KR20100042066A - Light emitting diode package - Google Patents

Light emitting diode package Download PDF

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Publication number
KR20100042066A
KR20100042066A KR1020080101189A KR20080101189A KR20100042066A KR 20100042066 A KR20100042066 A KR 20100042066A KR 1020080101189 A KR1020080101189 A KR 1020080101189A KR 20080101189 A KR20080101189 A KR 20080101189A KR 20100042066 A KR20100042066 A KR 20100042066A
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KR
South Korea
Prior art keywords
light emitting
emitting device
lead frame
device package
package
Prior art date
Application number
KR1020080101189A
Other languages
Korean (ko)
Inventor
김홍민
Original Assignee
삼성엘이디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성엘이디 주식회사 filed Critical 삼성엘이디 주식회사
Priority to KR1020080101189A priority Critical patent/KR20100042066A/en
Publication of KR20100042066A publication Critical patent/KR20100042066A/en

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Abstract

The present invention provides a light emitting device package having a simple structure, improving luminous efficiency through blue LEDs and phosphors, and enhancing color rendering and convenience of control using red LEDs and green LEDs.

Description

Light Emitting Diode Package

The present invention relates to a light emitting device package, and more particularly, to a light emitting device package capable of driving a blue LED, a green LED, and a red LED to improve the overall light efficiency of the light emitting device package and increase color rendering properties.

A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors of light by forming a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, and InGaInP.

In general, the criteria for determining the characteristics of the light emitting diode device include color, luminance, and luminance intensity range. The characteristics of such a light emitting diode element are primarily determined by the compound semiconductor material used in the light emitting diode element, but also greatly influenced by the structure of the package for mounting the chip as a secondary element. In order to obtain high luminance and luminance angular distribution according to user's demands, the primary factor due to material development is limited, which has attracted much attention to package structure.

Such a light emitting device package has a structure different from that of a conventional semiconductor package because it must exhibit not only thermal and electrical reliability but also optical characteristics.

Conventional light emitting device packages are typical shell-type packages that have metal leads and wrap the outside with transparent resin, and surface mount device (SMD) packages that can be surface-mounted with lead frames and injection resins.

Such a light emitting device package is used by converting the wavelength emitted from the LED to a wavelength of a desired color by changing the wavelength using an external phosphor.

Conventionally, a method of converting light of a blue LED into white light using a yellow color phosphor has been used. The white light emitting device having such a structure is widely used because of its low cost and very simple in principle and structure.

However, there is a problem that the color rendering is low due to the spectral deficiency of the green and red regions due to the emission of a single yellow phosphor.

In order to solve this problem, white light emitting devices were manufactured by mounting RGB (Red, Green, Blue) LEDs in one package without using white LEDs or by using green and red phosphors excited by blue LEDs and blue light. .

However, this method can improve color reproducibility, but there is a problem in that the dispersion of color reproducibility increases during manufacturing because color conversion is performed by the concentration of the phosphor.

In addition, the color rendering can be increased, but the excitation efficiency is lower than that of the conventional yellow phosphor, so that the amount of light of the entire light emitting device is significantly reduced, resulting in low luminous efficiency and difficulty in controlling with the difficulty of mixing color.

The present invention is to solve the above problems of the prior art, the purpose of the structure is simple, improve the luminous efficiency through the blue LED and the phosphor, and increase the color rendering and control convenience using the red LED and green LED To provide a light emitting device package that can be.

The light emitting device package according to the present invention includes: a first light emitting device mounted on a submount and positioned at a substantially central portion of the submount; A plurality of second light emitting devices mounted on the submount and adjacent to the first light emitting device; A first lead frame provided between the first light emitting device and the second light emitting device, the first lead frame forming a first mounting part in which the first light emitting device is mounted; And a second lead frame provided along an outer periphery of the submount and forming a second mounting portion in which the second light emitting device is mounted between the first lead frame.

In addition, the light emitting device package according to the present invention may further include a lens provided on the top of the first light emitting device, the plurality of second light emitting devices and sealed.

In addition, the light emitting device package according to the present invention may further include a molding member filled in the first mounting portion to cover the first light emitting device.

In addition, the light emitting device package according to the present invention may further contain a phosphor in the molding member.

In addition, the phosphor of the light emitting device package according to the present invention may include a yellow phosphor (yellow phosphor).

In addition, the first light emitting device of the light emitting device package according to the present invention may include a blue LED, the second light emitting device may include a red LED and a green LED.

In addition, the first lead frame of the light emitting device package according to the present invention is formed such that the inner circumferential surface is inclined downward toward the first light emitting element therein to form a first reflection surface, and the outer circumferential surface is downward toward the external second light emitting element. It may be formed to be inclined to form a second reflecting surface, respectively.

