KR20060062698A - Structure for heat dissipation of integrated circuit chip, and display module equipped with the same - Google Patents

Abstract

SUMMARY OF THE INVENTION An object of the present invention is to effectively dissipate heat generated in an integrated circuit chip installed to drive a plasma display panel, to prevent damage to the integrated circuit chip, and thus to reliably and stably display the display panel. To provide a heat dissipation structure of an integrated circuit chip and a display module having the same, which can be driven and contribute to increase the lifespan. In order to achieve the above object, in the present invention, the display panel is coupled to the front side, the driving circuit on the rear side A chassis base having a substrate coupled thereto and having a reinforcing member configured to compensate for rigidity; A connecting cable electrically connecting the elements on the driving circuit board to the display panel while surrounding an end of the chassis base; An integrated circuit chip disposed on the upper surface of the reinforcing member so as to be connected to the connection cable to control a signal transmitted to the display panel; And a heat dissipation sheet disposed between the integrated circuit chip and the reinforcement member to facilitate heat transfer from the integrated circuit chip to the reinforcement member, and a predetermined surface roughness is applied to an upper surface of the reinforcement member in contact with the heat dissipation sheet. The present invention provides a heat dissipation structure of an integrated circuit chip having a rough surface and a display module having the same.

Description

Structure for heat dissipation of integrated circuit chip, and display module equipped with the same

1 is a perspective view showing an example of a display module.

2 is a cross-sectional view taken along the line II-II of FIG.

3 is a view showing a heat dissipation structure of an integrated circuit chip according to the present invention.

4 illustrates the definition of surface roughness used in the present invention.

5 is a view showing a modification of the heat dissipation structure of the integrated circuit chip according to the present invention shown in FIG.

6 is a view showing another embodiment of a heat dissipation structure of an integrated circuit chip according to the present invention.

7 is a view showing a modification of the heat dissipation structure of the integrated circuit chip according to the present invention shown in FIG.

Explanation of symbols on the main parts of the drawings

10: chassis 11, 111: chassis base

12, 112: reinforcing member 20: connecting cable

21: integrated circuit chip 22: bump

24, 24 ": thermally conductive resin 25, 25": phase change material

30, 31: heat dissipation sheet for integrated circuit chip 40: drive circuit board

50: display panel 51: front display panel

52: Rear display panel 53: Heat dissipation sheet for panel

54: double-sided tape 60: cover plate

61: bolt 111a: bend

The present invention relates to a heat dissipation structure of an integrated circuit chip and a display module having the same, and more particularly, to an integrated circuit chip capable of effectively dissipating heat generated from an integrated circuit chip and protecting the integrated circuit chip from an external impact. It relates to a heat dissipation structure and a display module having the same.

FIG. 1 is a perspective view illustrating an example of a display module used in a plasma display device among flat panel display devices.

As shown in FIG. 1, the display module used in the plasma display apparatus includes a display panel 50, a predetermined number of driving circuit boards 40 and circuits for driving the display panel 50, and the display panel. 50 and a chassis 10 for supporting the driving circuit boards 40.

The display panel 50 is made by bonding the front substrate 51 and the rear substrate 52 to each other, and is electrically connected to the driving circuit boards 40 by the connection cable 20.

The chassis 10 should have sufficient rigidity because the display panel 50 is supported on the front surface and the driving circuit board is supported on the rear surface of the chassis 10. On the other hand, the chassis 10 is preferably made thin so that the weight of the entire plasma display device is not too large. Accordingly, conventionally, as shown in FIG. 1, the reinforcing member 12 is further coupled to the chassis base 11 to support both the display panel 50 and the driving circuit board by the thin chassis base 11. Chassis was used. The chassis base 11 serves as a ground of a circuit connected to the display panel 50 and the driving circuit boards 40 in addition to the function of supporting the display panel 50 and the driving circuit boards 40. In addition, the display panel 50 may radiate heat generated during operation to the outside to cool the display panel 50. The connection cable 20 is a connection cable called a tape carrier package (TCP), and a plurality of conductors extend in the longitudinal direction of the connection cable 20, and at least some of the conductors Via an integrated circuit chip 21 mounted on the connection cable 20. The integrated circuit chip 21 is fixed on the reinforcement member 12, and the connection cables 20 and the integrated circuit chip 21 are fixed on the reinforcement member 12 on the reinforcement member 12. The cover plate 60 to be protected is coupled. Since the integrated circuit chip 21 located in the connection cable 20 generates a lot of heat in the process of processing the high-speed address signal, it is very important to cool the heat.

