KR20050042556A - Led package and method for manufacturing led package - Google Patents

Abstract

The present invention discloses a light emitting diode package capable of increasing the lead frame light emitting region of the light emitting diode package to improve brightness and preventing damage to the mold region of the lead frame, and a method of manufacturing the same. The disclosed invention provides a method of providing a lead frame having an area extending from a light emitting area in which a light emitting diode is to be mounted; Die bonding a light emitting diode chip to a light emitting region of the lead frame ejecting unit; Performing a molding operation on the die-bonded LED chip; And forming a lead part in the extended area of the lead frame.

Here, the lead portion is characterized in that it is formed in a form bent outside the lead frame injection portion.

Description

Light emitting diode package and manufacturing method thereof {LED PACKAGE AND METHOD FOR MANUFACTURING LED PACKAGE}

The present invention relates to a light emitting diode package and a method of manufacturing the same. More specifically, the light emitting diode package which can improve the light intensity by increasing the light emitting region of the lead frame of the light emitting diode package, and can prevent damage to the mold region of the lead frame; It relates to a manufacturing method.

In general, a light emitting diode (LED) is used to transmit and receive signals by converting electricity into infrared rays or light using characteristics of compound semiconductors, which are used in home appliances, remote controls, electronic displays, It is used for an indicator, various automation devices, and the like.

The operation principle of the LED is that when a forward voltage is applied to a semiconductor of a specific element, electrons and holes move and recombine with each other through a junction portion of a positive-negative and a positive-negative, and energy levels are caused by the combination of electrons and holes. Will fall and this energy level is emitted as light.

In addition, LEDs are generally manufactured in small sizes and have structures mounted on epoxy molds, lead frames, and PCBs. Currently, the most commonly used LEDs are 5mm (T 1 3/4) plastic packages or new types of packages depending on the specific application. The color of the light emitted by the LEDs creates wavelengths depending on the composition of the semiconductor chip components, and these wavelengths determine the color of the light.

In particular, LEDs are becoming smaller and smaller, such as resistors, capacitors, and noise filters, due to the trend toward miniaturization and slimming of information and communication devices, and directly mounting them on a PCB (Printed Circuit Board) board. In order to make the surface mount device (Surface Mount Device) type.

Accordingly, LED lamps, which are used as display elements, are also being developed in SMD type. Such SMD can replace the existing simple lighting lamp, which is used for lighting indicators of various colors, character display and image display.

Recently, as the thickness of liquid crystal displays becomes thinner, there has been a demand for thinning of light emitting diodes, which are light guide plates and light sources, that enter a liquid crystal module.

In order to reduce the thickness of the light guide plate for the backlight, the thickness of the white side light emitting diode package itself applied as a light source of the light guide plate should be reduced.

Although the thickness of the white side light emitting diode element in the light guide plate for the small liquid crystal display device is commercially available from 1 mm to 0.8 mm, a thin light emitting diode package to 0.6 mm is required in the future.

1A and 1B illustrate a process of manufacturing a light emitting diode lead frame package according to the prior art.

As shown in FIGS. 1A and 1B, in order to manufacture a light emitting diode package, a light emitting diode chip is mounted on a lead frame package, and then an external PCB or control circuit is formed by the metal lead part 100 present in the lead frame package. Electrical connection with the field.

The lead frame package is disposed on both sides of the lower end of the lead frame injection unit 110 and the lead frame injection unit 110, which are disposed along the circumference of the light emitting unit 120 and the light emitting unit 120 on which the LED chip is mounted. It consists of the said metal lead part 100 arrange | positioned.

The LED chip is die-bonded to the light emitting unit 120 of the lead frame and is molded using an epoxy resin.

The lead frame ejection unit 110 exists along the circumference of the light emitting unit 120. The lead frame ejection unit 110 serves to protect the light emitting diode chip from the outside when the die is bonded.

The lead frame injection unit 110 has an open structure in the central light emitting unit 120, and a groove is formed at a predetermined size on the lower side to form the metal lead unit 100. have.

As shown in the drawing, the metal lead part 100 is subjected to a primary punching force in a groove direction formed at a lower end of the lead frame injection part 110, and to the metal lead at both edges thereof. In order to bend the secondary punching force (punching force) is applied to form the metal lead portion 100 of the lead frame.

As such, when the LED chip is mounted on the light emitting part 120 and the metal lead part 100 is formed on the lead frame injection part 110, the LED package is completed.

However, as described above, in order to use the backlight lamp of the liquid crystal display device, the height of the lead frame must be lowered according to the slim panel size.

2 is a view for explaining the problem of the lead frame package manufactured according to the prior art, as shown in the lead frame to form a metal lead portion 100 when the width is reduced in order to reduce the height of the lead frame There is a problem that the area of the light emitting part 120 is reduced by the groove formed under the injection part 110.

