KR20050083311A - Adhesive composition without cu peel-off and adhesive tape thereof - Google Patents

Abstract

The present invention relates to an adhesive composition without copper peeling and an adhesive tape prepared therefrom, wherein the adhesive composition further comprises a phenol or an aromatic amine antioxidant in an adhesive composition comprising an acrylic polymer, an epoxy resin, a curing agent, and other additives. The adhesive tape prepared from the composition has no copper peeling phenomenon due to oxidation of the lead frame after taping on the lead frame, compared to the conventional adhesive tape, and has excellent adhesive strength, sufficient heat resistance, insulation, and reliability.

Description

Adhesive composition without Cu peel-off and adhesive tape

The present invention relates to an adhesive composition without copper peeling and to an adhesive tape prepared therefrom, and more particularly, to a copper peeling prepared from an adhesive composition in which an antioxidant is further added to a conventional adhesive composition, and to which heat resistance, insulation and adhesion are Relates to an excellent adhesive tape.

Recently, with the development of information and communication, large capacity, high speed, and digitalization are required for exchange and transmission of a large amount of information data, and the trend of high performance, high functionality, and high density of electronic information devices is accelerating. As technology is required, higher levels of heat resistance, insulation, and ease of process application are required for materials such as adhesives and adhesive tapes, which have better performances than conventional adhesives.

Conventionally, the adhesive tape used for the resin package type semiconductor component includes a lead fixing adhesive tape, a TAB tape, and the like.

  In the case of the lead fixing adhesive tape, as shown in FIG. 1 in the assembly process of the lead frame and the semiconductor chip, it is used to improve the yield and productivity of the entire assembly process by facilitating the assembly process. In general, an adhesive tape for fixing a lead is adhered to a lead frame by a lead frame manufacturer, and a semiconductor manufacturer uses the semiconductor chip to mount the semiconductor chip and package the resin into a semiconductor chip protection resin. Therefore, the adhesive tape for fixing the lead should have sufficient heat resistance and reliability against heat that may occur in the semiconductor chip as well as adhesive force for fixing the lead.

  Existing adhesive tapes used for the above applications include a synthetic rubber-based resin such as polyacrylonitrile, polyacrylate or acrylonitrile-butadiene copolymer alone on a heat-resistant base film such as a polyamide film or a polyimide film. Or the adhesive mixed with these modified resins or another resin is apply | coated, or the adhesive is semi-hardened and used.

  However, in the case of fixing the lead pins in the resin package type semiconductor component, when the conventional adhesive tape is used, heat resistance or electrical reliability may not be sufficient, and when an excessive filler is used to compensate for this, the adhesive force may be inferior.

  In addition, when the lead pins are bonded or the semiconductor chip and the lead pins are bonded with an insulating tape, the taping temperature, pressure and time, curing conditions, etc. are strict, and there is a risk of damaging a metal material such as a lead frame.

  As part of this, according to Korean Patent Publication No. 1998-16625, a monomer composed of acrylonitrile, an acrylate having 2 to 10 carbon atoms, acrylic acid, methacrylic acid and hydroxyethyl acrylate or hydroxyethyl methacrylate An adhesive composition composed of an epoxy resin, a curing agent, and a silicone resin composed of an acrylic resin, a bisphenol-based epoxy, and a cresol novolac-based epoxy was presented.

  In addition, Japanese Patent Laid-Open No. 6-326158 discloses a curing composition composed of an epoxy resin, a phenol resin, an acrylic resin, a thermosetting resin such as a polyimide resin, an acrylonitrile-butadiene copolymer, polyamide, acrylic, polyurethane, and polyolefin. .

In addition, in Japanese Patent Application Laid-Open No. 7-74213, in order to solve the problem that insulation aging occurs in a conventional epoxy resin due to low electric resistance due to chlorine ion impurities, chlorine gas ion concentration is added by adding polyamide resin and bismaleimide resin. Presented a lowered technology.

  In addition, Japanese Patent Laid-Open No. 6-172524 proposes a soluble polyimide resin that can be used for electric and electronic components.

However, the conventional compositions presented above have a problem in that the lead frame is oxidized during the taping process in the lead frame, so that the copper plating is peeled off or degraded in the subsequent packaging process, resulting in a defect in wire bonding.

In addition, since heat resistance and adhesion at room temperature are good, but the adhesion at high temperature is poor, there is a disadvantage in that it can not stand at the actual epoxy molding temperature, which is a cause of defects in post-processing.

