KR20050090161A - Adhesive composition for electronic accessories and adhesive tape thereof - Google Patents

Abstract

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape prepared therefrom, wherein the acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer containing a carboxyl group at an end thereof; Silicone epoxy compounds comprising at least one functional group selected from vinyl groups, hydroxyl groups, amino groups, epoxy groups, mercapto groups, phenoxy groups, alkoxy groups having less than 5 carbon atoms or halogen atoms; Phenolic resins; Curing agent; The adhesive tape having a pressure-sensitive adhesive layer in which the pressure-sensitive adhesive composition including filler and other additives is applied to one or both surfaces of the composite heat-resistant plastic film is excellent in adhesion uniformity and can be peeled off even with a small peel force from the adhesive. It is easy and excellent in heat resistance and chemical resistance.

Description

Adhesive composition and adhesive tape prepared therefrom {Adhesive composition for electronic accessories and adhesive tape

The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape prepared therefrom, and more particularly, excellent adhesion uniformity, and can be peeled off even with a small peel force from the adhesive, so that the process is easy to apply, and heat resistance and chemical resistance The present invention relates to an adhesive tape prepared from an excellent adhesive composition.

With the acceleration of digitalization, CRT, which has become the mainstream of existing monitors and TVs, is rapidly changing to flat panel displays (FPD), including LCD and PDP, and new products such as notebooks and PDAs are created. The market expansion is progressing rapidly.

Following the FPD, Flexible Display is evaluated as the technology of the next generation of FPD, and R & D on materials and components, production technology, equipment and processes suitable for this is rapidly progressing.

In order to drive a flexible display, an active matrix driving is essential. However, an amorphous silicon TFT fabrication process of a liquid crystal display currently used requires a high temperature process of 250 ° C. or higher, so it is difficult to form a TFT on a plastic substrate having low heat resistance. .

In addition, in the case of poly-Si TFT, since the manufacturing process temperature of TFT is 500 degreeC or more, the process and material technology which can manufacture at the process temperature of 200 degrees C or less is urgent.

Until now, a method of using a plastic substrate based on a high heat-resistant low-shrink polyimide (PI) resin has been used. In order to process the plastic substrate, adhesive composition is required.

The adhesive composition used herein basically requires physical properties such as heat resistance for a high temperature process, uniformity of the adhesive layer for an effective process, a coefficient of thermal expansion similar to a plastic substrate, solvent resistance, and ease of removal after the process.

Existing pressure-sensitive adhesive composition is a synthetic rubber-based resin such as epoxy resin, phenol resin, acrylic resin, silicone resin, polyacrylonitrile, polyacrylate or acrylonitrile-butadiene copolymer alone or mixed with modified resin or other resin thereof. One adhesive composition has been applied and used, or an adhesive has been semi-cured.

As part of this, according to Korean Patent Publication No. 1998-16625, Acrylonitrile; Acrylic resins prepared from monomers consisting of acrylates, acrylic acid, methacrylic acid and hydroxyethyl acrylate or hydroxyethyl methacrylate with alkyl groups having 2 to 10 carbon atoms; Epoxy resins composed of bisphenol epoxy and cresol novolac epoxy; Curing agent; And an adhesive composition composed of a silicone resin.

In addition, Japanese Patent Laid-Open No. 6-326158 discloses thermosetting resins such as epoxy resins, phenol resins, acrylic resins, and polyimide resins; Acrylonitrile-butadiene copolymers; Polyamides; acryl; Polyurethane; And cure compositions composed of polyolefins.

In addition, Japanese Patent Laid-Open No. 2002-338910 proposes an adhesive sheet for semiconductor production using a silicone pressure sensitive adhesive.

In addition, Japanese Patent Laid-Open No. 6-172524 proposes a soluble polyimide resin that can be used for electric and electronic components.

However, while the conventional compositions presented above have excellent adhesion to the adherend, there is a possibility that the residue of the adhesive layer remains or the peeling force is too high when detaching from the adherend after the process, thereby causing a process problem. Moreover, it also contains the possibility of causing defects in heat resistance and chemical resistance.

