KR100707732B1 - Adhesive and adhesive tape for electronic accessories - Google Patents

Abstract

100 parts by weight of acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer having a weight average molecular weight of 20,000 to 2,000,000 containing a carboxyl group at the terminal; 5 to 100 parts by weight of a phenol resin based on 100 parts by weight of the copolymer; 50 to 200 parts by weight of an epoxy resin based on 100 parts by weight of the copolymer; And at least one curing agent selected from an acid anhydride, an amine curing agent, and a weak acid, the adhesive liquid for electronic parts comprising 1 to 20 parts by weight with respect to 100 parts by weight of the phenol resin or the epoxy resin, and the adhesive solution to the insulating and heat resistant base film. The present invention relates to a manufactured adhesive tape for electronic components, and that the adhesive tape can be bonded at a low temperature compared to a conventional adhesive tape, and the adhesive layer not only maintains continuous adhesive strength but also has sufficient heat resistance, insulation, and reliability. .

Adhesive Liquid * Adhesive Tape * Electronic Components * Semiconductor

Description

Adhesive and Adhesive Tape for Electronic Components {Adhesive and adhesive tape for electronic accessories}             

1 (a) is an overall view of the lead frame,

Fig. 1 (b) is a diagram related to lead shift.

※ Explanation of code of main part of drawing ※

1. Lead pin 2. Fixing tape

3. Die pad 4. Position of lead pin before fixing tape bonding process

5. Location of lead pin after fixing tape bonding process

The present invention relates to an adhesive liquid for fixing a lead pin of a lead frame constituting a semiconductor package and an adhesive tape obtained by applying the adhesive liquid, and more particularly, to an acrylic containing a carboxyl group at an end thereof. The nitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer is mixed with a noblock type or a resol type phenolic resin and an epoxy resin, and then the adhesive solution obtained by adding a curing agent and other fillers and the adhesive solution are insulated and heat-resistant. The adhesive tape obtained by apply | coating to the single side | surface or both surfaces of this excellent film (henceforth a base film).

With the recent development of information and communication, large-capacity, high-speed, and digitalization are required for the exchange and transmission of large amounts of information data, and the movement of high-performance, high-functionality and high-density electronic devices is accelerating. As mounting technology is required, higher levels of heat resistance, insulation, and ease of process application are required for organic materials, such as adhesives and adhesive tapes, which are more excellent in heat resistance than conventional adhesives.

Conventionally, the adhesive tape used for the resin package type semiconductor component includes a lead fixing adhesive tape, a TAB tape, and the like.

In the case of the lead fixing adhesive tape, as shown in FIG. 1 in the assembly process of the lead frame and the semiconductor chip, it is used to improve the yield and productivity of the entire assembly process by facilitating the assembly process. In general, a lead fixing adhesive tape is adhered on a lead frame by a lead frame manufacturer, and a semiconductor manufacturer mounts the semiconductor chip using the package and then packages the semiconductor chip with a resin for protecting the semiconductor chip. Therefore, the adhesive tape for fixing the lead must have sufficient heat resistance and reliability against heat that may occur in the semiconductor chip as well as adhesive force for fixing the lead.

Existing adhesive tapes used for the above applications include a synthetic rubber-based resin such as polyacrylonitrile, polyacrylate, or acrylonitrile-butadiene copolymer alone on a heat resistant support film such as a polyamide film or a polyimide film. Or the adhesive mixed with these modified resins or another resin is apply | coated, or the adhesive is semi-hardened and used.

However, when a conventional adhesive tape is used to fix lead pins in a resin packaged semiconductor component, heat resistance or electrical reliability may not be sufficient, and when an excessive filler is used to compensate for this, adhesive strength may be inferior. .

In addition, when the lead pins are bonded or the semiconductor chip and the lead pins are bonded with insulating tape, the taping temperature, pressure, time, curing conditions, etc. are strict, and there is a risk of damaging the metal materials such as lead frames. Technology and proper material selection were required.