In addition, the second lead frame of the light emitting device package according to the present invention may be formed such that the inner peripheral surface is inclined downward toward the second light emitting device therein to form a third reflecting surface.

In addition, the second lead frame of the light emitting device package according to the present invention may form a stepped portion in which an upper portion of the third reflective surface is bent in an outer circumferential direction.

In addition, the lens of the light emitting device package according to the present invention may further contain a dispersant therein for color mixing of the light emitted from the first light emitting device and the second light emitting device, respectively.

The light emitting device package according to the present invention is simple in structure, improves the overall light efficiency of the light emitting device, has excellent color rendering properties, and has the effect of achieving convenience of control.

Specific details of an embodiment of a light emitting device package according to the present invention will be described with reference to the drawings.

First, a light emitting device package according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 3.

1 is a cross-sectional view showing the structure of a light emitting device package according to an embodiment of the present invention, Figure 2 is a plan view showing a light emitting device package shown in Figure 1, Figure 3 (a) (b) is shown in Figure 1 It is a perspective view which shows the light emitting element package.

1 to 3, a light emitting device package according to an embodiment of the present invention includes a first light emitting device 10, a second light emitting device 20, a first lead frame 30, and a second lead frame. 40, the lens 60 is formed.

The first light emitting device 10 is mounted on a submount 50 provided on the lower side of the light emitting device package, and is disposed at a substantially central portion of the submount 50.

In addition, the second light emitting device 20 is mounted on the submount 50, and a plurality of second light emitting devices 20 are disposed adjacent to the periphery of the first light emitting device 10.

The first light emitting device 10 may include a blue LED, and the second light emitting device 20 may include a red LED and a green LED. Do.

In the present invention, the blue LED is provided in the center of the package, and the red and green LEDs are provided on each of the left and right sides of the blue LED, respectively, but not limited thereto, but may be provided in plural numbers, respectively. Do.

The first light emitting device 10 and the second light emitting device 20 are mounted and fixed on the submount 50 through an adhesive made of an epoxy resin (not shown).

As shown in the drawing, the first light emitting device 10 and the second light emitting device 20 are connected to each other through the pair of metal wires 51 by the first lead frame 30 and the second lead frame ( Electrical connection with 40).

However, the present invention is not limited thereto, and it is also possible to be electrically connected to the first lead frame 30 and the second lead frame 40 through a solder ball, which is not shown. A printed circuit (not shown) is provided with a pattern.

Meanwhile, the first lead frame 30 and the second lead frame 40 are electrically connected to the light emitting devices 10 and 20 so that the light emitting devices 10 and 20 emit light to supply external power. do.

1 and 2, the first lead frame 30 is provided at a predetermined height between the first light emitting device 10 and the second light emitting device 20, and the first light emitting device 10 is provided. The first mounting part 53 is mounted therein.

That is, the first lead frame 30 has a structure surrounding the first light emitting device 10 in the center to form the first mounting part 53 corresponding to a space having a predetermined size.

As shown in FIG. 2, the first mounting unit 53 may be formed in a quadrangular shape or a circular shape according to the structure in which the first lead frame 30 is provided, or may be formed in various other shapes.

The second lead frame 40 is provided at a predetermined height along the outer periphery of the submount 50, and the second light emitting device 20 is disposed between the second lead frame 30 and the first lead frame 30. A second mounting portion 55 to be mounted on is formed.

The second mounting unit 55 has a structure in which the second lead frame 40 surrounds the first lead frame 30 to between the second lead frame 40 and the first lead frame 30. The size corresponds to a space having a predetermined size, and the size thereof changes by a distance difference between the second lead frame 40 and the first lead frame 30.

The first lead frame 30 and the second lead frame 40 have a slope having a predetermined size toward the side facing the first light emitting device 10 and the second light emitting device 20 to improve the light efficiency. Slopes 31, 32, and 41 are provided.

As shown in the drawing, the first lead frame 30 is formed such that an inner circumferential surface is inclined downward toward the first light emitting device 10 therein to form a first reflection surface 31, and an external second light emitting device ( The outer circumferential surface is formed to be inclined downward toward 20 to form second reflecting surfaces 32, respectively.

The second lead frame 40 is formed such that an inner circumferential surface is inclined downward toward the second light emitting device 20 therein to form a third reflective surface 41.

The second lead frame 40 has a height higher than that of the first lead frame 30 so that the length of the third reflecting surface 41 is greater than that of the first reflecting surface 31 and the second reflecting surface 32. It is preferred to be longer than the length.

In this case, more light can be reflected through the third reflection surface 41 provided on the outer circumferential surface side, thereby improving the light efficiency.

However, the present invention is not limited thereto, and the length of the third reflecting surface 41 is increased so that the height of the second lead frame 40 corresponds to the height of the first lead frame 30. And to be substantially equal to the length of the second reflecting surface 32.

