KR20060000242A - White light source of high output and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a high power white light source and a method of manufacturing the same, wherein a chip mounting region is formed on the upper portion, and a pair of electrode terminals are formed around the chip mounting region, and the pair of electrode terminals are respectively A package substrate electrically connected to the pair of leads protruding outward; A light emitting diode chip bonded to the chip mounting region of the package substrate; Wires bonded to the light emitting diode chip and the electrode terminals; The light emitting diode chip, the electrode terminal and the wire of the package substrate is bonded to the package substrate so as to be included therein, and has a hollow inside, and consists of a lens made of a polymer resin in which the phosphor is dispersed.

Accordingly, the present invention does not require a polymer resin coating process in which a separate phosphor is dispersed in addition to the process of attaching the injection molded lens, thereby reducing the process time and producing mass at low cost.

In addition, by blocking the phosphor contact on the chip by using a lens in which the phosphor is dispersed, there is an excellent effect to solve the problems caused by heat and light resistance in the implementation of high brightness, high efficiency white light, and to implement a device having high reliability.

White, light source, phosphor, lens, injection

Description

White light source of high output and method for manufacturing the same             

1A and 1B are cross-sectional views illustrating a process of manufacturing a white light emitting device by applying a phosphor according to the related art.

2A to 2D are top views illustrating a process of manufacturing a high power white light source by another method according to the prior art.

3a to 3d are views illustrating a process of manufacturing a high power white light source according to the present invention.

4 is a cross-sectional view of a high power white light source according to the present invention;

5a to 5c are another embodiment of a high power white light source according to the present invention

<Description of the symbols for the main parts of the drawings>

500: package substrate 520: chip mounting area

530a, 530b: Electrode terminal 535a, 535b: Lead

540: light emitting diode chip 550: wire

590: groove 595: reflective film

600,900 lens 610,910 hollow part

700 molding resin 710 polymer resin

The present invention relates to a high-output white light source and a method for manufacturing the same, and more particularly, a process of shortening the process time is not required because a process of applying a polymer resin in which a separate phosphor is dispersed in addition to the process of attaching an injection molded lens is required. It can be mass-produced by using a lens in which phosphors are dispersed, and by blocking the phosphor contact on the chip, it solves the problem of heat and light resistance in realizing high brightness and high efficiency white light, and high power white that can implement a device having high reliability. A light source and its manufacturing method are related.

In general, light emitting diodes are compact and have excellent efficiency, are capable of emitting bright colors, and are less susceptible to damage because they are semiconductor devices, have excellent initial driving characteristics and shock resistance, and are ON / OFF. It has the advantage of being strong in repetition such as lighting.

For this reason, it is widely used by various indicators and various light sources.

Recently, ultra high brightness, high efficiency R, G, B light emitting diodes have been developed, and large LED displays using such light emitting diodes have been commercialized.

Such LED displays are expected to be used in the future with low power consumption and excellent characteristics of light and long life.

In recent years, various attempts have been made to configure a white light emitting light source using a light emitting diode.

In order to use a light emitting diode and to obtain white light, since the light emitting diode has a monochromatic peak wavelength, three light emitting diodes of R, G, and B should be installed in close proximity and emit light.

When white light is to be realized through such a configuration, there is a difficulty in obtaining desired white color due to irregular hue or luminance of the light emitting diode.

Further, since each of the light emitting diodes is formed using a different material, the driving voltages of the light emitting diodes are different and it is necessary to apply different voltages.

In addition, since each light emitting diode is a semiconductor light emitting element, each temperature characteristic and change with time vary, and color tone changes according to the use environment, or it is difficult to uniformly mix light generated by each light emitting diode, and spots are generated. There are many disadvantages.

In other words, it is true that the white light implementation through such tricolor mixing is not sufficient to obtain satisfactory results.

In order to solve the above-mentioned disadvantages, a phosphor that uses a light emitting diode emitting a specific wavelength and a resin which absorbs light from the light emitting element and emits light having a different wavelength from the resin mold material covering the device portion of the light emitting diode is used. The method of containing is widely known.

Such a method is, for example, using a light emitting device capable of emitting light of a blue color as a light emitting device, and is molded into a resin containing a phosphor which absorbs the light emitted from the light emitting device and emits light of a yellow light, and thus is mixed with white color. It is a method of manufacturing a diode capable of emitting light of the system.

In addition, using a light emitting diode in the ultraviolet band, R, G, B phosphors (Phosphor) are mixed to induce light emission in the visible light field, the white light emitting system is used.

Recently, as the demand for high brightness increases, product development for high power white light sources is increasing. However, in the case of realizing high brightness white light sources, not only a high output from the chip but also a lot of heat generation is necessarily followed.

