KR20070006213A - Apparatus and method for manufacturing semiconductor devices - Google Patents

Abstract

An apparatus and a method for manufacturing a semiconductor device are provided to prevent an inflow of air within a frame into a container when a wafer is conveyed between the container and process equipment by using a load port, the frame, and a gas supplying member. A container(20) accommodating substrates is placed on a load port(100). A frame(200) is arranged between the load port and process equipment(10). A conveying robot(280) is installed on the frame to convey the substrate between the container placed on the load port and the process equipment. A gas supplying member supplies nitrogen gas or inert gas into the inside of the container through an inlet hole formed on a wall of the container so that the gas flows from the inside of the container placed on the load port toward the frame.

Description

Semiconductor device manufacturing apparatus and method {APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES}

1 shows schematically a device generally used for transferring substrates between a vessel and a process facility;

2 is a schematic view showing a semiconductor device manufacturing apparatus of the present invention;

3 and 4 are views for schematically showing an example of the opening and closing member installed in the container and the load port, respectively;

5 shows the flow of gas with the vessel placed in the load port; And

6 is a flow chart sequentially showing a method of manufacturing a semiconductor device of the present invention.

Explanation of symbols on the main parts of the drawings

10: process equipment 20: container

40: substrate transfer system 100: load port

200: frame 300: gas supply member

320 gas line 342 valve

400: opening and closing member 440: support plate

460: spring 480: blocking plate

490: pressing member 520: sensor

540: controller

TECHNICAL FIELD The present invention relates to an apparatus and method for manufacturing a semiconductor device, and more particularly, to an apparatus and method for transferring a wafer between a container containing a wafer and a processing facility.

As semiconductor chip size and circuit line width design rules become more sophisticated, the importance of pollution prevention is greatly increased. BACKGROUND OF THE INVENTION In the past, semiconductor manufacturing processes have been carried out in clean rooms maintained with relatively high cleanliness and open containers have been mainly used for the storage and transport of wafers. However, in recent years, in order to reduce the maintenance cost of the clean room, high cleanliness is maintained only in the process chamber and in some chambers associated with the process chamber, and relatively low cleanliness is maintained in the remaining regions. In addition, a container is used instead of an open container in order to prevent the wafers stored therein from being contaminated by foreign matter in the air in an area where low cleanliness is maintained. (front open unified pod).

As the diameter of the wafer is increased from 200 mm to 300 mm, the front of the process chamber is provided with a substrate transfer system such as an equipment front end module (EFEM) as a module for transferring wafers from the vessel into the process chamber. . The substrate transfer system value has a frame 910 that is locally maintained at a high cleanness level as described above, and within the frame 910 a robot 940 for transferring the wafer W from the container 920 to a process chamber (not shown). ) And a door opener (not shown) for opening and closing the door of the container 920. A blowing fan 952 and a contaminant that blow air downward in the frame 910 at an upper portion of the frame 910. Filter 954 is installed to remove the.

During transfer of the wafer W between the vessel 920 and the process chamber, a portion of the air in the frame 910 flows into the vessel 920 as shown in FIG. 1. There is a large amount of contaminants in the air in the frame 910. These are included in the air flowing into the frame 910 and include molecular contaminants not filtered by the filter 954 and contaminants introduced into the frame 910 from the process chamber. Contaminants contained in the air introduced into these containers 920 adversely affect the quality of the film formed on the wafer (W).

In addition, after the loading of the wafer W into the container 920 is completed, a natural oxide film is formed on the wafer W by the air contained in the container 920 when the container 920 is moved to perform another process. do.

An object of the present invention is to provide an apparatus and method for manufacturing a semiconductor device capable of preventing contaminants from entering the container when the wafer is moved between the container and the process chamber.

The present invention provides an apparatus for use in the manufacture of semiconductor substrates. The apparatus of the present invention comprises a load port in which a container for holding substrates is placed, a frame in which a transfer robot is disposed between the load port and the processing equipment to move the substrate between the container and the processing equipment, and the load port placed in the load port. And a gas supply member for supplying nitrogen gas or inert gas to the inside of the container through an inlet formed in the wall of the container so as to flow from the inside of the container toward the frame. Due to the above structure, it is possible to prevent the air in the frame from flowing into the container when the substrate is transferred between the container and the process equipment.