In this case, there is an advantage that the height of the package can be reduced, thereby miniaturization.

On the other hand, Figure 4 shows the structure of another embodiment of a light emitting device package according to the present invention.

The overall structure of the light emitting device package according to the other embodiment shown in FIG. 4 is substantially the same as the embodiment described with reference to FIG. 1, except that the structure of the second lead frame is different from that of the embodiment of FIG. 1.

As shown in FIG. 4, the second lead frame 40 includes a step portion 42 in which an upper portion of the third reflecting surface 41 is bent in an outer circumferential direction to accommodate the lens 60 described below. Do it.

In this case, the length of the third reflecting surface 41 is preferably equal to the length of the first reflecting surface 31 and the second reflecting surface 32.

Meanwhile, the lens 60 includes a molding member 62 covering the first light emitting device 10, the first light emitting device 10, the second light emitting device 20, and the first lead frame 30. To protect it from the outside.

As shown in the drawing, the molding member 62 is made of silicone resin, and is filled in the first mounting portion 53 along the first reflecting surface 31 in the first lead frame 30. The light emitting element 10 is covered.

In this case, the molding member 62 preferably contains a yellow phosphor therein.

Therefore, the luminous efficiency is increased by using a yellow phosphor in the first light emitting device 10 including the blue LED.

In addition, transparent silicon is disposed on the first light emitting device 10, the first lead frame 30, the second light emitting device 20, and the second mounting unit 55, which are encapsulated by the molding member 62. The lens 60 molded by resin is formed and disposed to encapsulate the components.

Here, the lens 60 preferably further includes a dispersant therein for color mixing of light emitted from the first light emitting device 10 and the second light emitting device 20, respectively.

As described above, the light emitting device package according to the present invention implements white light using three color LEDs of blue LED, red LED and green LED.

In particular, the blue LED provided in the center is encapsulated with silicon containing a yellow phosphor to improve the light efficiency, and the red color and green LEDs provided around them improve the color rendering properties, as well as easily control the color mixing. It is possible to do so.

1 is a cross-sectional view showing the structure of a light emitting device package according to an embodiment of the present invention.

FIG. 2 is a plan view illustrating the light emitting device package illustrated in FIG. 1.

3A and 3B are perspective views illustrating the light emitting device package shown in FIG. 1.

4 is a cross-sectional view illustrating a structure of a light emitting device package according to another embodiment of the present invention.

Claims (10)

A first light emitting device mounted on the submount and positioned at a substantially central portion of the submount; A plurality of second light emitting devices mounted on the submount and adjacent to the first light emitting device; A first lead frame provided between the first light emitting device and the second light emitting device, the first lead frame forming a first mounting part in which the first light emitting device is mounted; And A second lead frame provided along an outer periphery of the submount and forming a second mounting part in which the second light emitting device is mounted between the first lead frame; Light emitting device package comprising a. The method of claim 1, The first light emitting device, the light emitting device package further comprises a lens provided on the sealing of the plurality of second light emitting device. The method of claim 1, The light emitting device package further comprises a molding member filled in the first mounting portion to cover the first light emitting device. The method of claim 3, A light emitting device package, characterized in that it further comprises a phosphor in the molding member. The method of claim 4, wherein The phosphor package comprises a yellow phosphor (yellow phosphor). The method of claim 1, The first light emitting device comprises a blue LED, the second light emitting device package characterized in that it comprises a red LED and a green LED. The method of claim 1, The first lead frame is formed such that the inner circumferential surface is inclined downward toward the first light emitting element therein to form a first reflection surface, and the outer circumferential surface is inclined downward toward the external second light emitting element to form a second reflective surface. Each light emitting device package, characterized in that formed. The method of claim 1, The second lead frame is formed so that the inner peripheral surface is inclined downward toward the second light emitting element therein to form a third reflecting surface. The method of claim 8, The second lead frame is a light emitting device package, characterized in that for forming a stepped portion wherein the upper portion of the third reflective surface is bent in the direction of the outer peripheral surface. The method of claim 1, The lens package further comprises a dispersant therein for color mixing of the light emitted from the first light emitting device and the second light emitting device, respectively.
KR1020080101189A 2008-10-15 2008-10-15 Light emitting diode package KR20100042066A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080101189A KR20100042066A (en) 2008-10-15 2008-10-15 Light emitting diode package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080101189A KR20100042066A (en) 2008-10-15 2008-10-15 Light emitting diode package

Publications (1)

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KR20100042066A true KR20100042066A (en) 2010-04-23

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8981392B2 (en) 2012-11-14 2015-03-17 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8981392B2 (en) 2012-11-14 2015-03-17 Samsung Electronics Co., Ltd. Light emitting device package and method of manufacturing the same

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