Accordingly, the inventors of the present invention, while trying to prepare a high temperature heat-resistant adhesive composition that can be used in the flexible display manufacturing process, acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer; Silicone epoxy compounds comprising at least one functional group selected from vinyl groups, hydroxyl groups, amino groups, epoxy groups, mercapto groups, phenoxy groups, alkoxy groups having less than 5 carbon atoms or halogen atoms; A pressure-sensitive adhesive tape comprising a phenol resin, a curing agent, a filler, and other additives was prepared, and a pressure-sensitive adhesive tape having an adhesive layer coated on one or both surfaces of the composite heat-resistant plastic film was produced. The adhesion is uniform, easily peeled off during the desorption after the process, the residue was not found, excellent heat resistance and chemical resistance, it was found that it can provide a highly reliable adhesive composition and adhesive tape to complete the present invention.

Accordingly, an object of the present invention is to provide an adhesive composition having excellent adhesive strength that can be used in a flexible display manufacturing process, easily peeling off after the process, no residue, and excellent heat resistance and chemical resistance.

Another object of the present invention is to provide a pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer in which the pressure-sensitive adhesive composition is coated on one or both surfaces of a composite heat resistant plastic film.

Such a pressure-sensitive adhesive composition of the present invention is acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer containing a carboxyl group at the terminal; Silicone epoxy compounds comprising at least one functional group selected from vinyl groups, hydroxyl groups, amino groups, epoxy groups, mercapto groups, phenoxy groups, alkoxy groups having less than 5 carbon atoms or halogen atoms; Phenolic resins; Curing agent; It is characterized by the inclusion of fillers and other additives.

In addition, the adhesive tape of the present invention is characterized by having an adhesive layer coated with the adhesive composition on one or both surfaces of the composite heat resistant plastic film.

Hereinafter, the present invention will be described in detail.

The pressure-sensitive adhesive composition of the present invention is an acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer containing a carboxyl group at its terminal; Silicone epoxy compounds comprising at least one functional group selected from vinyl groups, hydroxyl groups, amino groups, epoxy groups, mercapto groups, phenoxy groups, alkoxy groups having less than 5 carbon atoms or halogen atoms; Phenolic resins; Curing agent; It includes fillers and other additives.

The acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer used in the present invention has a weight average molecular weight of 20,000-1,000,000 and contains a carboxyl group at the chain end. By containing a carboxyl group in a chain terminal, the effect which can increase the adhesive force by a polar group can be anticipated.

When the weight average molecular weight of the copolymer is less than 20,000, heat resistance and adhesive strength are lowered, and when the weight average molecular weight is more than 1,000,000, fairness is lowered.

In addition, in the present invention, when the phenol resin is used to improve the heat resistance, the amount of the phenol resin added is preferably added in an amount of 1-200 parts by weight based on 100 parts by weight of the copolymer. If the added amount of the phenol resin is less than 1 part by weight, the heat resistance is lowered, and if it exceeds 200 parts by weight, the adhesive composition easily breaks.

As the phenol resin of the present invention, one selected from resol and novolak phenol resin is used.

In the present invention, in order to realize excellent adhesion and heat resistance of the pressure-sensitive adhesive composition, and also to solve the problem that the pressure-sensitive adhesive layer of the adhesive tape prepared by mixing the phenol resin alone in the copolymer is insufficient adhesive strength or adhesiveness to the adhesive. For this purpose, a silicone epoxy compound containing at least one functional group selected from vinyl, hydroxyl, amino, epoxy, mercapto, phenoxy, alkoxy groups having less than 5 carbon atoms or halogen atoms is used.

That is, (1) the silicone epoxy compound containing at least one functional group selected from vinyl group, hydroxyl group, amino group, epoxy group, mercapto group or halogen atom has a function to complement the adhesion to organic matter, and (2) methoxy The silicone epoxy compound containing an alkoxy group or phenoxy group having less than 5 carbon atoms, such as a period, an ethoxy group, plays a role of compensating the adhesion with the inorganic to have excellent adhesion to the metal substrate or the glass substrate.

The epoxy resin used in the present invention is not limited to a specific epoxy resin because it acts by the epoxy group present at the terminal. In addition, it is preferable that the addition amount of a silicone epoxy resin is 50-500 weight part with respect to 100 weight part of said binder resins. If the addition amount of the silicone epoxy resin is less than 50 parts by weight, there is a problem that the impact resistance is lowered, and if it exceeds 500 parts by weight, the pressure-sensitive adhesive layer is likely to flow out in the adhesion process.

The silicone epoxy resin used in the present invention has a weight average molecular weight of 200-20,000, preferably 1,000-5,000. If the molecular weight of the silicone epoxy resin is less than 200, the heat resistance and impact resistance is inferior, and if it exceeds 20,000, there is a problem that the adhesive force is reduced and the fluidity of the adhesive composition is inferior, which is disadvantageous for use in the adhesive layer forming process.