In addition, it is difficult to properly mount the light emitting diode chip during the epoxy injection process and the bonding process, and there is a problem that mechanical damage occurs due to the injection portion having a thin thickness when forming the metal lead portion.

In addition, such mechanical damage may not only deform the shape of the package itself, but also cause delamination of the mold (epoxy, silicon) and the lead frame injection, which may adversely affect the package tightness.

In particular, in order to fabricate a 0.6 mm side light emitting diode package from a conventional light emitting diode package, there is a problem in that the conventional lead frame injection apparatus cannot be used as it is.

When the lead frame injection unit is manufactured by using a new injection device, the thickness of the injection molded product is thin, which makes it difficult to manufacture a lead frame mold corresponding thereto.

The present invention provides a light emitting diode package that can extend a light emitting region of a lead frame mounting a light emitting diode chip and allow a metal lead to be worn outside the lead frame ejecting portion, thereby improving a light efficiency and realizing a rigid mold. The purpose is to provide a method of manufacturing the same.

In order to achieve the above object, a light emitting diode package manufacturing method according to the present invention,

Providing a lead frame ejecting portion having an area extending from a light emitting area in which the light emitting diode is to be mounted;

Die bonding a light emitting diode chip to a light emitting region of the lead frame ejecting unit;

Performing a molding operation on the die-bonded LED chip; And

And forming a lead portion in the extended area of the lead frame.

In addition, the light emitting diode package manufacturing method according to another embodiment of the present invention,

Providing a lead frame injection part mounted with a light emitting diode;

Die bonding a light emitting diode chip to a light emitting region of the lead frame ejecting unit;

Performing a molding operation on the die-bonded LED chip; And

And forming a lead part by lead forming outside the lead frame injection part.

Here, the lead portion is characterized in that it is formed in a form bent outside the lead frame injection portion.

The light emitting diode package according to the present invention,

A lead frame injection part having an area extending from an area in which the light emitting diode emits light;

A light emitting diode chip mounted on the lead frame injection part;

A molding part formed in an area of the lead frame injection part in which the light emitting diode chip is mounted; And

And a lead part disposed at a shape in which one side portion is bent forward on both sides of the lead frame injection part.

In addition, a light emitting diode package according to another embodiment of the present invention,

A lead frame injection part having an area extending from an area in which the light emitting diode emits light;

A light emitting diode chip mounted on the lead frame injection part;

A molding part formed in an area of the lead frame injection part in which the light emitting diode chip is mounted; And

And a lead part disposed at a shape in which one side portion is bent backward at both sides of the lead frame injection part.

Here, the lead portion is characterized in that the structure is bent in the 'b' shape in the state that the center is fixed to the center region of the lead frame injection portion.

According to the present invention, by extending the light emitting region of the lead frame mounting the light emitting diode chip, and allowing the metal lead to be placed outside the lead frame ejection portion, it is possible to implement a rigid mold while improving the light efficiency.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a view showing a light emitting diode lead frame package according to the present invention.

As shown in FIG. 3, the present invention relates to a LED lead frame package for a backlight which may be coupled to a light guide plate of a liquid crystal display to serve as a backlight.

The structure of the lead frame injection unit 210 of the LED package for side emission of the liquid crystal panel has a wide area of the light emitting unit 220 on which the LED chip is mounted, unlike the prior art, and has an electrode of the LED chip. Steps were formed in the lower structure of both sides so that the metal lead part 200 to be electrically connected can be easily bent.

According to the present invention, when the lead frame injection unit 210 having the structure described above is formed, the LED chip is mounted by die bonding in a region of the light emitting unit 220 of the lead frame. The chip mount on which the diode chip is mounted and the metal lead part 200 of the lead frame are electrically connected by wire bonding.

Thereafter, a discharging process is performed using a dispenser in a region of the light emitting unit 220 of the lead frame, and a molding operation of injecting a silicone resin into a region where the LED chip is die-bonded is performed.

This is because the silicone resin also serves to protect the chip surface when molded on the light emitting diode.

However, the molding liquid injected onto the light emitting diode chip may be selectively used according to the purpose of use, environment of use, and product characteristics as well as the silicone resin, an epoxy resin, a polyimide resin, and the like.

In addition, in addition to the high brightness, high permeability, high weather resistance characteristics according to the mold liquid, the orientation and viewing angle can be adjusted according to the addition of the mold material.

As the height of the lead frame is lowered as in the present invention, the area of the ejection part of the lead frame is not narrowed, but is widened. Therefore, in order to lower the height of the lead frame according to the prior art, precise die bonding and wire wiring according to the shrinkage of the light emitting part is reduced. Difficulties in the process, control of the epoxy discharge liquid and the thickness of the plastic injection molding of the lead frame is not thin, thereby causing a problem of difficulty in manufacturing the lead frame mold.

