KR102248642B1 - LED Package - Google Patents

Abstract

In order to provide an LED package capable of implementing a narrow bezel, the present invention has a cavity for accommodating an LED chip and an encapsulant, wherein the cavity is larger than the first length portion at the bottom side. A housing extending obliquely to the length portion; First and second inner leads respectively formed on the bottom surface of the housing, divided into an exposed portion positioned inside the cavity and a shielding portion positioned outside the cavity by the first length portion; And first and second outer leads respectively connected to the first and second inner leads, wherein the first and second outer leads are toward a bottom surface from each of the shielding portions of the first and second inner leads. It provides an LED package, characterized in that it is vertically extended and then bent at 90 degrees to be formed in a housing area.

Description

LED Package {LED Package}

The present invention relates to an LED package, and more particularly, to an LED package for implementing a narrow bezel.

The liquid crystal display device (LCD), which is advantageous for displaying moving images and has a large contrast ratio, is actively used in TVs and monitors. The optical anisotropy and polarization of liquid crystals The principle of image implementation is shown.

Such a liquid crystal display device has a liquid crystal panel bonded by interposing a liquid crystal layer between two parallel substrates as an essential component, and the difference in transmittance is realized by changing the arrangement direction of liquid crystal molecules by an electric field in the liquid crystal panel. do.

However, since the liquid crystal panel does not have its own light emitting element, a separate light source is required to display the difference in transmittance as an image. To this end, a backlight unit having a light source is disposed on the rear surface of the liquid crystal panel.

Here, as the light source of the backlight unit, a cold cathode fluorescent lamp (CCFL), an external electrode fluorescent lamp, and a light emitting diode (LED, hereinafter referred to as LED) are used. .

Among them, LEDs, in particular, have features such as small size, low power consumption, and high reliability, and are thus widely used as a display light source.

1 is a cross-sectional view of a liquid crystal display device using a general LED package as a light source.

As shown, a general liquid crystal display device includes a liquid crystal panel 10, a backlight unit 20, a support main 30, a cover bottom 50, and a top cover 40.

The liquid crystal panel 10 is a part that plays a key role in image expression and is composed of first and second substrates 12 and 14 bonded to each other with a liquid crystal layer therebetween.

A backlight unit 20 is provided behind the liquid crystal panel 10.

The backlight unit 20 includes an LED assembly 29 comprising an LED package 29a arranged along the longitudinal direction of at least one edge of the support main 30 and an LED printed circuit board 29b on which the LED package 29a is mounted. ), a reflective plate 25 seated on the cover buttum 50, a light guide plate 23 seated on the reflective plate 25, and a plurality of optical sheets 21 interposed thereon.

The liquid crystal panel 10 and the backlight unit 20 have a top cover 40 surrounding the upper surface of the liquid crystal panel 10 and the back of the backlight unit 20 with the edges surrounded by a support main 30 having a rectangular frame shape. The cover buttoms 50 covering the are combined in the front and rear, respectively, and are integrated through the support main 30 as a medium.

In addition, reference numerals 19a and 19b denote polarizing plates that are attached to the front and rear surfaces of the liquid crystal panel 10 and control the polarization direction of light, respectively.

In addition, the LED package is a light source of a package structure including a light emitting diode (Light Emitting Diode), which is a light emitting device that emits light when electrons and holes meet at a pn semiconductor junction by applying a current. It is divided into (top view) type, and the side view LED package is a package with a concept that is distinguished from the top view LED package in which the mounting area and the light emitting area are located vertically and horizontally, and the mounting area and the light emitting area are vertical. It is a structure that makes up.

Accordingly, the LED package 29a shown in the drawing is a side view LED package in which a mounting area and a light emitting area form a vertical structure and provides light to the side surface of the light guide plate 23.