 On the other hand, the silicone epoxy resin and phenol resin used in the present invention is semi-cured in step B and applied in the future bonding process, the acid anhydride, amine-based curing agent or hardening agent for curing the epoxy resin and phenol resin as a curing agent use. Specific examples of such a curing agent include phthalic anhydride, tetrachlorophthalic anhydride, trimellitic anhydride, hexahydrophthalic anhydride, hydric anhydride, pyromellitic dianhydride, methylhexahydrophthalic anhydride, maleic anhydride, and methyl tetrahydrophthalic anhydride. Acid anhydrides such as, Diethylene Triamine (DETA), Triethylene Tetramine (TETA), Diethylamino propylamine (DEAPA), Methane diamine (MDA), N- N-aminoethyl piperazine (N-AEP), M-xylene diamine (MXDA), Isophorone diamine (IPDA), metaphenylenediamine (MPD), 4, 4'-dimethyl aniline (DAM or DDM), diamino diphenyl sulfone (DDS), dimethyl aminomethyl phenol (DMP-10), tris- (dimethyl Aminomethyl) phenol (Tris) Amine-based curing agents such as-(Dimethylaminomethyl) phenol, DMP-30), salts of DMP-30, benzyl dimethyl amine (BDMA); Or acid hardeners such as xylene sulforic acid.

Preferred curing agents for general epoxy resins or phenolic resins are amine-based curing agents, specifically m-xylene diamine (MXDA), isophorone diamine (IPDA), and metaphenylenediamine (MPD). , 4,4'-dimethyl aniline (DAM or DDM), diamino diphenyl sulfone (DDS), dimethyl aminomethyl phenol (DMP-10), tris Shorten reaction time by using (dimethyl-trimethyl amine, DMP-30), salts of DMP-30, benzyl dimethyl amine (Benzyl Dimethyl Amine, BDMA) Thereby inducing three-dimensional crosslinking.

In the present invention, at least one selected from an acid anhydride, an amine-based curing agent or an acid hardener is added to 0.01-50 parts by weight, preferably 5-30 parts by weight, based on 100 parts by weight of the silicone epoxy aqueous compound and the phenol resin. If the amount of the curing agent added is less than 0.01 part by weight, the curing effect is insufficient, and if it exceeds 50 parts by weight, the change in physical properties due to the residual curing agent occurs over time.

In addition, fillers may be used for the purpose of making the adhesive layer have good workability in a high temperature and high pressure bonding process and a series of manufacturing processes, wherein the fillers used are calcium carbonate, zinc oxide, and silica having a particle size of 0.5-5 μm. At least one selected from alumina, diamond powder, quartz powder or zircon powder, and may be added to 0.01-15 parts by weight based on 100 parts by weight of the total solid content in the adhesive layer composition.

In addition, the pressure-sensitive adhesive composition of the present invention may use the following additives if necessary in addition to the above composition. However, all of these additives must be nonionic and have an extremely low impurity content.

That is, as a vulcanizing agent of the acrylonitrile-butadiene copolymer or the acrylonitrile-butadiene-acrylic acid terpolymer, thiuram vulcanizing agent, zinc oxide or peroxide is 0.5-10 parts by weight of the copolymer. It can be used in parts by weight, if the content exceeds the above range, due to the cross-linking of the excessive copolymer loses the function as the adhesive layer.

In addition, a phosphorus-based flame retardant may be added to improve the flame retardancy of the adhesive layer. The structure of the flame retardant is 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (9,10-dihydro-9-oxy-10-phosphaphenantrne-10-oxide), 3-hydroxyphenyl Phosphorus-containing compounds such as 3-hydroxyphenyl phosphynylpropanoic acid, diphenyl-1-1,2-di-hydroxyethylphosphine oxide, etc. As such, the addition amount thereof is 0.01-20 parts by weight, preferably 0.02-10 parts by weight based on 100 parts by weight of the binder polymer. If the added amount of the flame retardant is less than 0.01 parts by weight, there is no effect of improving the flame retardancy, and if it exceeds 20 parts by weight, the adhesive force is lowered and it is uneconomical.

On the other hand, the present invention also relates to a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer coated with the above pressure-sensitive adhesive composition on one side or both sides of the composite heat-resistant plastic film.