2 is a cross-sectional view taken along the line II-II of FIG. 1.

As shown in FIG. 2, the conventional integrated circuit chip heat dissipation structure includes a cover plate 60 covered on the integrated circuit chip 21 located on the upper surface of the reinforcing member. Since the cover plate 60 is made of a material having good thermal conductivity, the cover plate 60 can release heat generated during operation in the integrated circuit chip 21. In addition, an integrated circuit chip heat dissipation sheet 31 is provided between the cover plate 60 and the integrated circuit chip 21 to increase the heat dissipation effect.

In order to generate an image by discharging the plasma display panel in response to an image signal applied from the outside, the integrated circuit chip 21 has electrodes (eg, electrodes) provided inside the plasma display panel 50 having a potential corresponding to the image signal. (Not shown). Since the integrated circuit chip 21 must process several signals at the same time quickly and perform many switching operations for a short time to process the signals, a large amount of heat is generated. On the other hand, since the integrated circuit chip 21 is driven at a high voltage, it is relatively expensive, and there is a great need to properly dissipate heat generated during operation to prevent breakage.

In a heat dissipation structure using a heat dissipation sheet 31 and a cover plate 60 for a conventional integrated circuit chip, the heat dissipation sheet 31 or the cover plate 60 for an integrated circuit chip is provided to be in contact with the integrated circuit chip 21. In the process, the cover plate 60 and the heat dissipation sheet 31 for the integrated circuit chip are connected to the integrated circuit chip by using a fastening member 61 such as a bolt to maintain the contact portion closely so that heat transfer is performed well. It is installed by compressing it to the surface of 21). At this time, a heavy load is often applied to the integrated circuit chip 21, and thus, the expensive integrated circuit chip 21 is often damaged. Further, when the contact portion between the integrated circuit chip 21 and the heat dissipation sheet 31 or the cover plate 60 for the integrated circuit chip 21 is not held in close contact, such as when the screw is loosened, the integrated circuit chip 21 There is a problem such that it does not effectively block the rise of temperature, affects the operating performance of the integrated circuit chip, causing a decrease in the reliability of operation of the overall display device.

In order to improve this, the heat dissipation sheet 30 for integrated circuit chips has been further improved between the bottom of the integrated circuit chip 21 and the bent portion of the chassis base.

Even in this case, an air layer is formed at the contact portion between the integrated circuit chip and the heat dissipation sheet for the integrated circuit chip so that heat generated during operation in the integrated circuit chip cannot be smoothly discharged through the bent portion or the reinforcing member of the chassis base, There is a problem that the heat insulation effect is deteriorated.

Accordingly, there is a need for development of a heat dissipation structure capable of more effectively dissipating heat generated from the integrated circuit chip 21.

The present invention is to solve the above problems, an object of the present invention, an integrated circuit chip heat dissipation structure that can effectively release the heat generated during operation in the integrated circuit chip used in conjunction with the flexible circuit board or cable To provide.                         

In addition, in the display module in which the integrated circuit chip is used, not only the heat generated from the integrated circuit chip can be effectively released, but also the damage of the integrated circuit chip due to the stress applied to the integrated circuit chip in the assembly process can be prevented. Accordingly, the present invention provides a heat dissipation structure of an integrated circuit chip and a display module having the same, which contributes to manufacturing and operating a display module reliably and stably, thereby reducing manufacturing costs and increasing the life of the finished product.

In addition, by preventing the formation of an air layer between the integrated circuit chip and the heat dissipation sheet for the integrated circuit chip, the heat generated during operation in the integrated circuit chip can be smoothly discharged through the bent portion or the reinforcing member of the chassis base It is to provide a heat dissipation structure and a display module having the same.

An object of the present invention as described above, the front panel is coupled to the display panel, the rear side is coupled to the driving circuit board, the chassis base is disposed to reinforce the rigidity; A connecting cable electrically connecting the elements on the driving circuit board to the display panel while surrounding an end of the chassis base; An integrated circuit chip disposed on the upper surface of the reinforcing member so as to be connected to the connection cable to control a signal transmitted to the display panel; And a heat dissipation sheet disposed between the integrated circuit chip and the reinforcement member to facilitate heat transfer from the integrated circuit chip to the reinforcement member, and a predetermined surface roughness is applied to an upper surface of the reinforcement member in contact with the heat dissipation sheet. Branch is achieved by providing a heat dissipation structure of the integrated circuit chip having a rough surface or a display module having the same.

