KR101373969B1 - Electro luminescence display panel - Google Patents

Abstract

The electroluminescent display panel according to the present invention is to form a dummy to prevent the spread of the sealant, to secure a certain distance between the dummy and the adhesive surface, to prevent the spread of the sealant during bonding through the guide of the dummy At the same time, the curing reliability of the sealant can be improved.

Smear, sealant, adhesion, cap, substrate, dummy, insulation film, electroluminescent, EL, OLED, sealant, frit

Description

Electroluminescence display panel {Electro luminescence display panel}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroluminescent display panel, and more particularly, to an electroluminescent display panel that prevents the sealing agent from spreading to an undesired area when the cap and the substrate are bonded by using a sealing agent.

In recent years, research on new light emitting devices has been actively conducted in conjunction with miniaturization and thinning of display devices.

Among them, organic EL (OLED: Organic Light Emitting Diode / Display) and hybrid EL have been studied, and have been applied to real products.

Organic EL refers to a 'self-emitting organic material' that emits light by using an electroluminescence phenomenon that emits light when current flows through an organic compound. It can be driven at low voltage and can be made thin and thin. It has a wide viewing angle and fast response speed, so unlike ordinary LCD, the image quality does not change even when viewed from the side, and no afterimages are left on the screen. In addition, the small screen has an advantageous price competitiveness due to the image quality of the LCD and the simple manufacturing process.

Hybrid EL is a technology proposed to realize lower power driving and longer life than organic EL, and it is a combination of inorganic and organic electroluminescent (EL), and broadly the concept of organic EL. It may also be included.

Looking at the manufacturing process of such an organic or hybrid EL, as shown in FIG. 1, when the substrate 10 and the cap 20 are bonded to each other, a sealant 30 such as a liquid sealant or a frit that is a glass material is formed. I use it.

The sealant 30 is an element used for sealing and adhering the cap and the substrate. The sealant 30 is used to bond the cap between the substrate 10 and the cap 20.

The sealant 30 is spread between the substrate and the cap by the pressure at the time of bonding the substrate and the cap, as shown in Figure 2, when the sealant is spread to the undesired area of the substrate due to the smear The same problem arises.

After the substrate and the cap are in close contact with each other, a curing UV or curing UltraViolet or a laser is incident through the substrate having transparency (light transmission) to cure the sealant. In this case, the sealant 30 The device structure or non-transmissive (opaque, non-transmissive) when is smeared to the area where the device structure formed on the substrate is disposed or with another material covering the device structure (a material having a hard ultraviolet radiation rate or a low transmittance of laser) The material does not receive the cured ultraviolet light or laser and the sealant a generates a region that does not cure.

The sealant of the uncured region a is left inside the electroluminescent device, which adversely affects malfunctions and breakages during operation of the electroluminescent device.

This phenomenon is particularly noticeable when the adhesion of the substrate to the cap is made in a shift state where the position of the cap is undesirably changed.

In the above example, the organic and hybrid electroluminescent devices have been described. However, in the apparatus for adhering a predetermined cap and a substrate using a sealant, all of these problems have been encountered.

Therefore, in the present invention, as a countermeasure against this, the bleeding of the sealant used to bond the cap and the substrate in the manufacture of the electroluminescent device is prevented, and also the adhesion error due to the shift of the cap that is not desired when the cap and the substrate are bonded. An electroluminescent display panel can be provided.

As a result, the cap and the substrate are reliably adhered using the sealant, and at the same time, the malfunction of the electroluminescent device, which is expected to occur due to the smearing of the sealant, is to be prevented.

To this end, the present invention is a substrate; A cap that adheres to the substrate using a sealant to seal a portion of the substrate; At the time of adhering the cap, at least one portion of the substrate and the adhesive surface of the substrate to which the cap is to be attached includes a dummy formed between the anti-smearing area where the sealant does not spread. It is done.

In this case, the anti-smear zone includes at least a zone C1 including an element structure among the zones of the substrate sealed by the cap, and the dummy is spaced apart from the adhesive surface of the substrate to which the cap is bonded by A1. To be formed.

Here, A1 is represented by Equation 1 below.

Equation 1

50 μm ≦ A1 ≦ 500 μm

It is desirable to satisfy.