As part of this, according to Korean Patent Publication No. 1998-16625, from a monomer consisting of acrylonitrile, an acrylate having an alkyl group having 2 to 10 carbon atoms, acrylic acid, methacrylic acid and hydroxyethyl acrylate or hydroxyethyl methacrylate An adhesive composition composed of an epoxy resin, a curing agent, and a silicone resin composed of an acrylic resin, a bisphenol epoxy, and a cresol novolac epoxy was prepared.

In addition, Japanese Patent Laid-Open No. 6-326158 discloses a curing composition composed of an epoxy resin, a phenol resin, an acrylic resin, a thermosetting resin such as a polyimide resin, an acrylonitrile-butadiene copolymer, polyamide, acrylic, polyurethane, and polyolefin. Announced.

In addition, in Japanese Patent Application Laid-Open No. 7-74213, in order to solve the problem of insulation aging occurring in a conventional epoxy resin due to low electric resistance due to chlorine ion impurities, a polyamide resin and bismaleimide resin are added to increase the gas chlorine ion concentration to 200. Techniques lowered to below ppm are presented.

In addition, Japanese Patent Laid-Open No. 6-172524 proposes a soluble polyimide resin usable for electric and electronic components.

However, the conventional compositions presented above have a disadvantage in that they can not stand at the actual epoxy molding temperature because they have good heat resistance or adhesion at room temperature but poor adhesion at high temperature, causing defects in subsequent processes. Urgent measures are needed.

Therefore, the inventors of the present invention while trying to solve the above problems, the acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer containing a carboxyl group at the terminal and After the epoxy resin was mixed, an acidic anhydride or an amine-based curing agent and other fillers were added to form an adhesive solution, and the adhesive solution was applied to one or both sides of the base film to prepare an adhesive tape. The present invention has been completed by knowing that it can be equipped with both heat resistance and reliability.

Accordingly, it is an object of the present invention to provide an adhesive liquid composition for an electronic component configured to have excellent adhesion.

In addition, another object of the present invention is to provide an adhesive tape having excellent adhesive performance and excellent heat resistance and reliability by applying the adhesive liquid prepared above to one or both sides of the base film.

The composition of the adhesive solution of the present invention for achieving the above object is acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer having a weight average molecular weight of 20,000 to 2,000,000 containing a carboxyl group at the terminal; 5 to 100 parts by weight of a phenol resin based on 100 parts by weight of the copolymer; 50 to 200 parts by weight of an epoxy resin based on 100 parts by weight of the copolymer; And at least one curing agent selected from an acid anhydride, an amine curing agent, and a weak acid, based on 100 parts by weight of the phenol resin or epoxy resin.

In addition, the present invention is also characterized by an adhesive tape prepared by applying and drying the adhesive solution on one or both surfaces of the insulating and heat resistant base film.

The present invention will be described in more detail as follows.

The adhesive liquid applied to the adhesive tape for an electronic component of the present invention may be an acrylonitrile-butadiene copolymer or an acrylonitrile-butadiene-acrylic acid terpolymer containing a carboxyl group at its terminal; Phenolic resins; Epoxy resins; And at least one curing agent selected from acid anhydrides, amine based curing agents or weak acids.

The binder polymer used in the present invention specifically contains an acrylonitrile-butadiene copolymer or an acrylonitrile-butadiene-acrylic acid terpolymer having a weight average molecular weight of 20,000 to 2,000,000 and contains a carboxyl group at its terminal.

In addition, the present invention uses a mixture of a thermosetting resin phenol resin and epoxy resin in order to implement the excellent heat resistance and adhesion of the adhesive tape. If only phenolic resin is used, the adhesive layer of the manufactured adhesive tape may be weak to physical impact, and the adhesive may leak out to the side of the tape during the bonding process or cause lead shift, resulting in product defects.

However, if the curing degree is increased to compensate for this, the initial adhesive strength is low, and a high taping temperature is required in the bonding process.