In one example, the inlet is formed in the lower wall of the vessel, and the gas supply member has a gas line formed in the load port to supply nitrogen gas or inert gas to the inlet of the vessel overlying the load port. .

The apparatus further includes an opening and closing member for opening and closing the inlet. The opening and closing member is a support plate installed inside the container, a blocking plate for opening and closing the inlet, an elastic body connecting the support plate and the blocking plate so that the blocking plate blocks the inlet of the container by the elastic force, and on the load port It is installed in, and includes a pressing protrusion for pressing the blocking plate to open the inlet when the container is placed on the load port. An injection hole may be formed at a portion of the sidewall of the push protrusion inserted into the container while the container is placed at the load port, and the gas line may extend to the injection hole.

Due to the above structure, when the container is placed on the load port, an inlet of the container is opened to provide a passage through which gas is introduced, and when the container is moved from the load port, the inlet of the container is closed so that the inside of the container is opened from the outside. It is sealed.

According to one example, the container has a body for receiving substrates and having a front open space and a door for opening and closing the front of the space, the device is installed in the frame and the door opening and closing the door from the body Is installed.

The apparatus may further include a sensor for detecting whether the container is placed on the load port and a controller for opening and closing a valve installed on a supply pipe receiving a signal from the sensor and supplying nitrogen gas or inert gas to the gas line. It may further include.

In addition, the present invention provides a semiconductor device using a semiconductor device manufacturing apparatus having a load port on which a container is placed and a frame disposed between the load port and the processing equipment, and a transfer robot for transferring a substrate between the container and the processing equipment. It provides a method of manufacturing. According to the present invention, nitrogen gas or inert gas is supplied into the vessel while the substrate is transferred between the vessel and the process equipment, and the nitrogen gas or the inert gas prevents contaminants in the frame from entering the vessel. It is fed through an inlet formed in the wall of the vessel so as to flow from the vessel in the direction toward the frame. The inlet may be formed in the lower wall of the container.

In one example, the nitrogen gas or inert gas begins to be supplied into the container before the door of the container is opened and the supply is stopped after the door of the container is closed.

In one embodiment, the container is provided with a blocking plate for opening and closing the inlet, and before the container is placed in the load port or before the container is moved to the load port, the inlet is opened by the elastic force of the elastic body coupled with the blocking plate. When the container is placed in the load port, the inlet is opened by pressing the blocking plate by the push protrusion provided in the load port, and a gas line for supplying nitrogen gas or inert gas to the container is provided in the load port. It can be formed in.

According to another embodiment of the present invention, the substrate manufacturing method of the present invention includes the steps of placing a container on the load port, supplying nitrogen gas or inert gas into the container, opening a door of the container, and receiving the container. And transferring the substrate by the transfer robot between the process equipment and the process equipment, closing the door of the container, and stopping supply of nitrogen gas or inert gas into the container. In order to prevent contaminants in the frame from entering the container, it is supplied through an inlet formed in the wall provided in the container to flow in the direction from the container toward the frame.

The method may further comprise detecting whether the container is placed on the load port. In one example, the step of supplying nitrogen gas or inert gas into the vessel is performed after sensing that the vessel is placed on the load port. Also, as an example, the step of stopping the supply of nitrogen gas or inert gas into the vessel is performed after sensing that the vessel has been moved from the load port.

Hereinafter, embodiments of the present invention will be described in more detail with reference to FIGS. 2 and 6. Embodiment of the present invention may be modified in various forms, the scope of the present invention should not be construed as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings are exaggerated for clarity.

In addition, in the present embodiment, the substrate is described using a wafer as an example. However, the substrate may be any other type of substrate used for fabricating integrated circuits.