Meanwhile, in recent years, liquid crystal display devices are required to form a smaller bezel defined as the width of the non-display area outside the display area in order to achieve a slim design while pursuing a light weight and thinner. As described above, if the width LW of the LED package 29a is reduced, the width of the bezel can be formed to be small, thereby implementing a narrow bezel.

2 is a bottom view showing a conventional side view type LED package.

As shown in FIG. 2, the conventional side view type LED package 100 is divided into a housing area HA and a mold area MA, and power is input to the LED chip 110 and the LED chip 110. It consists of a housing 130 having a cavity 135 for accommodating the lead frame means and the LED chip 110 for doing so.

In the housing 130, a cavity 135 is formed at a predetermined depth on the front surface, and first and second external leads 190 and 191, which are part of the lead frame means, are positioned on a bottom surface perpendicular to the front surface.

The first and second outer leads 190 and 191 extend vertically toward the bottom from the first and second inner leads 170 and 171 located in the housing 130 and are then bent at 90 degrees to form the mold area MA. Is formed in

At this time, the LED chip 110 is mounted on the second inner lead 171 in the cavity 135 and is electrically connected to the first and second inner leads 170 and 171 by the bonding wire 115 have.

Although not shown in the drawing, a translucent encapsulant formed by filling and curing a liquid translucent resin is provided in the cavity 135.

In addition, the cavity inner wall 135a forms an inclined surface having a steep and constant inclination.

As shown in the drawing, in the conventional LED package, the first and second external leads 190 and 191 are formed in the mold area MA, and the first and second external leads of the mold area MA There is a limit to implementing a narrow bezel due to the thickness of the (190, 191) and the mold part 150.

The present invention has been devised to solve the conventional problems as described above, and implements a narrow bezel by reducing the thickness of the mold part opposite the LED light emitting surface, and when the LED package is mounted on a substrate, the LED package is overturned. Its purpose is to provide a common LED package that can be used in both a side view and a top view, as well as providing an LED package that prevents the phenomenon from losing.

In order to achieve the object as described above, the present invention includes a housing having a cavity for accommodating an LED chip and an encapsulant, wherein the cavity extends obliquely from a first length portion on the bottom side to a second length portion on the upper end side larger than that; First and second inner leads respectively formed on the bottom surface of the housing, divided into an exposed portion positioned inside the cavity and a shielding portion positioned outside the cavity by the first length portion; And first and second outer leads respectively connected to the first and second inner leads, wherein the first and second outer leads are toward a bottom surface from each of the shielding portions of the first and second inner leads. It provides an LED package, characterized in that it is vertically extended and then bent at 90 degrees to be formed in a housing area.

In addition, it provides an LED package further comprising a mold formed under the first and second inner leads and the first and second outer leads.

In addition, each of the first and second outer leads is characterized in that the side surface is exposed.

Each of the first and second outer leads is formed outside the second length portion and is spaced apart from the cavity.

An inner wall of the cavity connecting the first length portion and the second length portion may form an inclined reflective surface.

The slope of the reflective surface is characterized in that it is determined by the length of the first length portion or the second length portion.

In the LED package of the present invention, by forming the first and second outer leads toward the LED emission surface, the thickness of the mold portion opposite the LED emission surface may be reduced, thereby implementing a narrow bezel.

In addition, when the LED package is surface mounted on a substrate, it is possible to prevent the LED package from falling over.

In addition, if the mold part opposite to the LED light emitting surface is completely removed, it can be used as a top view LED package, and a common LED package that can be used in both a side view and a top view can be provided.

1 is a cross-sectional view of a liquid crystal display device using a general LED package as a light source.
2 is a bottom view showing a side view type LED package.
3 is a bottom view showing the LED package of the first embodiment of the present invention.
4 is a bottom view showing an LED package according to a second embodiment of the present invention.
5 is a front view showing an LED package according to a second embodiment of the present invention.
6 is a bottom view showing an LED package according to a third embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

<First Example>

3 is a bottom view showing the LED package of the first embodiment of the present invention.