On the other hand, when only epoxy resin is used, the initial adhesive strength of the manufactured adhesive tape may be drastically lowered over time, making it difficult to secure long-term storage of the product.

In the present invention, in order to solve such a problem, a phenol resin and an epoxy resin are mixed and used.

The phenol resin used in the present invention is selected from a noblock-based or resol-based phenol resin, and at least one phenol resin is used. The molecular weight of the phenol resin used in the present invention is 500 to 10,000, preferably 1,000 to 5,000.

If a phenolic resin having a molecular weight of less than 500 is used, the surface of the adhesive layer becomes sticky and heat resistance is weak, and when using a phenolic resin having a molecular weight of more than 10,000, the gelation phenomenon is severely shown, and the formation of the adhesive layer is disadvantageous.

On the other hand, in the adhesive composition, the phenol resin is semi-cured at 80 to 300 ° C., preferably 120 to 220 ° C., so that the curing speed is slow at a temperature lower than 80 ° C., and thus the efficiency of the process is low. It is difficult to produce suitable products because the initial adhesive strength can be reduced by fast curing.

In this way, the curing degree of the phenol resin during curing is 5 to 90%, preferably 20 to 80%. If the curing degree is less than 5%, low temperature adhesiveness is very good, but relatively low heat resistance, if more than 90% hardening is excellent in heat resistance but low temperature adhesiveness.

The phenolic resin is added in an amount of 5 to 100 parts by weight based on the acrylonitrile-butadiene copolymer or the acrylonitrile-butadiene-acrylic acid terpolymer, and if the content is less than 5 parts by weight, the effect of addition is insignificant. This is because the storage property is lowered, and if the amount exceeds 100 parts by weight, the impact resistance of the product is lowered or the adhesive strength is lowered even when it is compensated for.

On the other hand, the phenol resin used in the present invention may be a phenol formaldehyde resin having a formaldehyde content of 20 to 90 parts by weight, wherein if the formaldehyde content is less than 20 parts by weight, the adhesive strength of the product is low, if the product exceeds 90 parts by weight Impact resistance is lowered.

In addition, the epoxy resin used in the present invention is a bisphenol A-based epoxy resin is preferably added in an amount of 50 to 200 parts by weight based on the binder polymer resin composition. If the added amount of the epoxy resin is less than 50 parts by weight, there is a problem that the impact resistance is lowered, and if it exceeds 200 parts by weight, the problem of long-term storage of the product is lowered.

The epoxy resin used in the present invention has a molecular weight of 20,000 to 1,000,000, preferably 100,000 to 500,000. If the molecular weight of the epoxy resin is less than 20,000, the heat resistance and impact resistance is very low, if it exceeds 1,000,000 because the fluidity of the adhesive liquid tends to be inferior, it is disadvantageous for use in the adhesive layer forming process.

On the other hand, an acid anhydride, an amine curing agent or a weak acid is used as a curing agent for the curing reaction of the epoxy resin and phenol resin used in the present invention. That is, the curing reaction of the epoxy resin can be broadly classified into a reaction with a curing agent and a reaction with a phenol resin. What is used as a hardening | curing agent of a general epoxy resin is an amine-type hardening | curing agent, Specifically, a three-dimensional crosslinking is induced by shortening reaction time using a secondary amine and a tertiary amine.

In addition, the curing of the noblock- or resol-based phenolic resin may be cured by heat. However, when using the noblock-based phenolic resin, at least one selected from an acid anhydride, an amine-based curing agent or a weak acid may be used as a curing agent to increase the curing rate. It is good to add and use.

Therefore, in the present invention, 1 to 20 parts by weight of one or more selected from an acid anhydride, an amine curing agent and a weak acid for 100 parts by weight of the phenol resin or the epoxy resin for the curing reaction of the epoxy resin and the phenol resin, preferably 5 -10 weight part is good. If the amount of the added hardener is less than 1 part by weight, the curing effect is insufficient, and if it exceeds 20 parts by weight, it is because the curing effect is out of a range that can be expected no longer.

