KR20060077969A - 재작업이 가능한 고신뢰성 반도체 소자 언더필용 액상에폭시 수지 조성물 및 이를 이용한 반도체 소자 - Google Patents
재작업이 가능한 고신뢰성 반도체 소자 언더필용 액상에폭시 수지 조성물 및 이를 이용한 반도체 소자 Download PDFInfo
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- KR20060077969A KR20060077969A KR1020040116621A KR20040116621A KR20060077969A KR 20060077969 A KR20060077969 A KR 20060077969A KR 1020040116621 A KR1020040116621 A KR 1020040116621A KR 20040116621 A KR20040116621 A KR 20040116621A KR 20060077969 A KR20060077969 A KR 20060077969A
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- epoxy resin
- formula
- resin composition
- liquid epoxy
- semiconductor
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- 239000000203 mixture Substances 0.000 title claims abstract description 41
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 239000003822 epoxy resin Substances 0.000 claims abstract description 31
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 31
- 239000011256 inorganic filler Substances 0.000 claims abstract description 15
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920003986 novolac Polymers 0.000 claims abstract description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004593 Epoxy Substances 0.000 claims abstract description 5
- 239000007788 liquid Substances 0.000 claims abstract description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 claims description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- 229940106691 bisphenol a Drugs 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000011049 filling Methods 0.000 abstract description 8
- 230000008646 thermal stress Effects 0.000 abstract description 7
- 230000035882 stress Effects 0.000 abstract description 6
- 229930185605 Bisphenol Natural products 0.000 abstract description 2
- 230000003139 buffering effect Effects 0.000 abstract description 2
- 239000007791 liquid phase Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 230000035939 shock Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012854 evaluation process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
- C08K5/1515—Three-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (9)
- 하기 [화학식 1]로 표시되는 에폭시 수지, 하기 [화학식 2] 및 [화학식 3]으로 표시되는 화합물 중 선택된 선형 에폭시 수지, 하기 [화학식 4]로 표시되는 경화제, 하기 [화학식 5]로 표시되는 경화촉매, 및 입자 크기가 0.5 ~10 ㎛인 무기충진재를 포함하는 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물.[화학식 1](상기 식에서 R은 수소 혹은 메틸기이다.)[화학식 2](상기 식에서 R은 수소 혹은 메틸기이고, n은 5~15의 정수이다.)[화학식 3](상기 식에서 R은 탄소수 5∼15의 알킬기이다.)[화학식 4](상기 식에서 R1∼R5는 각각 독립적으로 탄소수 1∼3의 알킬기, 수소원자 또는 알릴기이고, n은 0∼3의 정수이다.)[화학식 5](상기 식에서 R1∼R4는 각각 독립적으로 수소원자, 메틸기, 에틸기, 페닐기, 시아노에틸기, 벤질기 또는 수산기이다.)
- 제 1항에 있어서, 상기 에폭시 수지는 10∼45중량%, 상기 선형 에폭시 수지는 5~20중량%, 상기 경화제는 10∼45중량%, 상기 경화촉매는 1∼5중량%, 상기 무기충진재는 20∼60중량%인 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물.
- 제 1항에 있어서, 상기 무기충전재의 입자 크기가 1~ 10㎛이며, 그 함량이20~60중량%인 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물.
- 제 1항 또는 제 2항에 있어서, 상기 반도체 언더필용 액상 에폭시 수지 조성물은 점도가 3,000∼50,000cps인 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물.
- 제 1항 또는 제 2항에 있어서, 상기 에폭시 수지는 에폭시 당량이 150∼220이고, 점도가 300∼5,000cps인 비스페놀-A, 비스페놀-F, 수소화 비스페놀-A, 수소화 비스페놀-F 또는 이들의 2 이상의 혼합물인 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물.
- 제 1항 또는 제 2항에 있어서, 상기 에폭시 수지에는 나프탈렌계, 페놀노볼락계, 사이클로 알리파틱계, 아민계 다관능성 에폭시수지 또는 이들의 2 이상의 혼합물이 첨가되는 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물.
- 제 1항 또는 제 2항에 있어서, 상기 무기충진재는 평균입자가 0.5∼20㎛이고, 최대 입경이 80㎛을 넘지 않는 용융 또는 합성 실리카를 사용하는 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물
- 제 1항 또는 제 2항에 있어서, 상기 선형 에폭시 수지는 상기 [화학식 2] 및 상기 [화학식 3]의 혼합물인 것을 특징으로 하는 반도체 언더필용 액상 에폭시 수지 조성물.
- 청구항 1 내지 청구항 8 중 어느 한 항에 의하여 제조된 액상 에폭시 수지 조성물을 이용하여 제조된 것을 특징으로 하는 반도체 소자.
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KR1020040116621A KR100671136B1 (ko) | 2004-12-30 | 2004-12-30 | 재작업이 가능한 고신뢰성 반도체 소자 언더필용 액상에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
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KR1020040116621A KR100671136B1 (ko) | 2004-12-30 | 2004-12-30 | 재작업이 가능한 고신뢰성 반도체 소자 언더필용 액상에폭시 수지 조성물 및 이를 이용한 반도체 소자 |
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KR20060077969A true KR20060077969A (ko) | 2006-07-05 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100740895B1 (ko) * | 2005-12-30 | 2007-07-19 | 제일모직주식회사 | 재작업이 가능한 고신뢰성 반도체 사이드필용 액상 에폭시수지 조성물 및 이를 이용한 반도체 소자 |
KR101293784B1 (ko) * | 2008-12-30 | 2013-08-06 | 제일모직주식회사 | 반도체 칩 부착용 접착제 조성물 및 이를 이용한 반도체 소자 |
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JP2001151994A (ja) | 1999-11-26 | 2001-06-05 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
KR100529256B1 (ko) * | 2002-12-20 | 2005-11-17 | 제일모직주식회사 | 반도체 봉지용 액상 에폭시 수지 조성물 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100740895B1 (ko) * | 2005-12-30 | 2007-07-19 | 제일모직주식회사 | 재작업이 가능한 고신뢰성 반도체 사이드필용 액상 에폭시수지 조성물 및 이를 이용한 반도체 소자 |
KR101293784B1 (ko) * | 2008-12-30 | 2013-08-06 | 제일모직주식회사 | 반도체 칩 부착용 접착제 조성물 및 이를 이용한 반도체 소자 |
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