At this time, as an adhesive agent to be used, for example, polyethylene terephthalate (PET), polypropylene (PP), polystyrene (PS), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN) , Polyetherimide (PEI), polyparaphenylene sulfide (PPS), polyimide (PI), polyether ketone (PEK) polyether ether ketone (PEEK) and glass, epoxy resin-glass fabric, epoxy resin-polyimide Composite heat-resistant materials such as glass fabrics; polyimide having the smallest difference in thermal expansion coefficient or thermal expansion coefficient at high temperature is preferred.

Referring to the method of producing a pressure-sensitive adhesive composition having the composition as described above are as follows.

Binder resin containing a carboxyl group at the terminal; Silicone epoxy compounds; After dissolving the phenol resin in a solvent, the mixed solution is stirred to be pre-cured and left to prepare a pressure-sensitive adhesive composition having improved low temperature curability. The solvent used may include toluene, heptane, hexane, xylene, methyl ethyl ketone, tetrahydrofuran, n-methylpyolidon, dimethylformamide, dimethyl acetamide, and the like. Preferably, toluene, xylene, heptane, etc. are suitable. Do. Alternatively, the above two or more solvents may be mixed and used.

This is because the viscosity of the mixed solution is 10-10,000cps, preferably 100-5,000cps within this range because it is easy to form an adhesive layer through the application. The pressure-sensitive adhesive composition prepared above is applied to one or both sides of the adherend using a comma knife. The applied film is dried and semi-cured to prepare a final adhesive layer. It is also possible to laminate a protective layer on the adhesive layer for ease of post-processing and protection of the adhesive layer.

Hereinafter, the present invention will be described in more detail, but the present invention is not limited to the following examples.

(Example 1)

Silicone epoxy resin EW Silikoftal (80 g of acrylonitrile-butadiene copolymer Nipol-34 (Nippon Zeon) having a carboxyl group at the terminal having a nitrile group content of 27% and a weight average molecular weight of 260,000, and an epoxy group at the terminal) % Solids, Tego) 100 g, cresol novolac phenolic resin KPE-B2100 (Kolon Co., Ltd.) 50 g was dissolved in 600 g of solvent methyl ethyl ketone, and then 2.2 g of 4-aminophenylsulfone as a curing agent and silica particles as a filler. 10 g of Aerosil 200 (Daegussa-Hils) and 0.8 g of zinc oxide were added as a vulcanizing agent. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

The standing solution was applied to one side of polyimide film apical 50HP (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, and then dried at 150 ° C. for 10 minutes to form a pressure-sensitive adhesive layer having a thickness of 20 μm. The equipped film-form adhesive tape was manufactured.

In addition, as a protective layer for protecting the adhesive layer, a polyethylene terephthalate (PET) release film (KOLON) was laminated on the adhesive layer at a thickness of 38 μm.

The adhesion uniformity, heat resistance, insulation, peelability and chemical resistance of the final prepared pressure-sensitive adhesive substrate was evaluated as follows, and the results are shown in Table 1 below.

(1) adhesion uniformity

After cutting the prepared pressure-sensitive adhesive substrate to a size of 20mm x 100mm, using a hot stamping machine (Hot Stamping Machine) on a glass plate (Samsung Corning Precision Glass) was pressed at 200 ℃, 0.1 atmosphere for 5 minutes to make a sample. The adhesion between the pressure-sensitive adhesive substrate and the glass plate and the presence or absence of bubbles were visually confirmed.

(2) Peel force and adhesive layer residue

The sample prepared above was hooked on a universal testing machine (Instron 4303, Instron Co., Ltd.), and pulled at a speed of 100 mm / min to measure the peel force between the adhesive substrate and the glass plate 10 times to obtain an average value. The lower the peel force, the better the peel force.

(3) heat resistance

The sample prepared above was placed in a Sibronn temoline 47900 oven and allowed to stand at 300 ° C. for 3 minutes. Then, the degree of cracking on the surface of the adhesive layer was visually observed. If there is no change at all, it is good. If the degree was severe, it was evaluated as bad.

(3) insulation

   The prepared pressure-sensitive adhesive substrate was allowed to stand for 24 hours under constant temperature and humidity conditions at a temperature of 24 ° C. and a relative humidity of 45%. After that, a voltage of 100 V was applied with a high current measuring instrument (Keithley 238), and the current amount at that time was measured. The smaller the current amount, the better the insulation.