In addition, a filler may be used for the purpose of making the adhesive layer have good tapping properties in a high temperature and high pressure bonding process and a series of semiconductor manufacturing processes, wherein the filler used is calcium carbonate, zinc oxide, silica having a particle size of 0.5 to 5 μm. , At least one selected from alumina, diamond powder, quartz powder or zircon powder, and may be used by adding 0.5 to 15 parts by weight based on 100 parts by weight of the solid content of the resin mixture.

In addition, the following additives may be used for the adhesive liquid of the present invention in addition to the above composition. However, all of these additives must be nonionic and have extremely low content of impurities.

That is, as a vulcanizing agent of the acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer, a thiuram vulcanizing agent, zinc oxide or peroxide is 0.5 to 10 parts by weight of the copolymer. It can be used in parts by weight, if the content is out of the above range can no longer expect a curing effect.

In addition, a phosphorus-based flame retardant may be added to improve the flame retardancy of the adhesive layer. The structure of the flame retardant is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 3-hydroxyphenyl phosphinyl propanoic acid, diphenyl-1-1,2-di-hydroxy As compounds containing phosphorus, such as ethylphosphine oxide, the addition amount thereof is 0.01 to 20 parts by weight, preferably 0.02 to 10 parts by weight based on 100 parts by weight of the copolymer.

If the amount of the flame retardant added is less than 0.01 part by weight based on 100 parts by weight of the copolymer, there is no effect of improving flame retardancy, and when it exceeds 20 parts by weight, the adhesive force is lowered and it is uneconomical.

On the other hand, when the adhesive solution prepared above is applied and dried on one or both sides of the base film having excellent insulation and heat resistance, the adhesive tape can be prepared, wherein the structure of the adhesive tape is a base film layer having excellent insulation and heat resistance; An adhesive layer coated with the adhesive solution prepared above; It consists of a protective layer for facilitating use in a later step.

Base films usable in the present invention include polyetherimide (PEI), polyparaphenylenesulfide (PPS), polyimide (PI), polyetherketone (PEK) films and epoxy resin-glass fabrics, epoxy resin-polyimides And a composite heat resistant film such as a mid-glass fabric. Among them, a polyimide film having a smallest difference in thermal expansion coefficient and thermal expansion coefficient with a copper alloy is preferable.

When the adhesive liquid of the composition mentioned above is apply | coated to the single side | surface or both surfaces of such a base film, the final thickness of the apply | coated adhesive layer is 10-200 micrometers, Preferably 25-100 micrometers is good.

The adhesive tape having the adhesive layer formed on the end surface of the base film is mainly suitable for fixing the lead pin of the lead frame. The adhesive tape coated with the adhesive liquid on both sides of the die film and the semiconductor chip are used for the protection of the semiconductor chip. It is suitable for use in the adhesion of the resin for.

In addition, a protective layer may be provided on the upper end of the adhesive layer for convenient use in a later process, and the resin used as the protective layer may include polyethylene, polypropylene, polyethylene terephthalate or fluorine resin, and the thickness of the protective layer may be It is 10-200 micrometers, Preferably it is 15-50 micrometers.

The adhesive liquid for an electronic component having the composition as described above and a method of manufacturing the adhesive tape prepared by applying the adhesive liquid will be described below.

The acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer, phenol resin and epoxy resin containing carboxyl groups at the end are dissolved in a solvent, and then the mixed solution is stirred and pre-cured to stand. To prepare an adhesive liquid having improved low temperature curability. This is because the viscosity of the mixed solution is 100 to 10,000 cps, preferably 500 to 5,000 cps. The adhesive solution prepared above is applied to a predetermined thickness using a comma knife on one side or both sides of the base film. The applied film is dried and semi-cured to prepare a final adhesive tape. In addition, the protective layer is laminated on the adhesive layer for ease of post-processing.