Accordingly, the present inventors have been working to provide a high temperature heat resistant adhesive composition and an adhesive tape that can be used in a semiconductor process, and the adhesive composition further comprising a phenolic or aromatic amine antioxidant added to a conventional adhesive composition on one or both sides of the base film. As a result of manufacturing the adhesive tape having the formed adhesive layer, it was found that the adhesive strength is excellent, and there is no peeling of copper due to oxidation of the lead frame after taping the lead frame, and the heat resistance and reliability are excellent, thereby completing the present invention.

Accordingly, an object of the present invention is to provide an adhesive composition which is excellent in adhesive strength, does not peel off due to oxidation of the lead frame after taping on the lead frame, and has excellent heat resistance and reliability.

Moreover, this invention also has the objective in providing the adhesive tape provided with the adhesive layer which formed the above-mentioned adhesive composition on the single side | surface or both surfaces of a base film.

The copper peel-free adhesive composition of the present invention, in the adhesive composition comprising an acrylic polymer, an epoxy resin, a curing agent and other additives, the antioxidant further comprises 0.01 to 30 parts by weight based on 100 parts by weight of the total solid content of the composition It is characterized by that.

Moreover, this invention has the characteristics also in the adhesive tape without copper peeling provided with the adhesive layer which formed the above adhesive composition on the single side | surface or both surfaces of a base film.

Hereinafter, the present invention will be described in detail.

The copper peel-free adhesive composition of the present invention is prepared by further adding an antioxidant to an adhesive composition including a conventional acrylic polymer, an epoxy resin, a curing agent, and other additives.

The acrylic polymer used in the present invention is an acrylonitrile-butadiene copolymer or an acrylonitrile-butadiene-acrylic acid terpolymer, having a weight average molecular weight of 20,000-1,000,000 and a carboxyl group at the chain end. By containing a carboxyl group in a chain terminal, the effect of improving the adhesive force with a to-be-adhered agent can be anticipated.

When the weight average molecular weight of the copolymer is less than 20,000, the heat resistance of the adhesive layer is lowered, and when the weight average molecular weight is more than 1,000,000, it is disadvantageous to form an adhesive layer through coating.

   In addition, in the present invention, it is preferable to mix and use an epoxy resin and a modified epoxy resin in order to realize excellent adhesion and heat resistance of the adhesive tape. That is, at least one epoxy resin selected from bisphenol A type epoxy or bisphenol F type epoxy and tetrabromophthalic anhydride epoxy, phenoxy, phenol novolak epoxy, cresol novolak epoxy, rubber modified epoxy and hydrogenated bisphenol A epoxy At least 1 type of epoxy resin selected from among them is mixed and used.

If the epoxy resin is used alone, sufficient heat resistance may not be realized, and the adhesive layer of the adhesive tape may not have sufficient adhesive strength or adhesion to the inorganic adhesive.

The amount of the epoxy resin added is preferably 1-15 parts by weight based on 100 parts by weight of the acrylic polymer. If the added amount of the epoxy resin is less than 1 part by weight, there is a problem in that the adhesive strength is not sufficient, and when the amount of the epoxy resin exceeds 15 parts by weight, the adhesive layer is easily leaked in the bonding process.

 In addition, the epoxy resin used in the present invention has a weight average molecular weight of 200-20,000, preferably 1,000-5,000. If the molecular weight of the epoxy resin is less than 200, the heat resistance and impact resistance is inferior, and if it exceeds 20,000, there is a problem that the adhesive force is reduced and the fluidity of the adhesive composition is inferior, which is disadvantageous for use in the adhesive layer forming process.

The addition amount of the modified epoxy resin is preferably added in an amount of 1-200 parts by weight based on 100 parts by weight of the acrylic polymer. If the addition amount of the modified epoxy resin is less than 1 part by weight, the heat resistance is lowered, and if it exceeds 200 parts by weight, there is a problem that the adhesive composition is peeled off from the base film.

   On the other hand, the epoxy resin and modified epoxy resin used in the present invention is semi-cured in step B and applied to the future bonding process, in order to cure the epoxy resin and the modified epoxy resin, an acid anhydride, an amine-based curing agent or an acid curing agent as a curing agent use.

