KR20050111595A - Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member - Google Patents

Abstract

A method of manufacturing a semiconductor device using an electronic component and a radiating member connected to each other through a heat conductive member, characterized by comprising the steps of forming one of a flat-shaped metallic body and a recessed metallic body on the electronic component by deposition treatment or plating treatment, forming the other of the flat-shaped metallic body and the recessed metallic body on the radiating member by the deposition treatment or the plating treatment, and filling a liquid metal in the recessed part of the recessed metallic body to form the liquid metal, flat-shaped metallic body, and a part of the recessed metallic body into a solid solution.

Description

ELECTRONIC COMPONENT AND RADIATING MEMBER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE COMPONENT AND MEMBER}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, a heat dissipation member, and a method for manufacturing a semiconductor device using the same, and more particularly, to a heat conductor connecting an electronic component and a heat dissipation member.

In recent years, information equipment devices demand high functions and high performance. Therefore, the electronic components used for the device apparatus have become high in functionality and high in speed.

On the other hand, the amount of heat generated by this electronic component increases, and the heat causes malfunction, thereby degrading performance. Therefore, it is necessary to radiate and cool this heat efficiently.

Common techniques for cooling electronic components include compressing electronic components and heat sinks, conducting heat generated by the electronic components to the heat sinks, and radiating heat from the heat sinks into the air. However, this cooling technique has a very small degree of adhesion between the heat conduction of the electronic component and the heat sink.

As an improved technique, for example, Japanese Patent Application Laid-Open No. 2002-30217. The cooling technique described in this publication improves the heat dissipation effect by increasing the degree of thermal conductivity of electronic components and heat sinks by compressing the electronic components and heat sinks through a thermally conductive resin incorporating a heat conducting filler. will be.

As another cooling technique, Japanese Patent Laid-Open No. 63-102345 is disclosed. The cooling technique described in this publication improves thermal conductivity by joining an electronic component and a heat sink through a thermally conductive alloy, thereby increasing the degree of adhesion of the thermal conductivity of the electronic component and the heat sink. This thermally conductive alloy is a metal in a semi-solidified state of indium metal and gallium liquid metal.

In addition, there is a Japanese Patent Application Publication No. 2002-140316. The cooling technique described in this publication improves thermal conductivity by joining an electronic component and a heat sink through a thermally conductive alloy of indium metal and liquid metal. This heat conductive alloy is a liquid, and has provided the bank which prevents this liquid metal from flowing out.

However, the technique described in Japanese Patent Application Laid-Open No. 2002-30217 is to compress an electronic part and a heat sink which is a heat sink through a thermally conductive resin. For this reason, there exists a problem that thermal conductivity is low. In addition, the technique described in Japanese Patent Laid-Open No. 63-102345 connects an electronic part and a heat sink in close contact with a metal in a semi-solidified state, thereby connecting the electronic part and the heat sink. As a result, the semi-solidified metal leaks and scatters, causing short circuits of surrounding circuit boards and electronic components. In addition, since the technique described in Japanese Patent Application Laid-Open No. 2002-140316 has provided a projection preventing liquid metal from flowing out, the presence of the projection increases the number of parts, part cost, and number of manufacturing processes.

Disclosure of the Invention

An object of the present invention is to increase the degree of adhesion between the heat conduction of the heat sink and the heat conductive member, thereby improving the thermal conductivity of the electronic component and the heat sink. As a result, the heat dissipation effect of the electronic component is improved. In addition, it is to provide a new electronic component device that can prevent short circuit disturbances of surrounding circuit boards, electronic components, and the like, thereby suppressing an increase in the number of components, component costs, and manufacturing processes.