2 is a view schematically showing a semiconductor device manufacturing apparatus 1 according to an embodiment of the present invention. The apparatus 1 has a substrate transfer system 40 for transferring the wafer W between the vessel 20 and the process equipment 10. The container 20 has a body 21 provided with an open front space and a door 22 opening and closing it. The inner wall of the body 21 is formed with a slot into which a portion of the edge of the wafer W is inserted. The slots are formed in a layered structure on the inner wall so that the wafers W can be placed side by side in the horizontal direction. The container 20 is sealed by the door 22 so that outside air does not flow in during the movement. As the vessel 20, a front open unified pod (FOUP) can be used.

The substrate transfer system 40 is located in front of the process facility 10. The process facility 10 has a loadlock chamber and a process chamber. The process chamber may be a chamber that performs a process such as chemical vapor deposition, etching, photo, measurement, or cleaning process.

The substrate transfer system 40 has a load port 100 on which the vessel 20 is placed and a frame 200 in which the interior is locally maintained with high cleanliness. For example, an equipment front end module (EFEM) may be used as the substrate transfer system.

The load port 100 has a generally flat top surface and is coupled to the frame 200 in front of the frame 200. One or more load ports 100 may be provided. The vessel 20 is placed on the load port 100 by a transfer device (not shown). As the transfer device, an overhead transfer (OHT), an overhead conveyor (OHC), an automatic guided vehicle (AGV), or the like may be used. The frame 200 is located between the process facility 10 and the load port 100.

Inside the frame 200, one or more transfer robots 280 are disposed to transfer wafers W between the container 20 placed on the load port 100 and the process facility 10. The frame 200 has a generally rectangular parallelepiped shape, and wafers between the frame 200 and the processing equipment 10 are transferred to a rear face 240 of the frame 200, which is a side surface adjacent to the processing equipment 10. An inlet 242 is formed which is a passage. In the front face 220 of the frame 200, which is a side surface adjacent to the load port 100, an opening 222, which is a passage for transferring a wafer between the container 20 and the frame 200, is formed. In the frame 200, a door opener 290 for opening and closing the door 22 of the container 20 is installed. The door opener 290 has a door holder 292 coupled to the door 22 of the container to separate the door 22 from the container 20 and an arm 294 for moving it.

The fan filter unit 250 is installed on the upper surface of the frame 200. The fan filter unit 250 is rotated by a motor and contaminants from the blower fan 252 that blows external air downward in the frame 200 and air disposed below the air is introduced into the frame 200. It comprises a filter 254 for filtering. An exhaust plate 270 is formed on the lower surface of the frame 200 to form exhaust ports through which air introduced into the frame 200 escapes.

When the container 20 is loaded in the load port 100, the door 22 is opened by the door opener 290. The wafer W in the vessel 20 is transferred to the process facility 10 by the transfer robot 280, and the wafer W having completed the process at the process facility 10 is again transferred by the transfer robot 280 to the vessel ( 20) are transported into. When all of the wafers W are transferred into the container 20, the door 22 is closed by the door opener 290. Various contaminants are present in the frame 200. The contaminants may be molecular contaminants contained in the air introduced from the outside by the fan filter unit 250 or contaminants introduced from the process facility 10 through the inlet 242. While the door 22 of the container 20 is open, contaminants present in the frame 200 may flow into the container 20. These adversely affect the properties of the thin film deposited on the wafer W, and form a native oxide film on the wafer W when the container 20 is moved with the door 22 closed.

In order to prevent this, the substrate supply system 40 is provided with a gas supply member 300. The gas supply member 300 supplies nitrogen gas or inert gas into the vessel 20. Hereinafter, nitrogen gas or inert gas is simply called gas. An inlet 24 is formed in the wall of the body 21, and the gas supply member 300 supplies gas into the vessel 20 through the inlet 24. Gas introduced into the vessel 20 flows from the vessel 20 toward the frame 200. This prevents air in the frame 200 from entering the vessel 20. The gas supply member 300 continuously supplies gas to the vessel 20 while the door 22 of the vessel 20 is opened. The gas supply member 300 starts to supply gas into the vessel 20 before the door 22 of the vessel 20 opens, and after the process is completed and the door 22 of the vessel 20 is closed, the vessel ( 20) Stop the supply of gas into the vessel.