Here, the surface roughness of the rough surface formed on the reinforcing member is preferably 200 μm to 700 μm, or 1 to 70/20 of the thickness of the heat dissipation sheet.

Here, in the reinforcing member, a rough surface having a predetermined surface roughness may be formed on the other surface in contact with the atmosphere besides the surface facing the integrated circuit chip.

Here, a cover plate is further provided on the integrated circuit chip to protect the integrated circuit chip from external shocks and to dissipate heat generated from the integrated circuit chip, and between the cover plate and the integrated circuit chip. It is preferable that a heat radiation sheet is further included.

In the meantime, the display panel has a greater effect when the display panel is a plasma display panel.

On the other hand, an object of the present invention as described above, the display panel is coupled to the front, the driving circuit board is coupled to the rear, the chassis base is formed in the upper and lower ends; A connecting cable electrically connecting the elements on the driving circuit board to the display panel while surrounding the bent portion of the end of the chassis base; An integrated circuit chip disposed on an upper surface of the bent portion and connected to the connection cable to control a signal transmitted to the display panel; A cover plate covering an upper surface of the bent portion in which the integrated circuit chip is disposed; And a heat dissipation sheet disposed between the integrated circuit chip and the bent portion to facilitate heat transfer from the integrated circuit chip to the bent portion, wherein the top surface of the bent portion in contact with the heat dissipation sheet has a rough surface roughness. It can be achieved by providing a heat dissipation structure of the integrated circuit chip having a surface or a display module having the same.

Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. For the same member as the member described in the prior art, the same member number is used in describing the embodiment of the present invention below.

3 is a cross-sectional view showing a heat dissipation structure of an integrated circuit chip according to the present invention.

As shown in FIG. 3, the heat dissipation structure of the display panel according to the present invention includes a chassis base 11, a connection cable 20, an integrated circuit chip 21, and a heat dissipation sheet 30 for an integrated circuit chip.

The chassis base 11 is made of a thin plate and is provided with a reinforcing member 112 to reinforce its rigidity. The display panel 50 is coupled to the front surface of the chassis base 11 via the panel heat dissipation sheet 53 and the double-sided tape 54, and the driving circuit board 40 is coupled to the rear surface of the chassis base 11. The connection cable 20 is wound around the reinforcing member 112 to electrically connect the elements (not shown) on the driving circuit board and the display panel 50. The integrated circuit chip 21 is disposed to be connected to the connection cable 20 on the reinforcing member 112 to control a signal transmitted to the display panel 52. A cover plate may be further installed to cover the reinforcing member 112 in which the integrated circuit chip 21 is disposed to protect the integrated circuit chip 21 and the connection cable 20.

Since the cover plate 60 and the reinforcing member 112 are conducted with heat generated from the integrated circuit chip 21, it is preferable that the cover plate 60 and the reinforcing member 112 are made of a material having high thermal conductivity to emit a lot of heat. In addition, between the integrated circuit chip 21 and the reinforcing member 112, and between the integrated circuit chip 21 and the cover plate 60, heat dissipation sheets 30 and 31 for integrated circuit chips are respectively provided. Heat generated in the integrated circuit chip 21 is conducted through the reinforcing member 112 and the cover plate 60 so as to be smoothly dissipated.

The heat dissipation sheets 30 and 31 for the integrated circuit chip are made of a material having good thermal conductivity such as silicon, acrylic, urethane, and graphite, and ferrite based ultrafine particles or conductive fillers to further improve thermal conductivity. ) Can be produced by mixing.

The surface facing the integrated circuit chip 21 of the reinforcing member 112 is preferably formed as a rough surface having a predetermined surface roughness. As can be seen from the experimental results shown in Table 1 below, when a rough surface having roughness of 200 μm to 700 μm is formed, the contact area between the heat dissipation sheet 30 for the integrated circuit chip 30 and the reinforcing member 112 increases. Therefore, the heat transfer is more smoothly performed, and thus the temperature of the integrated circuit chip 21 is lowered.

Surface roughness Surface temperature of integrated circuit chip (℃) 100 70.0 200 64.0 300 63.5 400 62.0 500 62.2 600 63.7 700 64.2 800 70.0 900 73.0

The definition of surface roughness used in the test to obtain the above result is as follows. That is, as shown in FIG. 4, the sum of the length Rp from the average surface centerline to the maximum height and the length Rv from the minimum height was used as a value representing the surface roughness Ry. .

