KR20100042066A - Light emitting diode package - Google Patents
Light emitting diode package Download PDFInfo
- Publication number
- KR20100042066A KR20100042066A KR1020080101189A KR20080101189A KR20100042066A KR 20100042066 A KR20100042066 A KR 20100042066A KR 1020080101189 A KR1020080101189 A KR 1020080101189A KR 20080101189 A KR20080101189 A KR 20080101189A KR 20100042066 A KR20100042066 A KR 20100042066A
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- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- lead frame
- device package
- package
- Prior art date
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Abstract
The present invention provides a light emitting device package having a simple structure, improving luminous efficiency through blue LEDs and phosphors, and enhancing color rendering and convenience of control using red LEDs and green LEDs.
Description
The present invention relates to a light emitting device package, and more particularly, to a light emitting device package capable of driving a blue LED, a green LED, and a red LED to improve the overall light efficiency of the light emitting device package and increase color rendering properties.
A light emitting diode (LED) refers to a semiconductor device capable of realizing various colors of light by forming a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, and InGaInP.
In general, the criteria for determining the characteristics of the light emitting diode device include color, luminance, and luminance intensity range. The characteristics of such a light emitting diode element are primarily determined by the compound semiconductor material used in the light emitting diode element, but also greatly influenced by the structure of the package for mounting the chip as a secondary element. In order to obtain high luminance and luminance angular distribution according to user's demands, the primary factor due to material development is limited, which has attracted much attention to package structure.
Such a light emitting device package has a structure different from that of a conventional semiconductor package because it must exhibit not only thermal and electrical reliability but also optical characteristics.
Conventional light emitting device packages are typical shell-type packages that have metal leads and wrap the outside with transparent resin, and surface mount device (SMD) packages that can be surface-mounted with lead frames and injection resins.
Such a light emitting device package is used by converting the wavelength emitted from the LED to a wavelength of a desired color by changing the wavelength using an external phosphor.
Conventionally, a method of converting light of a blue LED into white light using a yellow color phosphor has been used. The white light emitting device having such a structure is widely used because of its low cost and very simple in principle and structure.
However, there is a problem that the color rendering is low due to the spectral deficiency of the green and red regions due to the emission of a single yellow phosphor.
In order to solve this problem, white light emitting devices were manufactured by mounting RGB (Red, Green, Blue) LEDs in one package without using white LEDs or by using green and red phosphors excited by blue LEDs and blue light. .
However, this method can improve color reproducibility, but there is a problem in that the dispersion of color reproducibility increases during manufacturing because color conversion is performed by the concentration of the phosphor.
In addition, the color rendering can be increased, but the excitation efficiency is lower than that of the conventional yellow phosphor, so that the amount of light of the entire light emitting device is significantly reduced, resulting in low luminous efficiency and difficulty in controlling with the difficulty of mixing color.
The present invention is to solve the above problems of the prior art, the purpose of the structure is simple, improve the luminous efficiency through the blue LED and the phosphor, and increase the color rendering and control convenience using the red LED and green LED To provide a light emitting device package that can be.
The light emitting device package according to the present invention includes: a first light emitting device mounted on a submount and positioned at a substantially central portion of the submount; A plurality of second light emitting devices mounted on the submount and adjacent to the first light emitting device; A first lead frame provided between the first light emitting device and the second light emitting device, the first lead frame forming a first mounting part in which the first light emitting device is mounted; And a second lead frame provided along an outer periphery of the submount and forming a second mounting portion in which the second light emitting device is mounted between the first lead frame.
In addition, the light emitting device package according to the present invention may further include a lens provided on the top of the first light emitting device, the plurality of second light emitting devices and sealed.
In addition, the light emitting device package according to the present invention may further include a molding member filled in the first mounting portion to cover the first light emitting device.
In addition, the light emitting device package according to the present invention may further contain a phosphor in the molding member.
In addition, the phosphor of the light emitting device package according to the present invention may include a yellow phosphor (yellow phosphor).
In addition, the first light emitting device of the light emitting device package according to the present invention may include a blue LED, the second light emitting device may include a red LED and a green LED.