According to an example, the gas supply member 300 supplies gas into the vessel 20 when the vessel 20 is placed in the load port 100, and when the vessel 20 is moved from the load port 100, the vessel ( 20) Stop the supply of gas into the vessel.

Next, an example of a structure for supplying gas into the vessel 20 from the gas supply member 300 will be described. 3 is a view schematically showing the internal structure of the container 20, and FIG. 4 is a view schematically showing the structure of the load port 100. The inlet 24 is formed in the lower wall 21a of the body 21, and the gas supply member 300 is provided in the load port 100. One or more inlets 24 are provided, and are formed in the edge region of the lower wall 21a to minimize the direct injection of gas into the wafer W accommodated in the vessel 20. Inlets 24 may be formed at each of the edges of the lower wall 21a of the vessel 20. While the container 20 is moving, the inlet 24 is blocked so that the space inside the container 20 is sealed from the outside. Inlet 24 is opened and closed by opening and closing member 400.

The opening / closing member 400 has a supporting plate 440, an elastic body 460, a blocking plate 480, and a pressing protrusion 490. The support plate 440, the blocking plate 480, and the elastic body 460 are provided in the container 20, and the push protrusion 490 is provided in the load port 100. A plurality of support rods 420 positioned to be spaced apart from each other are positioned around an area in which the inlet 24 is formed among the lower walls 21a of the body 21. The support rod 420 protrudes into the body 21 vertically from the lower wall 21a of the body 21. Support plates 440 are fixedly installed at the ends of the respective support rods 420. The support plate 440 is positioned to face the inlet 24. A blocking plate 480 is disposed between the support plate 440 and the inlet 24 so as to face the inlet 24. The blocking plate 480 is provided to have a larger area than the inlet 24 so that the edge region of the blocking plate 480 is in close contact with the peripheral area of the inlet 24. The blocking plate 480 is fixedly coupled to the supporting plate 440 by an elastic body such as a spring 460. That is, one end of the spring 460 is fixed to the blocking plate 480, and the other end of the spring 460 is fixed to the support plate 440. The spring 460 is coupled to the support plate 440 and the blocking plate 480 in a compressed state so that the blocking plate 480 can block the inlet opening 24 by the elastic force in the state that no force is applied from the outside.

The pressing protrusion 490 is installed to protrude upward from the upper surface of the load port 100. The push projections 490 are provided in the same number as the inlets 24 at positions corresponding to the inlets 24 when the vessel 20 is placed in the load port 100. When the container 20 is placed in the load port 100, the pressing protrusion 490 presses the blocking plate 480. The spring 460 is further compressed and the blocking plate 480 is spaced apart from the bottom wall 21a of the body 21. The push protrusion 490 has a length that can be sufficiently inserted into the body 21.

The gas line 320 to which gas is supplied is formed in the load port 100. The gas line 320 receives gas from an external gas storage unit (not shown) through the supply pipe 340. The supply pipe 340 is provided with a valve 342 for opening and closing the inner passage or adjusting the flow rate. As the valve 342, a solenoid valve which can be controlled by an electrical signal may be used. One or more injection holes 492 are formed on the sidewall of the pressing protrusion 490, and the gas line 320 extends to the injection hole 492 provided in the pressing protrusion 490. Gas supplied through the supply pipe 340 and the gas line 320 is injected to the outside through the injection port 492 formed in the pressing projection 490. The injection port 492 is formed at a height inserted into the vessel 20 of the side wall of the pressing projection 490.

The sensor 520 is mounted on the load port 100. The sensor 520 detects whether the container 20 is placed in the load port 100 and transmits it to the controller 540. As the sensor 520, various types of sensors such as a pressure sensor or an optical sensor may be used. The controller 540 receives a signal from the sensor 520 and controls the valve 342 installed in the above-described supply pipe 340. When sensor 520 senses that vessel 20 is placed in load port 100, controller 540 opens valve 342 to allow gas to be supplied to gas line 320. When sensor 520 senses that vessel 20 has been moved from load port 100, controller 540 shuts off valve 342 to block gas from being supplied to gas line 320.