The LED package according to the first embodiment of the present invention is a side view LED package in which a mounting area and a light emitting area are perpendicular to each other.

As shown in the drawing, the LED package 200 of the first embodiment of the present invention is divided into a housing area HA and a mold area MA, and supplies power to the LED chip 210 and the LED chip 210. It consists of a housing 230 having a cavity 235 for accommodating the lead frame means and the LED chip 210 for input.

In the housing 230, a cavity 235 is formed at a predetermined depth on the front surface, and first and second external leads 290 and 291, which are part of the lead frame means, are positioned on a bottom surface perpendicular to the front surface.

The first and second outer leads 290 and 291 extend vertically toward the bottom surface from the first and second inner leads 270 and 271 located in the housing 230 and are then bent at 90 degrees to form the mold area MA. Is formed in

At this time, the LED chip 210 is mounted on the second inner lead 271 in the cavity 235 and is electrically connected to the first and second inner leads 270 and 271 by the bonding wire 215 have.

Although not shown in the drawing, a translucent encapsulant formed by filling and curing a liquid translucent resin is provided in the cavity 235.

In addition, the cavity 235 has a structure inclinedly extending from the first length portion L1 on the bottom side to the second length portion L2 on the upper end side longer than the first length portion L1.

In addition, the cavity inner wall 235a between the first length portion L1 and the second length portion L2 forms an inclined surface with a certain inclination, which reflects light generated from the LED chip 210 to reflect the cavity ( 235) serves as a reflective surface to the outside.

In this case, the inclination of the reflective surface is determined by adjusting the length of the first length portion L1 or the second length portion L2.

Each of the first and second inner leads 270 and 271 has exposed portions 270b and 271a positioned inside the cavity 235 by the first length portion L1, and the exposed portions 270b and 271a positioned outside the cavity 235. It is divided into shielding parts 270a and 271b.

In addition, the first and second outer leads 290 and 291 are vertically extended toward the bottom from the shielding portions 270a and 271b of the first and second inner leads 270 and 271, respectively, and then bent at 90 degrees to form a housing area. It is formed in (HA).

In particular, each of the first and second outer leads 290 and 291 is formed outside the second length L2 to be spaced apart from the cavity 235.

In this way, the first and second outer leads 290 and 291 are formed in the housing area HA while being completely separated from the cavity 235, so that the first and second outer leads 290 and 291 are formed in the housing 230. Even if it extends vertically toward the bottom surface from each of the shielding portions 270a and 271b of the inner leads 370 and 371 through penetration, the cavity 235 may be formed by the first and second outer leads 290 and 291. There will be no leakage paths present.

This means that there is no leakage of the resin to the outside of the housing 230 in the process of filling the liquid resin in the cavity 235.

In addition, each of the first and second external leads 290 and 291 is formed outside the second length L2 and is spaced apart from the cavity 235, so that when the LED package 200 is surface mounted on the substrate, the LED pad unit Since the solder cream in the LED does not adhere to the LED light emitting surface 255, the luminous efficiency of the LED package 200 is not lowered.

The second length part L2 is the uppermost length part of the cavity 235 that determines the size of the light emitting area of the LED package 200, and the inclination of the inner wall 235a of the cavity is the first length part L1 or the second It is determined by the length of the length portion L2.

That is, the inclination of the inner wall 235a of the cavity is formed as the first length part L1 is shorter or the second length part L2 is longer, and accordingly, the area of the cavity 335 is expanded and the light emitting area is expanded accordingly. This is possible.

In particular, the LED package 200 according to the first embodiment of the present invention has the first and second external leads 290 and 291 to implement a narrow bezel by reducing the width of the LED package (LW in FIG. 1). And it characterized in that the thickness of the mold part 250 is reduced.

On the other hand, if the thickness of the first and second outer leads 290 and 291 of the LED package and the mold part 250 of the mold part area MA are reduced, the LED chip ( Due to the weight of 210), the center of gravity of the LED package 200 may be moved forward and the LED package 200 may fall.