On the other hand, the ratio of the surface roughness of the upper surface of the reinforcing member 112 and the thickness of the integrated circuit chip 21 is approximately 1/70 to 1/20. If the surface roughness is 800 μm or more, the temperature of the integrated circuit chip 21 is further increased because an air layer is formed between the integrated circuit chip 21 and the cover plate 60 to exhibit a heat insulating effect. .

5 is a view showing a modification of the embodiment shown in FIG.

As shown in FIG. 5, the heat dissipation structure of the integrated circuit chip according to the present invention is rough as described above both on the surface where the reinforcing member 112 contacts the heat dissipation sheet 30 and on the surface exposed to other atmospheres. A surface is formed. As the rough surface is formed on the surface where the reinforcing member 112 is exposed to the atmosphere, heat generated during the operation of the integrated circuit chip 21 through the reinforcing member 112 may be more smoothly discharged.

6 is a view showing another embodiment of a heat dissipation structure of an integrated circuit chip according to the present invention.

As shown in FIG. 6, the heat dissipation structure of the integrated circuit chip according to another exemplary embodiment of the present invention uses a chassis base 111 having a bent portion 111a formed at an end thereof without providing a separate reinforcing member. 3 may be referred to as a modified form of the embodiment shown in FIG. That is, in the embodiment of FIG. 3, a rough surface having a predetermined surface roughness is formed on the upper surface of the reinforcing member 112. In the present embodiment, a predetermined surface is formed on the upper surface of the bent portion 111a formed at the end of the chassis base. A rough surface with surface roughness is formed. As such, even when the reinforcing member is not used, a rough surface having a predetermined surface roughness is formed on the bent portion 111a of the chassis base to facilitate heat transfer, thereby effectively absorbing heat generated by the integrated circuit chip 21 during operation. It can dissipate heat.

FIG. 7 is a view showing a modification of the embodiment shown in FIG. 6.

As shown in FIG. 7, the heat dissipation structure of the integrated circuit chip according to the present invention is described in detail on both the surface where the bent portion 111a and the heat dissipation sheet 30 contact each other and the surface exposed to the atmosphere. A rough surface having a predetermined roughness as described above is formed. Since the rough surface is formed on the surface where the bent portion 111a is exposed to the atmosphere, heat generated during the operation of the integrated circuit chip 21 through the bent portion 111a may be more smoothly discharged.

The heat dissipation structure of the integrated circuit chip 21 according to the present invention described above is very effective when applied to the plasma display module as shown in FIG.

That is, the integrated circuit chip 21 used in the plasma display module as shown in FIG. 1 generates a large amount of heat due to frequent switching action and high voltage driving. The integrated circuit chip 21 is formed of a semiconductor device for switching operation, and the semiconductor device is a relatively expensive component whose electrical characteristics are very sensitive to heat.

Therefore, when the heat dissipation structure of the present invention is applied, the contact portion between the reinforcement member 112 or the heat dissipation sheet 30 for the integrated circuit chip 30, which is a heat transfer medium disposed between the bent portion 111a of the chassis base and the integrated circuit chip 21, is applied. Can be kept intact without applying compressive stress to the integrated circuit chip 21. Accordingly, the heat generated from the integrated circuit chip 21 may be sufficiently discharged to the reinforcing member 112 or the bent portion 111a of the chassis base.

As a result, the integrated circuit chip 21 is likely to be damaged by a method of maintaining a large fastening force of the bolts for fastening the cover plate 60 to close the contact between the heat transfer medium and the integrated circuit chip 21. It can solve the problem. In addition, the heat dissipation is performed smoothly, thereby preventing malfunctions, allowing the plasma display panel to stably implement an image corresponding to an external video signal without distortion, and to improve the product life of the plasma display apparatus including the plasma display module. have.

On the other hand, the heat dissipation problem of the integrated circuit chip 21 is more important in the HD-class plasma display panel that implements high quality. That is, since the HD plasma display panel has to implement more detailed image quality than the conventional SD, there is a large amount of information to be processed for a short time, so that the switching operation of the integrated circuit chip 21 is much more frequent and faster. Should be performed. Due to these characteristics, the advantage of applying the heat dissipation structure according to the present invention to the plasma display module which can effectively discharge the heat generated from the integrated circuit chip 21 is very large.