Hereinafter, the present invention will be described in more detail, but the present invention is not limited to the following examples.

Example 1

Acrylonitrile-butadiene copolymer Nipole-34 (Nippon Zeon) 150g with a nitrile group content of 27% and a weight average molecular weight of 260,000, 50g of phenol resin CKA-908 (KOLON Emulsion) and epoxy resin YD-011 (80% solids, Kukdo Chemical Co., Ltd.) 100 g was dissolved in 600 g of solvent methyl ethyl ketone, followed by 0.2 g of 4-aminophenylsulfone, 0.5 g of sulfur, 0.5 g of zinc oxide, and 3-hydroxyphenyl phosphinyl propanoic acid. 5 g was added. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

The left solution was applied to the surface of the cross section of polyamide film Apical NPI (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, semi-cured at 150 ° C. for 10 minutes, and an adhesive tape having a thickness of 21 μm was applied. Prepared.

In addition, a protective layer was laminated on the adhesive layer with a polyethylene terephthalate (PET) release film (Kolon Co., Ltd.) at a thickness of 38 μm.

Adhesion, heat resistance, insulation and bleed out of the final adhesive tape was carried out, the results are shown in Table 1 below.

Each property evaluation performed in the present invention is as follows.

(1) adhesion

The adhesive tape was cut into a size of 10mm X 100mm, and then, using a hot stamping machine on one side of the standard copper foil, 0.3 at a temperature of 120 ° C., 200 ° C. and 300 ° C. and a pressure of 4 atm. Compress for seconds to make a sample. The sample prepared above was hooked on a universal testing machine (Instron 4303, Instron Co., Ltd.) and pulled at a rate of 100 mm / min to measure the peel force between the copper foil and the film adhesive layer. In the same manner, it is attached to a mirror wafer of 4 inches in diameter and left for 24 hours to measure the peel force.

(2) heat resistance

There are two ways to do this:

① Measure the remaining amount at 300 ℃ by thermogravimeteric analysis (TGA).

(2) Place the copper-bonded sample in the Sibronn temoline 47900 oven and leave it at 300 ° C for 3 minutes to observe the degree of cracking of the bonding surface. If there is no change at all, it is good if there is any change. Evaluate.

(3) insulation

The prepared adhesive tape is allowed to stand for 24 hours under constant temperature and humidity conditions at a temperature of 24 ° C. and a relative humidity of 45%. The high-current meter Keithley 238 then applies a voltage of 100 volts to measure the amount of current.

(4) Bleed Out

The adhesive tape is coated with a uniform thickness. The adhesive tape is cut into a size of 10mm x 100mm, and then a hot stamping machine is used on one side of the standard copper foil to obtain temperatures of 120 ° C, 200 ° C and 300 ° C. A sample is made by pressing 0.3 seconds at 4 atmospheres. This was magnified 1000 times to measure and evaluate the length of the adhesive liquid leaking out to the side of the tape, and the measurement was calculated as a percentage of the thickness of the adhesive layer.

Example 2

An adhesive liquid and an adhesive tape were prepared in the same manner as in Example 1, except that an acrylonitrile-butadiene copolymer having a weight average molecular weight of 1,000,000 was used. The coating thickness of the final adhesive tape was 21 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Example 3

An adhesive liquid and an adhesive tape were prepared in the same manner as in Example 1 except that the weight average molecular weight was cured for 10 minutes at an acrylonitrile-butadiene copolymer having a weight of 320,000 at 200 ° C. The coating thickness of the final adhesive tape was 21 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Example 4

Example 1 except that acrylonitrile-butadiene copolymer having a weight average molecular weight of 260,000 was used and 5 g of silica having a particle diameter of 5 μm was added to the mixed solution as in Example 1 above. In the same manner, an adhesive solution and an adhesive tape were prepared. The coating thickness of the final adhesive tape was 21 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Example 5

Adhesion was carried out in the same manner as in Example 1, except that 150 g of acrylonitrile-butadiene copolymer DN631 (Nippon Zeon), which was a nitrile group content of 33% and a weight average molecular weight of 340,000, was used. Liquid and adhesive tape were prepared. The coating thickness of the final adhesive tape was 24 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Example 6

An adhesive liquid and an adhesive tape were prepared in the same manner as in Example 1, except that 150 g of a terpolymer of acrylonitrile-butadiene-acrylic acid having a weight average molecular weight of 270,000 was used. The coating thickness of the final adhesive tape was 24 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.                     