<Second Example>

Figure 4 is a bottom view showing the LED package of the second embodiment of the present invention, Figure 5 is a front view showing the LED package of the second embodiment of the present invention.

In the case of the same components as in the first embodiment, 100 is added to the reference numerals of the first embodiment.

The LED package according to the second embodiment of the present invention is a side view LED package in which a mounting area and a light emitting area are perpendicular to each other.

As shown in Figure 4, the LED package 300 of the second embodiment of the present invention is divided into a housing area (HA) and a mold area (MA), the LED chip 310, the power to the LED chip 310 It consists of a housing 330 having a cavity 335 for accommodating the lead frame means and the LED chip 310 for inputting.

In the housing 330, a cavity 335 is formed to have a predetermined depth, and first and second inner leads 370 and 371, which are part of the lead frame means, are positioned on a bottom surface.

The first and second outer leads 390 and 391 are vertically extended toward the bottom from the first and second inner leads 370 and 371 located in the housing 330 and then bent at 90 degrees to form in the housing area HA. do.

Accordingly, by forming the first and second outer leads 390 and 391 in the housing area HA, the thickness of the mold part 350 formed in the mold area MA can be reduced, and accordingly, the LED package 300 ), a narrow bezel can be implemented by reducing the width (LW of FIG. 1).

In addition, even if the thickness of the mold part 350 formed in the mold part area MA is sufficiently reduced, the LED package 300 falls due to the weight of the LED chip 310 when the LED package 300 is surface-mounted on the substrate. Can be prevented.

That is, the first and second external leads 390 and 391 are formed in the housing area HA to support the LED package 300 so that it does not fall when the LED package 300 is surface mounted on a substrate.

In addition, the LED chip 310 is mounted on the second inner lead 371 in the cavity 335 and is electrically connected to the first and second inner leads 370 and 371 by the bonding wire 315. have.

Although not shown in the drawing, a translucent encapsulant formed by filling and curing a liquid translucent resin is provided in the cavity 335.

In addition, the cavity 335 has a structure inclinedly extended from the first length portion L1 on the bottom side to the second length portion L2 on the upper end side longer than the first length portion L1.

In addition, the cavity inner wall 335a between the first length part L1 and the second length part L2 forms an inclined surface with a certain inclination, which reflects light generated from the LED chip 310 to reflect the cavity ( 335) serves as a reflective surface to the outside.

In this case, the inclination of the reflective surface is determined by adjusting the length of the first length portion L1 or the second length portion L2.

Each of the first and second inner leads 370 and 371 has exposed portions 370b and 371a positioned inside the cavity 335 by the first length portion L1 and the exposed portions 370b and 371a positioned outside the cavity 335. It is divided into shielding parts 370a and 371b.

In addition, the first and second outer leads 390 and 391 are vertically extended toward the bottom surface from the shielding portions 370a and 371b of the first and second inner leads 370 and 371, respectively, and then bent at 90 degrees to form a housing area. It is formed in (HA).

In particular, each of the first and second outer leads 390 and 391 is formed outside the second length L2 to be spaced apart from the cavity 335.

In this way, the first and second outer leads 390 and 391 are formed in the housing area HA while being completely separated from the cavity 335, so that the first and second outer leads 390 and 391 are formed in the housing 330. Even if it extends vertically toward the bottom surface from each of the shielding portions 370a and 371b of the inner leads 370 and 371 through penetration, the cavity 335 may be formed by the first and second outer leads 390 and 391. There will be no leakage paths present.

This means that there is no leakage of the resin to the outside of the housing 330 in the process of filling the liquid resin in the cavity 335.

In addition, each of the first and second external leads 390 and 391 is formed outside the second length L2 and is spaced apart from the cavity 335, so that when the LED package 300 is surface mounted on the substrate, the LED pad unit Since the solder cream in the LED does not adhere to the LED light emitting surface 355, the luminous efficiency of the LED package 300 is not lowered.