Therefore, if the fluorescent polymer resin is directly applied on the chip as in the present, the optical and thermal safety is degraded by contact with the chip itself, and ultimately, the aging of the device causes a problem in reliability.

To overcome these shortcomings, we try to maximize heat dissipation efficiency by designing and attaching various heat sinks and using materials with excellent heat dissipation, but it is not easy approach due to cost increase and additional assembly process It is a way.

1A and 1B are cross-sectional views illustrating a process of manufacturing a white light emitting device by applying a phosphor according to the related art. First, as shown in FIG. 1A, the light emitting diode 110 is formed on the reflector 121 of the lead frame 120. ), The light emitting diodes 110 and the lead frame 120 are bonded with a wire 140, and then the polymer resin 130 containing phosphors is wrapped around the light emitting diodes 110. It is applied to the reflecting plate 121 of the lead frame 120.

Here, the lead frame 120 includes a pair of external drawing terminals 120a and 120b spaced apart from each other.

Thereafter, in order to protect the light emitting diode 110 from the external environment, a molding process of wrapping a part of the lead frame 120 with a transparent material is performed.

In the conventional white light emitting device described above, since the phosphor and the polymer resin are in direct contact with the surface of the light emitting diode chip, a phenomenon of aging due to heat and light energy generated during long time use may occur, which may seriously affect the reliability of the device.

In addition, in order to protect from the external environment, a molding part of a convex lens or a concave lens is formed using a polymer resin having excellent light transmittance, and the molding material which can be used is yellowed for a long time even at high temperature. (Yellowing) A transparent material having no phenomenon is used, that is, a resin such as epoxy, urea, and silicone.

In this case, however, the polymer resin in which the chip and the phosphor are dispersed may be protected from the external environment, but thermal and light safety generated from the inside may be difficult to expect.

Therefore, there is a problem that a change in color is caused due to yellowing of the molding material or decomposition of the phosphor when used for a long time.

2A to 2D are top views illustrating a process of manufacturing a high power white light source by another method according to the prior art. First, an annular guide 210 is provided on an upper portion thereof, and a chip is formed inside the annular guide 210. The mounting region 220 is formed, and a pair of electrode terminals 230a and 230b are formed around the chip mounting region 220, and are electrically connected to the pair of electrode terminals, respectively, to the outside. Then, a package substrate 200 on which a pair of leads 235a and 235b protrude is prepared. (FIG. 2A).

Thereafter, the LED chip 240 is bonded to the chip mounting region 220 of the package body 200, and the LED chip 240 and the electrode terminals 230a and 230b are bonded to the wire 250. (Fig. 2b)

Next, a polymer resin 260 in which phosphors are dispersed is coated on the light emitting diode chip 240 (FIG. 2C).

In order to cure the coated polymer resin 260, the polymer resin is cured by being left at 200 degrees for at least 3 hours.

Finally, a transparent molding resin 270 is molded into the annular guide 210 so as to surround the LED chip 240, the wire 250, and the electrode terminals 230a and 230b (FIG. 2D).

Even in such a prior art, when the polymer resin in which the phosphor is dispersed is directly applied on the high power light emitting diode chip, there is a problem that the phosphor easily ages and the life of the device is drastically decreased.

In addition, there is a disadvantage that careful attention is required to maintain uniformity in the coating process.

In order to solve the above problems, by using a lens in which phosphors are dispersed, the phosphor contacts are blocked on a chip, thereby solving the problems caused by heat and light resistance in realizing high brightness and high efficiency white light, and high reliability. An object of the present invention is to provide a high power white light source capable of realizing a device having a.

Another object of the present invention is a method of manufacturing a high-output white light source that can shorten the process time and can mass-produce at low cost since a process of applying a polymer resin in which a separate phosphor is dispersed in addition to the process of attaching an injection molded lens is not required. To provide.

According to a preferred aspect of the present invention, a chip mounting region is formed thereon, and a pair of electrode terminals are formed around the chip mounting region. A package substrate electrically connected to the terminals, the pair of leads protruding from the outside;

A light emitting diode chip bonded to the chip mounting region of the package substrate;

Wires bonded to the light emitting diode chip and the electrode terminals;

A high power white light source is provided, which is bonded to the package substrate so that the light emitting diode chip, the electrode terminals, and the wire of the package substrate are included therein, the hollow portion has a hollow portion, and is made of a lens made of a polymer resin in which phosphors are dispersed.