On the other hand, the anti-smear zone may further comprise a zone C2 which is not sealed by the cap, wherein the dummy formed in the C2 has a predetermined distance A2 between the adhesive surface of the substrate to which the cap is bonded A2 is represented by the following Equation 2

Equation 2

50㎛≤A2≤500㎛ or Open (Dummy not formed)

It is desirable to satisfy.

In this case, C2 is represented by Equation 3 below.

Equation 3

0 (Open) ≤C2≤1mm

Is satisfied.

In addition, the dummy is preferably formed to have an inclined surface to guide the cap adhered to the substrate.

The present invention is a substrate; A cap that adheres to the substrate using a sealant to seal a portion of the substrate; Another aspect of the present invention includes an insulating film formed on the substrate at a predetermined interval with respect to the adhesive surface of the substrate to which the cap is attached when the cap is attached.

Another feature of the present invention includes an insulating film formed on the substrate at a predetermined interval between the cap and the substrate when the cap is bonded by using a sealant.

Here, when the predetermined interval is divided into a constant interval A1 of the region sealed by the cap and a constant interval A2 of the region not sealed by the cap,

A1 and A2 are represented by Equation 5 below.

Equation 5

50 μm ≦ A1 ≦ 500 μm

50㎛≤A2≤500㎛ or Open (Open, no insulation film formed)

To satisfy the above, it is preferable that the end of the insulating film is formed in a dummy shape.

In summary, the present invention forms a predetermined pile in the case of adhering the cap and the substrate to at least one portion of the substrate between an area where the sealant does not spread (smear prevention area) and an adhesive surface of the substrate to be bonded to the cap. This prevents the spread of the sealant. In addition, by having a predetermined interval between the adhesive surface of the substrate to which the cap is bonded and the dummy prevents the cap from invading the dummy by the shift of the cap to adhere to the substrate. In addition, by forming the dummy as a guide to prevent the shift of the cap itself.

According to the present invention, it is possible to provide a reliable and stable electroluminescent display panel.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 illustrates an electroluminescent display panel according to an exemplary embodiment of the present invention, wherein a substrate 110, a cap 120 having a predetermined shape adhered to the substrate, and the substrate 110 and the cap 120 are formed. A sealant 130 for adhering and sealing is disclosed.

At least one portion of the sealant 130 between the substrate 110 and the cap 120 due to pressure when the cap 120 is adhered to the substrate 110 is an area where the sealant does not spread. The dummy 140 is formed between the cap and the adhesive surface of the substrate to be bonded so as not to spread.

By forming the dummy 140 on the substrate, when the sealant is smeared off the adhesive surface of the substrate and the cap, it serves as a breakwater to prevent the sealant from spreading, thereby preventing the sealant from spreading to the smear prevention zone. do.

Although the position of the dummy is expressed as between the bleeding prevention zone and the adhesive surface, the dummy may overlap the circumference of the bleeding prevention zone. That is, as shown in FIG. 3, the bleeding prevention zone may be set from the inner end of the dummy 140, or may be set from the outer end or a predetermined point between the ends.

Preferably, the anti-smear zone comprises a zone C1 in which the device structure (electroluminescent (EL) stack in the case of an organic electroluminescent device) is provided in the area of the substrate 110 which is sealed by the cap 120. .

The device structure is an element disposed on a substrate, and in the organic electroluminescent device, it is generally responsible for an essential part of the device to be constituted by the substrate and the cap, such as the organic electroluminescent device and the wiring thereof.

Here, it should be noted that the connection line with the outside of the device structure may be arranged to pass through the cap, and the treatment of the bleeding prevention zone for this portion is a problem, but in the description of the present invention do.

On the other hand, the component of the dummy may be any component as long as it does not adversely affect the system operation in the sealing space formed by the cap, but is preferably formed of a component through which light is transmitted. This is for the case where the smeared sealant covers the dummy partly, and the curing ultraviolet rays are projected through the dummy to cure the smeared sealant. Of course, the shape of the dummy, or by forming a predetermined distance between the dummy and the adhesive surface to be described below may be formed of a component that does not transmit light.

