KR20070057488A - Organic electro-luminescence display device and fabricating method thereof - Google Patents

Abstract

An organic electro-luminescence display device and a fabricating method thereof are provided to reduce waste of a partition wall material by forming a right taper shaped protecting partition wall in a seal line area together with a reverse taper shaped partition wall of an array area. An organic electro-luminescence display device includes an array area(P1). The array area(P1) includes an anode electrode(104) and a cathode electrode(112) which cross each other while interposing an organic light emitting layer(110) on a substrate(102). A cap(170) is adhered to the substrate(102) through a sealant(125) in a seal line area(P3) formed at an outer side of the array area(P1). Protecting partition walls(158) of a right taper shape are parallel with the sealant(125) at a predetermined distance at left and right sides of the seal line area(P3).

Description

Organic electroluminescent display device and manufacturing method therefor {ORGANIC ELECTRO-LUMINESCENCE DISPLAY DEVICE AND FABRICATING METHOD THEREOF}

1 is a view schematically showing a conventional organic electroluminescent display device.

FIG. 2 is a view showing specifically the region A shown in FIG. 1. FIG.

3 is a cross-sectional view taken along lines II ′ and II-II ′ of FIG. 2.

4A to 4D are views for explaining a process of applying a sealant to a seal line region on a substrate.

Fig. 5 is a diagram showing poor sealant coating due to a reverse taper-shaped protective partition wall.

6 is a plan view illustrating a portion of an organic electroluminescent display device according to an exemplary embodiment of the present invention.

FIG. 7 is a cross-sectional view taken along lines III-III ′ and IV-IV ′ of FIG. 6.

8A through 8E are cross-sectional views illustrating a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the present invention.

9A to 9F are cross-sectional views illustrating in detail the formation of the reverse taper-shaped partition wall of the array region and the positive taper-shaped partition wall of the vialay region according to an embodiment of the present invention.

<Brief description of symbols for the main parts of the drawings>

2, 102: substrate 4, 104: anode electrode

6, 106 insulating film 8, 108: partition wall

10, 110: organic light emitting layer 12, 112: cathode electrode

25, 125: Sealant 52: Scan Link

54: data link 58, 158: protective bulkhead

70, 170: Cap 80: Dispensing

200: first mask 210: second mask

220: photoresist

The present invention relates to an organic electroluminescent display device, and more particularly, to an organic electroluminescent display device capable of improving yield and a method of manufacturing the same.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. As a flat panel display, a liquid crystal display (hereinafter referred to as "LCD"), a field emission display (FED), and a plasma display panel (hereinafter referred to as "PDP") And an electro-luminescence display (hereinafter, referred to as “EL”) display device.

PDP is most advantageous for the large screen because of its relatively simple structure and manufacturing process, but it has the disadvantages of low luminous efficiency, low luminance and high power consumption.

As LCDs are mainly used as display elements in notebook computers, demand is increasing. However, since LCD is manufactured by a semiconductor process, it is difficult to make a large screen and because it is not a self-luminous device, a separate light source is required and power consumption is large due to the light source. In addition, LCD has a disadvantage of high light loss and a narrow viewing angle due to optical elements such as a polarizing filter, a prism sheet, and a diffusion plate.

The EL display device is roughly classified into an inorganic EL display device and an organic EL display device, and has advantages of fast response speed and high luminous efficiency, brightness, and viewing angle. The organic EL display element can display an image with a high luminance of tens of thousands [cd / m 2] at a voltage around 10 [V], and is applied to most EL display elements that are commercially available.

1 is a view schematically showing a conventional organic EL display element.

Referring to FIG. 1, a conventional organic EL display device includes an array region P1 in which an organic EL array including driving electrodes (eg, an anode electrode and a cathode electrode) intersecting each other with an organic light emitting layer interposed therebetween is formed. The via region P2 may include a pad unit for supplying a driving signal to the driving electrodes of the array region P1.