Specific examples of such a curing agent include phthalic anhydride, tetrachlorophthalic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, hydric anhydride, pyromellitic dianhydride, methyl hexahydrophthalic anhydride, maleic anhydride, and methyl tetrahydrophthalic anhydride. Acid anhydrides such as; Diethylene Triamine (DETA), Triethylene Tetramine (TETA), Diethylamino propylamine (DEAPA), Methane diamine (MDA), N-aminoethyl piperazine (N-aminoethyl piperazine, N-AEP), M-xylene diamine (MXDA), isophorone diamine (IPDA), metaphenylenediamine (MPD), 4,4'-dimethyl aniline (4,4`-Dimethyl aniline, DAM or DDM), Diamino Diphenyl Sulfone (DDS), Dimethyl aminomethyl phenol (DMP-10), Tris- (dimethylaminomethyl) phenol ( Amine based curing agents such as Tris- (Dimethylaminomethyl) phenol, DMP-30), salts of DMP-30, and benzyl dimethyl amine (BDMA); Or acid hardeners such as xylene sulforic acid.

Preferred curing agents for general epoxy or phenol resins are amine curing agents, specifically m-xylene diamine (MXDA), isophorone diamine (IPDA), metaphenylenediamine (MPD), 4,4'-Dimethyl aniline (DAM or DDM), Diamino Diphenyl Sulfone (DDS), Dimethyl aminomethyl phenol (DMP-10), Tris- Using secondary or tertiary amines such as (tris- (Dimethylaminomethyl) phenol, DMP-30), salts of DMP-30, benzyl dimethyl amine, BDMA; or xylene sulfonic acid To shorten the reaction time to induce three-dimensional crosslinking.

   The curing agent of the present invention is added 1-100 parts by weight, preferably 5-70 parts by weight based on 100 parts by weight of the epoxy resin and the modified epoxy resin. If the amount of the curing agent added is less than 1 part by weight, the curing effect is insufficient. If the amount of the curing agent is more than 100 parts by weight, the change in physical properties due to the residual curing agent occurs over time.

   In the present invention, the following phenols or aromatic amine-based antioxidants are added to prevent the copper peeling phenomenon in the subsequent process due to the oxidation of the lead frame after taping the adhesive tape to the lead frame.

Examples of such antioxidants include ethylenebis (oxyethylene) bis- (2- (5-tertiary-butyl-4-hydroxy-m-tolyl) -propionate) and calcium diethylbis (((3 , 5-bis (1,1-dimethylethyl) -4-hydroxyphenyl) methyl) phosphonate), octadecyl-3- (3,5-di-tertily-butyl-4-hydroxyphenyl)- Propionate, 3,3 ', 3', 5,5 ', 5'-hexa-tertily-butyl-a, a', a '-(methicene-2,4,6-tril) tri- p-cresol, benzenepropanoic acid, 3,5-bis (1,1-dimethyl-ethyl) -4-hydroxy-C ₇ -C ₉ branched alkyl ester, 4,6-bis (octylthiomethyl)- o-cresol, pentaerythritol tetrakis (3- (3,5-di-tertiary-butyl-4-hydroxyphenyl) propionate), tris (2,4-di-tertily-butylphenyl) Phosphite, 6,6'-di-tertily-butyl-2,2'-thiodi-p-cresol, octadecyl-3- (3,5-di-tertily-butyl-4-hydroxyphenyl) Propionate, N, N'-hexane-1,6-diylbis (3,5-di-tertily-butyl-4-hydroxyphenyl propion Selecting a polyimide), one kind of or more will be added at 0.01 to 30 parts by weight based on the total solid content of 100 parts by weight of the bonding composition. If 0.01 parts by weight or less is added, the anti-oxidation effect cannot be expected, and if it exceeds 30 parts by weight, there is a possibility of causing uneven curing of the adhesive layer.

   In addition, a filler may be used for the purpose of ensuring that the adhesive layer has good tapping properties in a high temperature and high pressure bonding process and a series of semiconductor manufacturing processes, wherein the filler used is calcium carbonate, zinc oxide, silica having a particle size of 0.5-5 μm. At least one selected from alumina, diamond powder, quartz powder or zircon powder, and may be used by adding 0.5-15 parts by weight based on 100 parts by weight of the total solid content in the adhesive composition.

   In addition, the adhesive composition of the present invention may use the following additives if necessary in addition to the above composition. However, all of these additives must be nonionic and have extremely low content of impurities.