Looking at Figure 3b, it can be seen that the dummy 140 is formed with a predetermined interval between the adhesive surface of the substrate 110 to which the cap 120 is bonded.

The constant interval is divided into a constant interval A1 on the side of the sealed area sealed by the cap and a constant distance A2 on the side of the unsealed area, and in some cases, a dummy may not be formed on the side of the unsealed area, so A2 is considered It can also happen if you do not.

In this way, the dummy is formed at a predetermined interval in order to give a certain amount of excess to the sealant spreading by the pressure at the time of adhering the substrate and the cap to invade the smear prevention area beyond the dummy 140, and the cap at the time of bonding ( This is to prevent a problem in the case where the adhesion is performed in the left and right movement of the 120, that is, the shifted state.

When the cap is adhered to the substrate, the cap is fine but undesirably shifted from side to side, i.e., shifted, and the dummy is formed on the substrate to fit the adhesive surface of the substrate to be bonded to the cap without a certain interval. In one case, the shifted cap is in contact with the dummy as shown in FIG. 4. In such a case, the sealant easily spreads to the bleed prevention zone, and the pile prevents the adhesion between the cap and the substrate.

Therefore, it is desirable to prevent the above problems by forming a constant interval in anticipation of the degree of shift of the cap.

For reference, the above mentioned adhesive surface of the substrate to which the cap is to be attached refers to the position where the cap is normally attached without an unwanted shift.

As described above, the constant interval forms a constant interval A1 toward the region sealed by the cap and forms a constant interval A2 on the unsealed region, wherein the constant interval A1 is the size and position of the device structure, Although it is determined in consideration of the size of the adhesive surface and the degree of shifting, it is generally preferable to satisfy the following equation (1).

50 μm ≦ A1 ≦ 500 μm

50㎛≤A2≤500㎛ or Open (Dummy not formed)

0 (Open) ≤C2≤1mm

When A1 and A2 are smaller than 50 μm, the margin for the area where the sealant spreads is small, so that the sealant may invade beyond the pile, so that A1 and A2 are 50 μm or more, and A1 and A2 are 500 μm. If larger, the size of the panel becomes larger, and therefore, A1 is preferably 500 µm or less.

The C2 is a bleeding prevention area of the area not sealed by the cap. When the thickness exceeds 1 mm, the overall size of the display panel increases due to the size of the substrate deviating from the outside of the cap, thereby counteracting the trend of miniaturization. Is preferably within 1 mm. In addition, when C2 is 0, that is, the sealant is formed to be inclined to the outside of the adhesive surface (the part not covered by the cap).

The sealant may be a liquid sealant or a frit that is a glass material. When a liquid sealant is used, when the sealant covers the pile, hardening infrared rays may not be received depending on the material of the pile. Since there may be a sealant that is generated and not cured, it is desirable to allow a certain amount of margin so that the dummy is not covered by the sealant. In the case of frit, it is basically solid state and it becomes liquid state by laser irradiation only when it is bonded, and it returns to solid state by itself after irradiation, so there is no problem like the sealant described above, but the cap is shifted undesirably and adhered to the substrate. In this case, since the adhesion is made at the position of the dummy, not the adhesion of the cap and the substrate, but the adhesion of the cap and the dummy is made, there is a problem in the adhesive force. Of course, this problem also applies to the sealant.

For reference, the dummy may be formed of various materials. For example, it may be formed by an insulating film described below, or may be formed by using a transparent conductive film such as indium oxide (ITO) film according to the arrangement state of the device structure in the region sealed by the cap. In particular, when the transparent conductive film is disposed outside the device structure, the transparent conductive film may be used as the dummy by adjusting the arrangement position.

Looking at another method for the shift of the cap through Figure 5, it can be seen that the dummy 145 is formed to be inclined in the direction to which the cap is to be bonded.

That is, when the cap 120 is bonded to the substrate 110, the inclined surface is formed on the dummy 145 to guide the cap 120, and the dummy 145 is used as a sealant bleeding prevention and guide. have.

In this configuration, even if the cap is shifted, the cap is adhered to the correct position according to the guide of the dummy, thereby preventing the cap from adhering to the dummy, and furthermore, the cap and the substrate are accurately bonded. Induction can improve the performance of the electroluminescent device.