As shown in FIGS. 2 and 3, the organic EL array in the array region P1 includes a first electrode (hereinafter referred to as “anode electrode”) that crosses each other with the organic light emitting layer 10 interposed therebetween on the substrate 2. 4, a second electrode 12 (hereinafter referred to as a “cathode electrode”) 12, an insulating film 6 exposing a region where the organic light emitting layer 10 is to be formed on the anode 4, and And a partition wall 8 that crosses the anode electrode 4.

A plurality of anode electrodes 4 are formed on the substrate 2 as a transparent electrode layer at a predetermined interval. The organic light emitting layer 10 is formed by stacking a hole transport layer, a light emitting layer and an electron transport layer on the anode electrode (4). A plurality of cathode electrodes 12 are formed on the organic light emitting layer 10 so as to intersect the anode electrode 4. The insulating film 6 is formed to have an opening for each region where the organic light emitting layer 10 is to be formed on the substrate 2 on which the anode electrode 4 is formed. The partition wall 8 is formed on the insulating film 6 in an inverted taper structure in which the upper end portion has a wider width than the lower end portion for separation of the cathode electrode 12.

In the via region P2, a data link 54 extending from the anode electrode 4 of the array region P1 and data pads for supplying a data voltage to the anode electrode 4 through the data link 54 are formed. The scan link 52 connected to the cathode electrode 12 and a scan pad for supplying a scan voltage to the cathode electrode 12 through the scan link 52 are provided.

On the other hand, the organic EL array in the array region P1 is easily deteriorated by moisture, oxygen, or the like. Thus, the organic EL array of the array region P1 is bonded to the cap 70 through the sealant 25 applied to the seal line region P3 on the substrate 2 by performing an encapsulation process.

The sealant 25 is formed in parallel with each other while maintaining a predetermined distance from the left and right of the region where the sealant 25 is applied on the substrate 2 and surrounded by the protective partition 58 defining the seal line region P3. The protective partition 58 is formed in the same process as the partition 8 of the array region P1, and prevents the sealant 25 from flowing into the organic EL array of the array region P1 and the sealant 25 is prevented from entering. It serves to prevent outflow to the outer region of the seal line region P3.

Hereinafter, a process of applying the sealant 25 to the inside of the protective partition 58 by using a dispense or the like will be described.

4A to 4D are diagrams for describing a process of applying a sealant to the seal line region P3 on the substrate.

The sealant 25 supplied from the dispense 80 is applied to the inside of the protective partition 58 formed in the via region P2 of the organic EL display element.

Referring to FIG. 4A, the dispense 80 applies the sealant 25 to the seal line region P3 on one side of the rectangular organic EL display element.

Subsequently, when the application of the sealant 25 is completed to the seal line region P3 on one side of the rectangular organic EL display element, the dispense 80 changes its application direction as shown in FIG. 4B to display a rectangular organic EL display. The sealant 25 is applied to the seal line region P3 on the other side of the device.

In addition, the dispensing 80 changes the coating direction again to apply the sealant 25 to the seal line region P3 of the remaining sides of the rectangular organic EL display element as shown in FIGS. 4C and 4D.

Subsequently, when the sealant 25 is applied to the seal line regions P3 of the four sides of the rectangular organic EL display element, the cap 70 is loaded on the coated sealant 25 to form the substrate 2 and the substrate 2. By attaching the cap 70, the organic EL display element is completed.

However, there is a problem in that the sealant 25 is not evenly applied to the four corner regions of the seal line region P3 of the conventional organic EL display element. This is because the reverse taper-shaped protective partition 58 formed at the outer portion of the seal line region P3 changes the application direction in order to apply the sealant 25 to the seal line region P3 of the four sides of the organic EL display element. This is because the four corner regions of the seal line region P3 are covered.