This invention is an electronic component apparatus which connected the electronic component and the heat dissipation member via the heat conductive member, Specifically, the metal body of the heat conductive member provided in the electronic component and the heat dissipation member is formed in a vapor deposition process or a plating process. Each metal body is fixed to each other by a solid metal as a solid solution. Therefore, the electronic component and the heat dissipation part are connected through a heat conduction member which is a solid solution of the metal body and the liquid metal body. As a result, the adhesion area for heat conduction of an electronic component and a heat conduction member is increased, and also the adhesion area for heat conduction of a heat radiating member and a heat conduction member is increased, and the thermal conductivity of the metal body of a heat conduction member, and a liquid metal body is further improved. For this reason, the heat radiating effect of an electronic component can be improved. In addition, since the solid solution of a metal body and a liquid metal body is performed at normal temperature, it does not give thermal stress to an electronic component.

In addition, the concave metal body is provided with the bottom and the protrusion-shaped bank part of the edge portion integrally, and the liquid metal body is filled into the concave portion to form a solid solution. Therefore, the liquid metal body is sealed in the recessed portion and does not flow out from within the portion. For this reason, it is possible to prevent short circuit disturbances of surrounding circuit boards and electronic components. In addition, since the metal body of the protruding embankment portion and the bottom portion is formed integrally, it is possible to suppress the reduction in the number of parts and the increase in the number of manufacturing steps without preparing each part.

The metal body is composed of the element symbol In, and the liquid metal body is selected from at least one of Ga, Ga-In alloy, Ga-In-Sn alloy, Ga-In-Zn alloy, Ga-Sn alloy, and Ga-Zn alloy. . Accordingly, the metal body and the liquid metal forming the heat conductive member solidify to form a solid solution. As a result, the degree of adhesion of the thermal conductivity is increased to improve the thermal conductivity. As a result, the heat dissipation effect of the electronic component can be improved.

In addition, the metal body provided in the electronic component or the heat dissipation member is formed in a deposition process or a plating process. Therefore, the degree of adhesion of the thermal conductivity of the electronic component and the heat conductive member is increased, and the degree of adhesion of the thermal conductivity of the heat dissipation member and the thermal conductive member is increased.

As a result, the heat dissipation effect of the electronic component can be improved.

1 is an explanatory diagram of an electronic component device according to the present invention.

2 is a schematic diagram of a plating apparatus for manufacturing an electronic component apparatus according to the present embodiment.

3 is a schematic diagram of an electronic component according to the present embodiment.

4 is a schematic view of a heat sink according to the present embodiment.

To practice the invention  Best form for

An embodiment of the present invention will be described with reference to the drawings.

1 is a view for explaining the structure of an electronic component device according to the present invention.

1 is an electronic component device, 2 is an electronic component such as a semiconductor component, 3 is a heat radiator made of a metal having good thermal conductivity such as alumina, 4 is a heat conductor, 41 is a concave metal body, and 411 is a protrusion of a concave metal body. The shape bank part 412 is a bottom part of a concave metal body, 42 is a flat metal body, and 43 is a liquid metal.

In this electronic component device 1, the electronic component 2 and the heat sink 3 are connected via the heat conductor 4. The heat conductor 4 is composed of a concave metal body 41, a flat metal body 42, and a liquid metal 43. This concave metal body 41 is provided with the bottom part 4l2 and the protrusion-shaped bank part 41l in an integral structure. The protrusion-shaped bank part 411 and the bottom part 412 of this edge part are integrally formed by the plating process.

Specifically, the concave metal body 41 of the heat conductor 4 is formed in the upper part of the electronic component 2 by plating. The flat metal body 42 of the heat conductor 4 is formed in the lower part of the heat sink 3 by plating. The liquid metal 43 is filled in the bottom portion 412 surrounded by the protruding embankment portion 411 of the concave metal body 41. As the liquid metal 43, for example, a Ga-based alloy having high thermal conductivity can be used. As the concave metal body 41 and the plate-shaped metal body 42, for example, the liquid metal 43 and the metal bodies 41 and 42 can solidify with each other, and the thermal conductivity decreases even when solidified. The metal which is not used is preferably elected from the element symbol ln or its alloy.