Of course, it will be possible to simultaneously form a predetermined interval and the inclined surface for the guide.

On the other hand, the dummy is preferably made of a transparent material as described above, but may be an opaque material according to the structure and placement position of the dummy, for example, a transparent insulating film or an insulating film having low light transmittance. It is possible to form a dummy, which will be described.

FIG. 6 is a schematic view illustrating an electroluminescent display panel according to another exemplary embodiment of the present invention. When the insulating layer 150 is formed on the substrate 110 to cover the device structure formed on the substrate 110, the substrate ( A predetermined interval is formed in the adhesive surface of the cap 120 with the cap 120 (inside the panel or inside the device covered by the cap) and outside (outside the panel or outside the device not covered by the cap). It can be seen that the insulating layer 150 is not formed at intervals.

As such, when the insulating layer 150 is formed at a predetermined interval between the adhesive surface of the substrate to which the cap is to be bonded, the sealant 130 used for the adhesion when the substrate 110 and the cap 120 are bonded to each other. ) Spreads beyond the adhesive surface, the insulating film 150 is not covered due to the predetermined interval, and even when the cap 120 is shifted, the cap 120 is a substrate on which the insulating film 150 is not formed. Adhesion is made to the site corresponding to a certain interval of.

Thus, forming the insulating film at a predetermined interval is particularly useful when the insulating film has the following properties as the insulating film used in the manufacture of the organic electroluminescent device.

That is, when the adhesive force α of the sealant and the insulating film and the adhesive force β of the substrate and the sealant exhibit the characteristics as shown in Equation 4 below, the insulating film absorbs Curing UV, Curing UltraViolet, or laser. In the case of having a low transmittance, it is more preferable to have a certain interval.

α <β

If after forming the insulating film without a certain interval, when the amount of the sealing agent is smeared beyond the adhesive surface when the cap and the substrate is bonded more than specified, the smeared sealant will cover the insulating film.

In this case, due to the characteristics of the insulating film, cured UV light incident through the substrate may be blocked or absorbed by the insulating film, and thus may not reach the sealant covering the insulating film. This means that an uncured sealant is present, which will cause a malfunction or breakage in the operation of the system. Of course, this case is a problem in which the sealant is a liquid sealant at room temperature.

As another problem, in the case where the insulating film is formed without a predetermined interval, if the adhesive is made in the shifted state of the cap, the cap will be adhered to the insulating film as a result. Of course, it may be directly adhered to the substrate partly, but since it will be spaced apart by the thickness of the insulating film, the adhesion reliability between the substrate and the cap will be degraded. If the adhesion between the insulating film and the sealant is excellent, the problem will be reduced. However, as mentioned above, the adhesion between the insulating film and the sealant is set lower than that of the substrate and the sealant. There is a problem that can not be provided, this is the case both the sealant is a liquid sealant or a glass frit.

As a solution to this, in the present embodiment, a predetermined interval is provided inside and outside the adhesive surface of the substrate to be bonded to the cap.

By forming the constant interval, even if the sealant is smeared to spread only within the predetermined interval (adjustment for the constant interval should be made according to the amount of the sealant), even if an unwanted shift of the cap occurs, the constant interval, that is, the substrate Make sure that the adhesion is done in.

Of course, since the insulating film will also have a predetermined thickness, the insulating film may serve as a dummy as described in the previous embodiment. In particular, when the end of the insulating film is formed in a dummy shape as shown in Fig. 7, the same as in the above-described embodiment.

Meanwhile, the predetermined interval inside the adhesive surface of the cap and the substrate may be divided into a predetermined interval A1 of the region sealed by the cap and a predetermined interval A2 of the region not sealed by the cap, wherein A1 and A2 are as follows. It is preferable to satisfy the equation (5).

50 μm ≦ A1 ≦ 500 μm

50㎛≤A2≤500㎛ or Open (Open, no insulation film formed)

The open state means a state in which the insulating film is not formed, which is considered in consideration of the fact that the insulating film may not be formed on the outer portion which is not sealed by the cap.