   That is, as a vulcanizing agent of the acrylonitrile-butadiene copolymer or the acrylonitrile-butadiene-acrylic acid terpolymer, thiuram-based vulcanizing agent, zinc oxide or peroxide is 0.5-10 parts by weight of the copolymer. It can be used in parts by weight, if the content exceeds the above range it will lose the function as an adhesive layer due to the cross-linking of the excessive copolymer.

   In addition, a phosphorus-based flame retardant may be added to improve the flame retardancy of the adhesive layer. The structure of the flame retardant is 9,10-dihydro-9-oxy-10-phosphaphenanthrene-10-oxide (9,10-dihydro-9-oxy-10-phosphaphenantrene-10-oxide), 3-hydroxyphenyl Phosphorus-containing compounds such as 3-hydroxyphenyl phosphynylpropanoic acid, diphenyl-1-1,2-di-hydroxyethylphosphine oxide, etc. As these, the addition amount thereof is 0.01-20 parts by weight, preferably 0.02-10 parts by weight based on 100 parts by weight of the acrylic polymer. If the added amount of the flame retardant is less than 0.01 parts by weight, there is no effect of improving the flame retardancy, and if it exceeds 20 parts by weight, the adhesive force is lowered and it is uneconomical.

   On the other hand, when the adhesive composition prepared above is applied and dried on one or both sides of the base film having excellent insulation and heat resistance, the adhesive tape can be prepared, wherein the structure of the adhesive tape is a base film layer having excellent insulation and heat resistance; An adhesive layer coated with the adhesive composition prepared above; It is composed of a protective layer to facilitate the use in the post process and to protect the adhesive layer.

   Substrate films that can be used in the present invention include polyetherimide (PEI), polyparaphenylene sulfide (PPS), polyimide (PI), polyetherketone (PEK) film, epoxy resin-glass fabrics, epoxy resin-polyimides And a composite heat resistant film such as a mid-glass fabric. Among them, a polyimide film having a smallest difference in thermal expansion coefficient and thermal expansion coefficient with a copper alloy is preferable.

   When the adhesive composition of the composition mentioned above is apply | coated to the single side | surface or both surfaces of such a base film, the final thickness of the apply | coated adhesive layer is 5-200 micrometers, Preferably it is 15-100 micrometers.

   The adhesive tape having an adhesive layer formed on one end of the base film is mainly suitable for fixing the lead pins of the lead frame, and the adhesive tape coated with the adhesive composition on both sides is used for the adhesion of the die pad and the semiconductor chip and the protection of the semiconductor chip. It is suitable for use in bonding the resin.

   In addition, a protective layer may be used on the top of the adhesive layer in order to facilitate post-processing and to protect the adhesive layer, and the resin used as the protective layer may include polyethylene, polypropylene, polyethylene terephthalate, silicone resin, or fluorine resin. The thickness of the layer is 10-200 μm, preferably 15-50 μm.

   The adhesive composition for an electronic component having the composition as described above and a method of manufacturing the adhesive tape prepared by applying the adhesive composition will be described below.

   A copolymer containing an carboxyl group, an epoxy resin, a modified epoxy resin, a curing agent and an antioxidant at a terminal is dissolved in a solvent, and then the mixed solution is stirred to be pre-cured and left to prepare an adhesive composition having improved low temperature curing property. At this time, the solvent used may be toluene, heptane, hexane, xylene, methyl ethyl ketone, tetrahydrofuran, n-methylpyrrolidone, dimethylformamide, dimethyl acetamide, and the like, preferably toluene, methyl ethyl ketone, xylene , Heptane and the like are suitable, and these solvents may be used alone or in combination of two or more solvents. The viscosity of the mixed solution here is 10-10,000 cps, preferably 50-5,000 cps, since comma coating is possible only within this range.

Then, the adhesive composition prepared above is applied to one or both sides of the base film using a comma knife. The applied film is dried and semi-cured to prepare a final adhesive tape. In addition, a protective layer is laminated on the adhesive layer in order to facilitate post-processing and to protect the adhesive layer.

   Hereinafter, the present invention will be described in more detail, but the present invention is not limited to the following examples.

