070086724A - 중성에 가까운 ｐＨ를 갖는 주석 전기도금용액 - Google Patents

중성에 가까운 ｐＨ를 갖는 주석 전기도금용액 Download PDF

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Publication number
KR20070086724A
KR20070086724A KR1020077014702A KR20077014702A KR20070086724A KR 20070086724 A KR20070086724 A KR 20070086724A KR 1020077014702 A KR1020077014702 A KR 1020077014702A KR 20077014702 A KR20077014702 A KR 20077014702A KR 20070086724 A KR20070086724 A KR 20070086724A
Authority
KR
South Korea
Prior art keywords
solution
tin
substrate
present
amount
Prior art date
Application number
KR1020077014702A
Other languages
English (en)
Korean (ko)
Inventor
죠지 라딜
로버트 스타비트스키
로버트 에이. 써드 스케티
Original Assignee
테크닉, 인크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 테크닉, 인크 filed Critical 테크닉, 인크
Publication of KR20070086724A publication Critical patent/KR20070086724A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
KR1020077014702A 2004-11-29 2005-11-15 중성에 가까운 ｐＨ를 갖는 주석 전기도금용액 KR20070086724A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63167604P 2004-11-29 2004-11-29
US60/631,676 2004-11-29

Publications (1)

Publication Number Publication Date
KR20070086724A true KR20070086724A (ko) 2007-08-27

Family

ID=35788479

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077014702A KR20070086724A (ko) 2004-11-29 2005-11-15 중성에 가까운 ｐＨ를 갖는 주석 전기도금용액

Country Status (6)

Country Link
US (1) US20060113195A1 (de)
EP (1) EP1819848A1 (de)
JP (1) JP2008522030A (de)
KR (1) KR20070086724A (de)
CN (1) CN101080513A (de)
WO (1) WO2006057873A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2832160B1 (fr) * 2001-11-15 2005-01-14 Atofina PROCEDE DE TRAVAIL OU MISE EN FORME DES METAUX EN PRESENCE DE LUBRIFIANTS AQUEUX A BASE D'ACIDE METHANESULFONIQUE (AMS) ou D'UN SEL HYDROSOLUBLE D'AMS
WO2004034427A2 (en) * 2002-10-08 2004-04-22 Honeywell International Inc. Semiconductor packages, lead-containing solders and anodes and methods of removing alpha-emitters from materials
WO2009061984A2 (en) * 2007-11-09 2009-05-14 Technic, Inc. Method of metallizing solar cell conductors by electroplating with minimal attack on underlying materials of construction
US9869029B2 (en) 2009-07-30 2018-01-16 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
WO2011012475A1 (en) 2009-07-30 2011-02-03 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
US20130264214A1 (en) * 2012-04-04 2013-10-10 Rohm And Haas Electronic Materials Llc Metal plating for ph sensitive applications
CN103060858A (zh) * 2012-12-12 2013-04-24 郎溪县金科金属有限公司 一种镀锡电解液
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
CN108866583B (zh) * 2018-08-28 2020-07-21 广州三孚新材料科技股份有限公司 一种应用于无引线电子元件的镀锡或锡铅合金的镀液及其制备方法和电镀方法
CN109338420A (zh) * 2018-12-14 2019-02-15 江苏艾森半导体材料股份有限公司 一种环保中性电镀锡电解液

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE495952A (de) * 1943-07-07
GB1221688A (en) * 1968-03-09 1971-02-03 Geigy Uk Ltd Tin electroplating bath and process
US3855085A (en) * 1973-06-14 1974-12-17 Du Pont Acid zinc electroplating electrolyte, process and additive
JPS6015716B2 (ja) * 1977-10-21 1985-04-20 デイツプソ−ル株式会社 錫または錫合金電気めつき用浴の安定化方法
JPS5818996B2 (ja) * 1980-02-21 1983-04-15 キザイ株式会社 緻密なめっき被膜を得るための中性錫電気めっき浴
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4640746A (en) * 1984-10-11 1987-02-03 Learonal, Inc. Bath and process for plating tin/lead alloys on composite substrates
JPS61194194A (ja) * 1985-02-22 1986-08-28 Keigo Obata すず、鉛又ははんだメツキ浴
US4681670A (en) * 1985-09-11 1987-07-21 Learonal, Inc. Bath and process for plating tin-lead alloys
US6099713A (en) * 1996-11-25 2000-08-08 C. Uyemura & Co., Ltd. Tin-silver alloy electroplating bath and tin-silver alloy electroplating process
JP3455712B2 (ja) * 2000-04-14 2003-10-14 日本ニュークローム株式会社 銅−スズ合金めっき用ピロリン酸浴
JP4392640B2 (ja) * 2000-10-11 2010-01-06 石原薬品株式会社 非シアン系の金−スズ合金メッキ浴
CN1260399C (zh) * 2001-08-31 2006-06-21 罗姆和哈斯电子材料有限责任公司 电解镀锡溶液和用于电镀的方法
JP4758614B2 (ja) * 2003-04-07 2011-08-31 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． 電気めっき組成物および方法
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ

Also Published As

Publication number Publication date
US20060113195A1 (en) 2006-06-01
WO2006057873A1 (en) 2006-06-01
EP1819848A1 (de) 2007-08-22
CN101080513A (zh) 2007-11-28
JP2008522030A (ja) 2008-06-26

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WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid