CN100405621C - High-output white light source and its production - Google Patents
High-output white light source and its production Download PDFInfo
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- CN100405621C CN100405621C CNB2005100301917A CN200510030191A CN100405621C CN 100405621 C CN100405621 C CN 100405621C CN B2005100301917 A CNB2005100301917 A CN B2005100301917A CN 200510030191 A CN200510030191 A CN 200510030191A CN 100405621 C CN100405621 C CN 100405621C
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Abstract
The invention is concerned with white lamp-house with high output and its production method. The white lamp-house relates to a bundle base plate set a base region of CMOS chip on its top, and there is a couple of electrode ends on the side of base region of CMOS chip, wire connects with CMOS chip of LBD and electrode end. There is lens with hollow device made up by macromolecule resin dispersed by fluorescence material agglutinated to the bundle base plate. The production of white lamp-house is carrying stickup working procedure through inject lens without carrying the spread working procedure of macromolecule resin with dispersed fluorescence material. It reduces the production procedure, the working time and cost for batch production.
Description
Technical field
The invention relates to the technology of white light source and manufacture method thereof.Specifically, will be undertaken the bonding operation by the lens that injection forms except carrying out exactly, need not to carry out again a kind of white light source and the manufacture method thereof of operation that the macromolecule resin that fluorescent material disperses is coated with.
Background technology
Generally speaking, for light-emitting diode, its volume is less, and luminous efficiency is good, and it sends light and has form and aspect clearly.Usually with it as making semi-conductive element, it have be not easy impaired, initial driving characteristic and vibration strength all comparatively outstanding.Simultaneously, relatively be fit to it is opened (ON)/the close advantages such as operation of (OFF) and so on repeatedly.
Therefore, it is widely used in various displays or the multiple light source.
Recently, a kind of have super brightness and high efficiency R, G, B light-emitting diode have been developed.At present, utilize the big picture LED display unit of this light-emitting diode making by common use.
Characteristics such as for above-mentioned this LED display unit, institute's power consumption power was few when it had work, and weight is lighter, and useful life is long.Will be widely used from now on.
In addition, recently, research staff are just attempting utilizing light-emitting diodes pipe manufacturer white emitting light source.
Because light-emitting diode has the characteristic of monochromaticjty and summit wavelength.Therefore, produce white light source in order to utilize light-emitting diode, just must be with R, G, B3 light-emitting diode carries out close proximity, and makes it luminous, handles thereby institute's light emitting source is spread colour mixture.
For the situation of attempting to send by above-mentioned formation white light, characteristics such as the tone of light-emitting diode or brightness will be irregular, be difficult to obtain the own white light source that obtains wanted.
In addition, for above-mentioned light-emitting diode, because they adopt different materials to make separately respectively.Therefore, the driving voltage of above-mentioned each light-emitting diode can be not identical yet.Like this, with regard to being necessary each different voltage is discerned.Thereby will cause drive circuit to become complicated more.This is its existing shortcoming.
Simultaneously, for above-mentioned each light-emitting diode, because they all are used as semi-conductive light-emitting component.Therefore, the temperature characterisitic of above-mentioned each light-emitting diode or visible change effect can be not identical yet.Its tone can change along with the difference of environment for use.Or, be difficult to it is carried out colour mixture processing equably for the light that above-mentioned each light-emitting diode sent.Like this, often, will produce some spots.This is its existing another one shortcoming.
That is to say that for the above-mentioned this white light of light through forming after the mixed processing with three kinds of colors, be difficult to obtain gratifying result often, this is the fact of an objective reality.
In order to address the above problem, just utilize the light-emitting diode of the light that can send specific wavelength.Contain a kind of fluorescent material in the resin die material of the componentry that covers above-mentioned this light-emitting diode, it can absorb the light that sends from light-emitting component.Then, again the light of the light that absorbed and other wavelength is carried out mixed processing and send the light of specific wavelength.This is a kind of method of generally using.
For above-mentioned this method, for example: just use the light-emitting component that can send blue serial light as light-emitting component, then, the light that will be sent from above-mentioned light-emitting component absorbs.Then, it is mapped on the resin that contains the fluorescent material that can send Yellow series light.Thereby just can produce the diode of the light that can send the white series that forms through colour mixture processing back.Here it is makes the embodiment of method of the light-emitting diode of the above-mentioned light that can send specific wavelength.
In addition, utilize the light-emitting diode of ultraviolet bandwidth, then, respectively with R, G, B phosphor (phosphor) mixes.Like this, bring out it and send the interior light of whole visible rays wave-length coverage.Thereby form a white color light emitting system that can send white light.
Recently, along with people are more and more stronger to the needs of high illumination element, the Products Development of relevant white light source also is being on the increase.But the situation for making the high-brightness white source not only requires to begin that from chip very high power output will be arranged, and and then just requires and must can produce enough heats.
Therefore, the same with present situation, if directly at the top of chip coating fluorescent material macromolecule resin, because above-mentioned fluorescent material macromolecule resin contacts with chip.Therefore, the fail safe of the heat of light will reduce.Finally will cause the reduction of user because of the aging of element to the product degree of belief.This is its existing problem.
In order to overcome above-mentioned shortcoming, people just design and install various heat abstractors (heat sink).Like this, by using the good material of some heat dispersions, to make great efforts to improve to greatest extent its radiating efficiency.But this can cause cost of manufacture to raise like this, can increase extra installation procedure simultaneously.Therefore, make in this way and just not too easily each element is connected well.
Fig. 1 a to Fig. 1 b is the sectional view that expression adopts the operation of coating fluorescent material manufacturing white-light luminescent component to show to the foundation prior art.At first, as shown in Figure 1a, be bonded with light-emitting diode 110 on the reflecting plate 121 of lead frame 120, above-mentioned light-emitting diode 110 is connected by electric wire 140 with above-mentioned lead frame 120.Then, for above-mentioned light-emitting diode 110 is wrapped up, the macromolecule resin 130 that just will include fluorescent material is coated on the reflecting plate 121 of above-mentioned lead frame 120.
Here, for above-mentioned lead frame 120, it comprises the sub-120a of bringing-out that a pair of space is provided with, 120b.
Then, avoid the influence of external environment condition in order to protect above-mentioned light-emitting diode 110, will be through a casting operation of wrapping up (shown in Fig. 1 b) of the lead frame 120 that will make with material transparent together.
As mentioned above, for the white-light luminescent component of foundation prior art manufacturing, because fluorescent material and macromolecule resin directly contact with the surface of light-emitting diode chip for backlight unit.Therefore, the heat and the luminous energy that are produced in the long-time process of using will quicken to cause component ageing, thereby seriously influence for the fail safe of element and stable bringing, and finally cause the decline of people for the product degree of belief.
In addition, avoid the influence of external environment condition, just use the good macromolecule resin material of light transmission, and constitute the pouring device of convex lens (convex lens) or concavees lens (concave lens) form in order to protect above-mentioned light-emitting diode 110.For operable cast material in this case, even it just can use under high temperature condition long-time use also not can flavescence look (Yellowing) transparent material, just finger ring epoxy resins, urea resin, and material such as silication resin.
In addition, though chip and fluorescent material also can protect the macromolecule resin danger of dispersion to avoid the harmful effect of external environment condition in this case.But heat that device interior produced and light bring bigger influence will for the fail safe of element and stability.This is to be worth the problem that allows the people worry.
Therefore, when under long-time situation about using, cast material flavescence look will appear or owing to phenomenons such as the decomposition of fluorescent material cause that form and aspect change.This is its existing another one problem.
To be expression make the schematic diagram that the operation of white light source shows to adopting according to the method for prior art to Fig. 2 a to Fig. 2 d.At first, as can be seen from the figure, be provided with the guider 210 of a ring-type at an upper portion thereof.Inside at above-mentioned this ring-type guider 210 forms chip pad zone 220.Periphery at said chip base area 220 is provided with pair of electrodes terminal 230a, 230b, and above-mentioned pair of electrodes terminal 230a, 230b are connected with power supply respectively.And a pair of guiding device 235a, 235b are arranged to outstanding bag (package) substrate 200 (shown in Fig. 2 a) in outside.
Then, on the chip pad zone 220 of above-mentioned bag (package) base main body 200, be provided with light-emitting diode chip for backlight unit 240 by bonding method.Above-mentioned light-emitting diode chip for backlight unit 240 and above-mentioned electrode terminal 230a, 230b are respectively by electric wire 250 be connected (shown in Fig. 2 b).
Then, be coated with the macromolecule resin material 260 (shown in Fig. 2 c) that fluorescent material disperses on the top of above-mentioned light-emitting diode chip for backlight unit 240.
In addition, for macromolecule resin 260 sclerosis that makes above-mentioned coating, just with it in placement under 200 degrees centigrade the temperature environment more than 3 hours, thereby just can make high score resin hardened.
At last, for above-mentioned light-emitting diode chip for backlight unit 240, electric wire 250, and electrode terminal 230a, 230b wrap up, with regard to transparent casting resin 270 is cast along the inboard of above-mentioned ring-type guider 210 (shown in Fig. 2 d).
As mentioned above, this according to prior art directly under the situation of the macromolecule resin that the top of above-mentioned high output light emitting diode chip coating fluorescent material disperses, it is aging to be easy to make above-mentioned fluorescent material to take place, thereby will cause shorten greatly the useful life of element.This is its existing another one problem.
In addition, in the process that the macromolecule resin that above-mentioned fluorescent material is disperseed is coated with,, when coating, just need careful especially in order to keep the uniformity of the macromolecule resin that above-mentioned fluorescent material disperses.This is its existing another one shortcoming.
Summary of the invention
The present invention proposes for addressing the above problem, and the object of the present invention is to provide a kind of white light source, and it has used the lens of being made by the macromolecule resin of fluorescent material dispersion, contacts with chip thereby just can block fluorescent material.Like this, just help producing the white light of high brightness, high output.Simultaneously, can also solve the problem of aspects such as the thermal endurance of product and light resistance well.Thus, just can further improve the degree of belief of people for product.
Another object of the present invention is to provide a kind of manufacture method of white light source, like this, except carrying out being undertaken the bonding operation by the lens that injection forms, need not to carry out the operation that the macromolecule resin that fluorescent material disperses is coated with again.Therefore, so just can reduce production process, save Production Time.Simultaneously, can also reduce the production cost, the favourable batch process in batches.
In order to realize above-mentioned purpose of the present invention, the manufacture method of white light source of the present invention is made of following step: the 1st step, to wrapping the step that substrate is prepared, promptly be provided with the chip pad zone on the top of above-mentioned bag substrate, then, periphery at the said chip base area is provided with the pair of electrodes terminal, and above-mentioned pair of electrodes terminal is connected with power supply respectively, and has a pair of guiding device outstanding to the outside; The 2nd step, bonding light-emitting diode chip for backlight unit on the chip pad zone of above-mentioned bag substrate then, is connected with above-mentioned electrode terminal above-mentioned light-emitting diode chip for backlight unit again by electric wire; The 3rd step is filled transparent casting resin to the hollow devices position of the lens of being made by the macromolecule resin of fluorescent material dispersion; The 4th step, for the transparent casting resin that the hollow devices position that makes the lens of making to the above-mentioned macromolecule resin that is disperseed by fluorescent material is filled into can be with light-emitting diode chip for backlight unit, the electrode terminal of above-mentioned bag substrate, and electric wire wraps up, and carries out said lens and above-mentioned bag substrate bonding.
Effect of the present invention:
As mentioned above, for according to white light source of the present invention and manufacture method thereof,, need not to carry out again the operation that the macromolecule resin that fluorescent material disperses is coated with except carrying out to be undertaken the bonding operation by the lens that injection forms.Therefore, so just can reduce production process, save Production Time.Simultaneously, can also reduce the production cost, the favourable batch process in batches.This is according to white light source of the present invention and a good result that manufacture method had thereof.
In addition, for according to white light source of the present invention and manufacture method thereof,, contact with chip thereby just can block fluorescent material because it has used the lens of being made by the macromolecule resin of fluorescent material dispersion.Like this, just help producing the white light of high brightness, high output.Simultaneously, can also solve the problem of aspects such as the thermal endurance of product and light resistance well.Thus, just can further improve the degree of belief of people for product.This is according to white light source of the present invention and another one good result that manufacture method had thereof.
For further specifying above-mentioned purpose of the present invention, design feature and effect, the present invention is described in detail below with reference to accompanying drawing.
Description of drawings
Fig. 1 a to Fig. 1 b is the sectional view that expression adopts the operation of coating fluorescent material manufacturing white-light luminescent component to show to the foundation prior art.
To be expression make the schematic diagram that the operation of white light source shows to adopting according to the method for prior art to Fig. 2 a to Fig. 2 d.
Fig. 3 a to Fig. 3 d is the schematic diagram that expression shows the operation that adopts foundation method of the present invention to make white light source.
Fig. 4 is the sectional view of expression according to white light source of the present invention.
Fig. 5 a to Fig. 5 c is the another one instance graph of expression according to white light source of the present invention.
The symbol description of major part in the accompanying drawing:
500: bag (package) substrate 520: chip pad zone
530a, 530b: electrode terminal 535a, 535b: guiding device
540: light-emitting diode chip for backlight unit 550: electric wire
590: groove 595: reflectance coating
600,900: lens 610,910: hollow devices
700: casting resin 710: macromolecule resin
Embodiment
Below, the embodiment to white light source of the present invention and manufacture method thereof is described in more details with reference to the accompanying drawings.
Fig. 3 a to Fig. 3 d is the schematic diagram that expression shows the operation that adopts foundation method of the present invention to make white light source.Wherein, Fig. 3 a, 3b, 3d are expression top schematic diagrames, and Fig. 3 c is the expression schematic cross-section.
At first, shown in Fig. 3 a, bag (package) substrate with following characteristics is prepared, promptly to being provided with chip pad zone 520 on bag substrate top.Then, periphery at said chip base area 520 is provided with pair of electrodes terminal 530a, 530b, above-mentioned pair of electrodes terminal 530a, 530b are connected with power supply respectively, and have a pair of guiding device 535a, 535b to prepare (shown in Fig. 3 a) to outstanding bag (package) substrate 500 in outside.
Then, bonding light-emitting diode chip for backlight unit 540 on the chip pad zone 520 of above-mentioned bag (package) substrate 500 then, is connected (as Fig. 3 b shown in) with above-mentioned electrode terminal 530a, 530b by electric wire 550 with above-mentioned light-emitting diode chip for backlight unit 540 again.
For above-mentioned light-emitting diode chip for backlight unit 540, if use the light-emitting diode chip for backlight unit effect meeting that to send blueness or ultraviolet more satisfactory.
Then, the transparent casting resin 700 (shown in Fig. 3 c) of hollow devices position filling that has the lens 600 of hollow devices 610 to its inside that the macromolecule resin that is disperseed by fluorescent material is made.
Here, for the shape of said lens 600, useful hemispheric shape effects can be more satisfactory.
In addition, for said lens 600, adopting the macromolecule resin that fluorescent material is disperseed to make effect by the method for injection can be more satisfactory.
For the technology of passing through injection moulding that is adopted here, it can be implemented in the batch process in the single production process.Simultaneously, can reduce the coating and the hardening process of the macromolecule resin of fluorescent material dispersion.Thereby just can the use operation oversimplify.
In addition, as being used as the macromolecule resin of making said lens, preferably select for use those such as PMMA (Polymethacrylate), PC (Polycarbonate), light transmission and all better macromolecular material of light fastness of COC (Cyclic olefin copolymer) and so on, and the material that should only not be confined to here to be mentioned.
Here, for above-mentioned fluorescent material, can be from organic fluorescence materials, inorganic fluorescent material, and select a kind of in the mixing fluorescent material of forming by organic fluorescence materials and inorganic fluorescent material arbitrarily.
Then, in order to make the casting resin 700 that is filled into to the hollow devices position 610 of said lens 600 can be with light-emitting diode chip for backlight unit 540, electrode terminal 530a, the 530b of above-mentioned bag (package) substrate 500, and electric wire 550 wraps up, and said lens 600 and above-mentioned bag (package) substrate 500 are carried out bonding (shown in Fig. 3 d).
Fig. 4 is the sectional view of expression according to white light source of the present invention.As shown in Figure 4, comprise following components according to white light source of the present invention: be provided with chip pad zone 520 at an upper portion thereof.Then, periphery at said chip base area 520 is provided with pair of electrodes terminal 530a, 530b, above-mentioned pair of electrodes terminal 530a, 530b are connected with power supply respectively, and a pair of guiding device 535a, 535b are arranged to outstanding bag (package) substrate 500 in outside; Be connected the light-emitting diode chip for backlight unit 540 on the chip pad zone 520 of above-mentioned bag (package) substrate 500; The electric wire 550 that is connected with above-mentioned electrode terminal 530a, 530b with above-mentioned light-emitting diode chip for backlight unit 540; For can be with light-emitting diode chip for backlight unit 540, electrode terminal 530a, the 530b on above-mentioned bag (package) substrate 500, and electric wire 550 all is wrapped in device inside, and is bonded in the lens 600 that its inside that the macromolecule resin that is disperseed by fluorescent material on above-mentioned bag (package) substrate 500 makes has hollow devices 610.
Here, more satisfactory situation is exactly a casting resin 700 when the hollow of said lens 600 is disposed 610 inside and recharged.Like this, just can be with above-mentioned light-emitting diode chip for backlight unit 540, electrode terminal 530a, 530b, and electric wire 550 has wrapped up.
Therefore, for foundation high output light source of the present invention, owing to kept certain spacing distance between light-emitting diode chip for backlight unit and the fluorescent material, like this, the surface of light-emitting diode chip for backlight unit just can never come in contact with fluorescent material.Therefore, fluorescent material just can not be subjected to a large amount of heat that light-emitting diode produces and the influence of its light of directly launching, thus the useful life that just can improve element.This is the advantage according to white light source of the present invention had.
Fig. 5 a to Fig. 5 c is the another one instance graph of expression according to white light source of the present invention.As shown in the figure, for foundation white light source of the present invention, because it has used the lens of being made by the macromolecule resin of fluorescent material dispersion.Therefore, just require the bag (package) substrate on selective setting with according to the similar ring-type guider of prior art.
That is to say, shown in Fig. 5 a, if a ring-type guider 510 is set again on the top of bag (package) substrate in the outside of said lens 600.Then said lens 600 and above-mentioned bag (package) substrate 500 are carried out bonding in, above-mentioned ring-type guider 510 just plays mark (Mark) effect that prevents bonding mistake.
In addition, shown in Fig. 5 b, the chip pad zone of above-mentioned bag (package) substrate 500 is recessed to form a groove 590 to inside.Then, if be coated with last layer reflectance coating 595 on the surface of the above-mentioned groove that is recessed to form 590, then the light of being launched by light-emitting diode chip for backlight unit 540 just can increase the output rating of light greatly after reflectance coating 595 reflections of the above-mentioned groove that is recessed to form 590.
In addition, in Fig. 5 c, following situation is shown, promptly under the state shown in Fig. 5 b, for light-emitting diode chip for backlight unit 540 is wrapped up, and the macromolecule resin 710 that the coating fluorescent material disperses on the above-mentioned groove that is recessed to form 590.Then, the lens that will not comprise fluorescent material again are bonded on above-mentioned bag (package) substrate.
That is to say that for the white light source shown in Fig. 5 c, it comprises following components: be provided with the groove 590 that is recessed to form at an upper portion thereof, scribble one deck reflectance coating 595 on the surface of the above-mentioned groove that is recessed to form 590.Then, periphery at the above-mentioned groove that is recessed to form 590 is provided with pair of electrodes terminal 530a, 530b, above-mentioned pair of electrodes terminal 530a, 530b are connected with power supply respectively, and a pair of guiding device 535a, 535b are arranged to outstanding bag (package) substrate 500 in outside; Be bonded in the light-emitting diode chip for backlight unit 540 on the groove 590 that is recessed to form on above-mentioned bag (package) substrate 500; The electric wire 550 that is connected with above-mentioned electrode terminal 530a, 530b with above-mentioned light-emitting diode chip for backlight unit 540; For above-mentioned light-emitting diode chip for backlight unit 540 can being wrapped up, and be coated on the macromolecule resin 710 that the fluorescent material on the above-mentioned groove that is recessed to form 590 disperses; For macromolecule resin 710, electrode terminal 530a, the 530b that above-mentioned fluorescent material can be disperseed, and electric wire 550 all is wrapped in device inside, and is bonded in the lens 900 that its inside of being made by transparent resin on above-mentioned bag (package) substrate 500 has hollow devices 910; For the macromolecule resin that above-mentioned fluorescent material can be disperseed, electrode terminal, and electric wire wraps up, and the casting resin 700 that is filled into to the inside of the hollow devices 910 of said lens 900.
As mentioned above, for foundation white light source of the present invention and manufacture method thereof, because it has used the macromolecule lens that contains fluorescent material.Therefore, just can produce the white-light luminescent component of characteristics such as having luminosity height, long service life.This is according to white light source of the present invention and a advantage that manufacture method had thereof.
In addition, it can also significantly reduce the manufacturing process of the light-emitting component of white light source, thereby production process is oversimplified.Just can reduce product cost thus, thereby guarantee that product has very strong price competitiveness.This is according to white light source of the present invention and another one advantage that manufacture method had thereof.
Simultaneously, when the macromolecule resin that contains fluorescent material is coated with, be not directly it to be coated on the top on the surface of light-emitting diode chip for backlight unit.Like this, just can reduce the influence of a large amount of heats that produce by light-emitting diode chip for backlight unit and the high-octane light of being exported thereof greatly to element.Thereby just can eliminate the factor that causes ageing equipment effectively, prevent ageing equipment.
For foundation white light source of the present invention and manufacture method thereof, it is when having above-mentioned advantage, and in the process of making, its manufacturing process is simple, need not additionally to increase other expensive equipment, only needs to provide some cheap elements.Simultaneously, can also make share (Lot) deviation arrive minimized degree.
Therefore, for foundation white light source of the present invention and manufacture method thereof, because it has above-mentioned advantage.Therefore, just can use light source, or display light source etc. has the white light source element of multiple application characteristic with a large amount of keyseaves (Key pad) that are used for mobile communication terminal device of producing of lower cost.
Those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, and be not to be used as limitation of the invention, as long as in connotation scope of the present invention, all will drop in the scope of claims of the present invention variation, the modification of the above embodiment.
Claims (5)
1. the manufacture method of a white light source is characterized in that step comprises:
The 1st step, the step to the bag substrate is prepared promptly is provided with the chip pad zone on the top of above-mentioned bag substrate, then, periphery at the said chip base area is provided with the pair of electrodes terminal, and above-mentioned pair of electrodes terminal is connected with power supply respectively, and has a pair of guiding device outstanding to the outside;
The 2nd step, bonding light-emitting diode chip for backlight unit on the chip pad zone of above-mentioned bag substrate then, is connected with above-mentioned electrode terminal above-mentioned light-emitting diode chip for backlight unit again by electric wire;
The 3rd step is filled transparent casting resin to the hollow devices position of the lens of being made by the macromolecule resin of fluorescent material dispersion;
The 4th step, for the transparent casting resin that the hollow devices position that makes the lens of making to the above-mentioned macromolecule resin that is disperseed by fluorescent material is filled into can be with light-emitting diode chip for backlight unit, the electrode terminal of above-mentioned bag substrate, and electric wire wraps up, and carries out said lens and above-mentioned bag substrate bonding.
2. the manufacture method of white light source as claimed in claim 1 is characterized in that:
Above-mentioned light-emitting diode chip for backlight unit is to use the light-emitting diode chip for backlight unit that can send blueness or ultraviolet.
3. the manufacture method of white light source as claimed in claim 1 is characterized in that:
Above-mentioned fluorescent material can be from organic fluorescence materials, inorganic fluorescent material, and selects a kind of in the mixing fluorescent material of being made up of organic fluorescence materials and inorganic fluorescent material arbitrarily.
4. the manufacture method of white light source as claimed in claim 1 is characterized in that:
The shape of said lens is the lens with semi-spherical shape.
5. the manufacture method of white light source as claimed in claim 1 is characterized in that:
Said lens is to adopt the macromolecule resin that fluorescent material is disperseed to be made by the method for injecting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100301917A CN100405621C (en) | 2005-09-29 | 2005-09-29 | High-output white light source and its production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100301917A CN100405621C (en) | 2005-09-29 | 2005-09-29 | High-output white light source and its production |
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| CN1941430A CN1941430A (en) | 2007-04-04 |
| CN100405621C true CN100405621C (en) | 2008-07-23 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2361581A (en) * | 2000-04-20 | 2001-10-24 | Lite On Electronics Inc | A light emitting diode device |
| CN1372330A (en) * | 2001-02-26 | 2002-10-02 | 华上光电股份有限公司 | LED using scattered light media to make light conversion |
| CN1399355A (en) * | 2001-07-25 | 2003-02-26 | 株式会社西铁城电子 | LED device |
| WO2004021461A2 (en) * | 2002-08-30 | 2004-03-11 | Gelcore Llc | Phosphor-coated led with improved efficiency |
| US20050121686A1 (en) * | 2003-12-09 | 2005-06-09 | Bernd Keller | Semiconductor light emitting devices and submounts and methods for forming the same |
-
2005
- 2005-09-29 CN CNB2005100301917A patent/CN100405621C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2361581A (en) * | 2000-04-20 | 2001-10-24 | Lite On Electronics Inc | A light emitting diode device |
| CN1372330A (en) * | 2001-02-26 | 2002-10-02 | 华上光电股份有限公司 | LED using scattered light media to make light conversion |
| CN1399355A (en) * | 2001-07-25 | 2003-02-26 | 株式会社西铁城电子 | LED device |
| WO2004021461A2 (en) * | 2002-08-30 | 2004-03-11 | Gelcore Llc | Phosphor-coated led with improved efficiency |
| US20050121686A1 (en) * | 2003-12-09 | 2005-06-09 | Bernd Keller | Semiconductor light emitting devices and submounts and methods for forming the same |
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| CN1941430A (en) | 2007-04-04 |
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