Comparative Example 1

Acrylonitrile-butadiene copolymer Nipol-34 (Nippon Zeon) 150g, a phenol resin CKA-908 (KOLON Emulsified), which has a nitrile group content of 27% and a weight average molecular weight of 300,000 After 50 g was dissolved in 400 g of solvent methylethylketone, 0.5 g of sulfur, 0.5 g of zinc oxide, and 1 g of 3-hydroxyphenyl phosphinyl propanoic acid were added. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours to prepare an adhesive solution. The process of making the adhesive tape was performed in the same manner as in Example 1. The coating thickness of the final adhesive tape was 21 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Comparative Example 2

Acrylonitrile-butadiene copolymer Nipol-20 (Nippon Zeon) 150 g, a phenol resin CKA-908 (Kolon Emulsified), which has a nitrile group content of 40% and a weight average molecular weight of 280,000. 5 g, epoxy resin YD-011 (80% solids, Kukdo Chemical Co., Ltd.) was carried out in the same manner as in Example 1 except for dissolving 250 g of solvent methyl ethyl ketone. The coating thickness of the final adhesive tape was 23 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.                     

Comparative Example 3

Acrylonitrile-butadiene copolymer Nipole-34 (Nippon Zeon) 20 g, a phenol resin CKA-908 (Kolon Emulsified), having a nitrile group content of 27% and a weight average molecular weight of 400,000 50 g and 10 g of silicone epoxy EW Silikoftal (80% solids, Tego) were dissolved in 80 g of solvent methyl ethyl ketone, except that the same procedure as in Example 1 was carried out. The final coating tape had a coating thickness of 18 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Comparative Example 4

Acrylonitrile-butadiene copolymer Nipole-34 (Nippon Zeon) 20 g, a phenol resin CKA-908 (Kolon Emulsified), having a nitrile group content of 27% and a weight average molecular weight of 400,000 50 g, 100 g of silicon epoxy EW Silikoftal (80% solids, Tego) was carried out in the same manner as in Example 1, except that 200 g of solvent methyl ethyl ketone was dissolved. The final coating tape had a coating thickness of 18 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Comparative Example 5

Acrylonitrile-butadiene copolymer Nipol-34 (Nippon Zeon) 20 g, a phenol resin CKA-908 (Kolon Emulsified), which is a acrylonitrile-butadiene copolymer having a nitrile group content of 27% and a weight average molecular weight of 270,000 50 g, silicon epoxy EW Silikoftal (80% solids, Tego Co.) was carried out in the same manner as in Example 1 except that dissolved in 80 g of solvent methyl ethyl ketone. The final coating tape had a coating thickness of 18 μm.

Adhesion, heat resistance, insulation and leakage experiment of the final adhesive tape was carried out in the same manner as in Example 1, the results are shown in Table 1 below.