According to another preferred aspect of the present invention, a chip mounting region is formed thereon, and a pair of electrode terminals are formed around the chip mounting region. A first step of preparing a package substrate in which a pair of leads are protruded to the outside by being electrically connected to the electrode terminals of the first and second electrodes;

Bonding a light emitting diode chip to a chip mounting region of the package substrate and wire bonding the light emitting diode chip and the electrode terminals;

A third step of filling the transparent molding resin with a hollow portion in the hollow portion of the lens made of a polymer resin in which phosphors are dispersed;

And a fourth step of bonding the lens and the package substrate so that the molding resin filled in the hollow portion of the lens surrounds the LED chip, the electrode terminals, and the wire of the package substrate. Is provided.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

3A to 3D are views illustrating a process of manufacturing a high power white light source according to the present invention. FIGS. 3A, 3B, and 3D are top views, and FIG. 3C is a cross-sectional view.

First, in FIG. 3A, a chip mounting region 520 is formed at an upper portion thereof, and a pair of electrode terminals 530a and 530b are formed around the chip mounting region 520. The package substrate 500 is electrically connected to the terminals 530a and 530b to protrude a pair of leads 535a and 535b to the outside (FIG. 3A).

Thereafter, the LED chip 540 is bonded to the chip mounting region 520 of the package substrate 500, and the LED chip 540 and the electrode terminals 530a and 530b are bonded to the wire 550. (Fig. 3b)

The light emitting diode chip is preferably a light emitting diode chip that emits blue or ultraviolet light.

Next, the transparent molding resin 700 is filled in the hollow portion of the lens 600 having the hollow portion 610 therein and made of a polymer resin in which phosphors are dispersed (FIG. 3C).

Here, the shape of the lens 600 is preferably a hemispherical shape.

In addition, the lens 600 may be made by injection molding a polymer resin in which phosphors are dispersed.

The injection molding process applied here can be mass-produced in a single process, and the process can be simplified because the process of applying and curing the polymer resin in which the phosphor is dispersed is eliminated.

In addition, the polymer resin usable as the lens is preferably a polymer material having excellent light transmittance and light resistance, such as polymethacrylate (PMMA), polycarbonate (PC), and cyclic olefin copolymer (COC), and is not limited thereto. .

In this case, the phosphor is any one selected from organic and inorganic hybrid phosphors, organic phosphors and inorganic phosphors.

Subsequently, the molding resin 700 filled in the hollow portion 610 of the lens 600 may connect the light emitting diode chip 540, the electrode terminals 530a and 530b, and the wire 550 of the package substrate 500. The lens 600 and the package substrate 500 are adhered to each other so as to surround the package 600 (FIG. 3D).

4 is a cross-sectional view of a high power white light source according to the present invention, in which a chip mounting region 520 is formed at an upper portion thereof, and a pair of electrode terminals 530a and 530b are formed around the chip mounting region 520. A package substrate 500 electrically connected to the pair of electrode terminals 530a and 530b to protrude outward from the pair of leads 535a and 535b; A light emitting diode chip 540 bonded to the chip mounting region 520 of the package substrate 500; Wires 550 bonded to the LED chip 540 and the electrode terminals 530a and 530b; The light emitting diode chip 540, the electrode terminals 530a and 530b, and the wire 550 of the package substrate 500 are attached to the package substrate 500 to be included therein, and the hollow part 610 therein. It is composed of a lens 600 made of a polymer resin in which the phosphor is dispersed.

Here, it is preferable that the molding resin 700 filled with the LED chip 540, the electrode terminals 530a and 530b, and the wire 550 is further provided inside the hollow part 610 of the lens 600. Do.

Therefore, the high power white light source of the present invention does not make any contact with the phosphor on the surface of the LED chip, and since the phosphor is distributed at a distance apart from the LED chip by a predetermined distance or more, a large amount of heat generated by the LED chip and direct light Since no output is received, the durability of the device is increased.

5A to 5C show another embodiment of the high power white light source according to the present invention. Since the high power white light source of the present invention uses a lens in which phosphors are dispersed, the package substrate selectively requires an annular guide as in the prior art.

That is, as shown in FIG. 5A, when the annular guide 510 is further formed on the package substrate 500 outside the lens 600, the adhesive is bonded when the lens 600 and the package substrate 500 are adhered. It serves as a mark to prevent errors.

In addition, as shown in FIG. 5B, when the chip mounting region of the package substrate 500 includes the concave groove 590, and the reflective film 595 is coated on the surface of the concave groove 590, the LED chip 540 includes: The light emitted is reflected by the reflective film 595 of the concave groove 590 to increase the light output.

In FIG. 5C, the polymer resin 710 in which the phosphor is dispersed is coated on the concave groove 590 to surround the light emitting diode chip 540 in the state of FIG. 5B, and the lens 900 which does not contain the phosphor is It shows that it can be produced by attaching to the package substrate.