As described above, when the sealant 25 is evenly applied to the four corner regions of the seal line region P3 of the organic EL display device, adhesion failure occurs in the substrate 2 and the cap 70. The EL display element is judged to be defective. The organic EL display element has a problem in that its yield is lowered by the sealant 25 which is not evenly applied to the four corner regions in the seal line region P3.

Accordingly, it is an object of the present invention to provide an organic electroluminescent display device and a method of manufacturing the same which can improve yield.

In order to achieve the above object, an organic electroluminescent display device according to an embodiment of the present invention includes an array region including an anode electrode and a cathode electrode intersecting with each other with an organic light emitting layer on the substrate; A cap bonded to the substrate through a sealant in a seal line region located outside the array region; A protective partition wall having a positive taper shape parallel to the sealant may be provided while maintaining a predetermined distance from the left and right of the seal line region.

The organic electroluminescent display includes an insulating film exposing a region where the organic light emitting layer is to be formed in the array region formed on the anode electrode; And an inverse taper-shaped partition wall formed on the insulating film in a direction crossing the anode electrode.

The barrier ribs on the left and right sides of the seal line region and the barrier rib are the same material.

A method of manufacturing an organic electroluminescent display device according to an embodiment of the present invention includes the steps of forming an anode electrode in the array region on the substrate; Maintaining a predetermined distance on the left and right sides of the seal line region located outside the array region, and forming a protective taper having a positive taper shape parallel to the sealant applied to the seal line region; Forming a cathode electrode intersecting the anode electrode with an organic light emitting layer interposed therebetween in the array region; Bonding the cap and the substrate through the sealant.

The method of manufacturing an organic electroluminescent display device includes forming an insulating film exposing a region where the organic light emitting layer is to be formed in the array region where the anode electrode is formed; And forming an inverted taper-shaped partition wall formed on the insulating layer in a direction crossing the anode electrode.

The barrier ribs are formed on the left and right sides of the seal line region in the same process as the protective barrier rib and the array region.

Forming the barrier ribs in the protective barrier ribs and the array region on the left and right sides of the seal line region may include applying a barrier material on the substrate on which the insulating layer is formed; Front coating the photoresist on the barrier material; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the partition wall is to be formed; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the protective barrier is to be formed; Forming a positive tapered photoresist pattern on the left and right sides of the seal line region and an inverse tapered photoresist pattern on the array region through a developing process; Patterning a barrier rib on the left and right sides of the seal line region and the barrier rib on the array region using the photoresist pattern as a mask.

Forming the barrier ribs in the protective barrier ribs and the array region on the left and right sides of the seal line region may include applying a barrier material on the substrate on which the insulating layer is formed; Front coating the photoresist on the barrier material; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the protective barrier is to be formed; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the partition wall is to be formed; Forming a positive tapered photoresist pattern on the left and right sides of the seal line region and an inverse tapered photoresist pattern on the array region through a developing process; Patterning a barrier rib on the left and right sides of the seal line region and the barrier rib on the array region using the photoresist pattern as a mask.

The first mask is spaced apart from the substrate at intervals of 40 to 60 μm and aligned on the substrate.

The second mask is spaced apart from the substrate at intervals of 180 to 220 μm and aligned on the substrate.

Other objects and advantages of the present invention in addition to the above object will be apparent from the description of the preferred embodiments of the present invention with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 6 to 9E.

6 is a plan view illustrating a portion of an organic EL display device according to an exemplary embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along the line III-III ′ and IV-IV ′ of FIG. 6.

6 and 7, an organic EL display device according to an exemplary embodiment of the present invention may include an array region P1 in which an organic EL array is formed, and a pad unit for supplying driving signals to driving electrodes in the array region P1. The via-lay region P2 is positioned, and the seal-line region P3 to which the sealant 125 is applied is applied to the outer portion of the via-lay region P2. In addition, the organic EL display device includes a cap 170 that seals the array region P1 through a sealant 125 applied to the seal line region P3.