The second length part L2 is the uppermost length part of the cavity 335 that determines the size of the light emitting area of the LED package 300, and the inclination of the inner wall 335a of the cavity is the first length part L1 or the second It is determined by the length of the length portion L2.

That is, the inclination of the inner wall 335a of the cavity is formed as the first length portion L1 is shorter or the second length portion L2 is longer, and accordingly, the area of the cavity 335 is expanded and the light emitting area is expanded accordingly. This is possible.

<Third Example>

6 is a bottom view showing an LED package according to a third embodiment of the present invention.

In the case of the same components as in the first embodiment, 200 is added to the reference numerals in the first embodiment.

The LED package of the third embodiment of the present invention is characterized in that the mold portion (350 of FIG. 3) of the mold portion region (MA of FIG. 3) is removed compared to the LED package of the second embodiment.

As shown in Figure 6, the LED package 400 of the third embodiment of the present invention is divided into a housing area (HA) and a mold area (MA), the LED chip 410, the power to the LED chip 410 It consists of a housing 430 having a cavity 435 for accommodating the lead frame means and the LED chip 410 for inputting.

The housing 430 has a cavity 435 formed at a predetermined depth on the front surface, and first and second inner leads 470 and 471, which are part of the lead frame means, are located on the bottom surface.

The first and second outer leads 490 and 491 are vertically extended toward the bottom from the first and second inner leads 470 and 471 located in the housing 430 and then bent at 90 degrees to form in the housing area HA. do.

Accordingly, by forming the first and second outer leads 490 and 491 in the housing area HA, the mold part (350 in FIG. 3) of the mold part area (MA in FIG. 3) can be completely removed. Accordingly, a narrow bezel can be implemented by reducing the width of the LED package 400 (LW of FIG. 1).

In addition, even if the mold part (350 in FIG. 3) of the mold part area (MA in FIG. 3) is completely removed, when the LED package 400 is surface-mounted on the substrate, the LED package 400 is reduced by the weight of the LED chip 410. It can prevent a fall phenomenon.

That is, the first and second external leads 490 and 491 are formed in the housing area HA to support the LED package 400 so that it does not fall when the LED package 400 is surface mounted on a substrate.

In particular, by completely removing the mold part (350 in FIG. 3) of the mold part area MA, the side portions of the first and second outer leads 490 and 491 that were in contact with the mold part (350 in FIG. 3) are exposed, When mounting on a substrate using the exposed side as an electrode, the LED package of the second embodiment of the present invention can be used as a top view LED package.

Of course, it is natural that it can be used as a side view LED package like the first and second embodiments of the present invention.

That is, the LED package of the third embodiment of the present invention selectively includes a side view LED package in which a mounting area and a light emitting area are vertical and a top view LED package in which the mounting area and the light emitting area are vertically horizontal. It can play the role of a common LED package that can be used.

In addition, the LED chip 410 is mounted on the second inner lead 471 in the cavity 435 and is electrically connected to the first and second inner leads 470 and 471 by a bonding wire 415. have.

Although not shown in the drawing, a translucent encapsulant formed by filling and curing a liquid translucent resin is provided in the cavity 435.

In addition, the cavity 435 has a structure inclinedly extended from the first length portion L1 on the bottom side to the second length portion L2 on the upper end side longer than the first length portion L1.

In addition, the cavity inner wall 435a between the first length portion L1 and the second length portion L2 forms an inclined surface having a certain inclination, which reflects light generated from the LED chip 410 to reflect the cavity ( 435) to the outside of the reflective surface.

In this case, the inclination of the reflective surface is determined by adjusting the length of the first length portion L1 or the second length portion L2.

Each of the first and second inner leads 470 and 471 are exposed portions 470b and 471a positioned inside the cavity 435 by the first length portion L1 and the exposed portions 470b and 471a positioned outside the cavity 435. It is divided into shielding parts 470a and 471b.