(Example 1)

Acrylonitrile-butadiene copolymer Nipol-34 (Nippon Zeon) 150g containing a carboxyl group at a terminal having a weight average molecular weight of 260,000 and a nitrile group content of 27%, epoxy resin YD-017 (Kukdo Chemical) 20g After dissolving 100 g of modified epoxy resin Epikote180S70 (Japan jer) in 600 g of solvent methyl ethyl ketone, 0.2 g of 4-aminophenylsulfone and 5 g of silica particles Aerosil 200 (Daegussa-Hils) were added, and ethylene bis (oxy) was used as an antioxidant. Ethylene) bis- (2- (5-tert-butyl-4-hydroxy-m-tolyl) -propionate) was added with varying amounts as shown in Table 1 for 100 parts by weight of the total solids content in the composition. . The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

An antistatic solution (viscosity 400cps) was applied to the surface of polyimide film Apical NPI (Kaneka Co.) using a comma knife, dried at 160 ° C for 3 minutes, semi-cured at 150 ° C for 10 minutes, and an adhesive tape having a thickness of 20 μm. Was prepared.

In addition, a protective layer was laminated on the adhesive layer with a polyethylene terephthalate (PET) release film (Kolon Co., Ltd.) at a thickness of 38 μm.

   Adhesion, heat resistance, insulation and bleed out of the final adhesive tape was carried out as follows, and the resultant tape was taped to the leadframe to check whether the copper was peeled off, and the results are shown in Table 1 below. Shown in

(1) adhesion

   After cutting the prepared adhesive tape to a size of 10mm x 100mm, using a hot stamping machine (Hot Stamping Machine) on one side of the standard copper foil by pressing for 120 ℃, 4 atm, 0.3 seconds to make a sample. The sample prepared above was put on a universal testing machine (Instron 4303, Instron Co., Ltd.), and the average value was obtained by measuring the peel force between the copper foil and the film adhesive layer 10 times at a speed of 100 mm / min.

(2) heat resistance

   The residual amount at 300 ° C. is measured while the prepared adhesive tape is heated at a rate of 20 ° C./min using a thermogravimetric analysis (TGA).

(3) insulation

   The prepared adhesive tape is allowed to stand for 24 hours under constant temperature and humidity conditions at a temperature of 24 ° C. and a relative humidity of 45%. After that, a voltage of 100 V is applied with a high current meter (Keithley 238) and the current amount is measured.

(4) Bleed Out

   The adhesive tape is coated with a uniform thickness. The adhesive tape is cut into a size of 10 mm x 100 mm, and then pressed on one side of a standard copper foil using a hot stamping machine at 120 ° C., 4 atm, and 0.3 seconds to make a sample. . Using the 400-fold magnification of the HI-SCOPE Compact Micro Vision System (Model KH-2200), the length of the adhesive composition leaked out to the side of the tape was measured 10 times and the average value was taken.

(5) Check if copper is peeled off

The prepared adhesive tape was taped to a lead frame at 150 ° C. using a taping machine (Voice Woo Techron), and then the taped sample was left to stand on a 250 ° C. hot plate for 10 minutes. After the sample is cooled, the tape-attached portion is attached and detached using an industrial adhesive tape (3M), and then visually checked for copper peeling. If there is no copper peeling, it is good, and if a small amount of copper is peeled off, normally, if copper peeling is severe, it evaluates as defect.

(Example 2)

150 g of acrylonitrile-butadiene copolymer Nipol-34 (Nippon Zeon) containing a carboxyl group at a terminal having a nitrile group content of 27% and a weight average molecular weight of 260,000, 10 g of epoxy resin YD-017 (Kukdo Chemical) After dissolving 150 g of modified epoxy resin Epikote180S70 (Japan jer ) in 600 g of solvent methyl ethyl ketone, 0.2 g of 4-aminophenylsulfone and 5 g of silica particles Aerosil 200 (Daegussa-Hils) were added, and N, N 'was used as an antioxidant. -Hexane-1,6-diylbis (3,5-di-tert-butyl-4-hydroxyphenyl propionamide) was added with varying amounts as shown in Table 1 for 100 parts by weight of the total solids content in the composition. . The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

An antistatic solution (viscosity 450 cps) was applied to the surface of polyimide film Apical NPI (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, semi-cured at 150 ° C. for 10 minutes, and adhesive tape having a thickness of 20 μm. Was prepared.

In addition, a protective layer was laminated on the adhesive layer with a polyethylene terephthalate (PET) release film (Kolon Co., Ltd.) at a thickness of 38 μm.

   After peeling off the physical properties and the lead frame of the final adhesive tape was confirmed by peeling copper in the same manner as in Example 1, the results are shown in Table 1 below.