The organic EL array of the array region P1 includes a first electrode 104 (hereinafter referred to as an “anode electrode”) 104 and a second electrode crossing each other with the organic light emitting layer 110 therebetween on the substrate 102. Hereinafter, referred to as “cathode electrode” 112, an insulating film 106 exposing a region where the organic light emitting layer 110 is to be formed on the anode electrode 104, and a partition wall 108 crossing the anode electrode 104. ).

A plurality of anode electrodes 104 are formed on the substrate 102 as a transparent electrode layer and spaced apart at predetermined intervals. The organic light emitting layer 110 is formed by stacking a hole transport layer, a light emitting layer and an electron transport layer on the anode electrode (104). A plurality of cathode electrodes 112 are formed on the organic emission layer 110 to intersect the anode electrode 104. The insulating layer 106 is formed to have an opening in each region where the organic light emitting layer 110 is to be formed on the substrate 102 on which the anode electrode 104 is formed. The partition 108 is formed on the insulating layer 106 in an inverted taper structure in which the upper end portion has a wider width than the lower end portion for separation of the cathode electrode 112.

In the via region P2, a data link (not shown) extending from the anode electrode 104 of the array region P1 and data pads for supplying a data voltage to the anode electrode 104 through the data link are formed. A scan link 152 connected to the cathode electrode 112 and a scan pad for supplying a scan voltage to the cathode electrode 112 through the scan link 152 are provided.

The sealant 125 applied to the seal line region P3 is formed side by side while maintaining a predetermined distance from the left and right of the seal line region P3 so that the sealant 125 flows into the organic EL array of the array region P1. In addition, the sealant 125 is surrounded by a protective taper 158 having a positive taper shape, which prevents the sealant 125 from flowing into the outer region of the seal line region P3.

As described above, in the organic EL display device according to the exemplary embodiment of the present invention, as the conventional organic EL display device includes a reverse tapered protective barrier in the seal line region P3, the reverse tapered protective barrier is formed in the sealed line region ( The problem of covering the four corner regions of P3) can be eliminated by forming a protective taper 158 having a positive taper shape in the seal line region P3. That is, the protective taper 158 having a positive taper shape has a seal line region even when the application direction of the dispense (not shown) is changed to apply the sealant 125 to the seal line region P3 on the four sides of the organic EL display element. By not covering P3, the problem that the sealant 125 is not evenly applied to the four corner regions of the seal line region P3 can be eliminated. Therefore, the organic EL display device according to the embodiment of the present invention improves the yield by eliminating the defects of the bonding between the substrate 102 and the cap 170 to reduce the defects of the organic EL display device.

Hereinafter, a method of manufacturing an organic EL display device according to an exemplary embodiment of the present invention will be described with reference to FIGS. 8A to 8E.

Referring to FIG. 8A, a transparent conductive material, such as indium tin oxide (ITO), indium zinc oxide (IZO), or indium tin zinc oxide (ITZO), is deposited on the substrate 102 and then patterned, thereby forming the array region P1. An anode electrode 104 is formed in the.

Next, an insulating material is entirely coated on the substrate 102 and then patterned to expose the region where the organic light emitting layer 110 is to be formed on the anode electrode 104 of the array region P1 as shown in FIG. 8B. Is formed.

Subsequently, on the insulating layer 106 of the array region P1, an inverted taper-shaped partition 108 for separating the organic light emitting layer 110 and the cathode electrode 112 crosses the anode electrode 104 as shown in FIG. 8C. It is formed in the direction, and the protective partition wall 158 of the positive tapered shape is formed together to the left and right of the seal line region P3.

In addition, as shown in FIG. 8D, an organic light emitting material is deposited using a mask to form an organic light emitting layer 110 in the array region P1 on the substrate 102 on which the reverse taper-shaped partition 108 is formed. 112 is formed through full deposition of electrode material.