A sufficient amount of gas supplied into the container 20 is supplied to allow the inside of the container 20 to maintain a higher pressure than the inside of the frame 200. This prevents air in the frame 200 from entering the vessel 20. In addition, the gas is continuously supplied into the container 20 until the door 22 is closed so that the inside of the container 20 has a nitrogen gas or an inert gas atmosphere after the container 20 is closed. This prevents the formation of the native oxide film on the wafer W accommodated in the container 20 while the container 20 is moved to another facility.

5 shows the flow of gas in a state where the vessel 20 is placed in the load port 100. When the vessel 20 is placed in the load port 100, the inlet 24 is opened, and the push projection 490 is inserted into the vessel 20. The gas supplied through the gas line 320 is introduced into the container 20 through the injection port 492 of the push protrusion 490. Some gas flows up the inner wall of the wafer W and flows in the direction toward the inside of the frame 200 through the space provided between the wafers W. This causes the flow of fluid in the boundary area between the frame 200 and the container 20 to flow from the container 20 toward the frame 200, thereby preventing air in the frame 200 from entering the container 20. do.

Next, an operation process of the apparatus of the present invention will be described with reference to FIG. 6. The inlet 24 of the vessel 20 remains closed by the blocking plate 480 before the vessel 20 is initially placed in the load port 100. The container 20 is placed on the load port 100 by the transfer device (step S10). When the vessel 20 is placed in the load port 100, the inlet 24 is opened by the push protrusion 490 and the push protrusion 490 is inserted into the vessel 20. At this time, the sensor 520 detects that the container 20 is placed in the load port 100, and transmits a signal corresponding thereto to the controller 540. The controller 540 opens the valve 342 to supply nitrogen gas or inert gas to the gas line 320. Gas is injected into the vessel 20 through the injection port 492 provided in the push projection 490. The inside of the container 20 is maintained at a higher pressure than the inside of the frame 200 (step S20).

After that, the door 22 of the container 20 is opened and the front of the body 21 is opened (step S30). The gas in the container 20 flows in the direction toward the inside of the frame 200, and blocks the air in the frame 200 from flowing into the body 21. The wafer W in the container 20 is sequentially transferred to the process facility 10 by the transfer robot 280, and the process is performed in the process chamber. The wafer W after the process is completed is transferred to the container 20 again by the transfer robot (step S40). When the process is completed for all the wafers W in the container 20, the door 22 is closed (step S50).

The interior of the vessel 20 is formed in an atmosphere of nitrogen gas or inert gas, and the vessel 20 is moved to another process facility 10. When the container 20 is spaced apart from the load port 100, the blocking plate 480 is in close contact with the lower wall 21a of the container 20 by an elastic force to block the inlet 24. The sensor 520 detects the movement of the container 20 from the load port 100, and transmits a corresponding signal to the controller 540. The controller 540 shuts off the valve 342 and stops supplying gas to the gas line 320 (step S60).

According to the present invention, it is possible to prevent the air in the frame from flowing into the container when the wafer is transferred between the container and the processing equipment.

According to the present invention, the inside of the container can be formed in a nitrogen gas or an inert gas atmosphere while the container is in motion.