In particular, the shape of the lead frame according to the present invention may form mechanical steps and light distribution on the package light emitting unit 220 when the metal lead unit 200 is formed by forming a step at both lower ends of the lead frame injection unit 210. In order not to reduce the area, an area of the lead frame ejection unit 220 on the side of the light emitting unit 220 of the lead frame is wide.

Therefore, as the area of the injection part 220 of the lead frame is expanded, the metal lead part 200 is formed on the lead frame injection part 220 extending to the side for surface mounting, and thus the lead frame manufactured in the prior art. It can be made much thinner.

In the LED package manufactured in the present invention, the size of the LED chip (width 0.35 mm, length 0.3 to 0.33 mm) of the light emitting unit 220 of the lead frame on which the LED chip is mounted is maintained while maintaining the same size as the conventional one. The width was widened to improve the light efficiency, and the height of the lead frame injection part 210 was reduced to realize a thinner thickness.

4 and 5 are diagrams illustrating a light emitting diode lead frame package according to another embodiment of the present invention, as shown in FIG. 3, as shown in FIG. 3, on both sides of the lead frame ejection part 310. Without forming a step at the bottom, it is a structure that can form the metal lead parts (300, 400) on both sides of the lead frame injection part (310).

In order to form the metal lead parts 300 and 400, the metal lead parts 300 and 400 are connected to the lead frame injection part 310 without forming additional injection areas on both sides of the lead frame injection part 310. The thickness of the lead frame was maintained by forming on both outer sides of.

Then, the metal lead part 300 is formed outside the lead frame injection part 310, and as shown in FIG. 4, the metal lead part 300 is bent forward based on a horizontal direction, or the As shown in FIG. 5, the metal lead part 400 is bent backward, which is the direction opposite to that of FIG. 4, based on a horizontal direction.

The metal leads 300 and 400 may be formed by changing a bending direction according to a mounting position of a part and a full speed with another part.

Therefore, the metal lead parts 300 and 400 are disposed vertically under the lead frame injection part 310, and the metal lead parts 300 and 400 under the lead frame injection part 310 are moved forward and backward. It is bent and 'b' shaped.

Therefore, as described above with reference to FIG. 3, the area of the light emitting part 320 of the lead frame is enlarged and the area of the lead frame ejecting part 310 is increased to reduce the height of the lead frame.

Therefore, the light emitting part 320 area of the lead frame package shown in FIGS. 4 and 5 is the same as the area of the light emitting part area of the lead frame package shown in FIG. It is possible to increase the light efficiency as shown in FIG.

As described in detail above, the present invention extends the light emitting area of the lead frame mounting the LED chip, and allows the metal lead to stay outside the lead frame ejection part, thereby improving light efficiency and providing a rigid mold. There is an effect that can be implemented.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

1A and 1B illustrate a process of manufacturing a light emitting diode lead frame package according to the prior art.

2 is a view for explaining the problem of the lead frame package manufactured according to the prior art.

3 illustrates a light emitting diode lead frame package according to the present invention.

4 and 5 illustrate a light emitting diode lead frame package according to another embodiment according to the present invention;

* Description of the symbols for the main parts of the drawings *

200, 300, 400: metal lead portion 210, 310: lead frame injection portion

220, 320: light emitting unit

Claims (6)

Providing a lead frame ejecting portion having an area extending from a light emitting area in which the light emitting diode is to be mounted; Die bonding a light emitting diode chip to a light emitting region of the lead frame ejecting unit; Performing a molding operation on the die-bonded LED chip; And And forming a lead in the extended region of the lead frame. Providing a lead frame injection part mounted with a light emitting diode; Die bonding a light emitting diode chip to a light emitting region of the lead frame ejecting unit; Performing a molding operation on the die-bonded LED chip; And And forming a lead part by lead forming on an outer side of the lead frame injection part. The method according to claim 1 or 2, The lead portion is a light emitting diode package manufacturing method, characterized in that formed in the form bent outside the lead frame injection portion. A lead frame injection part having an area extending from an area in which the light emitting diode emits light; A light emitting diode chip mounted on the lead frame injection part; A molding part formed in an area of the lead frame injection part in which the light emitting diode chip is mounted; And And a lead part disposed on both sides of the lead frame ejection part in a shape in which one side portion is bent forward. A lead frame injection part having an area extending from an area in which the light emitting diode emits light; A light emitting diode chip mounted on the lead frame injection part; A molding part formed in an area of the lead frame injection part in which the light emitting diode chip is mounted; And And a lead part disposed at both sides of the lead frame injection part in a shape in which one side part is bent backward. The method according to claim 4 or 5, The lead unit is a light emitting diode package, characterized in that the center of the structure is bent in the 'b' shape in a state fixed to the lead frame center portion.