Thereafter, as shown in FIG. 8E, the sealant 125 is applied to the seal line region P3, and the substrate 102 and the cap 170 are bonded to each other through the sealant 125 to encapsulate the organic EL array of the array region P1. The organic EL display is completed.

In the method of manufacturing the organic EL display device according to the exemplary embodiment of the present invention, as described above, the reverse taper-shaped partition wall 108 of the array region P1 and the protective taper of positive taper shape on the left and right sides of the seal line region P3 ( 158 is formed in the same process. Referring to FIGS. 9A to 9E, a process of forming the reverse tapered partition 108 of the array region P1 and the protective partition 158 of positive taper shape on the left and right sides of the seal line region P3 will be described in detail. As follows.

Referring to FIG. 9A, the barrier rib material 108a and the photoresist 220 are entirely coated on the substrate 102 on which the insulating film 106 is formed in the array region P1.

Next, as shown in FIG. 9B, the opening 200a is formed in the region where the partition wall is to be formed in the array region P1 and the blocking portion 200b is formed in the other region. 1 The mask 200 is aligned and an exposure process is performed. In this case, the first mask 200 is aligned to be 40 to 60 μm apart from the substrate 102 to form the partition wall 108 formed in the array region P1 in a reverse taper shape. The first mask 200 is more preferably aligned to be 50 μm apart from the substrate 102 as shown in FIG. 9B.

Thereafter, the first mask 200 is removed, and the opening 210a is formed in the region where the protective partition wall is to be formed on the left and right sides of the seal line region P3 as shown in FIG. 9C on the substrate 102 on which the photoresist 220 is entirely coated. The second mask 210 having the blocking portion 210b is aligned in the and other regions, and an exposure process is performed. In this case, the second mask 210 is aligned on the substrate 102 so as to be spaced apart from the substrate 102 by 180 to 220 μm to form a protective partition wall formed on the left and right sides of the seal line region P3 in a positive taper shape. The second mask 210 is more preferably aligned to be 200 μm apart from the substrate 102 as shown in FIG. 9C.

Subsequently, the development process is performed on the photoresist 220 subjected to the exposure process using the first mask 200 and the second mask 210 to form a positive taper shape on the left and right sides of the seal line region P3 as shown in FIG. 9D. An inverse taper-shaped photoresist pattern 220a is formed in the photoresist pattern 220b and the array region P1.

Subsequently, an ashing process is performed using the photoresist patterns 220a and 220b as a mask, so that the partition 108 is disposed on the protective partition 158 and the array region P1 on the left and right sides of the seal line region P3 as shown in FIG. 9E. By removing the photoresist patterns 220a and 220b through the strip process, the barrier ribs 108 are formed in the protective barrier rib 158 and the array region P1 on the left and right sides of the seal line region P3 as shown in FIG. 9F. do.

Here, in the method of manufacturing an organic EL display device according to an exemplary embodiment of the present invention, a second portion having an opening 210a in a region where protective barrier ribs are formed on the left and right sides of the seal line region P3 and a blocking portion 210b in the other region is provided. After first aligning the mask 210 and performing an exposure process, the first mask 200 having the opening 200a in the region where the partition wall is to be formed in the array region P1 and the blocking portion 200b in the other region is aligned. The photoresist patterns 220a and 220b may be formed by performing an exposure process.

As described above, the organic EL display device and the method of manufacturing the same according to the exemplary embodiment of the present invention provide a sealant in the four corner regions of the seal line region P3 by forming a protective taper 158 having a positive taper shape in the seal line region P3. The problem that 125 is not evenly applied can be eliminated. Therefore, the organic EL display device and the method of manufacturing the same according to the embodiment of the present invention can improve the yield by eliminating the defect of the substrate 102 and the cap 170 to reduce the defect of the organic EL display device.