(4) chemical resistance

    Iii) solvent resistance

    The prepared adhesive base material was immersed in isopropyl alcohol, n-methylpyrrolidone, and propylene glycol mono methyl ether acetate for 5 minutes, respectively, and then visually observed the appearance, adhesive force change, and solution penetration of the adhesive base material, and no change was observed. If there is no good, and if there is even a little abnormality, it was evaluated as defect normally if the degree of change is severe.

    Ii) acid resistance

    After immersing the prepared adhesive substrate in 50% nitric acid, 50% phosphoric acid, and 50% acetic acid aqueous solution for 2 minutes, the appearance, adhesive force, and solution penetration of the adhesive material were visually observed. If abnormalities were found, they were usually evaluated as defective if the degree of change was severe.

(Example 2)

100 g of acrylonitrile-butadiene copolymer Nipol-34 (Nippon Zeon) containing a carboxyl group at a terminal having a nitrile group content of 27% and a weight average molecular weight of 260,000 HTS Silikoftal (Tego) G) 150 g, cresol novolac phenolic resin KPE-B2100 (Kolon Emulsion Co., Ltd.) 80 g was dissolved in 600 g of solvent methyl ethyl ketone, and then 4-aminophenyl sulfone 2.5 g and silica particles Aerosil 200 (Daegussa-Hils) 15 g 0.5 g of zinc oxide was added as a vulcanizing agent. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

The standing solution was applied to one side of polyimide film apikal 50HP (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, and then dried at 150 ° C. for 10 minutes to provide a pressure-sensitive adhesive layer having a thickness of 20 μm. The film-form adhesive tape was produced.

Also, as a protective layer for protecting the adhesive layer, a polyethylene terephthalate (PET) release film (KOLON) was laminated on the adhesive layer at a thickness of 38 μm.

Physical properties of the final prepared pressure-sensitive adhesive substrate was measured in the same manner as in Example 1, the results are shown in Table 1 below.

(Example 3)

200 g of nitrile-containing acrylonitrile-butadiene-acrylic acid terpolymer JSR N640 (Japan Synthetic Rubber Co., Ltd.) having a nitrile group content of 25%, and a silicone epoxy resin KF880 (Dow Corning) containing an amino group at the terminal ) 100 g, cresol novolac phenolic resin KPE-B2100 Kolon Emulsion) 100 g was dissolved in 600 g of solvent methyl ethyl ketone, followed by 2.0 g of 4-aminophenylsulfone, 10 g of silica particles Aerosil 200 (Daegussa-Hils), and vulcanized. 1.2 g of zero zinc oxide was added. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

The left solution was applied to one side of polyimide film Apical 50HP (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, and then dried at 150 ° C. for 10 minutes to provide an adhesive layer having a thickness of 20 μm. One film-form adhesive tape was produced.

In addition, as a protective layer for protecting the adhesive layer, a polyethylene terephthalate (PET) release film (KOLON) was laminated on the adhesive layer at a thickness of 38 μm.

Physical properties of the final prepared pressure-sensitive adhesive substrate was measured in the same manner as in Example 1, the results are shown in Table 1 below.

(Comparative Example 1)

After dissolving 150 g of methyl methacrylate-2 and ethylhexyl acrylate copolymer (Daelong Chemical Co., Ltd.) having a weight average molecular weight of 200,000 containing a hydroxyl group in 500 g of solvent methyl ethyl ketone, 1.5 g of an isocyanate curing agent and silica particles Aerosil 200 ( 10 g of Daegussa-Hils) was added. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

The standing solution was applied to one side of polyimide film apikal 50HP (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, and then dried at 150 ° C. for 10 minutes to provide a pressure-sensitive adhesive layer having a thickness of 20 μm. The film-form adhesive tape was produced.

Also, as a protective layer for protecting the adhesive layer, a polyethylene terephthalate (PET) release film (KOLON) was laminated on the adhesive layer at a thickness of 38 μm.

Physical properties of the final prepared pressure-sensitive adhesive substrate was measured in the same manner as in Example 1, the results are shown in Table 1 below.

(Comparative Example 2)

After dissolving 200 g of a silicone resin (ShinEtSu) having a weight average molecular weight of 300,000 in 500 g of solvent methyl ethyl ketone, 0.5 g of a platinum catalyst, 1.2 g of a curing agent resin, and 10 g of silica particles Aerosil 200 (Da egussa-Hils) were added. The mixed solution was stirred at 90 ° C. for 1 hour and then left at room temperature for 3 hours.