Example Comparative example One 2 3 4 5 6 One 2 3 4 5 Adhesion (g / cm) Copper foil 120 ℃ 90 80 90 85 90 85 22 50 7 80 66 200 ℃ 280 250 265 265 265 265 212 125 90 250 251 300 ℃ 390 330 320 280 290 290 190 155 77 280 261 wafer Room temperature 95 90 88 88 88 88 21 34 28 75 31 Heat resistance 300 ℃ residual amount (%) 99 99 99 99 99 99 93 94 94 97 91 Oven experiment Good Good Good Good Good Good usually usually usually Good usually Insulation Current value (A) 2 x 10 ^-12 2 x 10 ^-12 2 x 10 ^-12 3 x 10 ^-12 3 x 10 ^-12 2 x 10 ^-12 5 x 10 ^-11 2 x 10 ^-11 8 x 10 ^-12 2 x 10 ^-12 4x10 ^-10 Runoff experiment (%) 120 ℃ <20 <20 <10 <30 <30 <30 <150 <140 <180 <50 <100 200 ℃ <40 <40 <30 <50 <70 <70 <200 <190 <240 <70 <260 300 ℃ <60 <60 <40 <55 <90 <90 <250 <280 <260 <100 <340

From the results of Table 1, the adhesive tape prepared by applying the adhesive liquid of the present invention is excellent in both the adhesive force over the low temperature and high temperature in the copper foil and wafer, the residual amount at 300 ℃ all excellent 99% or more thermal stability In addition, it can be more clearly confirmed that the adhesive and leakage problems, which have been a problem in the conventional electronic components and semiconductor processes, can be solved with excellent characteristics that do not leak in the insulation and leakage experiments.

As described in detail above, an acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer containing a carboxyl group at the terminal; Phenolic resins; Epoxy resins; And an adhesive liquid composed of at least one curing agent selected from an acid anhydride, an amine curing agent, and a weak acid, and an adhesive tape prepared by applying the adhesive solution to a binder polymer having excellent insulation and heat resistance, at a relatively low temperature compared with a conventional adhesive tape. Adhesion is possible and the adhesive layer not only maintains continuous adhesion but also has utility of exhibiting sufficient heat resistance, insulation and reliability.

Claims (8)

100 parts by weight of acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer having a weight average molecular weight of 20,000 to 2,000,000 containing a carboxyl group at the terminal; 5 to 100 parts by weight of a phenol resin having a molecular weight of 500 to 10,000 with respect to 100 parts by weight of the copolymer; 50 to 200 parts by weight of an epoxy resin having a molecular weight of 20,000 to 1,000,000 with respect to 100 parts by weight of the copolymer; 1 to 20 parts by weight of at least one curing agent selected from an acid anhydride, an amine curing agent and a weak acid based on 100 parts by weight of a phenol resin or an epoxy resin; And 0.01 to 20 parts by weight of a phosphorus flame retardant based on 100 parts by weight of the copolymer. The adhesive solution for electronic parts according to claim 1, wherein the phenol resin is at least one selected from a noblock-based or resol-based phenol resin. The adhesive liquid for electronic parts according to claim 1 or 2, wherein the phenol resin is a phenol formaldehyde resin having a formaldehyde content of 20 to 90 parts by weight. The method of claim 1, wherein the particle size of 0.5 to 5㎛ of at least one filler selected from calcium carbonate, zinc oxide, silica, alumina, diamond powder, quartz powder and zircon powder 0.5 parts by weight of the solid content of the adhesive liquid 0.5 The adhesive liquid for an electronic component, characterized in that it further comprises so as to be -15 parts by weight. The vulcanizing agent of the acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer according to claim 1, wherein the at least one selected from thiuram vulcanizing agents, zinc oxide and peroxides is The adhesive liquid for an electronic component, characterized in that it further comprises 0.5 to 10 parts by weight based on 100 parts by weight of the copolymer. An adhesive tape for electronic parts manufactured by applying the adhesive solution prepared in claim 1 to one or both surfaces of a base film. The base film of claim 6 wherein the base film is polyetherimide (PEI), polyparaphenylenesulfide (PPS), polyimide (PI), polyetherketone (PEK), epoxy resin-glass fabric and epoxy resin-polyimide -Adhesive tape for electronic parts, characterized in that at least one selected from a composite heat resistant film such as glass fabric. 7. The adhesive tape for electronic parts according to claim 6, wherein the thickness of the adhesive liquid applied to the adhesive tape after drying is 10 to 200 mu m.

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