In addition, the first and second outer leads 490 and 491 are vertically extended toward the bottom from the shielding portions 470a and 471b of the first and second inner leads 470 and 471, respectively, and then bent at 90 degrees to form a housing area. It is formed in (HA).

In particular, each of the first and second outer leads 490 and 491 is formed outside the second length L2 to be spaced apart from the cavity 435.

In this way, the first and second outer leads 490 and 491 are formed in the housing area HA while being completely separated from the cavity 435, so that the first and second outer leads 490 and 491 are formed in the housing 430. Even if it extends vertically toward the bottom surface from each of the shielding portions 470a and 471b of the inner leads 470 and 471, the cavity 435 may be formed by the first and second outer leads 490 and 491. There will be no leakage paths present.

This means that there is no leakage of the resin to the outside of the housing 430 in the process of filling the liquid resin in the cavity 435.

In addition, each of the first and second outer leads 490 and 491 is formed outside the second length L2 and is spaced apart from the cavity 435, so that when the LED package 400 is surface mounted on the substrate, the LED pad unit Since the solder cream in the LED does not adhere to the LED light emitting surface 455, the luminous efficiency of the LED package 400 is not lowered.

The second length part L2 is the uppermost length part of the cavity 435 that determines the size of the light emitting area of the LED package 400, and the inclination of the inner wall 435a of the cavity is the first length part L1 or the second It is determined by the length of the length portion L2.

That is, the inclination of the inner wall 435a of the cavity is formed as the first length portion L1 is shorter or the second length portion L2 is longer, and accordingly, the area of the cavity 435 is expanded and the light emitting area is expanded accordingly. This is possible.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.

310: LED chip
315: bonding wire
330: housing
335: cavity
335a: inner wall of cavity
350: mold part
355: light-emitting surface
370, 371: first and second internal leads
370a, 371b: covered area
370b, 371a: exposed area
390, 391: first and second internal leads
L1, L2: 1st and 2nd length part
HA: Housing area
MA: Mold area
LW: LED package width

Claims (7)

A housing having a cavity for accommodating an LED chip and an encapsulant, but having a length in a first direction and a width in a second direction, the cavity extending obliquely from a first length on the bottom side to a second length on the upper side that is larger than that ;
First and second inner leads respectively formed on the bottom surface of the housing, divided into an exposed portion positioned inside the cavity and a shielding portion positioned outside the cavity by the first length portion; And
Including first and second outer leads respectively connected to the first and second inner leads,
The first and second outer leads are vertically extended from each of the shielding portions of the first and second inner leads toward a bottom surface and then bent at 90 degrees to be formed in the housing area,
The lower surfaces of the first and second outer leads are located on the same plane as the lower surfaces of the exposed portions of the first and second inner leads,
Both end faces of the housing facing along the first direction coincide with outer surfaces of the first and second outer leads, respectively, so that the distance between both end surfaces of the housing is between outer surfaces of the first and second outer leads. LED package equal to the distance of.
The method of claim 1,
Further comprising a mold portion formed under the first and second inner leads and the first and second outer leads,
The thickness of the mold part formed under the first and second inner leads is the same as the thickness of the mold part formed under the first and second outer leads.
The method of claim 1,
Each of the first and second external leads is an LED package, characterized in that the side surface of the second direction is exposed.
The method according to claim 1 or 2,
Each of the first and second outer leads is formed outside the second length portion and is spaced apart from the cavity.
The method according to claim 1 or 2,
The LED package, characterized in that the inner wall of the cavity connecting the first length portion and the second length portion to form an inclined reflective surface.
The method of claim 5,
LED package, characterized in that the slope of the reflective surface is determined by the length of the first length portion or the second length portion.
The method of claim 2,
The thickness of the mold part is smaller than the vertically extended length of the first and second outer leads.

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