The standing solution was applied to one side of polyimide film apikal 50HP (Kaneka Co., Ltd.) using a comma knife, dried at 160 ° C. for 3 minutes, and then dried at 150 ° C. for 10 minutes to provide a pressure-sensitive adhesive layer having a thickness of 20 μm. The film-form adhesive tape was produced.

In addition, a polyethylene terephthalate (PET) release film (Kolon Co., Ltd.) was laminated on the adhesive layer in a thickness of 38 μm as a protective layer of the adhesive layer.

Physical properties of the final prepared pressure-sensitive adhesive substrate was measured in the same manner as in Example 1, the results are shown in Table 1 below.

Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Adhesion uniformity Uniformity Uniformity Uniformity Heterogeneity Uniformity Peel force (N / m) 19 17 45 980 180 Adhesive layer residue after peeling none none none plenty handful Heat resistance Good usually Good Bad usually Insulation (A) 10 ^-13 10 ^-12 10 ^-13 10 ^-10 10 ^-12 Chemical resistance Solvent resistance Good Good Good Good usually Acid resistance Good Good usually Bad Bad

As shown in Table 1, the pressure-sensitive adhesive tape including the pressure-sensitive adhesive layer coated with the pressure-sensitive adhesive composition of the present invention on one or both surfaces of the composite heat-resistant plastic film is excellent in adhesion uniformity after pressing the adhesive, and less peeling from the adhesive It can be confirmed that the peeling is also possible by the force, and excellent in the ease of applying the process, and excellent in heat resistance and chemical resistance.

As described above, the pressure-sensitive adhesive composition of the present invention is excellent in adhesion uniformity, can be peeled off even with a small peel force from the adherent, and is easy to apply the process, and is produced by coating it on one or both surfaces of the composite heat resistant plastic film. The adhesive tape has excellent heat resistance and chemical resistance.

Claims (10)

Acrylonitrile-butadiene copolymer or acrylonitrile-butadiene-acrylic acid terpolymer containing a carboxyl group at the terminal; Silicone epoxy compounds comprising at least one functional group selected from vinyl groups, hydroxyl groups, amino groups, epoxy groups, mercapto groups, phenoxy groups, alkoxy groups having less than 5 carbon atoms or halogen atoms; Phenolic resins; Curing agent; Adhesive composition comprising filler and other additives.    The pressure-sensitive adhesive composition of claim 1, wherein the copolymer has a weight average molecular weight of 20,000-1,000,000. According to claim 1, 50-500 parts by weight of the silicone epoxy compound, 1-200 parts by weight of the phenol resin, 0.01-50 parts by weight of the curing agent and adhesive composition based on 100 parts by weight of the silicone epoxy compound and phenol resin based on 100 parts by weight of the copolymer Pressure-sensitive adhesive composition, characterized in that it is included as 0.01-15 parts by weight of the filler with respect to 100 parts by weight of the total solid content. The adhesive composition according to claim 1, wherein the phenol resin is at least one selected from resol and novolak phenol resins. The pressure-sensitive adhesive composition of claim 1, wherein the curing agent is at least one selected from acid anhydrides, amine curing agents, and acid curing agents. The pressure-sensitive adhesive composition of claim 1, wherein the filler has a particle size of 0.5-5 µm and is at least one selected from calcium carbonate, zinc oxide, silica, alumina, diamond powder, quartz powder or zircon powder. The pressure-sensitive adhesive according to claim 1, wherein the other additive includes one or more vulcanizing agents selected from thiuram-based vulcanizing agents, zinc oxides, and peroxides so as to be 0.5-10 parts by weight based on 100 parts by weight of the copolymer. Composition. Adhesive tape provided with the adhesive layer which apply | coated the adhesive composition of Claim 1 to the single side | surface or both surfaces of a composite heat resistant plastic film. The method of claim 8, wherein the composite heat-resistant plastic film is polyethylene terephthalate (PET), polypropylene (PP), polystyrene (PS), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate ( PEN), polyetherimide (PEI), polyparaphenylenesulfide (PPS), polyimide (PI), polyetherketone (PEK) polyetheretherketone (PEEK) and glass, epoxy resin-glass fabric or epoxy resin- Adhesive tape, characterized in that at least one member selected from polyimide-glass fabrics. The adhesive tape according to claim 8, wherein the adhesive force of the adhesive layer is 1 N / m to 50 N / m.