KR20070051716A - 반도체장치 - Google Patents

반도체장치 Download PDF

Info

Publication number
KR20070051716A
KR20070051716A KR1020060111975A KR20060111975A KR20070051716A KR 20070051716 A KR20070051716 A KR 20070051716A KR 1020060111975 A KR1020060111975 A KR 1020060111975A KR 20060111975 A KR20060111975 A KR 20060111975A KR 20070051716 A KR20070051716 A KR 20070051716A
Authority
KR
South Korea
Prior art keywords
region
insulating film
trench isolation
isolation insulating
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060111975A
Other languages
English (en)
Korean (ko)
Inventor
테쓰야 와타나베
타카시 이뽀시
Original Assignee
가부시끼가이샤 르네사스 테크놀로지
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 르네사스 테크놀로지 filed Critical 가부시끼가이샤 르네사스 테크놀로지
Publication of KR20070051716A publication Critical patent/KR20070051716A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6708—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect
    • H10D30/6711—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device for preventing the kink effect or the snapback effect, e.g. discharging the minority carriers of the channel region for preventing bipolar effect by using electrodes contacting the supplementary regions or layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/201—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates the substrates comprising an insulating layer on a semiconductor body, e.g. SOI
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment

Landscapes

  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Element Separation (AREA)
  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
KR1020060111975A 2005-11-15 2006-11-14 반도체장치 Withdrawn KR20070051716A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00329789 2005-11-15
JP2005329789A JP5000125B2 (ja) 2005-11-15 2005-11-15 半導体装置

Publications (1)

Publication Number Publication Date
KR20070051716A true KR20070051716A (ko) 2007-05-18

Family

ID=38041433

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060111975A Withdrawn KR20070051716A (ko) 2005-11-15 2006-11-14 반도체장치

Country Status (5)

Country Link
US (2) US7391095B2 (https=)
JP (1) JP5000125B2 (https=)
KR (1) KR20070051716A (https=)
CN (1) CN1967850A (https=)
TW (1) TW200729507A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160116104A (ko) * 2015-03-25 2016-10-07 삼성전자주식회사 전계 효과 트랜지스터를 포함하는 반도체 소자
KR20220166177A (ko) * 2021-06-09 2022-12-16 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 공유 웰 구조, 레이아웃, 및 방법

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5042518B2 (ja) * 2006-04-12 2012-10-03 ルネサスエレクトロニクス株式会社 半導体装置
US7790564B2 (en) * 2008-04-24 2010-09-07 International Business Machines Corporation Methods for fabricating active devices on a semiconductor-on-insulator substrate utilizing multiple depth shallow trench isolations
JP2010040630A (ja) * 2008-08-01 2010-02-18 Toshiba Corp 半導体装置
US20100308405A1 (en) * 2009-06-08 2010-12-09 International Business Machines Corporation Mosfet on silicon-on-insulator with internal body contact
US9786663B2 (en) 2013-08-23 2017-10-10 Qualcomm Incorporated Layout construction for addressing electromigration
US9972624B2 (en) 2013-08-23 2018-05-15 Qualcomm Incorporated Layout construction for addressing electromigration
US9691750B2 (en) * 2015-01-30 2017-06-27 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and layout method thereof
KR102318410B1 (ko) * 2015-04-01 2021-10-28 삼성전자주식회사 반도체 소자 및 이의 제조 방법
FR3070222A1 (fr) 2017-08-16 2019-02-22 Stmicroelectronics (Rousset) Sas Puce comprenant deux transistors mos en parallele
FR3070221B1 (fr) * 2017-08-16 2020-05-15 Stmicroelectronics (Rousset) Sas Transistors mos en parallele
CN115810371B (zh) * 2021-09-15 2025-06-20 长鑫存储技术有限公司 读出电路架构
US20240297091A1 (en) * 2023-03-03 2024-09-05 Qorvo Us, Inc. Heat sink for soi

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3778581B2 (ja) * 1993-07-05 2006-05-24 三菱電機株式会社 半導体装置およびその製造方法
US5976930A (en) * 1997-04-25 1999-11-02 Micron Technology, Inc. Method for forming gate segments for an integrated circuit
JP3416725B2 (ja) * 1999-08-24 2003-06-16 日本電信電話株式会社 絶縁ゲート型電界効果トランジスタおよびその製造方法
JP2002261292A (ja) * 2000-12-26 2002-09-13 Toshiba Corp 半導体装置及びその製造方法
JP2002246600A (ja) * 2001-02-13 2002-08-30 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2003174162A (ja) * 2001-12-06 2003-06-20 Mitsubishi Electric Corp 半導体装置
US6882027B2 (en) * 2003-05-28 2005-04-19 Infineon Technologies Ag Methods and apparatus for providing an antifuse function
US7190050B2 (en) * 2005-07-01 2007-03-13 Synopsys, Inc. Integrated circuit on corrugated substrate
US7265008B2 (en) * 2005-07-01 2007-09-04 Synopsys, Inc. Method of IC production using corrugated substrate
US7247887B2 (en) * 2005-07-01 2007-07-24 Synopsys, Inc. Segmented channel MOS transistor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160116104A (ko) * 2015-03-25 2016-10-07 삼성전자주식회사 전계 효과 트랜지스터를 포함하는 반도체 소자
KR20220166177A (ko) * 2021-06-09 2022-12-16 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 공유 웰 구조, 레이아웃, 및 방법
US12288786B2 (en) 2021-06-09 2025-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Shared well structure manufacturing method

Also Published As

Publication number Publication date
JP2007141916A (ja) 2007-06-07
US20080203479A1 (en) 2008-08-28
JP5000125B2 (ja) 2012-08-15
CN1967850A (zh) 2007-05-23
US7391095B2 (en) 2008-06-24
TW200729507A (en) 2007-08-01
US20070111409A1 (en) 2007-05-17
US7649238B2 (en) 2010-01-19

Similar Documents

Publication Publication Date Title
KR102940250B1 (ko) Finfet 기술의 반도체 레이아웃
US7649238B2 (en) Semiconductor device
US8338864B2 (en) Semiconductor device
US7834377B2 (en) Semiconductor integrated circuit device
US10748933B2 (en) Semiconductor device
JP7529121B2 (ja) 半導体装置
CN115136296B (zh) 半导体集成电路装置
US20070096154A1 (en) Standard cell
EP1315210A1 (en) Multi-threshold mis integrated circuit device and circuit design method thereof
US12284828B2 (en) Semiconductor device
US11217604B2 (en) Semiconductor device
US20170243888A1 (en) Layout structure for semiconductor integrated circuit
JPWO2012120599A1 (ja) 半導体装置
US9373611B2 (en) Semiconductor integrated circuit device
US5808346A (en) Semiconductor device structure which provides individually controllable body-terminal voltage of MOS transistors
US8471336B2 (en) Semiconductor integrated circuit including transistor having diffusion layer formed at outside of element isolation region for preventing soft error
US10396080B2 (en) Semiconductor device and method of manufacturing the same
KR100343147B1 (ko) 에스오아이 모스 트랜지스터를 구비한 반도체 소자 및신호 처리 장치
KR20020073249A (ko) 반도체 장치
JP2006019647A (ja) 半導体集積回路
US20250239524A1 (en) Integrated circuit providing power gating and method of designing the same
JP4787554B2 (ja) 入出力回路装置
JP2025099777A (ja) 半導体装置
KR20050028100A (ko) 반도체 메모리 장치
JP2013038107A (ja) 半導体装置及び半導体装置の製造方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000