(Comparative Example 1)

Nitrile-butadiene copolymer Nipol-34 (Nippon Zeon) 150g containing a carboxyl group at a terminal having a nitrile group content of 27% and a weight average molecular weight of 260,000, 15g of epoxy resin YD-017 (Kukdo Chemical) After 200 g of the modified epoxy resin Epikote180S70 (Japan jer ) was dissolved in 600 g of solvent methyl ethyl ketone, 0.2 g of 4-aminophenylsulfone and 5 g of silica particles Aerosil 200 (Daegussa-Hils) were added. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

   The standing solution was applied to the surface of the polyimide film Apical NPI (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, and semi-cured at 150 ° C. for 10 minutes to prepare an adhesive tape having a thickness of 20 μm.

   In addition, a protective layer was laminated on the adhesive layer with a polyethylene terephthalate (PET) release film (Kolon Co., Ltd.) at a thickness of 38 m.

After peeling the physical properties of the final adhesive tape and the lead frame was confirmed whether the copper peeled in the same manner as in Example 1, the results are shown in Table 1 below.

Example 1 Example 2 Comparative Example 1 Antioxidant amount (part by weight) Antioxidant amount (part by weight) 0.01 1.0 5.0 10.0 25.0 0.01 1.0 5.0 10.0 25.0 Adhesive force (N / m) 210 200 185 180 170 235 215 210 195 180 240 Heat resistance (%) 98.5 98.2 98.1 98.4 98.1 99.2 99.1 99.3 99.0 99.8 97.6 Insulation (A) 10 ^-12 10 ^-12 10 ^-13 10 ^-13 10 ^-13 10 ^-12 10 ^-12 10 ^-12 10 ^-13 10 ^-13 10 ^-11 Runoff Test (㎛) 45.3 44.7 43.6 42.1 41.8 46.2 45.8 44.6 44.2 43.5 47.8 Copper stripping usually Good Good Good Good usually usually Good Good Good Bad

As shown in Table 1, the adhesive tape prepared by applying the adhesive composition of the present invention containing an antioxidant is the oxidation of the lead frame after taping compared to the adhesive tape prepared from the conventional adhesive composition without the antioxidant There is no copper peeling phenomenon due to, it can be confirmed that the adhesive strength is excellent, heat resistance and insulation.

As described above, by manufacturing the adhesive tape from the adhesive composition prepared by adding the antioxidant of the present invention to the conventional adhesive composition, there is no copper peeling phenomenon due to oxidation of the lead frame after taping, and excellent adhesion, heat resistance and insulation. .

1 shows a leadframe after a taping process.

<Description of Drawing>

1. Lead pin

2. Lead fixing tape

3. Die Pad

Claims (4)

In the adhesive composition containing an acrylic polymer, an epoxy resin, a curing agent and other additives, Adhesive composition, characterized in that it further comprises from 0.01 to 30 parts by weight based on 100 parts by weight of the total solid content of the composition. The antioxidant according to claim 1, wherein the antioxidant is ethylenebis (oxyethylene) bis- (2- (5-tertiary-butyl-4-hydroxy-m-tolyl) -propionate), calcium diethylbis ((( 3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl) methyl) phosphonate), octadecyl-3- (3,5-di-tertily-butyl-4-hydroxyphenyl) Propionate, 3,3 ', 3', 5,5 ', 5'-hexa-tertily-butyl-a, a', a '-(methicene-2,4,6-tril) tree -p-cresol, benzenepropanoic acid, 3,5-bis (1,1-dimethyl-ethyl) -4-hydroxy-C ₇ -C ₉ branched alkyl ester, 4,6-bis (octylthiomethyl) -o-cresol, pentaerythritol tetrakis (3- (3,5-di-tertily-butyl-4-hydroxyphenyl) propionate), tris (2,4-di-tertily-butylphenyl Phosphite, 6,6'-di-tertiary-butyl-2,2'-thiodi-p-cresol, octadecyl-3- (3,5-di-tertiary-butyl-4-hydroxyphenyl ) -Propionate, N, N'-hexane-1,6-diylbis (3,5-di-tertily-butyl-4-hydroxyphenyl propiona Adhesive composition, characterized in that the beads) at least one selected from the.   Adhesive tape comprising an adhesive layer prepared by applying the adhesive composition of claim 1 to one or both sides of the base film. The substrate film of claim 3, wherein the substrate film is polyetherimide (PEI), polyparaphenylenesulfide (PPS), polyimide (PI), polyetherketone (PEK), epoxy resin-glass fabric and epoxy resin-polyimide- Adhesive tape, characterized in that at least one selected from glass fabrics.