As described above, according to the present invention, it is possible to prevent breakage of an integrated circuit chip that occurs frequently in the manufacturing process of the plasma display module. In addition, by efficiently dissipating heat generated from the integrated circuit chip it is possible to maintain a reliable and stable driving of the plasma display panel.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (14)

A chassis base on which a display panel is coupled to a front surface, and a driving circuit board is coupled to a rear surface, and a reinforcing member for complementing rigidity is disposed; A connecting cable electrically connecting the elements on the driving circuit board to the display panel while surrounding an end of the chassis base; An integrated circuit chip disposed on the upper surface of the reinforcing member so as to be connected to the connection cable to control a signal transmitted to the display panel; And A heat dissipation sheet disposed between the integrated circuit chip and the reinforcement member to facilitate heat transfer from the integrated circuit chip to the reinforcement member, The heat dissipation structure of the integrated circuit chip, characterized in that a rough surface having a predetermined surface roughness is formed on the upper surface of the reinforcing member in contact with the heat dissipation sheet. The method of claim 1, The surface roughness of the rough surface formed on the reinforcing member is a heat dissipation structure of the integrated circuit chip, characterized in that 200㎛ to 700㎛. The method of claim 1, The surface roughness of the rough surface formed on the reinforcing member is a heat dissipation structure of the integrated circuit chip, characterized in that 1/70 to 1/20 of the thickness of the heat radiation sheet. The method of claim 1, The heat dissipation structure of the integrated circuit chip, characterized in that a rough surface having a predetermined surface roughness is formed on the other surface in contact with the atmosphere in addition to the surface facing the integrated circuit chip in the reinforcing member. The method of claim 1, A cover plate is further provided on the integrated circuit chip to protect the integrated circuit chip from external shocks and to dissipate heat generated from the integrated circuit chip. The heat dissipation structure of the integrated circuit chip, characterized in that further comprising a heat dissipation sheet between the cover plate and the integrated circuit chip. The method of claim 1, The display panel is a heat dissipation structure of the integrated circuit chip, characterized in that the plasma display panel. A chassis base having a display panel coupled to a front surface and a driving circuit board coupled to a rear surface thereof, and having a bent portion at upper and lower ends thereof; A connecting cable electrically connecting the elements on the driving circuit board to the display panel while surrounding the bent portion of the end of the chassis base; An integrated circuit chip disposed on an upper surface of the bent portion and connected to the connection cable to control a signal transmitted to the display panel; And A heat dissipation sheet disposed between the integrated circuit chip and the bent portion to facilitate heat transfer from the integrated circuit chip to the bent portion, And a rough surface having a predetermined surface roughness is formed on an upper surface of the bent portion in contact with the heat dissipation sheet. The method of claim 7, wherein The surface roughness of the rough surface formed in the bent portion is a heat dissipation structure of the integrated circuit chip, characterized in that 200㎛ to 700㎛. The method of claim 7, wherein The surface roughness of the rough surface formed in the bent portion is a heat dissipation structure of the integrated circuit chip, characterized in that 1/70 to 1/20 of the thickness of the heat radiation sheet. The method of claim 7, wherein And a rough surface having a predetermined surface roughness is formed on the other side of the bent portion facing the atmosphere in addition to the upper surface of the bent portion facing the integrated circuit chip in the chassis base. The method of claim 7, wherein A cover plate is further provided on the integrated circuit chip to protect the integrated circuit chip from external shocks and to dissipate heat generated from the integrated circuit chip. The heat dissipation structure of the integrated circuit chip, characterized in that further comprising a heat dissipation sheet between the cover plate and the integrated circuit chip. The method of claim 7, wherein The display panel is a heat dissipation structure of the integrated circuit chip, characterized in that the plasma display panel. A display panel, a driving circuit board driving the display panel, and a chassis base supporting the display panel and the driving circuit board, The chassis base is provided with a reinforcing member to complement the rigidity, A connection cable electrically connecting the elements on the driving circuit board and the display panel; An integrated circuit chip arranged to be connected to the connection cable on a flat surface of the reinforcing member to control a signal transmitted to the display panel; And It includes a heat dissipation sheet disposed between the integrated circuit chip and the upper surface of the reinforcing member, And a rough surface having a predetermined surface roughness formed on an upper surface of the reinforcing member. A display panel, a driving circuit board driving the display panel, and a chassis base supporting the display panel and the driving circuit board, The chassis base is bent at the end is formed, A connection cable electrically connecting the elements on the driving circuit board and the display panel; An integrated circuit chip disposed on an upper surface of the bent portion and connected to the connection cable to control a signal transmitted to the display panel; And It includes a heat dissipation sheet disposed between the integrated circuit chip and the upper surface of the bent portion, And a rough surface having a predetermined surface roughness is formed on an upper surface of the bent portion.

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