That is, in the high-output white light source of FIG. 5C, a concave groove 590 is formed on an upper portion thereof, a reflective film 595 is coated on the surface of the concave groove 590, and a pair of electrodes is disposed around the concave groove 590. The package substrate 500 having terminals 530a and 530b formed therein and electrically connected to the pair of electrode terminals 530a and 530b to protrude the pair of leads 535a and 535b to the outside. )and; A light emitting diode chip 540 bonded to the concave groove 590 of the package substrate 500; Wires 550 bonded to the LED chip 540 and the electrode terminals 530a and 530b; A polymer resin 710 coated on the recess 590 to surround the light emitting diode chip 540 and having a phosphor dispersed therein; The phosphor is dispersed in the polymer resin 710, the electrode terminals (530a, 530b) and the wire 550 is bonded to the package substrate 500 to be included therein, and has a hollow portion 910 therein A lens 900 made of a transparent resin; A polymer resin in which phosphors are dispersed in the hollow part 910 of the lens 900, an electrode terminal, and a wire are formed to surround the molding resin 700.

As described above, the present invention has an advantage that a high brightness, long life white light emitting device can be manufactured using a polymer lens containing phosphor.

In addition, by drastically reducing the manufacturing process of the white light source device, there is an advantage that the price competitiveness can be secured through cost reduction.

In addition, since the coating polymer resin containing the phosphor is not directly applied on the upper surface of the light emitting diode chip, it is possible to directly reduce the influence from the aging factor caused by the high heat and high light output generated in the light emitting diode chip.

In addition to these advantages, it is possible to minimize the occurrence of low-cost device supply and lot-to-lot variation by simplifying the process without requiring additional expensive equipment for the current process.

Therefore, the present invention can mass-produce a white light source device having various applications as a light source for a keypad or a display light source for use in a mobile communication terminal at low cost.

As described above, since the present invention does not require a polymer resin coating process in which a separate phosphor is dispersed in addition to the process of attaching the injection molded lens, the process time can be shortened and mass production at low cost is possible. .                     

In addition, by using a lens in which the phosphor is dispersed, by blocking the phosphor contact on the chip, there is an excellent effect to solve the problems caused by heat and light resistance in the implementation of high brightness, high efficiency white light and to implement a device having high reliability.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (10)

A chip mounting region is formed at an upper portion, and a pair of electrode terminals are formed around the chip mounting region, and a pair of leads are electrically connected to each of the pair of electrode terminals to protrude outward. A package substrate; A light emitting diode chip bonded to the chip mounting region of the package substrate; Wires bonded to the light emitting diode chip and the electrode terminals; A high power white light source comprising a lens made of a polymer resin in which a light emitting diode chip, an electrode terminal, and a wire of the package substrate are attached to the package substrate, and having a hollow portion therein, and a phosphor dispersed therein. The method of claim 1, Inside the hollow part of the lens, A high power white light source, characterized in that the light emitting diode chip, the electrode terminal and the wire is filled with a molding resin filled. The method according to claim 1 or 2, On the package substrate on the outside of the lens, A high power white light source, characterized in that an annular guide is further formed. The method according to claim 1 or 2, The chip mounting region of the package substrate is a concave groove, the surface of the concave groove is coated with a reflective film, the light emitting diode chip is bonded on top of the reflective film of the concave groove. The method according to claim 1 or 2, The phosphor is, A high power white light source, characterized in that any one selected from organic and inorganic hybrid phosphor, organic phosphor and inorganic phosphor. A chip mounting region is formed at an upper portion, and a pair of electrode terminals are formed around the chip mounting region, and a pair of leads are electrically connected to each of the pair of electrode terminals to protrude outward. A first step of preparing a package substrate; Bonding a light emitting diode chip to a chip mounting region of the package substrate and wire bonding the light emitting diode chip and the electrode terminals; A third step of filling the transparent molding resin with a hollow portion in the hollow portion of the lens made of a polymer resin in which phosphors are dispersed; And a fourth step of bonding the lens and the package substrate so that the molding resin filled in the hollow portion of the lens surrounds the LED chip, the electrode terminals and the wire of the package substrate. . The method of claim 6, The light emitting diode chip, A light emitting diode chip emitting blue or ultraviolet light. The method of claim 6, The phosphor is, A method for producing a high power white light source, characterized in that any one selected from organic and inorganic hybrid phosphor, organic phosphor and inorganic phosphor. The method of claim 6, The shape of the lens, A method for producing a high power white light source, characterized in that hemispherical shape. The method of claim 6, The lens, A method of manufacturing a high power white light source, characterized in that it is made by injection molding a polymer resin in which a phosphor is dispersed.

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