Claims (18)

In the apparatus for manufacturing a semiconductor element, A load port on which a container containing the substrates is placed; A frame disposed between the load port and the process facility, and having a transfer robot configured to transfer a substrate between the container placed at the load port and the process facility; And a gas supply member for supplying nitrogen gas or inert gas to the inside of the container through an inlet formed in the wall of the container so as to flow from the inside of the container placed in the load port toward the frame. Device manufacturing apparatus. The method of claim 1, The inlet is formed in the lower wall of the container, And the gas supply member has a gas line formed in the load port and supplying nitrogen gas or inert gas to an inlet of the vessel on the load port. The method of claim 2, The apparatus further includes an opening and closing member for opening and closing the inlet of the container, The opening and closing member, A support plate installed in the container; A blocking plate installed in the container to open and close the inlet; An elastic body connecting the supporting plate and the blocking plate so that the blocking plate blocks the inlet of the container by an elastic force; And And a push protrusion installed on the load port and pressing the blocking plate to open the inlet when the container is placed on the load port. The method of claim 3, wherein The injection hole is formed in a portion of the side wall of the pressing projection which is inserted into the container while the container is placed in the load port, The gas line extends to the injection hole. The method of claim 2, The container, A body for receiving substrates and having an open front space; Has a door for opening and closing the front of the space, The device further comprises a door opening and closing device which is installed on the frame and detaches the door from the body. The method of claim 2, The device, A sensor for detecting whether the container is placed on the load port; And a controller which receives a signal from the sensor and opens and closes a valve provided on a supply pipe for supplying nitrogen gas or inert gas to the gas line. The method of claim 2, The inlet is a semiconductor device manufacturing apparatus, characterized in that one or a plurality is formed in the edge region of the lower wall. A method for transferring a substrate in a semiconductor device manufacturing apparatus having a load port on which a container is placed and a frame disposed between the load port and the processing equipment, the frame having a transfer robot for transferring the substrate between the container and the processing equipment, While nitrogen or inert gas is supplied into the vessel while the substrate is transferred between the vessel and the process equipment, The nitrogen gas or inert gas is supplied into the vessel through an inlet formed in the wall of the vessel to flow in a direction from the vessel toward the frame to prevent contaminants in the frame from entering the vessel. A semiconductor device manufacturing method. The method of claim 8, Wherein the nitrogen gas or the inert gas begins to be supplied into the container before the door of the container is opened, and the supply is stopped after the door of the container is closed. The method of claim 8, The inlet is formed in the bottom wall of the container, characterized in that the semiconductor device manufacturing method. The method of claim 10, The container is provided with a blocking plate for opening and closing the inlet, the container is blocked by the elastic force of the elastic body coupled with the blocking plate before the container is placed in the load port or moved to the load port, the container Is placed in the load port, the inlet opening is opened by pressing the blocking plate by the pressing protrusion provided in the load port, A gas line for supplying nitrogen gas or inert gas to the vessel is formed in the load port. A method for transferring a substrate in a semiconductor device manufacturing apparatus having a load port on which a container is placed and a frame disposed between the load port and the processing equipment, the frame having a transfer robot for transferring the substrate between the container and the processing equipment, Placing a container on the load port; Supplying nitrogen gas or inert gas into the vessel; Opening the door of the container; Transferring a substrate by the transfer robot between the vessel and the process facility; Closing the door of the container; And Stopping supply of nitrogen gas or inert gas into the vessel, Wherein said nitrogen gas or inert gas is supplied through an inlet formed in a wall provided in said container to flow in a direction from said container toward said frame to prevent contaminants in said frame from entering said container; Device manufacturing method. The method of claim 12, The method further comprises sensing whether the container is placed on the load port. The method of claim 13, Supplying nitrogen gas or inert gas into the vessel is performed after sensing that the vessel is placed on the load port. The method of claim 13, Discontinuing supply of nitrogen gas or inert gas into the vessel after sensing that the vessel has been moved from the load port. The method of claim 12, And the wall on which the inlet is formed is a lower wall of the container. The method of claim 16, The container is provided with a blocking plate for opening and closing the inlet, the container is blocked by the elastic force of the elastic body coupled with the blocking plate before the container is placed in the load port or moved to the load port, the container Is placed in the load port, the inlet opening is opened by pressing the blocking plate by the pressing protrusion provided in the load port, A gas line for supplying nitrogen gas or inert gas to the vessel is formed in the load port. The method of claim 17, The injection hole is formed in a portion of the side wall of the pressing projection which is inserted into the container while the container is placed in the load port, The gas line extends to the injection hole.

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