This electronic component apparatus 1 is mounted on a circuit board and operates. This electronic component device 1 generates heat during operation. The heat is transferred from the heat sink 3 by heat transfer to the heat conductor 4. Therefore, the electronic components are cooled and kept at a constant temperature to operate stably.

It demonstrates with reference to schematic diagram of the plating apparatus which manufactures the electronic component apparatus of FIG. This plating apparatus can fill a plating liquid in a bathtub, provide a plated material, for example, In, on the anode electrode, and provide a plated material on the cathode electrode. In addition, a current having a predetermined value may be applied between the anode and the cathode.

The manufacturing method of an electronic component is demonstrated with reference to FIG.

(1) First, the electronic component 2 is prepared. And other than the plating process area | region of this electronic component 2 is masked. For example, a resist resin is applied. Thereafter, the electronic component 2 is attached to the hanger of the plating apparatus. And it mounts in the bathtub of a plating apparatus.

(2) Next, acid immersion processing is performed. The treatment conditions are specifically the acid solution is sulfuric acid having a concentration of about 10%, the temperature of the liquid is maintained at room temperature, for example 15 ℃. Then, in a plating bath for about 30 seconds, the oscillation is gently performed with an amplitude of about 75 mm in stroke. After removing the oil film and the contaminants in the plating region, the acid solution is washed by washing with water.

(3) Subsequently, Ni plating is performed. Plating conditions, for example, Watts bath (Watts bath) is about p.H. 4.5, a current density of 4 A / square dm, and a liquid temperature of about 50 ° C. The plate is then plated with gentle shaking with agitation and amplitude of about 75 mm. After that, the plating solution is washed by washing with water.

(4) Next, acid immersion treatment is performed. The processing conditions are specifically Dainsilver (product name ACC of Daiwakasei Co., Ltd.) whose concentration is about 10%, and the liquid temperature is kept at room temperature. Then, in the plating bath for about 30 seconds, gently swing with an amplitude of about 75 mm stroke. Then, oil film and contaminants in the plating region are removed. Then, the water is washed by washing with water.

(5) Next, strike In plating is performed. Plating treatment conditions are DAI NIN-PL30 (indium methane sulfonate which is a main component of Daiwa Kasei Co., Ltd. product), a current density of about 7.5 A / square dm, and a liquid temperature of about 50 degreeC, for example. Strike-plated with gentle shaking with agitation and amplitude of approximately 75mm stroke.

(6) Then, In plating process is performed. Plating treatment conditions include, for example, DAI NIN-PL30 (indium methane sulfonate, the main component of Daiwa Kasei Co., Ltd.), current density of about 0.5A / square dm, and liquid temperature of about 50 ° C. Plating while rocking gently at the amplitude of. The thickness of this In plating is about 0.1 mm. Therefore, in addition to the area | region to which the resist resin of the electronic component 2 was apply | coated, plating is provided in flat form.

(7) Next, a resist resin is apply | coated on the said flat plate. The area | region which apply | coats a resist resin is an area | region except the protrusion-like bank part of the edge part of an electronic component. The resist resin uses PDFl00 manufactured by Shinil Iron Chemical Co., Ltd. Laminate conditions have a temperature of about 80 ° C. and a vacuum of about 0.3 MPa.

(8) Then, In plating treatment is performed. The treatment conditions are, for example, the plating liquid is DAININ-P L30 (indium methane sulfonate which is the main component of Daiwa Kasei Co., Ltd.), the current density is about 0.5 A / square dm, and the liquid temperature is about 50 ° C. The plate is then plated with gentle shaking with an air-stirring stroke and an amplitude of about 75 mm. The thickness of this In plating is about 0.02 mm. Therefore, the concave metal body 41 of the heat conductor 4 could be formed in the electronic component 2. The shape has a thickness of about 0.1 mm at the bottom, an inner height of the protruding embankment 411 of the concave metal body 41 is about 0.02 mm, and a width of about 5 mm.