In addition, the first lead frame of the light emitting device package according to the present invention is formed such that the inner circumferential surface is inclined downward toward the first light emitting element therein to form a first reflection surface, and the outer circumferential surface is downward toward the external second light emitting element. It may be formed to be inclined to form a second reflecting surface, respectively.
In addition, the second lead frame of the light emitting device package according to the present invention may be formed such that the inner peripheral surface is inclined downward toward the second light emitting device therein to form a third reflecting surface.
In addition, the second lead frame of the light emitting device package according to the present invention may form a stepped portion in which an upper portion of the third reflective surface is bent in an outer circumferential direction.
In addition, the lens of the light emitting device package according to the present invention may further contain a dispersant therein for color mixing of the light emitted from the first light emitting device and the second light emitting device, respectively.
The light emitting device package according to the present invention is simple in structure, improves the overall light efficiency of the light emitting device, has excellent color rendering properties, and has the effect of achieving convenience of control.
Specific details of an embodiment of a light emitting device package according to the present invention will be described with reference to the drawings.
First, a light emitting device package according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 3.
1 is a cross-sectional view showing the structure of a light emitting device package according to an embodiment of the present invention, Figure 2 is a plan view showing a light emitting device package shown in Figure 1, Figure 3 (a) (b) is shown in Figure 1 It is a perspective view which shows the light emitting element package.
1 to 3, a light emitting device package according to an embodiment of the present invention includes a first
The first
In addition, the second
The first
In the present invention, the blue LED is provided in the center of the package, and the red and green LEDs are provided on each of the left and right sides of the blue LED, respectively, but not limited thereto, but may be provided in plural numbers, respectively. Do.
The first
As shown in the drawing, the first
However, the present invention is not limited thereto, and it is also possible to be electrically connected to the
Meanwhile, the
1 and 2, the
That is, the
As shown in FIG. 2, the
The
The
The
As shown in the drawing, the
The
The
In this case, more light can be reflected through the
However, the present invention is not limited thereto, and the length of the third reflecting
In this case, there is an advantage that the height of the package can be reduced, thereby miniaturization.
On the other hand, Figure 4 shows the structure of another embodiment of a light emitting device package according to the present invention.
The overall structure of the light emitting device package according to the other embodiment shown in FIG. 4 is substantially the same as the embodiment described with reference to FIG. 1, except that the structure of the second lead frame is different from that of the embodiment of FIG. 1.
As shown in FIG. 4, the
In this case, the length of the third reflecting
Meanwhile, the
As shown in the drawing, the molding
In this case, the molding
Therefore, the luminous efficiency is increased by using a yellow phosphor in the first
In addition, transparent silicon is disposed on the first
Here, the
As described above, the light emitting device package according to the present invention implements white light using three color LEDs of blue LED, red LED and green LED.
In particular, the blue LED provided in the center is encapsulated with silicon containing a yellow phosphor to improve the light efficiency, and the red color and green LEDs provided around them improve the color rendering properties, as well as easily control the color mixing. It is possible to do so.
1 is a cross-sectional view showing the structure of a light emitting device package according to an embodiment of the present invention.
FIG. 2 is a plan view illustrating the light emitting device package illustrated in FIG. 1.
3A and 3B are perspective views illustrating the light emitting device package shown in FIG. 1.
4 is a cross-sectional view illustrating a structure of a light emitting device package according to another embodiment of the present invention.
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080101189A KR20100042066A (en) | 2008-10-15 | 2008-10-15 | Light emitting diode package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080101189A KR20100042066A (en) | 2008-10-15 | 2008-10-15 | Light emitting diode package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20100042066A true KR20100042066A (en) | 2010-04-23 |
Family
ID=42217529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080101189A KR20100042066A (en) | 2008-10-15 | 2008-10-15 | Light emitting diode package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20100042066A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8981392B2 (en) | 2012-11-14 | 2015-03-17 | Samsung Electronics Co., Ltd. | Light emitting device package and method of manufacturing the same |
-
2008
- 2008-10-15 KR KR1020080101189A patent/KR20100042066A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8981392B2 (en) | 2012-11-14 | 2015-03-17 | Samsung Electronics Co., Ltd. | Light emitting device package and method of manufacturing the same |
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WITN | Withdrawal due to no request for examination |