In addition, the organic EL display device of the present invention and its manufacturing method are formed by forming a positive tapered protective partition 158 in the seal line region P3 together with the reverse tapered partition 108 of the array region P1. In the case of forming the tapered protective barrier wall 158, the barrier material for forming the positive tapered protective barrier wall 158 is not required, thereby wasting waste material and forming a photoresist pattern in a developing process. The waste of the developer can be reduced.

As described above, the organic EL display device and the method of manufacturing the same according to the exemplary embodiment of the present invention provide a problem that the sealant is not evenly applied to the four corner regions of the seal line region by forming a protective taper of positive taper shape in the seal line region. Can be removed. Therefore, the yield is improved by eliminating the defect of bonding of a board | substrate and a cap and reducing the defect of an organic electroluminescent display element.

In addition, the organic EL display device of the present invention and the manufacturing method thereof form a positive tapered protective barrier 158 by forming a positive tapered protective barrier in the seal line region together with an inverted taper-shaped barrier rib in the array region. By not requiring a separate partition material, waste of the partition material and a waste of the developer for forming the photoresist pattern in the developing process can be reduced.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (10)

An array region including an anode electrode and a cathode electrode crossing each other with an organic light emitting layer interposed therebetween on a substrate; A cap bonded to the substrate through a sealant in a seal line region located outside the array region; An organic electroluminescent display device comprising a protective taper of positive taper shape parallel to the sealant while maintaining a predetermined distance from the left and right of the seal line region. The method of claim 1, An insulating film exposing a region where the organic light emitting layer is to be formed in the array region formed on the anode electrode; And an inverted taper-shaped partition wall formed on the insulating film in a direction crossing the anode electrode. The method of claim 2, And the barrier ribs on the left and right sides of the seal line region and the barrier rib in the array region are made of the same material. Forming an anode electrode in an array region on the substrate; Maintaining a predetermined distance on the left and right sides of the seal line region located outside the array region, and forming a protective taper having a positive taper shape parallel to the sealant applied to the seal line region; Forming a cathode electrode intersecting the anode electrode with an organic light emitting layer interposed therebetween in the array region; And attaching the cap and the substrate through the sealant. The method of claim 4, wherein Forming an insulating layer in the array region where the anode electrode is formed to expose a region where the organic light emitting layer is to be formed; And forming an inverted taper-shaped partition wall formed on the insulating film in a direction crossing the anode electrode. The method of claim 5, And the barrier ribs on the left and right sides of the seal line region and the barrier rib in the array region are formed in the same process. The method of claim 6, The process of forming the barrier ribs in the protection barrier and the array region on the left and right of the seal line region, Applying a barrier material to the entire surface of the substrate on which the insulating film is formed; Front coating the photoresist on the barrier material; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the partition wall is to be formed; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the protective barrier is to be formed; Forming a positive tapered photoresist pattern on the left and right sides of the seal line region and an inverse tapered photoresist pattern on the array region through a developing process; And patterning the barrier ribs on the left and right sides of the seal line region and the barrier ribs on the array region using the photoresist pattern as a mask. The method of claim 6, The process of forming the barrier ribs in the protection barrier and the array region on the left and right of the seal line region, Applying a barrier material to the entire surface of the substrate on which the insulating film is formed; Front coating the photoresist on the barrier material; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the protective barrier is to be formed; Aligning and exposing a mask on the substrate, the mask having an opening in a region where the partition wall is to be formed; Forming a positive tapered photoresist pattern on the left and right sides of the seal line region and an inverse tapered photoresist pattern on the array region through a developing process; And patterning the barrier ribs on the left and right sides of the seal line region and the barrier ribs on the array region using the photoresist pattern as a mask. The method according to claim 7 or 8, And the first mask is spaced apart from the substrate at intervals of 40 to 60 μm and aligned on the substrate. The method according to claim 7 or 8, And the second mask is spaced apart from the substrate at intervals of 180 to 220 μm and aligned on the substrate.

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