On the other hand, the lower limit and the upper limit of the predetermined intervals A1 and A2 are determined for the same reason as in the case of Equations 1 and 2 described above, and when the insulating film is not on the outer side of the adhesive surface (only inside the panel covered by the cap) When there is no part to be a breakwater in the case of opening, that is, when the sealant (sealant or frit) is spread to the outside is formed to be inclined. The outer side of the adhesive surface may include a region of scribing in which the separation between modules eventually occurs, and the scribing region may have a lower spreading degree than other positions when the sealant is spread, so that the other region is heightened by the spreading sealant. Compared with the height is formed low.

In the above, the method of forming an insulating film at a predetermined interval and forming a dummy in order to prevent the spread of the sealant has been described. As mentioned above, the dummy may be formed of various materials, and in addition to the above-described insulating film, the dummy may serve as a dummy by adjusting the arrangement of the indium oxide film (ITO) used as the transparent conductive film. In addition, the indium oxide film is also formed to leave a certain amount of margin on the adhesive surface with the cap can enjoy the effect described in the previous insulating film as it is.

The above-described embodiment can be applied in the manufacture of various semiconductors for adhering a predetermined cap to a substrate using a sealant, and in particular, it is expected to be applied to a display manufacturing field such as an organic electroluminescent manufacturing field.

1 is a schematic representation of a prior art of adhering a cap and a substrate using a sealant.

Figure 2 is a schematic view showing a state in which the sealant after the adhesion in Figure 1 is spread.

3 is a schematic diagram illustrating an electroluminescent display panel according to an exemplary embodiment of the present invention.

4 is a schematic diagram illustrating a problem due to the shift of the cap in FIG.

5 is a schematic view showing the solution of FIG.

6 is a schematic diagram illustrating an electroluminescent display panel according to another exemplary embodiment of the present invention.

7 is a schematic diagram illustrating another embodiment of FIG. 6.

Description of the Related Art [0002]

110 ... substrate 120 ... cap

130.Seal 140, 145 ... pile

150 ... insulation film

Claims (12)

A substrate; A cap that adheres to the substrate using a sealant to seal a portion of the substrate; And an insulating film formed on the substrate at a predetermined interval with respect to the adhesive surface of the substrate to which the cap is to be bonded when the cap is attached, wherein the insulating film is wider than the adhesive surface of the substrate to which the cap is attached to the substrate. An electroluminescent display panel formed at a predetermined interval of an area. The method of claim 1, When the predetermined interval is divided into a predetermined interval A1 of the area sealed by the cap and a predetermined interval A2 of the area not sealed by the cap, A1 and A2 are represented by Equation 5 below. Equation 5 50 μm ≦ A1 ≦ 500 μm 50㎛≤A2≤500㎛ or Open (Open, no insulation film formed) An electroluminescent display panel characterized by satisfying the above. The method of claim 1, And the end portion of the insulating layer is formed in a dummy shape. A substrate; A cap that adheres to the substrate using a sealant to seal a portion of the substrate; At least one portion of the substrate and the adhesive surface of the substrate to which the cap is to be bonded when the cap is attached includes a pile formed between the anti-smear area where the sealant does not spread. And the dummy is formed of a transparent conductive film. 5. The method of claim 4, And wherein the anti-smear zone is a zone C1 that includes an element structure of the area of the substrate that is sealed by the cap. 6. The method of claim 5, And the dummy is formed at a predetermined distance A1 between the adhesive surface of the substrate to which the cap is attached. The method according to claim 6, A1 is represented by Equation 1 below. Equation 1 50 μm ≦ A1 ≦ 500 μm An electroluminescent display panel characterized by satisfying the above. 6. The method of claim 5, And wherein the anti-smear zone further comprises a zone C2 which is not sealed by the cap. 9. The method of claim 8, And the dummy formed in the C2 is formed at a predetermined interval A2 between the adhesive surface of the substrate to which the cap is attached. 10. The method of claim 9, A2 is represented by Equation 2 below. Equation 2 50㎛≤A2≤500㎛ or Open (Dummy not formed) An electroluminescent display panel characterized by satisfying the above. 11. The method of claim 10, C2 is the following Equation 3 Equation 3 0 (Open) ≤C2≤1mm An electroluminescent display panel characterized by satisfying the above. The method according to any one of claims 4 to 11, And the dummy has an inclined surface to guide the cap adhered to the substrate.

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