Since the electronic component 2 forms the concave metal body 41 by such a plating process, the closeness of heat conduction is favorable. Further, the protruding embankment portion 411 and the bottom portion 412 of the edge portion of the concave metal body 41 are integrally formed by the plating process. For this reason, the reduction of the number of components and the increase of the number of manufacturing processes can be suppressed, without preparing each component.

(9) Then, the resist resin used at the said manufacturing process is peeled off. When using a peeling liquid, it can carry out easily.

(10) Next, a flat metal body 42 is formed on the heat sink 3.

The manufacturing method of a heat sink is demonstrated with reference to FIG.

The manufacturing method forms the flat metal body 42 using the plating technique mentioned above. As described above, the heat sink 3 is plated to form a flat metal body 42 at the bottom of the heat sink 3. Because of this plating treatment, the degree of adhesion between the heat radiator 3 and the metal body 42 is good.

(11) Next, the liquid metal 43, specifically, the liquid gallium and the element symbol Ga are filled in a portion surrounded by the protrusion embankment formed on the electronic component 2. The charging method is performed by a dispenser device.

(12) The electronic component 2 and the heat sink 3 described above are merged. Therefore, both the metal bodies 41 and 42 and the liquid metal 43 solidify to form a solid solution. Solid solution may be left for several ten hours at room temperature. For this reason, no thermal stress is applied to the electronic components. The liquid metal 43 is a liquid until it becomes a solid solution, but is not leaked to the surroundings because the liquid metal 43 is surrounded by the protruding embankment 411. When it becomes a solid solution, the metal bodies 41 and 42 and the liquid metal 43 adhere, and become the electronic component apparatus 1.

Other embodiments

In the above embodiment, an example in which Ga is used for the liquid metal has been described. However, as other liquid metals, 75.5% Ga-24.5% In, 62% Ga-25% In-13% Sn, 67% Ga-29% 1n-4% Zn, 92% Ga-8% Sn, 95% Ga The same effect can be obtained by using a -5% Zn alloy.

In the said Example, the concave metal body 41 was formed in the electronic component 2 side, and the flat metal body 42 was formed in the heat sink 3 side. However, the electronic component device is mounted on the circuit board in various states. Depending on the mounting state, the flat metal body 42 may be formed on the electronic component 2 side, and the concave metal body 41 may be formed on the radiator 3 side.

As described above, the electronic component device according to the present invention increases the degree of adhesion between the thermal conductivity of the electronic component and the thermally conductive member, and also increases the degree of adhesion of the thermal conductivity between the heat sink and the thermally conductive member. As a result, the heat dissipation effect of the electronic component can be improved. In addition, it is possible to prevent short circuit disturbances of surrounding circuit boards, electronic components and the like, and to suppress increase in the number of components and the number of manufacturing steps.

Claims (4)

In the manufacturing method of the electronic component apparatus which connected the electronic component and the heat dissipation member through a heat conductive member, One of the flat metal body or the concave metal body is formed in the electronic component by vapor deposition or plating. The other of the flat metal body or the concave metal body is formed on the heat dissipation member by vapor deposition or plating; Thereafter, the liquid metal is filled into the concave portion of the concave metal body, A method for manufacturing a semiconductor device, wherein a part of a liquid metal, a flat metal body and a concave metal body is used as a solid solution. The method of claim 1, The metal body is composed of the element symbol In, The liquid metal is made of at least one of Ga, Ga-In alloy, Ga-ln-Sn alloy, Ga-ln-Zn alloy, Ga-Sn alloy, Ga-Zn alloy. A terminal surface on one side and a heat transfer surface on the other side, wherein one of the plate-shaped metal body or the concave-shaped metal body is formed on the heat-transfer surface by vapor deposition or plating. Electronic components. A heat dissipation member having a heat dissipation fin on one side and a heat transfer surface on the other side, and the other of the flat metal body or the concave metal body on the heat transfer surface formed by vapor deposition or plating.